JP2002110449A - Capacitor and polyester film therefor - Google Patents
Capacitor and polyester film thereforInfo
- Publication number
- JP2002110449A JP2002110449A JP2000303779A JP2000303779A JP2002110449A JP 2002110449 A JP2002110449 A JP 2002110449A JP 2000303779 A JP2000303779 A JP 2000303779A JP 2000303779 A JP2000303779 A JP 2000303779A JP 2002110449 A JP2002110449 A JP 2002110449A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyester
- heat
- polyester film
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 88
- 229920006267 polyester film Polymers 0.000 title claims abstract description 68
- 239000004840 adhesive resin Substances 0.000 claims abstract description 60
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 60
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 28
- 229920000728 polyester Polymers 0.000 claims abstract description 28
- 229920001225 polyester resin Polymers 0.000 claims abstract description 26
- 239000004645 polyester resin Substances 0.000 claims abstract description 26
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 12
- 239000001257 hydrogen Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 12
- 238000004804 winding Methods 0.000 claims description 11
- 239000002985 plastic film Substances 0.000 claims description 8
- 229920006255 plastic film Polymers 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- FAWGZAFXDJGWBB-UHFFFAOYSA-N antimony(3+) Chemical compound [Sb+3] FAWGZAFXDJGWBB-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 239000002075 main ingredient Substances 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 26
- 239000007787 solid Substances 0.000 description 21
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000977 initiatory effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- ZUHPIMDQNAGSOV-UHFFFAOYSA-N 2-benzyl-2-phenylpropanedioic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)(C(O)=O)CC1=CC=CC=C1 ZUHPIMDQNAGSOV-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 101100219325 Phaseolus vulgaris BA13 gene Proteins 0.000 description 1
- 229910002046 SYLYSIA SY430 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、コンデンサー用ポ
リエステルフィルム、及び該フィルムを用いて得られる
コンデンサーに関する。さらに詳しくは、外装を必要と
せず、長期の耐湿性および耐熱性に優れた巻き取り型コ
ンデンサーを提供し得るコンデンサー用ポリエステルフ
ィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyester film for a capacitor and a capacitor obtained by using the film. More specifically, the present invention relates to a polyester film for a capacitor that does not require an exterior and can provide a wound-type capacitor having excellent long-term moisture resistance and heat resistance.
【0002】[0002]
【従来の技術】従来、フィルムコンデンサーの外装方法
として、コンデンサー素子を樹脂にディピングまたはモ
ールディングして包む方法、金属または樹脂よりなる容
器にコンデンサー素子を収納して密閉する方法等、金属
ケースまたは樹脂ケースによる外装を行う方法が知られ
ている。2. Description of the Related Art Conventionally, as a method of packaging a film capacitor, a method of wrapping a capacitor element in a resin by dipping or molding, and a method of storing a capacitor element in a metal or resin container and sealing it, etc. There is known a method of providing an exterior by using a conventional method.
【0003】近年、コンデンサーの軽量化、小型化およ
び製造工程削減による低コスト化を目的として、誘電体
である樹脂フィルムに外装機能を付与した無外装コンデ
ンサーが開発されている。[0003] In recent years, non-exterior capacitors have been developed in which a resin film as a dielectric is provided with an exterior function for the purpose of reducing the weight and size of the capacitor and reducing the cost by reducing the number of manufacturing steps.
【0004】この様な無外装コンデンサーで用いる樹脂
フィルムは、通常、基材フィルムに熱接着性樹脂層を形
成したものであるが、この様な樹脂フィルムを誘電体と
した巻き取り型コンデンサーは、熱接着性樹脂層の熱接
着性が充分ではなく、長期の耐湿性や耐熱性が悪く、熱
接着面が剥離してコンデンサーの容量変化が生じる等の
問題点がある。また、接着性樹脂の熱接着性を向上させ
ようとすると、フィルムロールのブロッキングが発生し
易くなって、巻き取り型コンデンサーとしての加工が困
難になるという問題もある。[0004] The resin film used in such a non-exterior capacitor is generally formed by forming a heat-adhesive resin layer on a base film. There is a problem that the thermal adhesiveness of the thermal adhesive resin layer is not sufficient, the long-term moisture resistance and heat resistance are poor, the thermal adhesive surface is peeled off, and the capacitance of the capacitor changes. In addition, there is a problem that when the thermal adhesiveness of the adhesive resin is to be improved, blocking of the film roll is likely to occur, and it is difficult to process the film-type capacitor.
【0005】[0005]
【発明が解決しようとする課題】本発明は、上記従来の
課題を解決するためになされたものであり、その主な目
的は、誘電体であるポリエステルフィルムに外装機能を
付与した無外装コンデンサー用ポリエステルフィルムで
あって、優れた熱接着性と耐ブロッキングを有するポリ
エステルフィルムを提供することである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and its main object is to provide a non-exterior capacitor in which an exterior function is imparted to a polyester film which is a dielectric. An object of the present invention is to provide a polyester film having excellent heat adhesion and blocking resistance.
【0006】[0006]
【課題を解決するための手段】本発明者は、上記した目
的を達成すべく鋭意研究を重ねてきた。その結果、ポリ
エステル樹脂からなる基材フィルムの少なくとも片面に
熱接着性樹脂層を積層したコンデンサー用ポリエステル
フィルムにおいて、該熱接着性樹脂層が、非晶性ポリエ
ステル系共重合樹脂と球状の不活性粒子を含む樹脂組成
物により形成され、該熱接着性樹脂層表面の表面自由エ
ネルギーが特定範囲内にある場合に、上記した目的を達
成し得るコンデンサー用ポリエステルフィルムが得られ
ることを見出し、ここに本発明を完成するに至った。Means for Solving the Problems The present inventor has made intensive studies to achieve the above object. As a result, in a polyester film for a capacitor in which a heat-adhesive resin layer is laminated on at least one surface of a base film made of a polyester resin, the heat-adhesive resin layer has an amorphous polyester copolymer resin and spherical inert particles. It has been found that when the surface free energy of the surface of the heat-adhesive resin layer is within a specific range, a polyester film for a capacitor that can achieve the above-mentioned object can be obtained. The invention has been completed.
【0007】即ち、本発明は、下記のコンデンサー用ポ
リエステルフィルム及びコンデンサーを提供するもので
ある。 1. ポリエステル樹脂からなる基材フィルムの少なく
とも片面に熱接着性樹脂層を積層した熱接着性ポリエス
テルフィルムであって、該熱接着性樹脂層が非晶性ポリ
エステル系共重合樹脂及び球状の不活性粒子を主たる構
成成分とし、該熱接着性樹脂層表面の表面自由エネルギ
ーにおける水素結合力成分項γshが5〜15mN/m
且つ水素分散力成分項γsdが30〜45mN/mであ
り、該不活性粒子が該非晶性ポリエステル系共重合樹脂
100重量部に対して1〜15重量部配合されているこ
とを特徴とするコンデンサー用ポリエステルフィルム。 2. 熱接着性樹脂層が塗布法により形成され、基材フ
ィルムに積層された熱接着性樹脂層の乾燥塗布量が0.
