JP2002110484A - Apparatus for machining electronic component - Google Patents

Apparatus for machining electronic component

Info

Publication number
JP2002110484A
JP2002110484A JP2000299060A JP2000299060A JP2002110484A JP 2002110484 A JP2002110484 A JP 2002110484A JP 2000299060 A JP2000299060 A JP 2000299060A JP 2000299060 A JP2000299060 A JP 2000299060A JP 2002110484 A JP2002110484 A JP 2002110484A
Authority
JP
Japan
Prior art keywords
electronic component
roller
holding
belt
supplying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000299060A
Other languages
Japanese (ja)
Inventor
Tadayoshi Nagasawa
忠義 長沢
Taketoshi Haruyama
武利 春山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP2000299060A priority Critical patent/JP2002110484A/en
Publication of JP2002110484A publication Critical patent/JP2002110484A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To solve a problem that a roller must be replaced frequently because a recess is easily formed thereon and a problem that the machining accuracy of an electronic component deteriorates. SOLUTION: The apparatus for machining an electronic component comprises an endless stripe means for carrying an electronic component while holding, a pulley provided with means for positioning the stripe carrying means on the outer circumference and fixed rotatably about a shaft, and means for feeding a material to the electronic component. The means for feeding a material to the electronic component comprises a roller for holding the material, and a pressure movable means for supporting the roller to touch the end face of the electronic component with a constant pressure.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品を保持、
搬送するためのエンドレスな帯状搬送手段、帯状搬送手
段を位置決めする手段を外周に有し、軸を中心に回転可
能に配置されたプーリー及び、電子部品に材料を供給す
る手段を備え、電子部品に材料を供給する手段によって
加工位置で電子部品に加工が施される電子部品用加工装
置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention
Endless belt-shaped transporting means for transporting, having means for positioning the belt-shaped transporting means on the outer circumference, a pulley rotatably arranged around an axis, and a means for supplying a material to the electronic component, The present invention relates to a processing device for an electronic component in which an electronic component is processed at a processing position by means for supplying a material.

【0002】[0002]

【従来の技術】従来の電子部品用加工装置に、図4に示
す様に、電子部品40を保持、搬送するためのベルト4
1と、ベルト41を位置決めするピン41Bを外周に有
し、軸42Aを中心に回転可能に取りつけられたプーリ
ー42及び、電子部品に材料を供給する手段43を備
え、この電子部品に材料を供給する手段43によって電
子部品40の端面に例えば導電性塗料などの電極形成材
料で電極を塗布するものがある。ベルト41は、エンド
レスなもので、その長さ方向に配列する様に複数の電子
部品40が保持される。プーリー42の外周面には、ベ
ルトがスリップするのを防止し、その位置を決めるため
に、外周面における幅方向の両側にその外周に沿って配
列されたピン42Bが設けられる。このプーリー42に
ピン42Bによってベルト41が位置決めされ、ベルト
41を駆動することによりベルト41に保持された電子
部品が搬送される。電子部品に材料を供給する手段43
は、材料を保持するためのローラ44と、一端にローラ
が回転軸44Aを中心に回転可能に取りつけられ、他端
が本体の支柱46にその取り付け部分を支点として移動
可能に取り付けられたローラ保持部45を有する。ロー
ラ保持部45は、一端と他端間の所定の位置がマイクロ
ヘッドなどのネジ47によって支持される。
2. Description of the Related Art As shown in FIG. 4, a belt 4 for holding and transporting an electronic component 40 is mounted on a conventional electronic component processing apparatus.
1, a pulley 42 having a pin 41B for positioning the belt 41 on its outer periphery and rotatably mounted around a shaft 42A, and means 43 for supplying a material to an electronic component, and supplying a material to the electronic component. In some cases, an electrode is applied to the end face of the electronic component 40 by an electrode forming material such as a conductive paint. The belt 41 is endless, and holds a plurality of electronic components 40 so as to be arranged in the length direction. On the outer peripheral surface of the pulley 42, pins 42B arranged along the outer periphery on both sides in the width direction of the outer peripheral surface are provided in order to prevent the belt from slipping and determine its position. The belt 41 is positioned on the pulley 42 by the pin 42B, and the electronic component held by the belt 41 is conveyed by driving the belt 41. Means 43 for supplying material to electronic component
A roller 44 for holding the material, and a roller holding member having one end rotatably mounted on a rotating shaft 44A and the other end movably mounted on a support 46 of the main body with the mounting portion as a fulcrum. It has a part 45. A predetermined position between one end and the other end of the roller holding unit 45 is supported by a screw 47 such as a micro head.

