JP2002110501A - Method and device for removing resist bead - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for removing a resist bead that is generated in a peripheral part of a glass substrate, which prevents a rear end void caused from splash of developing solution onto the substrate without lengthening the line process time in a large scaled system nor increasing the amount for use of developing solution, rinse and the like. SOLUTION: A resist bead in the peripheral part of a glass substrate is removed by a high-pressure jet 16 of liquid that does not resolve photo resists, immediately after a photo resist is painted to be dried initially. This removing device of a resist bead is provided with a head 11 for high pressure, jetting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a color filter used for a liquid crystal display device and the like, and more particularly to the removal of a resist bead when forming a photoresist coating film on a glass substrate.

[0002]

2. Description of the Related Art FIG. 4A is a plan view schematically showing an example of a color filter used in a liquid crystal display device or the like. FIG. 4B is a cross-sectional view taken along line XX ′ of the color filter shown in FIG. FIG. 4 (a)
As shown in (b) and (b), a color filter used in a liquid crystal display device or the like has a black matrix (42) and a colored pixel (41) formed on a glass substrate (40).

[0003] The black matrix (42) is a matrix having a light-shielding property, and includes a colored pixel (4).
1) has, for example, a red, green and blue filter function. The black matrix makes the position and size of the colored pixels of the color filter uniform, and when used in a display device, shields undesired light, and makes the image of the display device uniform and uniform. It has a function to make an image with improved contrast.

As a method of manufacturing a color filter having a black matrix having the above structure, which is used in many liquid crystal display devices, first, a black matrix is formed by forming a black matrix on a glass substrate. In addition, a method of manufacturing a color filter by forming a colored pixel by aligning with a pattern of a black matrix on the black matrix substrate is widely used.

To manufacture this black matrix substrate, a metal such as chromium (Cr) or chromium oxide (CrO _x ) as a black matrix material or a metal compound is formed into a thin film on a glass substrate. On the formed thin film, for example, an etching resist pattern is formed using a positive type photoresist, and then, the exposed portion of the formed metal thin film is etched and the etching resist pattern is stripped. _A method of forming a black matrix made of a thin metal film such as _X has been adopted.

In addition, a colored pixel is formed by forming a coating film on the black matrix substrate using, for example, a negative photoresist in which a dye is dispersed, and exposing and developing the coating film to form the colored pixel. The method of forming is used. At this time, as a method of applying a positive photoresist or a negative photoresist in which a dye is dispersed on a glass substrate, a roll coating method, a dip method, a spray method, a spinner method, or the like is used. .

FIGS. 1A, 1B and 1C are explanatory views showing the state of a photoresist film when a photoresist is applied on a glass substrate by a spinner method. FIG.
FIG. 6A is a plan view showing a state of a photoresist film applied on a glass substrate, and FIG.
FIG. 6C is a cross-sectional view taken along the line X-Y ′, and FIG.
It is sectional drawing of a line.

As shown in FIGS. 6 (b) and 6 (c), when a photoresist is applied on a glass substrate (60) by a spinner method, a photoresist coating film (62) is formed on the glass substrate (60). Is thicker at the peripheral portion (66) than at portions other than the peripheral portion. Also, the photoresist is applied to the end face (67) of the substrate (60). (6) of FIG.
4) shows the applied state.

The peripheral portion (6) of the glass substrate (60)
The portion where the thickness of the photoresist is large in 6) is called a resist bead (63). Then, a resist bead (63) at such a peripheral portion (66)
Is a remarkable tendency in a coating film formed by a spinner method among the above various methods of applying a photoresist on a glass substrate.

Such a resist bead (63) may cause incomplete adhesion when forming an image, for example, when an exposure photomask is brought into close contact with a glass substrate. In addition, since such a resist bead (63) is a non-exposed portion, it is not cured and is originally dissolved by a development process after exposure at the time of image formation. Will remain. For example, in the post-process for producing the display device substrate, the remaining beads may elute the components of the resist bead and adversely affect the post-process for producing the display device substrate. In addition, even after such a development process, a resist bead that partially remains is used to accurately set a gap between glass substrates forming a display device, for example, in a post-process of manufacturing a display device. It can cause problems such as being unable to do so.