1g/m2〜2.0g/m2であり、かつ熱傾斜測定器に
よる熱接着開始温度が80〜120℃であることを特徴
とする上記項1記載のコンデンサー用ポリエステルフィ
ルム。 3. 不活性粒子が二酸化珪素粒子である上記項1又は
2に記載のコンデンサー用ポリエステルフィルム。 4. 基材フィルムがポリエステル樹脂の2軸延伸フィ
ルムであり、該基材フィルム中に三酸化アンチモンがア
ンチモン元素として100〜300ppm含まれている
ことを特徴とする上記項1〜3のいずれかに記載のコン
デンサー用ポリエステルフィルム。 5. 熱接着性ポリエステルフィルムの厚さが3〜30
μmである上記項1〜4のいずれかに記載のコンデンサ
ー用ポリエステルフィルム。 6. 熱接着性ポリエステルフィルムのヘイズ値が5%
以下である上記項1〜5のいずれかに記載のコンデンサ
ー用ポリエステルフィルム。 7. 上記項1〜6のいずれかに記載のコンデンサー用
ポリエステルフィルムと、金属箔または金属蒸着プラス
チックフィルムとを、該ポリエステルフィルムの熱接着
性樹脂層と金属箔または金属蒸着面とが接するように重
ねて巻き取り、加熱圧着して得られる、巻き取り型コン
デンサー。That is, the present invention provides the following polyester film for a capacitor and a capacitor. 1. A heat-adhesive polyester film in which a heat-adhesive resin layer is laminated on at least one surface of a base film made of a polyester resin, wherein the heat-adhesive resin layer contains an amorphous polyester-based copolymer resin and spherical inert particles. The hydrogen bonding force component term γsh in the surface free energy of the surface of the thermoadhesive resin layer is 5 to 15 mN / m as a main component.
And a hydrogen dispersing power component term γsd of 30 to 45 mN / m, and 1 to 15 parts by weight of the inactive particles are mixed with 100 parts by weight of the amorphous polyester copolymer resin. For polyester film. 2. A heat-adhesive resin layer is formed by a coating method, and the dry-coating amount of the heat-adhesive resin layer laminated on the base film is 0.
1 g / m 2 was to 2.0 g / m 2, and a polyester film for capacitor according to Item 1, wherein the thermal bonding initiation temperature due to the thermal gradient measuring device is 80 to 120 ° C.. 3. Item 3. The polyester film for a capacitor according to Item 1 or 2, wherein the inert particles are silicon dioxide particles. 4. The substrate film according to any one of items 1 to 3, wherein the substrate film is a biaxially stretched film of a polyester resin, and the substrate film contains 100 to 300 ppm of antimony trioxide as an antimony element. Polyester film for condenser. 5. The thickness of the heat-adhesive polyester film is 3 to 30
Item 5. The polyester film for a capacitor according to any one of Items 1 to 4, which has a size of μm. 6. Haze value of thermal adhesive polyester film is 5%
Item 6. The polyester film for a capacitor according to any one of Items 1 to 5, above. 7. The polyester film for a capacitor according to any one of the above items 1 to 6, and a metal foil or a metal-deposited plastic film are stacked so that the heat-adhesive resin layer of the polyester film is in contact with the metal foil or the metal-deposited surface. Winding type condenser obtained by winding up and heat pressing.
【0008】[0008]
【発明の実施の形態】本発明のコンデンサー用ポリエス
テルフィルムは、ポリエステル樹脂からなる基材フィル
ムの少なくとも片面に熱接着性樹脂層が積層されたもの
である。BEST MODE FOR CARRYING OUT THE INVENTION The polyester film for a capacitor of the present invention is obtained by laminating a heat-adhesive resin layer on at least one surface of a base film made of a polyester resin.
【0009】基材フィルム 基材フィルムとして用いるポリエステル樹脂は、エステ
ル結合によって高分子化された結晶性熱可塑性樹脂であ
り、通常、ジカルボン酸成分とグリコール成分とを重縮
合することにより得られる。[0009] Polyester resins used as the base film substrate film is a crystalline thermoplastic resin which is polymerized by an ester bond is usually obtained by polycondensation of a dicarboxylic acid component and a glycol component.
【0010】ポリエステル樹脂を構成するジカルボン酸
成分としては、テレフタル酸、イソフタル酸、ナフタレ
ンジカルボン酸、シクロへキサンジカルボン酸、ジフェ
ニルエタンジカルボン酸などが挙げられる。グリコール
成分としては、エチレングリコール、プロピレングリコ
ール、テトラメチレングリコール、シクロへキサンジメ
タノールなどが挙げられる。好ましいジカルボン酸成分
は、テレフタル酸、ナフタレン−2,6−ジカルボン酸
等であり、好ましいグリコール成分は、エチレングリコ
ール等である。The dicarboxylic acid component constituting the polyester resin includes terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, cyclohexanedicarboxylic acid, diphenylethanedicarboxylic acid and the like. Examples of the glycol component include ethylene glycol, propylene glycol, tetramethylene glycol, cyclohexanedimethanol and the like. Preferred dicarboxylic acid components are terephthalic acid, naphthalene-2,6-dicarboxylic acid and the like, and preferred glycol components are ethylene glycol and the like.
【0011】基材フィルムで用いるポリエステル樹脂の
内で、好ましいものとして、ポリエチレンテレフタレー
ト、ポリエチレン−2,6−ナフタレート、ポリ−1,
4−シクロへキサンジメチレンテレフタレートなどが挙
げられる。これらの好ましいポリエステル樹脂は、更
に、必要に応じて、該ポリエステル樹脂を構成するジカ
ルボン酸成分及びグリコール成分以外に、前述したジカ
ルボン酸成分又はグリコール成分を、ポリエステル樹脂
を構成するモノマー成分の30モル%以下の範囲、好ま
しくは15モル%以下の範囲で用いて得られたものでも
良い。あるいは、上記した好ましいポリエステル樹脂以
外のポリエステル樹脂を混合して用いても良い。Among the polyester resins used for the base film, preferred are polyethylene terephthalate, polyethylene-2,6-naphthalate, poly-1,
4-cyclohexane dimethylene terephthalate and the like. These preferable polyester resins further include, if necessary, in addition to the dicarboxylic acid component and the glycol component constituting the polyester resin, the aforementioned dicarboxylic acid component or the glycol component in an amount of 30 mol% of the monomer component constituting the polyester resin. It may be obtained using the following range, preferably 15% by mole or less. Alternatively, a polyester resin other than the above-mentioned preferred polyester resin may be mixed and used.