【0003】[0003]

【発明が解決しようとする課題】この様な電子部品用加
工装置を用いて電子部品の端面に複数の外部電極を形成
する場合、図5に示す様にローラ44としてその外周に
電極形成材料を保持するための複数の溝が形成されたも
のが用いられ、このローラ44の外周が電子部品40の
端面に接触するようにネジ47によってベルト41の表
面とローラ44の表面間の距離Gが調整される。この様
な従来の電子部品用加工装置は、ネジ47によって距離
Gが調整されるので、一度調整されると距離Gの大きさ
は一定に固定され、電子部品40のベルト41からの突
出量がばらついたり、所定の形状よりも大きな電子部品
40が保持されたりして電子部品40が距離Gよりも突
出した場合、電子部品40がローラ44に強くぶつか
り、ローラ44の表面に窪みが生じる。この様に表面に
窪みが生じたローラ44を使用すると、電子部品40の
端面に塗布される電極形成材料の量にばらつきが生じ
る。従って、従来の電子部品用加工装置は、頻繁にロー
ラを交換しなければならず、製造コストが増加すると共
に、図6に示す様に電子部品の電極61の形状、大き
さ、位置にばらつきが生じやすいという問題があった。
また、従来の電子部品用加工装置は、ベルト41の表面
とローラ44の表面間の距離Gをネジ47によって調整
しているので、作業者によってこの距離Gがばらつき易
く、電子部品の電極61の形状、大きさ、位置を一定に
保つことが困難だった。
When a plurality of external electrodes are formed on an end face of an electronic component using such an electronic component processing apparatus, as shown in FIG. A roller having a plurality of grooves for holding is used, and the distance G between the surface of the belt 41 and the surface of the roller 44 is adjusted by the screw 47 so that the outer periphery of the roller 44 contacts the end surface of the electronic component 40. Is done. In such a conventional electronic component processing apparatus, since the distance G is adjusted by the screw 47, once adjusted, the magnitude of the distance G is fixed, and the amount of projection of the electronic component 40 from the belt 41 is reduced. If the electronic component 40 protrudes beyond the distance G due to the variation or the holding of the electronic component 40 larger than the predetermined shape, the electronic component 40 strongly hits the roller 44, causing a depression on the surface of the roller 44. The use of the roller 44 having a depression on its surface causes variations in the amount of the electrode forming material applied to the end face of the electronic component 40. Therefore, in the conventional processing device for electronic components, the rollers must be frequently replaced, which increases the manufacturing cost and causes variations in the shape, size, and position of the electrodes 61 of the electronic components as shown in FIG. There was a problem that it easily occurred.
Further, in the conventional processing device for electronic components, the distance G between the surface of the belt 41 and the surface of the roller 44 is adjusted by the screw 47. It was difficult to keep the shape, size and position constant.

【0004】本発明は、ローラの寿命を延ばして製造コ
ストを低減できると共に、電子部品の加工精度を向上で
きる電子部品用加工装置を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a processing device for an electronic component capable of extending the life of a roller to reduce the manufacturing cost and improving the processing accuracy of the electronic component.