Therefore, when forming a pattern of a black matrix using a photoresist or forming a colored pixel, for example, a photoresist is applied on a glass substrate to remove such a resist bead. Immediately after the initial drying or immediately before the pattern is exposed and developed, a method of dissolving and removing the resist bead on the peripheral portion of the glass substrate is adopted.

FIG. 5 is a sectional view for explaining an example of a head portion of a resist bead removing apparatus for removing such a resist bead. First, as shown in FIG. 5, a solution for dissolving the photoresist in the head portion (51), for example, a developing solution for the photoresist is supplied from the pipe (52) and stays in the hatched portion. The glass substrate (50) on which the photoresist has been applied is dissolved in the resist bead (53) on the periphery of the glass substrate (50) and the photoresist on the end face by a developer that is inserted into the hatched portion and dissolves the photoresist. It is supposed to be. Then, the air from the pipes (54) and (55) is discharged together with the developer for dissolving the photoresist. The arrow indicates the developer in which the air and the discharged photoresist are dissolved.
After a certain period of time required for dissolving the photoresist, the supply of the developer is stopped.

Next, a rinsing liquid, for example, pure water is piped (5).
It is supplied from 2) and stays in the shaded area. The rinsing liquid rinses the portion where the photoresist is dissolved, and is discharged together with air. FIG. 7A is a plan view illustrating a state in which such a head unit (51) is used. First, a of the glass substrate (70) is
The resist beads on the sides and b are removed, and then the resist beads on the sides c and d of the glass substrate (70) are removed.
FIG. 7B shows the glass substrate from which the resist beads on the side a and the side b have been removed, and the portions where the resist beads have been removed are indicated by oblique lines.

However, when the resist bead at the peripheral edge is removed by such a head portion (51), the pipe (5) is removed.
The fine balance between the developer supplied from 2) and retained in the shaded portion and the air supplied from the pipes (54) and (55) is broken, and the droplets of the developer splash on the substrate, resulting in a black matrix pattern. Necessary part, or
Dissolve the necessary part of the photoresist as a colored pixel,
As a result, missing (white spots) may occur in the pattern or the colored pixels.

In addition, when the size of the glass substrate is increased, or when the thickness of the photoresist is increased, the tact time of the resist bead removing device becomes longer, which affects the production capacity of the production line. Become. Furthermore, with the enlargement of the glass substrate, a developer for dissolving the photoresist, for example, a solvent for a positive photoresist,
In addition, the use amount of an alkaline aqueous solution, a rinsing liquid (for example, pure water) or the like in a negative photoresist in which a dye is dispersed increases.

[0016]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. For example, the present invention relates to a method for manufacturing a color filter used in a liquid crystal display device or the like.
When a black matrix pattern is formed using a photoresist, or when a photoresist coating film is formed on a glass substrate, such as when forming a colored pixel, a resist generated on the periphery of the glass substrate. In the removal of the resist bead to remove the bead, the droplets of the developer for removing the resist bead splash on the substrate, and the pattern,
Alternatively, a developing solution that does not cause missing (white spots) in the colored pixels, does not increase the takt time of the resist bead removing device even if the glass substrate is enlarged, and further dissolves the photoresist It is an object to provide a resist bead removing method and a resist bead removing apparatus which do not increase the amount of use of a rinsing liquid or the like.

[0017]

According to the present invention, when a photoresist coating film is formed on a glass substrate, the photoresist bead is applied to the glass substrate, and immediately after initial drying, a resist bead at the periphery of the glass substrate is removed. A resist bead removing method, wherein the resist bead is removed by high-pressure injection of a liquid that does not dissolve.

Further, the present invention provides a resist bead removing apparatus for removing a resist bead on a peripheral portion of a glass substrate immediately after applying a photoresist and initial drying when forming a coating film of a photoresist on a glass substrate. A resist bead removing apparatus, comprising: a head unit for injecting a high pressure liquid that does not dissolve the photoresist.