【0012】基材フィルムを構成するポリエステル樹脂
は、三酸化アンチモンを重合触媒として得られたもので
あることが好ましく、その使用量は、ポリエステル樹脂
中にアンチモン元素として100ppm〜300ppm
程度、好ましくは120ppm〜240ppm程度含ま
れる量であることが好適である。The polyester resin constituting the base film is preferably obtained by using antimony trioxide as a polymerization catalyst. The amount of the polyester resin used is 100 ppm to 300 ppm as an antimony element in the polyester resin.
It is suitable that the amount is contained, preferably about 120 ppm to 240 ppm.
【0013】通常、ポリエステル樹脂は、極限粘度が大
きいほど、耐電圧性、機械特性、長期耐湿性、耐熱性等
が良好であり、極限粘度が0.5dl/g程度以上、好
ましくは0.6dl/g程度以上が適している。また、
極限粘度が0.5dl/g未満では、押し出し溶融によ
る製膜が困難になる。重合触媒としてのアンチモン量が
100ppm未満の場合には、得られるポリエステル樹
脂は、極限粘度が0.5dl/g未満となり易いので好
ましくない。Usually, the higher the intrinsic viscosity of the polyester resin, the better the voltage resistance, mechanical properties, long-term moisture resistance, heat resistance, etc., and the intrinsic viscosity is about 0.5 dl / g or more, preferably 0.6 dl / g. / G or more is suitable. Also,
If the intrinsic viscosity is less than 0.5 dl / g, it becomes difficult to form a film by extrusion melting. If the amount of antimony as a polymerization catalyst is less than 100 ppm, the resulting polyester resin is not preferred because the intrinsic viscosity tends to be less than 0.5 dl / g.
【0014】一方、アンチモン量が300ppmを越え
ると不純物、異物等の発生量が多く、コンデンサーの誘
電体として絶縁不良を引き起こし易くなるので好ましく
ない。On the other hand, if the amount of antimony exceeds 300 ppm, the amount of impurities and foreign substances generated is large, and insulation failure is likely to occur as a dielectric of the capacitor, which is not preferable.
【0015】熱接着性樹脂層 本発明のコンデンサー用フィルムにおいて、ポリエステ
ル樹脂からなる基材フィルムの少なくとも片面に積層す
る熱接着性樹脂層は、非晶性ポリエステル系共重合樹脂
により形成する。 Heat Adhesive Resin Layer In the capacitor film of the present invention, the heat adhesive resin layer laminated on at least one surface of the polyester resin base film is formed of an amorphous polyester copolymer resin.
【0016】非晶性ポリエステル系共重合樹脂は、エス
テル結合によって高分子化された樹脂であって、通常、
ジカルボン酸成分とグリコール成分の重縮合によって得
られ、ジカルボン酸成分とグリコール成分の何れか一方
又は両方について、2種類以上の成分を用いて得られ
た、結晶性を有さない樹脂である。The amorphous polyester copolymer resin is a resin polymerized by an ester bond.
A resin having no crystallinity, which is obtained by polycondensation of a dicarboxylic acid component and a glycol component, and is obtained by using two or more types of one or both of the dicarboxylic acid component and the glycol component.
【0017】該非晶性ポリエステル系共重合樹脂の構成
成分の内で、ジカルボン酸としては、前述した基材フィ
ルム用ポリエステル樹脂において使用できるジカルボン
酸以外に、アジピン酸、セバシン酸、トリメリット酸等
を使用できる。グリコール成分としては、基材フィルム
用ポリエステル樹脂について上述したもの以外に、ネオ
ペンチルグリコール、ジエチレングリコール、ビスフェ
ノールAのエチレンオキサイド付加物、グリセリンなど
を使用できる。これらのジカルボン酸成分およびグリコ
ール成分は、それぞれ単独で、または任意の適切な2種
類以上を任意の適切な量で組み合わせて用いることがで
きる。Among the constituent components of the amorphous polyester copolymer resin, examples of the dicarboxylic acid include adipic acid, sebacic acid, trimellitic acid and the like in addition to the dicarboxylic acid usable in the polyester resin for a base film described above. Can be used. As the glycol component, in addition to those described above for the polyester resin for the base film, neopentyl glycol, diethylene glycol, an ethylene oxide adduct of bisphenol A, glycerin and the like can be used. These dicarboxylic acid components and glycol components can be used alone or in any combination of two or more in any appropriate amount.
【0018】熱接着性樹脂層は、2種類以上の非晶性ポ
リエステル系共重合樹脂を任意の割合で混合して形成し
ても良い。The heat-adhesive resin layer may be formed by mixing two or more amorphous polyester-based copolymer resins at an arbitrary ratio.
【0019】本発明では、熱接着性樹脂層は、該樹脂層
表面における表面自由エネルギーにおける水素結合力成
分項γshが5〜15mN/mの範囲内にあり、且つ水
素分散力成分項γsdが30〜45mN/mの範囲内に
あることが必要である。In the present invention, the heat-adhesive resin layer has a hydrogen bonding force component term γsh of 5 to 15 mN / m in surface free energy on the surface of the resin layer, and a hydrogen dispersing force component term γsd of 30 mN / m. It needs to be in the range of 〜45 mN / m.
【0020】熱接着性樹脂層表面における表面自由エネ
ルギーが上記範囲内にあることによって、該熱接着性樹
脂層は優れた熱接着性を有するものとなり、優れた耐久
性を有するコンデンサーを得ることができる。熱接着性
樹脂層表面における表面自由エネルギーが上記範囲外の
場合には、記熱接着性樹脂層の熱接着性が不足して、該
熱接着性樹脂層と、金属蒸着フィルムの金属蒸着面、金
属箔の金属面、プラスチックフィルム等との密着性が不
十分となる。その結果、例えば、コンデンサーとしての
使用時に、金属蒸着フィルムの金属蒸着面、金属箔の金
属面等との接着面の剥離が生じ、コンデンサーの容量変
化が起こる場合がある。また、外装フイルムの剥離が生
じてコンデンサーとして使用することが不可能となる場
合もある。When the surface free energy on the surface of the heat-adhesive resin layer is within the above range, the heat-adhesive resin layer has excellent heat-adhesive properties, and a capacitor having excellent durability can be obtained. it can. When the surface free energy on the surface of the heat-adhesive resin layer is outside the above range, the heat-adhesive resin layer has insufficient heat adhesion, and the heat-adhesive resin layer and the metal-deposited surface of the metal-deposited film, Adhesion between the metal surface of the metal foil and the plastic film becomes insufficient. As a result, for example, at the time of use as a capacitor, peeling of the metal-deposited surface of the metal-deposited film, the metal foil of the metal foil, and the like may occur, and the capacitance of the capacitor may change. In some cases, the outer film may be peeled off, making it impossible to use it as a capacitor.
