JP2002111194A5 - - Google Patents

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Publication number
JP2002111194A5
JP2002111194A5 JP2000299423A JP2000299423A JP2002111194A5 JP 2002111194 A5 JP2002111194 A5 JP 2002111194A5 JP 2000299423 A JP2000299423 A JP 2000299423A JP 2000299423 A JP2000299423 A JP 2000299423A JP 2002111194 A5 JP2002111194 A5 JP 2002111194A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000299423A
Other languages
Japanese (ja)
Other versions
JP2002111194A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000299423A priority Critical patent/JP2002111194A/ja
Priority claimed from JP2000299423A external-priority patent/JP2002111194A/ja
Priority to PCT/JP2001/008298 priority patent/WO2002028156A1/ja
Priority to US10/148,014 priority patent/US6805282B2/en
Priority to EP03029562A priority patent/EP1405687B1/en
Priority to DE60140769T priority patent/DE60140769D1/de
Priority to EP01967824A priority patent/EP1259101A4/en
Publication of JP2002111194A publication Critical patent/JP2002111194A/ja
Publication of JP2002111194A5 publication Critical patent/JP2002111194A5/ja
Pending legal-status Critical Current

Links

JP2000299423A 2000-09-26 2000-09-29 フローはんだ付け方法および装置 Pending JP2002111194A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000299423A JP2002111194A (ja) 2000-09-29 2000-09-29 フローはんだ付け方法および装置
PCT/JP2001/008298 WO2002028156A1 (en) 2000-09-26 2001-09-25 Method and device for flow soldering
US10/148,014 US6805282B2 (en) 2000-09-26 2001-09-25 Flow soldering process and apparatus
EP03029562A EP1405687B1 (en) 2000-09-26 2001-09-25 Method and device for flow soldering
DE60140769T DE60140769D1 (de) 2000-09-26 2001-09-25 Schwallötvorrichtung und -methode
EP01967824A EP1259101A4 (en) 2000-09-26 2001-09-25 FLOATING GAS DEVICE AND METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000299423A JP2002111194A (ja) 2000-09-29 2000-09-29 フローはんだ付け方法および装置

Publications (2)

Publication Number Publication Date
JP2002111194A JP2002111194A (ja) 2002-04-12
JP2002111194A5 true JP2002111194A5 (enrdf_load_stackoverflow) 2007-06-07

Family

ID=18781231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000299423A Pending JP2002111194A (ja) 2000-09-26 2000-09-29 フローはんだ付け方法および装置

Country Status (1)

Country Link
JP (1) JP2002111194A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013256A1 (ja) * 2005-07-27 2007-02-01 Matsushita Electric Industrial Co., Ltd. 金属試料作製装置と金属試料作製方法
KR100776262B1 (ko) * 2006-11-03 2007-11-15 삼성전자주식회사 자동납땜장치
KR102009692B1 (ko) 2019-02-08 2019-08-12 주식회사 위드텍 납땜공정 상에서 납땜처리된 단자의 커팅수단 및 세척수단을 갖는 인쇄회로기판의 자동납땜장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787987B2 (ja) * 1987-07-13 1995-09-27 松下電器産業株式会社 半田付装置
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH05318100A (ja) * 1992-05-25 1993-12-03 Matsushita Electric Ind Co Ltd 半田付け装置
JPH09237964A (ja) * 1996-02-28 1997-09-09 Sony Corp 窒素ガス封入式半田付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法

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