【0005】[0005]

【課題を解決するための手段】本発明の電子部品用加工
装置は、ローラをその外周面が電子部品の端面と接触す
るように圧力可動手段で支持することにより前述の課題
を解決するものである。すなわち、電子部品を保持、搬
送するためのエンドレスな帯状搬送手段、帯状搬送手段
を位置決めする手段を外周に有し、軸を中心に回転可能
に取りつけられたプーリー及び、電子部品に材料を供給
する手段を備え、電子部品に材料を供給する手段が、材
料を保持するためのローラと、ローラが電子部品の端面
と接触するように支持する圧力可動手段を有する。ま
た、本発明の電子部品用加工装置は、電子部品を保持、
搬送するためのエンドレスな帯状搬送手段、帯状搬送手
段を位置決めする手段を外周に有し、軸を中心に回転可
能に取りつけられたプーリー及び、電子部品に材料を供
給する手段を備え、電子部品に材料を供給する手段が、
材料を保持するためのローラと、一端にローラが回転軸
を中心に回転可能に取りつけられ、他端が本体にその取
り付け部分を支点として移動可能に取り付けられたロー
ラ保持部及び、ローラが電子部品の端面と接触するよう
にローラ保持部の一端と他端間を支持する圧力可動手段
を有する。
An electronic component processing apparatus according to the present invention solves the above-mentioned problems by supporting a roller by a pressure movable means so that an outer peripheral surface of the roller contacts an end surface of the electronic component. is there. That is, an endless belt-like transporting means for holding and transporting an electronic component, a pulley rotatably mounted around an axis having a means for positioning the belt-like transporting means on an outer periphery, and supplying a material to the electronic component The means for supplying material to the electronic component includes a roller for holding the material and a pressure movable means for supporting the roller in contact with an end surface of the electronic component. Further, the electronic component processing apparatus of the present invention holds an electronic component,
Endless belt-shaped transporting means for transporting, having means for positioning the belt-shaped transporting means on the outer circumference, a pulley rotatably mounted around an axis, and a means for supplying material to the electronic component, The means for supplying the material is
A roller for holding the material, a roller holding portion having one end rotatably attached to the roller about a rotation axis and the other end movably attached to the main body with the attachment portion as a fulcrum, and the roller being an electronic component Pressure holding means for supporting between one end and the other end of the roller holding portion so as to contact the end face of the roller holding portion.

【0006】[0006]

【発明の実施の形態】本発明の電子部品用加工装置は、
電子部品を保持、搬送するためのエンドレスな帯状搬送
手段、帯状搬送手段を位置決めする手段を外周に有し、
軸を中心に回転可能に取りつけられたプーリー及び、電
子部品に材料を供給する手段を備える。電子部品に材料
を供給する手段は、材料を保持するためのローラと、一
端にローラが回転軸を中心に回転可能に取りつけられ、
他端が本体にその取り付け部分を支点として移動可能に
取り付けられたローラ保持部を有する。そして、ローラ
の外周が電子部品の端面に接触するようにローラ保持部
の一端と他端間が圧力可動手段によって支持される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component processing apparatus according to the present invention
Holding the electronic components, endless belt-shaped transport means for transport, having means for positioning the belt-shaped transport means on the outer periphery,
A pulley rotatably mounted about an axis; and means for supplying material to the electronic component. The means for supplying the material to the electronic component is a roller for holding the material, and a roller is attached to one end so as to be rotatable about a rotation axis,
The other end has a roller holding portion movably mounted on the main body with the mounting portion as a fulcrum. Then, one end and the other end of the roller holding portion are supported by the pressure movable means so that the outer periphery of the roller contacts the end surface of the electronic component.

【0007】[0007]