【0021】該熱接着性樹脂層中には、球状の不活性粒
子を、非晶性ポリエステル系共重合樹脂100重量部に
対して1〜15重量部程度配合することが必要である。
該熱接着性樹脂層中に球状の不活性粒子を配合すること
によって、上記した表面自由エネルギーを有する熱接着
性の良好な熱接着性樹脂層を形成した場合であっても、
フィルム間のブロッキングを有効に防止することができ
る。It is necessary that the thermal adhesive resin layer contains about 1 to 15 parts by weight of spherical inert particles based on 100 parts by weight of the amorphous polyester copolymer resin.
Even when a good heat-adhesive resin layer having the above-mentioned surface free energy is formed by blending spherical inert particles in the heat-adhesive resin layer,
Blocking between films can be effectively prevented.
【0022】本発明で使用する球状の不活性粒子として
は、粒子の長径と短径の割合が、長径/短径=1〜1.
5程度の範囲内であって、平均粒径が10〜500nm
程度のものが好ましい。また、下記式で定義される粒子
の長径の粒径変動率が、30%以内であることが好まし
い。As the spherical inert particles used in the present invention, the ratio of the major axis to the minor axis is such that the major axis / minor axis = 1 to 1.
Within a range of about 5 and an average particle size of 10 to 500 nm
Are preferred. Further, it is preferable that the variation rate of the major axis of the particles defined by the following formula is within 30%.
【0023】長径の粒径変動率(%)=(長径の標準偏
差/長径の平均値)×100尚、本願明細書では、粒子
の径は、走査型電子顕微鏡(日立、S−510型)を用
いて10,000〜50,000倍で写真撮影し、少な
くとも100個の粒子について、画像解析装置(ルーゼ
ックス2D、日本光学工業社製)を用いて画像解析によ
り求めた値であり、平均粒径は2本の垂直線で画像を挟
んだときの2本の垂直線間の距離から求めた値(水平方
向フェレ径)、長径は画像の周上の任意の2点間の距離
のうち最大の長さより求めた値(絶対最大長)、短径は
最大長に平行な2本の直線で画像を挟んだときの2直線
間の最短距離より求めた値(幅)である。Rate of change of particle diameter of major axis (%) = (standard deviation of major axis / average of major axis) × 100 In the specification of the present application, the particle diameter is determined by a scanning electron microscope (Hitachi, Model S-510). Is a value determined by image analysis using an image analyzer (Luzex 2D, manufactured by Nippon Kogaku Kogyo Co., Ltd.) for at least 100 particles. The diameter is the value obtained from the distance between two vertical lines when the image is sandwiched between two vertical lines (horizontal Feret diameter), and the long diameter is the maximum of the distance between any two points on the circumference of the image. (Absolute maximum length), and the minor axis is the value (width) calculated from the shortest distance between two straight lines when an image is sandwiched between two straight lines parallel to the maximum length.
【0024】不活性粒子の配合量が1重量部を下回ると
耐ブロッキング性が不足し、フィルムコンデンサー巻き
取り加工が困難になる。一方、不活性粒子の配合量が1
5重量部を上回ると、該熱接着性樹脂層の熱接着性が低
下するので好ましくない。If the amount of the inert particles is less than 1 part by weight, the blocking resistance becomes insufficient, and the winding of the film capacitor becomes difficult. On the other hand, if the amount of the inert particles is 1
If it exceeds 5 parts by weight, the thermal adhesiveness of the thermal adhesive resin layer is undesirably reduced.
【0025】不活性粒子としては、二酸化珪素、酸化チ
タン、炭酸カルシウム、ケイ酸カルシウム、硫酸バリウ
ム、リン酸カルシウム、酸化アルミニウム、酸化マグネ
シウム、カオリナイト、タルク、マイカ、ゼオライト等
の無機粒子、ベンゾグアナミン樹脂架橋体、スチレン樹
脂等の有機粒子等を用いることができる。これらの内
で、特に、二酸化珪素は、屈折率が基材フィルムとして
使用されるポリエステル樹脂に非常に近いため、例え
ば、ヘイズ値が5%以下という様な透明性に優れたコン
デンサー用ポリエステルフィルムが得られる点で好適で
ある。Examples of the inert particles include inorganic particles such as silicon dioxide, titanium oxide, calcium carbonate, calcium silicate, barium sulfate, calcium phosphate, aluminum oxide, magnesium oxide, kaolinite, talc, mica, and zeolite, and crosslinked benzoguanamine resin. And organic particles such as styrene resin. Among these, in particular, since silicon dioxide has a refractive index very close to that of the polyester resin used as the base film, for example, a polyester film for capacitors having excellent transparency such as a haze value of 5% or less is required. It is preferable in that it can be obtained.
【0026】上記非晶性ポリエステル系共重合樹脂に
は、その性能を阻害しない程度でその他の成分、例え
ば、上記した不活性粒子以外の滑剤、ワックス類等を添
加しても良い。The above-mentioned amorphous polyester-based copolymer resin may contain other components, for example, a lubricant other than the above-mentioned inert particles, waxes, etc. to such an extent that its performance is not impaired.
【0027】表面自由エネルギーにおける水素結合力成
分項γshが5〜15mN/mの範囲内にあり、且つ水
素分散力成分項γsdが30〜45mN/mの範囲内に
ある熱接着性樹脂層を形成するには、該樹脂層を形成す
るために用いる非晶性ポリエステル系共重合樹脂の構成
成分であるジカルボン酸とグリコール中の親水性基と疎
水性基の組み合わせ、その割合等を適宜調整すればよ
い。また、不活性粒子の親水性や疎水性等の特性や配合
量も熱接着性樹脂層の表面自由エネルギーに多少影響す
るので、使用する不活性粒子の種類や配合量について
も、熱接着性樹脂層の表面自由エネルギーが、上記範囲
内になるように決める必要がある。Forming a heat-adhesive resin layer in which the hydrogen bonding force component term γsh in the surface free energy is in the range of 5 to 15 mN / m and the hydrogen dispersion force component term γsd is in the range of 30 to 45 mN / m. In order to adjust the combination of the hydrophilic group and the hydrophobic group in the dicarboxylic acid and glycol, which are the constituent components of the amorphous polyester copolymer resin used to form the resin layer, and the proportions thereof are appropriately adjusted. Good. In addition, since the properties and blending amount of the inert particles such as hydrophilicity and hydrophobicity have some influence on the surface free energy of the thermoadhesive resin layer, the type and blending amount of the inert particles to be used is It is necessary to determine the surface free energy of the layer to be within the above range.
