JP2002110879A5 - - Google Patents

Download PDF

Info

Publication number
JP2002110879A5
JP2002110879A5 JP2000292331A JP2000292331A JP2002110879A5 JP 2002110879 A5 JP2002110879 A5 JP 2002110879A5 JP 2000292331 A JP2000292331 A JP 2000292331A JP 2000292331 A JP2000292331 A JP 2000292331A JP 2002110879 A5 JP2002110879 A5 JP 2002110879A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000292331A
Other languages
Japanese (ja)
Other versions
JP4475785B2 (ja
JP2002110879A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000292331A priority Critical patent/JP4475785B2/ja
Priority claimed from JP2000292331A external-priority patent/JP4475785B2/ja
Publication of JP2002110879A publication Critical patent/JP2002110879A/ja
Publication of JP2002110879A5 publication Critical patent/JP2002110879A5/ja
Application granted granted Critical
Publication of JP4475785B2 publication Critical patent/JP4475785B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000292331A 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法 Expired - Lifetime JP4475785B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002110879A JP2002110879A (ja) 2002-04-12
JP2002110879A5 true JP2002110879A5 (no) 2007-09-20
JP4475785B2 JP4475785B2 (ja) 2010-06-09

Family

ID=18775288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000292331A Expired - Lifetime JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4475785B2 (no)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム
CN1198331C (zh) 2001-12-27 2005-04-20 松下电器产业株式会社 布线结构的形成方法
WO2003090289A1 (fr) * 2002-04-19 2003-10-30 Asahi Kasei Electronics Co., Ltd. Transducteur magnetoelectrique et son procede de fabrication
US6667073B1 (en) * 2002-05-07 2003-12-23 Quality Platers Limited Leadframe for enhanced downbond registration during automatic wire bond process

Similar Documents

Publication Publication Date Title
BE2014C019I2 (no)
BE2014C009I2 (no)
BE2013C048I2 (no)
BE2010C019I2 (no)
JP2001204084A5 (no)
JP2003514178A5 (no)
BRPI0112928B8 (no)
JP2001054572A5 (no)
BE2010C040I2 (no)
JP2002006217A5 (no)
JP2001025081A5 (no)
JP2002114293A5 (no)
JP2001243017A5 (no)
JP2000353120A5 (no)
JP2002110879A5 (no)
JP2001279766A5 (no)
JP2002182086A5 (no)
JP2002055045A5 (no)
JP2002033344A5 (no)
BY5768C1 (no)
JP2002166545A5 (no)
CN3149762S (no)
CN3135584S (no)
CN3140185S (no)
CN3135489S (no)