JP2002111194A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002111194A5 JP2002111194A5 JP2000299423A JP2000299423A JP2002111194A5 JP 2002111194 A5 JP2002111194 A5 JP 2002111194A5 JP 2000299423 A JP2000299423 A JP 2000299423A JP 2000299423 A JP2000299423 A JP 2000299423A JP 2002111194 A5 JP2002111194 A5 JP 2002111194A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000299423A JP2002111194A (ja) | 2000-09-29 | 2000-09-29 | フローはんだ付け方法および装置 |
| DE60140769T DE60140769D1 (de) | 2000-09-26 | 2001-09-25 | Schwallötvorrichtung und -methode |
| PCT/JP2001/008298 WO2002028156A1 (fr) | 2000-09-26 | 2001-09-25 | Procede et dispositif de soudage a vague |
| US10/148,014 US6805282B2 (en) | 2000-09-26 | 2001-09-25 | Flow soldering process and apparatus |
| EP01967824A EP1259101A4 (en) | 2000-09-26 | 2001-09-25 | WAVE WELDING METHOD AND DEVICE |
| EP03029562A EP1405687B1 (en) | 2000-09-26 | 2001-09-25 | Method and device for flow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000299423A JP2002111194A (ja) | 2000-09-29 | 2000-09-29 | フローはんだ付け方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002111194A JP2002111194A (ja) | 2002-04-12 |
| JP2002111194A5 true JP2002111194A5 (sk) | 2007-06-07 |
Family
ID=18781231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000299423A Pending JP2002111194A (ja) | 2000-09-26 | 2000-09-29 | フローはんだ付け方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002111194A (sk) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101233406B (zh) * | 2005-07-27 | 2012-09-26 | 松下电器产业株式会社 | 金属试样的制作方法 |
| KR100776262B1 (ko) * | 2006-11-03 | 2007-11-15 | 삼성전자주식회사 | 자동납땜장치 |
| KR102009692B1 (ko) | 2019-02-08 | 2019-08-12 | 주식회사 위드텍 | 납땜공정 상에서 납땜처리된 단자의 커팅수단 및 세척수단을 갖는 인쇄회로기판의 자동납땜장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787987B2 (ja) * | 1987-07-13 | 1995-09-27 | 松下電器産業株式会社 | 半田付装置 |
| JPH01154865A (ja) * | 1987-12-10 | 1989-06-16 | Tamura Seisakusho Co Ltd | はんだ付け装置 |
| JPH05318100A (ja) * | 1992-05-25 | 1993-12-03 | Matsushita Electric Ind Co Ltd | 半田付け装置 |
| JPH09237964A (ja) * | 1996-02-28 | 1997-09-09 | Sony Corp | 窒素ガス封入式半田付け装置 |
| JPH09307221A (ja) * | 1996-05-15 | 1997-11-28 | Omron Corp | フローハンダ装置及び実装基板のハンダ付け方法 |
-
2000
- 2000-09-29 JP JP2000299423A patent/JP2002111194A/ja active Pending