【0028】該熱接着性樹脂層は、熱傾斜測定器による
熱接着開始温度が80〜120℃の範囲内にあることが
好ましい。熱接着開始温度がこの範囲内にあることによ
って、耐ブロッキング性と熱接着性の両方について、特
に優れた特性を有する熱接着性樹脂層となる。熱接着開
始温度が80℃を下回るとブロッキングが生じ易くな
り、夏期にはブロッキングによりコンデンサー用に加工
することが困難になる。一方、熱接着開始温度が120
℃を上回ると、熱接着性が低下して熱接着性樹脂層とコ
ンデンサーの導体層を形成する金属とを接着させる際に
微小空間ができ、コンデンサーとして絶縁破壊が生じ易
くなるので好ましくない。It is preferable that the thermoadhesive resin layer has a thermoadhesion initiation temperature measured by a thermogradient in the range of 80 to 120 ° C. When the thermal bonding initiation temperature is within this range, a thermal adhesive resin layer having particularly excellent properties with respect to both blocking resistance and thermal adhesiveness can be obtained. If the thermal bonding initiation temperature is lower than 80 ° C., blocking tends to occur, and in summer, blocking makes it difficult to process for capacitors. On the other hand, when the thermal bonding starting temperature is 120
If the temperature is higher than 0 ° C., it is not preferable because the thermal adhesiveness is reduced and a minute space is formed when the thermal adhesive resin layer and the metal forming the conductor layer of the capacitor are bonded to each other, and dielectric breakdown easily occurs as a capacitor.
【0029】コンデンサー用ポリエステルフィルムの製
造方法 以下、本発明のコンデンサー用ポリエステルフィルムの
製造方法の一例について説明する。Production of polyester film for condenser
Manufacturing Method Hereinafter, an example of a method for manufacturing the polyester film for a capacitor of the present invention will be described.
【0030】まず、ポリエステル樹脂を用いて所定の大
きさの基材フィルムを作製する。基材フィルムの作製方
法については特に限定的ではないが、例えば、ポリエス
テル樹脂を融点を超える温度で押出機により溶融押出
し、ガラス転移温度以下に冷却して未延伸フィルムとす
る。次いで、この未延伸フィルムを長さ方向及び幅方向
に2軸延伸する。延伸方法については、特に限定的では
なく、同時に2軸方向の延伸を行う方法、逐次2軸方向
の延伸を行う方法のどちらでも良い。長さ方向及び幅方
向の延伸倍率は、それぞれ、3〜5倍程度とすることが
好ましく、3.5〜4倍程度とすることがより好まし
い。First, a base film having a predetermined size is prepared using a polyester resin. The method for producing the base film is not particularly limited. For example, the polyester resin is melt-extruded at a temperature higher than the melting point by an extruder, and cooled to a glass transition temperature or lower to obtain an unstretched film. Next, the unstretched film is biaxially stretched in the length direction and the width direction. The stretching method is not particularly limited, and may be a method of simultaneously stretching in the biaxial direction or a method of sequentially stretching in the biaxial direction. The stretching ratio in the length direction and the width direction is preferably about 3 to 5 times, and more preferably about 3.5 to 4 times.
【0031】次に、熱接着性樹脂層用のポリエステル系
共重合樹脂を有機溶媒中に溶解し、これに不活性粒子を
添加して、熱接着性樹脂層形成用溶液を調製する。有機
溶媒としては、トルエン、メチルエチルケトン、酢酸エ
チル等を用いることができる。該溶液中のポリエステル
共重合樹脂の量は、例えば、固形分量として1〜20重
量%程度とすればよい。Next, the polyester-based copolymer resin for the heat-adhesive resin layer is dissolved in an organic solvent, and inert particles are added thereto to prepare a heat-adhesive resin layer forming solution. As the organic solvent, toluene, methyl ethyl ketone, ethyl acetate and the like can be used. The amount of the polyester copolymer resin in the solution may be, for example, about 1 to 20% by weight as a solid content.
【0032】次いで、熱接着性樹脂層形成用溶液を基材
フィルムに塗布する。塗布量は、乾燥塗布量として、
0.1〜2g/m2程度となる量とすることが好まし
い。Next, a solution for forming a heat-adhesive resin layer is applied to the base film. The coating amount is the dry coating amount,
The amount is preferably about 0.1 to 2 g / m 2 .
【0033】熱接着性樹脂層は、基材フィルムの少なく
とも一方の面に形成する。具体的には、巻き取り型コン
デンサーの誘電体フィルムとしての使用形態に応じて、
熱接着性が要求される基材フィルム面に形成すればよ
い。The heat-adhesive resin layer is formed on at least one surface of the substrate film. Specifically, depending on the usage of the winding type capacitor as a dielectric film,
What is necessary is just to form on the base film surface which requires thermal adhesiveness.
【0034】その後、熱接着性樹脂層形成用溶液を塗布
したフィルムを乾燥することによってコンデンサー用ポ
リエステルフィルムを得ることができる。乾燥は、有機
溶媒を乾燥除去できる温度で、有機溶媒が十分除去され
るまで行えば良く、例えば、80℃程度で0.5分程度
乾燥すればよい。Thereafter, the film coated with the heat-adhesive resin layer forming solution is dried to obtain a polyester film for a capacitor. Drying may be performed at a temperature at which the organic solvent can be dried and removed until the organic solvent is sufficiently removed. For example, drying may be performed at about 80 ° C. for about 0.5 minutes.
【0035】この様にして得られたコンデンサー用ポリ
エステルフィルムは、常法により巻き取った後、通常、
コンデンサー用フィルムとして適した幅に切断して巻き
取る操作であるスリットを行う。The thus obtained polyester film for a capacitor is wound up by a conventional method,
A slit is performed, which is an operation of cutting and winding into a width suitable for a film for a capacitor.
【0036】本発明のコンデンサー用ポリエステルフィ
ルムは、熱接着性樹脂層を含めた全体の厚さが、3〜3
0μm程度であることが好ましい。該フィルムが薄すぎ
る場合には、巻き取りの際に皺が入りやすく、作業性が
悪くなる。一方、フィルムが厚すぎると、巻き取り後の
径が大きくなりすぎる。The polyester film for a capacitor of the present invention has a total thickness of 3 to 3 including the heat-adhesive resin layer.
It is preferably about 0 μm. If the film is too thin, wrinkles are likely to be formed during winding, resulting in poor workability. On the other hand, if the film is too thick, the diameter after winding becomes too large.
【0037】コンデンサーの製造方法 本発明のコンデンサー用ポリエステルフィルムは、例え
ば、常法に従って、該ポリエステルフィルムと金属箔又
は金属蒸着プラスチックフィルムとを、該ポリエステル
フィルムの熱接着性樹脂層と金属箔又は蒸着された金属
とが接するように重ねて巻き取り、加熱圧着することに
よって、巻き取り型コンデンサーとすることができる。 Method for Producing a Capacitor The polyester film for a capacitor of the present invention may be prepared , for example, by subjecting the polyester film and a metal foil or a metal-deposited plastic film to a heat-adhesive resin layer of the polyester film and a metal foil or a vapor-deposited film according to a conventional method. The rolled-up capacitor can be obtained by stacking and winding so as to be in contact with the metal that has been made, and then by heating and pressing.
