JP2002110879A5 - - Google Patents

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Publication number
JP2002110879A5
JP2002110879A5 JP2000292331A JP2000292331A JP2002110879A5 JP 2002110879 A5 JP2002110879 A5 JP 2002110879A5 JP 2000292331 A JP2000292331 A JP 2000292331A JP 2000292331 A JP2000292331 A JP 2000292331A JP 2002110879 A5 JP2002110879 A5 JP 2002110879A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2000292331A
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Japanese (ja)
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JP4475785B2 (ja
JP2002110879A (ja
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Priority to JP2000292331A priority Critical patent/JP4475785B2/ja
Priority claimed from JP2000292331A external-priority patent/JP4475785B2/ja
Publication of JP2002110879A publication Critical patent/JP2002110879A/ja
Publication of JP2002110879A5 publication Critical patent/JP2002110879A5/ja
Application granted granted Critical
Publication of JP4475785B2 publication Critical patent/JP4475785B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000292331A 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法 Expired - Lifetime JP4475785B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000292331A JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002110879A JP2002110879A (ja) 2002-04-12
JP2002110879A5 true JP2002110879A5 (enrdf_load_stackoverflow) 2007-09-20
JP4475785B2 JP4475785B2 (ja) 2010-06-09

Family

ID=18775288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000292331A Expired - Lifetime JP4475785B2 (ja) 2000-09-26 2000-09-26 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4475785B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム
CN1198331C (zh) 2001-12-27 2005-04-20 松下电器产业株式会社 布线结构的形成方法
JP4685356B2 (ja) * 2002-04-19 2011-05-18 旭化成エレクトロニクス株式会社 磁電変換素子及びその製造方法
US6667073B1 (en) 2002-05-07 2003-12-23 Quality Platers Limited Leadframe for enhanced downbond registration during automatic wire bond process

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