【実施例】以下、本発明の電子部品用加工装置を図1乃
至図3を参照して説明する。図1は本発明の電子部品用
加工装置の実施例を示す側面図、図2は図1の部分拡大
正面図である。図1、図2において、11は帯状搬送手
段、12はプーリー、13は電子部品に材料を供給する
手段である。帯状搬送手段11は、終端のないエンドレ
スなテープやベルトによって構成される。この帯状搬送
手段11の幅方向の中央部には、その長さ方向に一定の
間隔を空けて電子部品を保持するための複数の貫通孔が
設けられる。また、帯状搬送手段11の幅方向の両側に
は、その長さ方向に所定の間隔を以って位置決め用孔が
設けられる。プーリー12は、円柱状に形成され、その
回転軸12Aを中心に回転可能に取りつけられる。プー
リー12の外周面の両端部には、帯状搬送手段11がス
リップするのを防止し、その位置を決めるための位置決
め手段12Bが設けられる。この位置決め手段12B
は、プーリー12の外周面に沿って所定の間隔でピンを
設けることにより形成される。このプーリー12の外周
面には、この面と帯状搬送手段11の内面が対向する様
に帯状搬送手段11が配置される。そして、帯状搬送手
段11の位置決め用孔内に位置決め手段12Bが挿入さ
れる。この様に帯状搬送手段11が配置されたプーリー
12の近傍には、電子部品に材料を供給する手段13が
配置される。この電子部品に材料を供給する手段13
は、材料を保持するためのローラ14と、このローラ1
4が取りつけられるローラ保持部15を有する。ローラ
14は、円柱状に形成されたゴム等の弾性体で構成され
る。このローラ14は、例えば、電子部品の端面に複数
の電極を形成する場合、その外周面に電極形成材料を保
持するための複数の溝14Bが形成されたものが用いら
れる。そして、このローラ14は、回転軸14Aを中心
に回転可能にローラ保持部15の一端に取りつけられ
る。ローラ14の回転軸は、電子部品の搬送に対応して
このローラを回転させる動力源に接続される。また、こ
のローラ14の近くには、ローラに材料を一定量補給す
る装置が設けられている。ローラ保持部15の他端は、
その取り付け部分15Aを支点として移動可能に本体の
支柱16に取り付けられる。このローラ保持部15は、
ローラの外周が電子部品の端面に接触するようにその一
端と他端間が圧力可動手段17によって支持される。圧
力可動手段17は、例えば、エアシリンダーの様にロー
ラ保持部15を所定の圧力で支持するものが用いられ
る。この圧力可動手段17は、支柱16の支持台に、ロ
ーラの外周が電子部品の端面に接触するようにローラ保
持部15を支持できる様に取りつけられる。この様に取
り付けられた圧力可動手段17は、電子部品に塗布する
電極形成材料の量に応じて圧力が設定される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component processing apparatus according to the present invention will be described below with reference to FIGS. FIG. 1 is a side view showing an embodiment of the electronic component processing apparatus of the present invention, and FIG. 2 is a partially enlarged front view of FIG. 1 and 2, reference numeral 11 denotes a belt-like conveying means, 12 denotes a pulley, and 13 denotes a means for supplying a material to an electronic component. The belt-shaped conveyance means 11 is constituted by an endless tape or belt having no end. A plurality of through holes for holding electronic components are provided at a central portion in the width direction of the belt-shaped transport means 11 at predetermined intervals in the length direction. Positioning holes are provided on both sides in the width direction of the belt-shaped conveyance means 11 at predetermined intervals in the length direction. The pulley 12 is formed in a columnar shape, and is attached so as to be rotatable about a rotation axis 12A thereof. At both ends of the outer peripheral surface of the pulley 12, positioning means 12B for preventing the belt-shaped transport means 11 from slipping and determining the position thereof are provided. This positioning means 12B
Is formed by providing pins at predetermined intervals along the outer peripheral surface of the pulley 12. On the outer peripheral surface of the pulley 12, the belt-shaped transport means 11 is arranged such that this surface and the inner surface of the belt-shaped transport means 11 face each other. Then, the positioning means 12B is inserted into the positioning hole of the belt-shaped transport means 11. In the vicinity of the pulley 12 on which the belt-shaped conveying means 11 is arranged, a means 13 for supplying a material to the electronic component is arranged. Means 13 for supplying material to this electronic component
Is a roller 14 for holding the material, and the roller 1
4 has a roller holding unit 15 to which the unit 4 is attached. The roller 14 is formed of an elastic body such as rubber formed in a columnar shape. For example, when a plurality of electrodes are formed on an end surface of an electronic component, the roller 14 has a plurality of grooves 14B formed on an outer peripheral surface thereof for holding an electrode forming material. The roller 14 is attached to one end of a roller holder 15 so as to be rotatable about a rotation shaft 14A. The rotating shaft of the roller 14 is connected to a power source for rotating the roller in accordance with the transport of the electronic component. In addition, a device for replenishing the roller with a certain amount of material is provided near the roller 14. The other end of the roller holding unit 15
It is movably attached to the support 16 of the main body using the attachment portion 15A as a fulcrum. The roller holding unit 15
One end and the other end thereof are supported by the pressure movable means 17 so that the outer periphery of the roller contacts the end face of the electronic component. As the pressure movable means 17, for example, one that supports the roller holding unit 15 at a predetermined pressure, such as an air cylinder, is used. The pressure movable means 17 is mounted on the support base of the column 16 so as to support the roller holding portion 15 so that the outer periphery of the roller contacts the end face of the electronic component. The pressure of the pressure movable means 17 attached in this manner is set according to the amount of the electrode forming material applied to the electronic component.