【0038】導体層を形成する金属箔又は金属蒸着プラ
スチックフィルムに用いられる金属としては、アルミニ
ウム、パラジウム、亜鉛、ニッケル、金、銀、銅、イン
ジウム、錫、クロム、チタンなどが挙げられる。代表的
には、アルミニウムが用いられる。金属箔の厚さは、好
ましくは3μm〜12μm程度(例えば6μm程度)で
ある。金属蒸着プラスチックフィルムの厚さは、好まし
くは3μm〜12μm程度(例えば6μm程度)であ
る。金属蒸着プラスチックフィルムの基材としては、任
意の適切なプラスチックフィルム(例えば、ポリエステ
ルフィルム)が用いられる。Examples of the metal used for the metal foil or the metal-deposited plastic film forming the conductor layer include aluminum, palladium, zinc, nickel, gold, silver, copper, indium, tin, chromium, and titanium. Typically, aluminum is used. The thickness of the metal foil is preferably about 3 μm to 12 μm (for example, about 6 μm). The thickness of the metal-deposited plastic film is preferably about 3 μm to 12 μm (for example, about 6 μm). Any appropriate plastic film (for example, polyester film) is used as a base material of the metal-deposited plastic film.
【0039】コンデンサーの製造方法をより具体的に説
明すると、例えば、厚さ6μmのアルミ金属箔および/
またはアルミ蒸着ポリエステルフィルムと上記コンデン
サー用ポリエステルフィルムの熱接着性樹脂層とを接触
させるようにして、ロールが幅20mm〜100mm程
度となるようにして、重ねて巻き取る。得られた巻き取
りフィルムリールを、例えば、120〜200℃程度の
温度、5〜10kgf/cm2程度の圧力で、1〜5時
間程度熱圧着することにより熱接着を行う。次いで、こ
の巻き取りフィルムの両端面に金属溶射によって外部電
極を形成し、この外部電極にリード線を溶接することに
よって巻取り型コンデンサー素子が得られる。The method of manufacturing the capacitor will be described more specifically. For example, an aluminum metal foil having a thickness of 6 μm and / or
Alternatively, the aluminum-deposited polyester film is brought into contact with the heat-adhesive resin layer of the above-mentioned polyester film for a capacitor, and the roll is wound up with a width of about 20 mm to 100 mm. The obtained wound film reel is thermally bonded at a temperature of, for example, about 120 to 200 ° C. and a pressure of about 5 to 10 kgf / cm 2 for about 1 to 5 hours to perform thermal bonding. Next, external electrodes are formed on both end surfaces of the wound film by metal spraying, and a lead wire is welded to the external electrodes to obtain a wound capacitor element.
【0040】[0040]
【発明の効果】本発明のコンデンサー用ポリエステルフ
ィルムは、優れた熱接着性と耐ブロッキング性を有する
ものである。The polyester film for a capacitor of the present invention has excellent heat adhesion and blocking resistance.
【0041】この様なポリエステルフィルムを無外装コ
ンデンサー用の誘電体として用いることによって、ブロ
ッキングトラブルを防止でき、巻き取り型コンデンサー
への加工性が良好になる。また、得られたコンデンサー
は、熱接着性が良好で、長期の耐湿性や耐熱性等に優
れ、良好な耐久性を有するものとなる。By using such a polyester film as a dielectric for a non-exterior capacitor, a blocking trouble can be prevented, and the processability of a wound-type capacitor can be improved. Further, the obtained capacitor has good thermal adhesiveness, excellent long-term moisture resistance and heat resistance, and has good durability.
【0042】特に、不活性粒子として二酸化珪素を用い
る場合には、フィルムの透明性が良好であるため、フィ
ルム加工時に欠陥部を容易に見つけることができる点で
有利である。In particular, when silicon dioxide is used as the inert particles, the transparency of the film is good, which is advantageous in that a defective portion can be easily found at the time of processing the film.
【0043】[0043]
【実施例】以下、本発明を実施例により具体的に説明す
るが、本発明はこれらの実施例に限定されない。EXAMPLES Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Examples.
【0044】実施例1 非晶性ポリエステル系共重合樹脂として、商標名:バイ
ロンRV20SS(固形分30重量%)のポリエステル
系共重合樹脂と、商標名:バイロンRV30SS(固形
分30重量%)のポリエステル系共重合樹脂(いずれも
東洋紡績(株)社製)の二種類を用い、これらを固形分
重量として、1:1となるように配合し、固形分濃度が
5重量%になるようにメチルエチルケトンに溶解した。
次いで、この溶液に球状の二酸化珪素(日産化学工業
(株)社製、商標名:MEK−ST(固形分量30重量
%、平均粒径15nm))をポリエステル系共重合樹脂
100重量部に対して、固形分量換算で5重量部となる
ように添加して、熱接着性樹脂層形成用溶液を調製し
た。Example 1 As an amorphous polyester copolymer resin, a polyester copolymer resin having a trade name of Viron RV20SS (solid content of 30% by weight) and a polyester having a trade name of Byron RV30SS (solid content of 30% by weight) were used. Two types of copolymer resins (both manufactured by Toyobo Co., Ltd.) were used, and these were blended so as to have a solid content of 1: 1 and methyl ethyl ketone so that the solid content concentration was 5% by weight. Was dissolved.
Next, spherical silicon dioxide (manufactured by Nissan Chemical Industries, Ltd., trade name: MEK-ST (solid content: 30% by weight, average particle size: 15 nm)) was added to this solution based on 100 parts by weight of the polyester-based copolymer resin. To obtain a thermoadhesive resin layer forming solution by adding 5 parts by weight in terms of solid content.
【0045】基材フィルムとしては、厚さ12μmの2
軸延伸した結晶性ポリエステルフィルム(東洋紡績
(株)社製、商標名:E5107、アンチモン元素を1
30ppm含有)を用い、この基材フィルムの片面に、
上記した熱接着性樹脂層形成用溶液をリバースコーター
により塗工し、乾燥温度100℃で乾燥し、乾燥塗工量
が0.5g/m2のコンデンサー用ポリエステルフィル
ムを得た。As a base film, 2 μm thick 12 μm
An axially stretched crystalline polyester film (manufactured by Toyobo Co., Ltd., trade name: E5107, antimony element 1
30 ppm) on one side of the base film,
The above-mentioned solution for forming a heat-adhesive resin layer was applied by a reverse coater and dried at a drying temperature of 100 ° C. to obtain a polyester film for capacitors having a dry coating amount of 0.5 g / m 2 .
