JPH09246353A - Conveying fork - Google Patents

Conveying fork

Info

Publication number
JPH09246353A
JPH09246353A JP8068396A JP8068396A JPH09246353A JP H09246353 A JPH09246353 A JP H09246353A JP 8068396 A JP8068396 A JP 8068396A JP 8068396 A JP8068396 A JP 8068396A JP H09246353 A JPH09246353 A JP H09246353A
Authority
JP
Japan
Prior art keywords
wafer
fork
mounting
pad
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8068396A
Other languages
Japanese (ja)
Inventor
Tsutomu Asaeda
勉 朝枝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP8068396A priority Critical patent/JPH09246353A/en
Publication of JPH09246353A publication Critical patent/JPH09246353A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the replacing frequency of a conveying fork by providing a groove provided on the surface of the fork for mounting a wafer, a roller having a recess on the mounting outer periphery to rotate the groove, and a ring pad mounted at the recess of the roller, thereby holding the frictional force of the pad of the fork for a long time. SOLUTION: A rectangular groove 2 is provided on a wafer mounting surface 8 for mounting a wafer 7 of a conveying for 1, and rollers 4 each having a recess 5 on the outer periphery is mounted in the groove 2 so as to rotate a pin 3. A ring pad 6 is formed of a material having large frictional coefficient, and engaged with the recess 5 of the roller 4. A plurality of the rollers 4 are radially disposed on the surface 8. The pad 6 is brought into contact with the wafer 7 in the case of mounting the wafer 7 on the surface 8 of the fork 1, and rotated each slightly integrally with the roller 4. Thus, the pad 6 is always brought into contact with the wafer 7 at the new part to make it possible to hold the frictional force for a long period.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ウェハを載置して
搬送する搬送フォークに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer fork for mounting and transferring a wafer.

【0002】[0002]

【従来の技術】従来、搬送フォークは図3、4に示すよ
うになっている。図において、9は搬送フォークで、こ
の搬送フォーク9のウェハ載置面10に穴11が設けら
れ、この穴11にパッド12が接着剤で接着して固定し
てある。このパッド12は摩擦係数の大きいシリコンゴ
ム等の材料からなり載置したウェハ13の滑りを防止す
るようにしている。
2. Description of the Related Art Conventionally, a conveying fork is as shown in FIGS. In the figure, 9 is a carrying fork, and a hole 11 is provided in a wafer mounting surface 10 of the carrying fork 9, and a pad 12 is bonded and fixed to the hole 11 with an adhesive. The pad 12 is made of a material such as silicon rubber having a large friction coefficient so as to prevent the mounted wafer 13 from slipping.

【0003】[0003]

【発明が解決しようとする課題】ところが、従来技術で
は、ウェハ13をウェハ載置面10のパッド12に載置
して搬送する作業を長く続けていると、パッド12がウ
ェハ13によって汚損され摩擦力が低下してくる。その
ため、搬送時にパッド12に載置されたウェハ13が滑
り、ウェハ13の位置決め精度が低下する問題が生じて
いた。これを防ぐため、従来はウェハ搬送ロボット(図
示せず)のアームに取付けている搬送フォーク9を頻繁
に取替えるようにしていたが、前記搬送フォーク9の交
換作業は、ウェハ搬送ロボットを収納しているウェハ搬
送室のドアを開いて人手でウェハ搬送ロボットのアーム
から搬送フォーク9を取り外し、新しい搬送フォーク9
を取付けるという面倒な作業であり、作業時間も長くか
かり、ウェハ搬送ロボットの稼働率を低下させる原因に
もなっていた。そこで、本発明は、搬送フォークのパッ
ドの摩擦力を長時間保持し、ウェハ搬送ロボットにおけ
る搬送フォークの交換頻度を少なくすることを目的とす
る。
However, in the prior art, when the work of placing the wafer 13 on the pad 12 on the wafer placing surface 10 and carrying it is continued for a long time, the pad 12 is contaminated by the wafer 13 and is rubbed. The power is decreasing. Therefore, there is a problem that the wafer 13 placed on the pad 12 slides during the transportation, and the positioning accuracy of the wafer 13 deteriorates. In order to prevent this, conventionally, the transfer fork 9 attached to the arm of the wafer transfer robot (not shown) is frequently replaced. However, the replacement work of the transfer fork 9 involves storing the wafer transfer robot. Open the door of the wafer transfer chamber and manually remove the transfer fork 9 from the arm of the wafer transfer robot.
This is a troublesome work of mounting, takes a long working time, and is a cause of lowering the operation rate of the wafer transfer robot. Therefore, it is an object of the present invention to maintain the frictional force of the pad of the transfer fork for a long time and reduce the frequency of replacement of the transfer fork in the wafer transfer robot.