【0008】この様に形成された電子部品用加工装置
は、ローラ14の表面に電子部品10が接触し、ローラ
14に所定以上の圧力が加わった場合、この圧力によっ
て圧力可動手段17が点線で示す様に押し下げられ、ロ
ーラ保持部15が取り付け部分15Aを支点として点線
で示す様に移動し、ローラ14がAの方向(すなわち、
ローラ14の表面が電子部品の端面から遠ざかる方向)
に移動する。この電子部品の加工装置を用いて加工する
場合、電子部品10を帯状搬送手段11の貫通孔内に挿
入して電子部品10が帯状搬送手段11に弾力的に保持
され、加工位置でローラ14の溝14B内の電極形成材
料が電子部品の端面に塗布される。そして、図3に示す
様に、電子部品30の端面に電極31が形成される。な
お、この電子部品30の場合、圧力可動手段17の圧力
を変えることにより、電子部品の上面と底面に周りこむ
電極材料の量を調整して電極31の大きさが調整され
る。
In the electronic component processing apparatus thus formed, when the electronic component 10 comes into contact with the surface of the roller 14 and a predetermined pressure or more is applied to the roller 14, the pressure causes the pressure movable means 17 to move in a dotted line. As shown in the figure, the roller holding portion 15 moves as indicated by a dotted line with the mounting portion 15A as a fulcrum, and the roller 14 moves in the direction of A (that is,
The direction in which the surface of the roller 14 moves away from the end surface of the electronic component)
Go to In the case of processing using this electronic component processing apparatus, the electronic component 10 is inserted into the through hole of the belt-shaped transporting means 11 so that the electronic component 10 is elastically held by the belt-shaped transporting means 11 and the roller 14 is processed at the processing position. The electrode forming material in the groove 14B is applied to the end face of the electronic component. Then, as shown in FIG. 3, an electrode 31 is formed on the end face of the electronic component 30. In the case of the electronic component 30, the size of the electrode 31 is adjusted by changing the pressure of the pressure movable means 17 to adjust the amount of the electrode material surrounding the top and bottom surfaces of the electronic component.

【0009】以上、本発明の電子部品用加工装置の実施
例を述べたが、この実施例に限られるものではない。例
えば、プーリーに設けられた位置決め手段は、プーリー
の外周面に沿って鍔を設けることにより形成されてもよ
い。その場合、帯状搬送手段の幅方向の両側に位置決め
用孔を設けなくてもよい。また、ローラ保持部は、その
他端が圧力可動手段に直接取り付けられてもよい。さら
に、ローラは、その回転軸を圧力可動手段に直接取り付
け、この圧力可動手段によってローラが保持されてもよ
い。この場合、ローラ保持部は不用となる。また、本実
施例では、電子部品の端面に複数の電極を形成する場合
を説明したが、電子部品の端面に1つの電極を形成する
場合や、電子部品の表面に捺印等を施す場合にも適用で
きる。その場合、ローラは、その用途に応じ、外周に1
つの溝が形成されたものやスポンジ状のもの等様々なも
のを用いることができる。
Although the embodiment of the electronic component processing apparatus of the present invention has been described above, the present invention is not limited to this embodiment. For example, the positioning means provided on the pulley may be formed by providing a flange along the outer peripheral surface of the pulley. In that case, it is not necessary to provide the positioning holes on both sides in the width direction of the belt-shaped conveying means. Further, the other end of the roller holding portion may be directly attached to the pressure movable means. Further, the roller may have its rotation axis directly attached to the pressure movable means, and the roller may be held by the pressure movable means. In this case, the roller holding unit is unnecessary. Further, in the present embodiment, the case where a plurality of electrodes are formed on the end face of the electronic component has been described. However, even when one electrode is formed on the end face of the electronic component, or when the surface of the electronic component is to be stamped or the like. Applicable. In that case, the roller should be one perimeter, depending on the application.
Various ones such as one in which one groove is formed and a sponge-like one can be used.