【0046】このコンデンサー用ポリエステルフィルム
と、厚さ6μmのアルミ蒸着2軸延伸ポリエステルフィ
ルムとを、熱接着性樹脂層とアルミ蒸着面とが重なるよ
うにして巻き取り、幅40mm、外形15mmφの巻き
取りリールを得た。このリールを140℃、圧力5kg
f/cm2で2時間プレスし、その両端に金属溶射によ
って外部電極を形成し、この外部電極にリード線を溶接
して巻き取り型コンデンサー素子を作製した。The polyester film for a capacitor and a 6 μm-thick aluminum-evaporated biaxially stretched polyester film are wound so that the heat-adhesive resin layer and the aluminum-evaporated surface overlap each other, and are wound to a width of 40 mm and an outer diameter of 15 mmφ. Got a reel. This reel is 140 ° C, pressure 5kg
Pressing was performed at f / cm 2 for 2 hours, external electrodes were formed on both ends of the external electrodes by metal spraying, and lead wires were welded to the external electrodes to produce a wound-type capacitor element.
【0047】上記方法で得られたコンデンサー用ポリエ
ステルフィルムと巻き取り型コンデンサー素子につい
て、以下の方法で物性測定及び性能評価を行った。結果
を下記表1及び表2に示す。The polyester film for a capacitor and the take-up type capacitor element obtained by the above method were measured for physical properties and evaluated for performance by the following methods. The results are shown in Tables 1 and 2 below.
【0048】(1)表面自由エネルギーの測定評価 協和界面科学社製の接触角計を用いて、20℃×65%
RHの条件下で、ポリエステルフィルムの熱接着性樹脂
層表面に接する水と2ヨウ化メチレンの接触角θwとθy
を測定し、これらの測定値からD.K.Qwensらによって、j
ournal of Applied polymer Science, Vol.13,P.17
41〜1747('69)に記載された方法に従って、表面自由
エネルギーのγsh(水素結合力成分項)とγsd(水
素分散力成分項)を算出した。(1) Measurement and evaluation of surface free energy 20 ° C. × 65% using a contact angle meter manufactured by Kyowa Interface Science Co., Ltd.
Under the condition of RH, the contact angles θw and θy between water and methylene diiodide in contact with the surface of the heat-adhesive resin layer of the polyester film
DKQwens et al., From these measurements j
ournal of Applied polymer Science, Vol.13, P.17
According to the method described in 41 to 1747 ('69), γsh (term of hydrogen bonding force component) and γsd (term of hydrogen dispersion force component) of surface free energy were calculated.
【0049】(2)熱接着開始温度の評価 熱接着性樹脂層を形成したポリエステルフィルムの熱接
着性樹脂の塗工面と非塗工面とを合わせ、熱傾斜測定装
置(TOYO SEIKI社製GRADIENT TYPE HG-100)によりエア
ー圧2kgf/cm2、圧着時間60秒間で50℃から
10℃刻みで120℃まで温度調節を行い、熱圧着を実
施した。熱傾斜測定装置から熱圧着されたフィルムを取
り出し、手で熱圧着されたフィルムを剥がし、剥離に抵
抗を示す際の温度を熱接着開始温度とした。(2) Evaluation of Thermal Adhesion Initiation Temperature The thermal adhesive resin coated surface and the non-coated surface of the polyester film on which the thermal adhesive resin layer was formed were joined, and a thermal gradient measuring device (TOYO SEIKI's GRADIENT TYPE HG) was used. -100), the temperature was adjusted from 50 ° C. to 120 ° C. in steps of 10 ° C. with an air pressure of 2 kgf / cm 2 and a pressing time of 60 seconds, and thermocompression bonding was performed. The thermocompression-bonded film was taken out of the thermal gradient measuring device, and the thermocompression-bonded film was peeled off by hand.
【0050】(3)耐ブロッキング性の評価 熱接着性樹脂層を形成したポリエステルフィルムを5c
m×5cmに切断し、熱接着性樹脂の塗工面と非塗工面
を合わせて25kgfの荷重をかけ、60℃で24時間
熱風乾燥機に放置し、塗工面と非塗工面を合わせたフィ
ルムを取り出した。重ね合わせたフィルムを幅2.5c
mに短冊状に切り出し、テンシロン(東洋ボードウィン
社製、RTM−100)を用い、200mm/分の速度
で剥離して剥離強度を測定した。測定は5回行い、平均
剥離強度が1gf/2.5cm未満を○、1gf/2.
5cm以上、10gf/2.5cm未満を△、10gf
/2.5cm以上を×とした。(3) Evaluation of blocking resistance The polyester film on which the heat-adhesive resin layer was formed
m × 5 cm, and the coated surface and uncoated surface of the heat-adhesive resin were applied with a load of 25 kgf, left in a hot air drier at 60 ° C. for 24 hours, and the film with the coated and uncoated surfaces was bonded. I took it out. 2.5c width of laminated film
m, and was peeled at a speed of 200 mm / min using Tensilon (RTM-100, manufactured by Toyo Boardwin Co., Ltd.), and the peel strength was measured. The measurement was performed 5 times. When the average peel strength was less than 1 gf / 2.5 cm, ○, 1 gf / 2.
5 cm or more and less than 10 gf / 2.5 cm
/2.5 cm or more was evaluated as x.
【0051】(4)フィルムヘイズの評価 熱接着性樹脂層を形成したポリエステルフィルムについ
て、ヘイズメーター(東京電色社製、MODEL TC
−H3DP)を用いて、JIS K 6714に準じて
ヘイズ値を測定した。(4) Evaluation of Film Haze For the polyester film on which the heat-adhesive resin layer was formed, a haze meter (MODEL TC manufactured by Tokyo Denshoku Co., Ltd.) was used.
-H3DP), and the haze value was measured according to JIS K6714.
【0052】(5)コンデンサーの耐久性 65℃×95%RH雰囲気下で、巻き取り型コンデンサ
ー素子に直流20kVを印加してエージングを行い、静
電気容量変化率を測定した。1000時間後の静電気容
量変化率ΔC/Cが±8%以内であるものを耐久性が良
好、±8%よりも大きいものを耐久性が不良と判定し
た。(5) Durability of Capacitor In a 65 ° C. × 95% RH atmosphere, a aging was performed by applying a direct current of 20 kV to the take-up type capacitor element, and the electrostatic capacity change rate was measured. Those having an electrostatic capacity change rate ΔC / C after 1000 hours of within ± 8% were judged to have good durability, and those having a rate of change larger than ± 8% were judged to be poor in durability.