【0004】[0004]

【課題を解決するための手段】上記問題点を解決するた
めに、本発明は、ウェハを載置して搬送する搬送フォー
クにおいて、前記搬送フォークのウェハを載置する面に
設けた溝と、この溝に回転しうるように取付け外周に凹
部を有するローラと、前記ローラの凹部に取付けたリン
グパッドとを設けるようにしている。
In order to solve the above problems, the present invention relates to a transfer fork for mounting and transferring a wafer, and a groove provided on a surface of the transfer fork on which the wafer is mounted, A roller having a recess on the outer periphery for mounting so as to be rotatable in this groove and a ring pad mounted on the recess of the roller are provided.

【0005】[0005]

【発明の実施の形態】以下、本発明の実施例を図を用い
て説明する。図1は搬送フォークの平面図、図2は図1
のA−A線に沿う断面図である。図において、1は搬送
フォークで、この搬送フォーク1のウェハ7を載置する
ウェハ載置面8に長方形の溝2が少なくとも3ヶ所設け
られ、この溝2に、外周に凹部5を有するローラ4がピ
ン3により回転しうるように取付けられている。6は摩
擦係数の大きいシリコンゴム等よりなる材料で形成され
たリングパッドで、ローラ4の凹部5に嵌め込まれてい
る。なお、複数個のローラ4はウェハ載置面8に放射状
に配置されている。このような構成において、リングパ
ッド6は、搬送フォーク1のウェハ載置面8にウェハ7
を載置する際にウェハ7と接触してローラ4と一体に非
常にわずかずつ回転する。このため、リングパッド6
は、常に新しい部分でウェハ7と接触することになり、
摩擦力を長時間保持することができる。したがって、リ
ングパッド6上のウェハ7は滑ることがなくウェハ搬送
ロボットは、設定された位置にウェハ7を搬送できる。
また、ローラ4をウェハ載置面8に放射状に配置してい
るので、ウェハ7を載置した後は、それぞれのローラ4
が他のローラ4の回転を阻止することができ、そのため
ローラ4の回転によるウェハ7の位置ずれが生じること
はない。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a plan view of the transfer fork, and FIG. 2 is FIG.
FIG. 3 is a cross-sectional view taken along line AA of FIG. In the figure, reference numeral 1 denotes a transfer fork, and at least three rectangular grooves 2 are provided on a wafer mounting surface 8 on which the wafer 7 of the transfer fork 1 is mounted, and in this groove 2, a roller 4 having a concave portion 5 on the outer circumference is provided. Is rotatably mounted by a pin 3. A ring pad 6 made of a material such as silicon rubber having a large friction coefficient is fitted into the recess 5 of the roller 4. The plurality of rollers 4 are radially arranged on the wafer mounting surface 8. In such a configuration, the ring pad 6 is mounted on the wafer mounting surface 8 of the transfer fork 1 to the wafer 7
When it is mounted, it comes into contact with the wafer 7 and rotates very little together with the roller 4. Therefore, the ring pad 6
Is always in contact with the wafer 7 at a new part,
The frictional force can be maintained for a long time. Therefore, the wafer 7 on the ring pad 6 does not slip, and the wafer transfer robot can transfer the wafer 7 to the set position.
Further, since the rollers 4 are radially arranged on the wafer mounting surface 8, after the wafer 7 is mounted, the respective rollers 4 are mounted.
Can prevent the rotation of the other rollers 4, so that the displacement of the wafer 7 due to the rotation of the rollers 4 does not occur.