[0019]

Embodiments of the present invention will be described below in detail. FIG. 1 is a sectional view showing one embodiment of a head portion of a resist bead removing apparatus according to the present invention. The head part (11) of the resist bead removing device shown in FIG. 1 includes a support part (12), an upper nozzle (13A) for injecting a high pressure liquid that does not dissolve the photoresist, and a lower nozzle (13).
B), upper nozzle (13A) and lower nozzle (13B)
The upper supply pipe (14A) and the lower supply pipe (14A) for supplying a liquid that does not dissolve the photoresist at a high pressure
B), comprising a discharge pipe (15) for discharging the liquid after the resist bead has been removed and the inflowing air.

In the present invention, the liquid used for removing the resist bead in the resist bead removing device is not a solvent or a developing solution that dissolves the used photoresist, but a liquid that does not dissolve the used photoresist (for example, pure water). Water), and is characterized by high-pressure injection (16) of this liquid.

As shown in FIG. 1, first, a glass substrate (10) coated with a photoresist and initially dried is inserted between an upper nozzle (13A) and a lower nozzle (13B). As indicated by the solid arrows, the liquid that does not dissolve the photoresist supplied from the high-pressure liquid supply device (not shown) at a high pressure passes through the upper supply pipe (14A) and the lower supply pipe (14B) to the upper nozzle (13A). ) And the lower nozzle (13B) to spray at high pressure, and the glass substrate (10)
The resist bead on the peripheral edge is removed.

The liquid from which the resist beads have been removed and the air indicated by the dotted arrows are discharged from a discharge pipe (15) connected to a suction device (not shown). At this time, the supply of the liquid is stopped after a certain period of time for removing the resist beads, but the suction of the discharge pipe is continued.

Next, the glass substrate (10) from which the resist beads have been removed is dried. That is, the drying is performed by the flow of the outside air (dotted arrow) due to the suction of the discharge pipe. The mixture of the liquid and the air that has been discharged from the discharge pipe (15) after removing the resist beads is separated into the liquid and the air, and the liquid is reused after filtering. . Further, a portion where the resist bead is removed from the peripheral portion of the glass substrate (10) (for example,
The width of (corresponding to the hatched portion shown in FIG. 7) is adjusted by adjusting the position of the glass substrate within the width (D) of the ejection.

The head (11) of the resist bead removing apparatus according to the present invention has the above-described structure and function, and removes the resist bead using a liquid which does not dissolve the used photoresist. Even if the splash bounces on the substrate, no dropout (white spot) occurs in the pattern or the colored pixel. Also, if pure water is used as the liquid, the rinsing process in the conventional method becomes unnecessary,
And the tact time is shortened.

The injection pressure of the liquid is 50 MPa to 25
Since the pressure is about 0 MPa, the processing time required for removing the resist bead is extremely reduced. Therefore,
The tact time of the resist bead removing device does not increase even if the glass substrate becomes large or the coating film becomes thick. Further, a solvent for dissolving the photoresist, a developing solution, and the like become unnecessary.

FIG. 2 is a plan view schematically showing an example of the arrangement of the heads in the resist bead removing apparatus according to the present invention. The example shown in FIG. 2 is a so-called head reciprocating method. As shown in FIG. 2, a substrate chuck (not shown)
(A) of the glass substrate (10) fixed by
(B), (c), (d) Head portions (11A), (11B), (11C), and (11D) are provided corresponding to each of the four sides. Each head section reciprocates on each side as shown by arrows, and removes the resist beads on each side. The shaded area indicates the area where the resist bead is removed.

FIGS. 3A and 3B are plan views schematically showing another example of the arrangement of the heads in the resist bead removing apparatus according to the present invention. Fig. 3 (a), (b)
The other example shown in (1) is a so-called substrate reciprocating method. First,
As shown in FIG. 3 (a), the head portion (11) corresponds to each of two sides (c) and (d) of the glass substrate (10) fixed by a substrate chuck (not shown) reciprocating left and right.
C) and (11D) are provided. The glass substrate (10) is reciprocated in each head as shown by arrows to remove the resist beads on each side while each head is fixed. The shaded area indicates the area where the resist bead is removed.