【0010】[0010]

【発明の効果】以上述べた様に本発明の電子部品用加工
装置は、電子部品を保持、搬送するためのエンドレスな
帯状搬送手段、帯状搬送手段を位置決めする手段を外周
に有し、軸を中心に回転可能に取りつけられたプーリー
及び、電子部品に材料を供給する手段を備え、電子部品
に材料を供給する手段が、材料を保持するためのローラ
と、ローラが電子部品の端面と接触するように支持する
圧力可動手段を有するので、電子部品の帯状搬送手段か
らの突出量がばらついたり、所定の形状よりも大きな電
子部品が帯状搬送手段に保持されたりしても、ローラに
必要以上の圧力がかかることがない。従って、本発明の
電子部品用加工装置は、ローラの寿命を延ばすことがで
き、製造コストを低減できる。また、本発明の電子部品
用加工装置は、1つのローラを長時間使用してもローラ
の状態を一定にたもてるので、電子部品を決まった加工
状態(例えば、図3に示す様に電子部品の電極31の形
状、大きさ、位置等)に保つことができ、電子部品の加
工精度を向上させることができる。さらに、本発明の電
子部品用加工装置は、圧力可動手段の圧力を設定するだ
けで電子部品に所定の加工を施せるので、作業者によっ
て加工精度にばらつきが発生することがなくなる。
As described above, the electronic component processing apparatus according to the present invention has endless belt-like transport means for holding and transporting electronic components, and means for positioning the belt-like transport means on the outer periphery, and has a shaft. A pulley rotatably mounted at the center and a means for supplying material to the electronic component, wherein the means for supplying material to the electronic component includes a roller for holding the material, and the roller contacts an end surface of the electronic component. Even if the electronic component protrudes from the belt-shaped transporting means varies, or an electronic component larger than a predetermined shape is held by the belt-shaped transporting means, the rollers need more than necessary. No pressure is applied. Therefore, the electronic component processing apparatus of the present invention can extend the life of the roller and reduce the manufacturing cost. Further, the electronic component processing apparatus of the present invention can keep the state of the roller constant even when one roller is used for a long time, so that the electronic component can be processed in a predetermined processing state (for example, as shown in FIG. The shape, size, position, etc. of the electrode 31 of the component) can be maintained, and the processing accuracy of the electronic component can be improved. Further, the electronic component processing apparatus of the present invention can perform predetermined processing on the electronic component only by setting the pressure of the pressure movable means, so that there is no variation in processing accuracy among operators.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の電子部品用加工装置の実施例を示す
側面図である。
FIG. 1 is a side view showing an embodiment of an electronic component processing apparatus of the present invention.

【図2】 図1の部分拡大正面図である。FIG. 2 is a partially enlarged front view of FIG.

【図3】 (A)本発明の電子部品用加工装置によって
加工された電子部品の上面図、(B)本発明の電子部品
用加工装置によって加工された電子部品の側面図であ
る。
3A is a top view of an electronic component processed by the electronic component processing apparatus of the present invention, and FIG. 3B is a side view of the electronic component processed by the electronic component processing apparatus of the present invention.