【0006】[0006]

【発明の効果】以上述べたように、本発明によればつぎ
のような効果がある。 (1) 長時間の作業においても、搬送フォークのリング
パッドの摩擦力を常に保持することができ、ウェハ搬送
におけるウェハの位置決め精度を向上させることができ
る。 (2) ウェハ搬送ロボットにおける搬送フォークの交換
頻度を少なくして、ウェハ搬送ロボットの稼働率を向上
させることができる。
As described above, the present invention has the following effects. (1) It is possible to always maintain the frictional force of the ring pad of the transfer fork even in a long-time operation, and improve the positioning accuracy of the wafer during wafer transfer. (2) It is possible to improve the operating rate of the wafer transfer robot by reducing the frequency of replacement of the transfer fork in the wafer transfer robot.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す搬送フォークの平面図で
ある。
FIG. 1 is a plan view of a transport fork showing an embodiment of the present invention.

【図2】図1のA−A線に沿う断面図である。FIG. 2 is a sectional view taken along line AA of FIG.

【図3】従来の搬送フォークの平面図である。FIG. 3 is a plan view of a conventional transfer fork.

【図4】図3のB−B線に沿う断面図である。FIG. 4 is a sectional view taken along line BB of FIG. 3;

【符号の説明】[Explanation of symbols]

1 搬送フォーク、 2 溝、 3 ピン、 4 ロー
ラ、5 凹部、 6 リングパッド、 7 ウェハ、
8 ウェハ載置面
1 transfer fork, 2 groove, 3 pin, 4 roller, 5 recess, 6 ring pad, 7 wafer,
8 Wafer mounting surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ウェハを載置して搬送する搬送フォーク
において、前記搬送フォークのウェハを載置する面に設
けた溝と、この溝に回転しうるように取付け外周に凹部
を有するローラと、前記ローラの凹部に取付けたリング
パッドとを設けたことを特徴とする搬送フォーク。
1. A transfer fork for mounting and transferring a wafer, comprising: a groove provided on a surface of the transfer fork on which the wafer is mounted; and a roller having a recess on an outer periphery for mounting so as to rotate in the groove. A transport fork provided with a ring pad attached to the recess of the roller.
JP8068396A 1996-03-08 1996-03-08 Conveying fork Pending JPH09246353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8068396A JPH09246353A (en) 1996-03-08 1996-03-08 Conveying fork

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8068396A JPH09246353A (en) 1996-03-08 1996-03-08 Conveying fork

Publications (1)

Publication Number Publication Date
JPH09246353A true JPH09246353A (en) 1997-09-19

Family

ID=13725151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8068396A Pending JPH09246353A (en) 1996-03-08 1996-03-08 Conveying fork

Country Status (1)

Country Link
JP (1) JPH09246353A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168717A (en) * 2001-12-03 2003-06-13 Yaskawa Electric Corp Wafer transport fork
JP2008252012A (en) * 2007-03-30 2008-10-16 Applied Materials Inc Wafer transferring blade
JP2014099542A (en) * 2012-11-15 2014-05-29 Tokyo Electron Ltd Substrate delivery mechanism, substrate carrying device and substrate delivery method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168717A (en) * 2001-12-03 2003-06-13 Yaskawa Electric Corp Wafer transport fork
JP2008252012A (en) * 2007-03-30 2008-10-16 Applied Materials Inc Wafer transferring blade
JP4516089B2 (en) * 2007-03-30 2010-08-04 アプライド マテリアルズ インコーポレイテッド Wafer transfer blade
JP2014099542A (en) * 2012-11-15 2014-05-29 Tokyo Electron Ltd Substrate delivery mechanism, substrate carrying device and substrate delivery method

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