Next, as shown in FIG. 3B, each of the two sides (a) and (b) of the glass substrate (10) fixed by a substrate chuck (not shown) reciprocating up and down in the figure. Are provided, head portions (11A) and (11B) are provided.
The glass substrate (10) is reciprocated in each head as shown by arrows to remove the resist beads on each side while each head is fixed. The shaded area indicates the area where the resist bead is removed. In addition, FIG. 3 (a), (b)
In, there is one head portion corresponding to each side, but a plurality of head portions may be provided corresponding to each side, or a long slit-shaped nozzle is provided in the side direction of the glass substrate. A head portion may be provided corresponding to each side.

[0029]

According to the present invention, when a photoresist coating film is formed on a glass substrate, immediately after the photoresist is applied and initially dried, a resist bead at the periphery of the glass substrate is removed by a liquid that does not dissolve the photoresist. The high-pressure jet removes the resist beads, so that the droplets of the developing solution do not splash on the substrate and do not cause a pattern (colored pixel) to be lost (white spots). However, the tact time of the resist bead removing device does not become long, and further, a developing solution for dissolving the photoresist becomes unnecessary, and the resist bead removing method does not increase the use amount of the rinsing liquid or the like.

Further, the present invention provides a resist bead removing apparatus for removing a resist bead on a peripheral portion of a glass substrate immediately after applying a photoresist and initial drying when forming a coating film of a photoresist on a glass substrate. Since a head for ejecting a liquid that does not dissolve the photoresist at a high pressure is provided, a droplet of a developing solution for removing a resist bead splashes on a substrate, and a pattern or a colored pixel is lost (white spots). In addition, even if the size of the glass substrate is increased, the takt time of the resist bead removing device is not increased, and the developing solution for dissolving the photoresist is not required, and the amount of the rinsing solution used is increased. The resist bead removal device is not used.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a head portion of a resist bead removing apparatus according to the present invention.

FIG. 2 is a plan view schematically showing an example of an arrangement of head portions in the resist bead removing device according to the present invention.

FIGS. 3A and 3B are plan views schematically showing another example of the arrangement of the heads in the resist bead removing apparatus according to the present invention.

FIG. 4A is a plan view schematically illustrating an example of a color filter used in a liquid crystal display device or the like.
FIG. 4B is a cross-sectional view taken along line XX ′ of the color filter shown in FIG.
It is sectional drawing in a line.

FIG. 5 is a cross-sectional view illustrating an example of a head portion of the resist bead removing device.

FIGS. 6A, 6B, and 6C are explanatory views showing the state of a photoresist film when a photoresist is applied on a glass substrate by a spinner method.

FIG. 7A is a plan view illustrating a state in which a head unit is used. (B) is an explanatory view of a portion where the resist beads on the side a and the side b are removed.

[Explanation of symbols]

11, 11A, 11B, 11C, 11D: Head portion of resist bead removing device 12: Support portion 13A, 13B: Upper nozzle, lower nozzle 14A, 14B: Upper supply pipe, lower supply pipe 15: Discharge pipe 16: Injection 10, 40, 50, 60, 70: Glass substrate 41: Colored pixel 42: Black matrix 62: Photoresist coating film 53, 63 ... Resist bead 64: Photoresist at end face 66 ... Peripheral part 67 ... End face 51: Head part 52, 54, 55 ... pipe

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) G02F 1/13 101 G03F 7/16 G03F 7/16 H01L 21/30 577 (72) Inventor Atsushi Mitsuda Atsushi Mitsuda Taito-ku, Tokyo Taito-ku, Tokyo 1-5-1 No. 1 Toppan Printing Co., Ltd. F-term (Reference) 2H025 AA18 AB13 DA19 EA10 2H048 BA11 BB02 BB14 BB42 2H088 FA18 FA30 HA01 HA12 MA01 MA20 4D075 BB20Z BB24Z DA06 DB13 DC21 EA45 5F046 JA15

Claims (2)

[Claims] When a photoresist coating film is formed on a glass substrate, immediately after the photoresist is applied and initially dried, a resist bead on the periphery of the glass substrate is removed by high-pressure injection of a liquid that does not dissolve the photoresist. A method for removing a resist bead, comprising removing the resist bead. 2. A resist bead removing device for removing a resist bead on a peripheral portion of a glass substrate immediately after applying a photoresist and initial drying when forming a coating film of the photoresist on the glass substrate. A resist bead removing device comprising a head for jetting a liquid that does not dissolve at a high pressure.