【図4】 従来の電子部品用加工装置を示す側面図であ
る。
FIG. 4 is a side view showing a conventional electronic component processing apparatus.

【図5】 図4の部分拡大正面図である。FIG. 5 is a partially enlarged front view of FIG. 4;

【図6】 (A)従来の電子部品用加工装置によって加
工された電子部品の上面図、(B)従来の電子部品用加
工装置によって加工された電子部品の側面図である。
6A is a top view of an electronic component processed by a conventional electronic component processing device, and FIG. 6B is a side view of the electronic component processed by a conventional electronic component processing device.

【符号の説明】[Explanation of symbols]

11 帯状搬送手段 12 プーリー 13 電子部品に材料を供給する手段 DESCRIPTION OF SYMBOLS 11 Belt-like conveyance means 12 Pulley 13 Means of supplying material to electronic parts

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電子部品を保持、搬送するためのエンド
レスな帯状搬送手段、該帯状搬送手段を位置決めする手
段を外周に有し、軸を中心に回転可能に取りつけられた
プーリー及び、電子部品に材料を供給する手段を備え、
該電子部品に材料を供給する手段が、材料を保持するた
めのローラと、該ローラが電子部品の端面と接触するよ
うに支持する圧力可動手段を有することを特徴とする電
子部品用加工装置。
1. An endless belt-like transport means for holding and transporting an electronic component, a pulley having a means for positioning the belt-like transport device on an outer periphery, and being rotatably mounted around an axis, and Means for supplying the material,
An electronic component processing apparatus, wherein the means for supplying a material to the electronic component includes a roller for holding the material, and a pressure movable means for supporting the roller so as to be in contact with an end surface of the electronic component.
【請求項2】 電子部品を保持、搬送するためのエンド
レスな帯状搬送手段、該帯状搬送手段を位置決めする手
段を外周に有し、軸を中心に回転可能に取りつけられた
プーリー及び、電子部品に材料を供給する手段を備え、
該電子部品に材料を供給する手段が、材料を保持するた
めのローラと、一端に該ローラが回転軸を中心に回転可
能に取りつけられ、他端が本体にその取り付け部分を支
点として移動可能に取り付けられたローラ保持部及び、
該ローラが電子部品の端面と接触するように該ローラ保
持部の該一端と該他端間を支持する圧力可動手段を有す
ることを特徴とする電子部品用加工装置。
2. An endless belt-like transporting means for holding and transporting an electronic component, a pulley having a means for positioning the belt-like transporting means on its outer periphery, and being rotatably mounted around an axis, and Means for supplying the material,
A means for supplying the material to the electronic component includes a roller for holding the material, one end of which the roller is rotatably mounted about a rotation axis, and the other end of which is movable on the main body with the mounting portion as a fulcrum. An attached roller holding unit;
An electronic component processing apparatus comprising: a pressure movable means for supporting the roller holding portion between the one end and the other end so that the roller contacts an end surface of the electronic component.
JP2000299060A 2000-09-29 2000-09-29 Apparatus for machining electronic component Pending JP2002110484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000299060A JP2002110484A (en) 2000-09-29 2000-09-29 Apparatus for machining electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000299060A JP2002110484A (en) 2000-09-29 2000-09-29 Apparatus for machining electronic component

Publications (1)

Publication Number Publication Date
JP2002110484A true JP2002110484A (en) 2002-04-12

Family

ID=18780923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000299060A Pending JP2002110484A (en) 2000-09-29 2000-09-29 Apparatus for machining electronic component

Country Status (1)

Country Link
JP (1) JP2002110484A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105690985A (en) * 2014-12-15 2016-06-22 株式会社村田制作所 Electronic member manufacture device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105690985A (en) * 2014-12-15 2016-06-22 株式会社村田制作所 Electronic member manufacture device
JP2016115784A (en) * 2014-12-15 2016-06-23 株式会社村田製作所 Electronic component manufacturing apparatus
KR101813917B1 (en) 2014-12-15 2018-01-02 가부시키가이샤 무라타 세이사쿠쇼 Electronic component manufacturing apparatus

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