【0053】比較例1 商標名:バイロンRV20SS(固形分30重量%)の
非晶性ポリエステル系共重合樹脂と、商標名:バイロン
RV30SS(固形分30重量%)の非晶性ポリエステ
ル系共重合樹脂(いずれも東洋紡績(株)社製)を、固
形分量として1:1(重量比)となるように配合し、固
形分濃度が5重量%になるようにトルエンとメチルエチ
ルケトンの1:1溶液に溶解した。次いで、この溶液に
無定型の二酸化珪素(富士シリシア(株)社製、商標
名:サイリシア430、平均粒径2.5μm)をポリエ
ステル系共重合樹脂100重量部に対して、固形分量換
算で2重量部となるように添加して、熱接着性樹脂層形
成用溶液を調製した。Comparative Example 1 Amorphous polyester copolymer resin having a trade name of Byron RV20SS (solid content of 30% by weight) and an amorphous polyester copolymer resin having a trade name of Byron RV30SS (solid content of 30% by weight) (All manufactured by Toyobo Co., Ltd.) were blended so that the solid content was 1: 1 (weight ratio), and the solid content was changed to 1: 1 solution of toluene and methyl ethyl ketone such that the solid content concentration became 5% by weight. Dissolved. Next, amorphous silicon dioxide (trade name: Sylysia 430, manufactured by Fuji Silysia K.K., average particle size: 2.5 μm) was added to this solution in terms of solid content based on 100 parts by weight of the polyester-based copolymer resin. The solution was added so as to be in parts by weight to prepare a solution for forming a heat-adhesive resin layer.
【0054】この熱接着性樹脂層形成用溶液用いて、実
施例1と同様にして、コンデンサー用ポリエステルフィ
ルムを作製した。Using this solution for forming a heat-adhesive resin layer, a polyester film for a capacitor was produced in the same manner as in Example 1.
【0055】更に、得られたコンデンサー用ポリエステ
ルフィルムを用いて、実施例1と同様にして巻き取り型
コンデンサー素子を作製した。Further, a roll-up type capacitor element was produced in the same manner as in Example 1 using the obtained polyester film for a capacitor.
【0056】上記方法で得られたコンデンサー用ポリエ
ステルフィルムと巻き取り型コンデンサー素子につい
て、実施例1と同様にして物性測定及び性能評価を行っ
た。結果を下記表1及び表2に示す。With respect to the polyester film for a capacitor and the take-up type capacitor element obtained by the above method, physical properties were measured and performance was evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2 below.
【0057】比較例2 水分散ポリエステル系共重合樹脂(東洋紡績(株)製、
商標名:バイロナールMD−1250(固形分30重量
%))を固形分量が5重量%となるように、水とイソプ
ロピルアルコールの1:1(重量比)溶液に稀釈分散さ
せた。次いで、この溶液に、球状の二酸化珪素(日産化
学工業(株)社製、コロイダルシリカOL(固形分20
重量%、平均粒径40nm))を、ポリエステル共重合
樹脂100重量部に対して、固形分量換算で0.05重
量部となるように添加して、熱接着性樹脂層形成用溶液
を調製した。Comparative Example 2 Water-dispersed polyester copolymer resin (manufactured by Toyobo Co., Ltd.
(Trade name: Vironal MD-1250 (solid content 30% by weight)) was diluted and dispersed in a 1: 1 (weight ratio) solution of water and isopropyl alcohol so that the solid content was 5% by weight. Next, spherical silicon dioxide (colloidal silica OL (Nissan Chemical Industry Co., Ltd.)
% By weight and an average particle size of 40 nm) were added to 100 parts by weight of the polyester copolymer resin so as to be 0.05 parts by weight in terms of the solid content to prepare a solution for forming a heat-adhesive resin layer. .
【0058】この熱接着性樹脂層形成用溶液用いて、実
施例1と同様にして、コンデンサー用ポリエステルフィ
ルムを作製した。Using this solution for forming a heat-adhesive resin layer, a polyester film for a capacitor was produced in the same manner as in Example 1.
【0059】更に、得られたコンデンサー用ポリエステ
ルフィルムを用いて、実施例1と同様にして巻き取り型
コンデンサー素子を作製した。Further, using the obtained polyester film for a capacitor, a roll-up type capacitor element was produced in the same manner as in Example 1.
【0060】上記方法で得られたコンデンサー用ポリエ
ステルフィルムと巻き取り型コンデンサー素子につい
て、実施例1と同様にして物性測定及び性能評価を行っ
た。結果を下記表1及び表2に示す。With respect to the polyester film for a capacitor and the take-up type capacitor element obtained by the above method, physical properties were measured and performance was evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2 below.
【0061】比較例3 水分散ポリエステル系共重合樹脂(東洋紡績(株)製、
商標名:バイロナールMD−1250(固形分30重量
%))を固形分量が5重量%となるように水とイソプロ
ピルアルコールの1:1(重量比)溶液に稀釈分散し
た。次いで、この溶液に、制電防止剤として松本油脂製
薬(株)製TB−702(固形分40重量%)をポリエ
ステル共重合樹脂100重量部に対して5重量部添加
し、更に、球状の二酸化珪素(日産化学工業(株)社
製、コロイダルシリカOL(固形分30重量%、平均粒
径40nm))を、ポリエステル共重合樹脂100重量
部に対して、固形分換算で0.05重量部添加して熱接
着性樹脂層形成用溶液を調製した。Comparative Example 3 Water-dispersed polyester copolymer resin (manufactured by Toyobo Co., Ltd.
(Trade name: Vironal MD-1250 (solid content 30% by weight)) was diluted and dispersed in a 1: 1 (weight ratio) solution of water and isopropyl alcohol so that the solid content was 5% by weight. Next, 5 parts by weight of TB-702 (solid content: 40% by weight) manufactured by Matsumoto Yushi Seiyaku Co., Ltd. was added as an antistatic agent to 100 parts by weight of the polyester copolymer resin. Silicon (manufactured by Nissan Chemical Industries, Ltd., colloidal silica OL (solid content: 30% by weight, average particle size: 40 nm)) was added in an amount of 0.05 part by weight in terms of solid content based on 100 parts by weight of the polyester copolymer resin. Thus, a solution for forming a heat-adhesive resin layer was prepared.
【0062】この熱接着性樹脂層形成用溶液用いて、実
施例1と同様にしてコンデンサー用ポリエステルフィル
ムを作製した。Using this solution for forming a heat-adhesive resin layer, a polyester film for a capacitor was produced in the same manner as in Example 1.
【0063】更に、得られたコンデンサー用ポリエステ
ルフィルムを用いて、実施例1と同様にして巻き取り型
コンデンサー素子を作製した。Further, a roll-up type capacitor element was produced in the same manner as in Example 1 using the obtained polyester film for a capacitor.
【0064】上記方法で得られたコンデンサー用ポリエ
ステルフィルムと巻き取り型コンデンサー素子につい
て、実施例1と同様にして物性測定及び性能評価を行っ
た。結果を下記表1及び表2に示す。With respect to the polyester film for a capacitor and the take-up type capacitor element obtained by the above method, physical properties were measured and performance was evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2 below.
【0065】[0065]
【表1】 [Table 1]
【0066】[0066]
【表2】 [Table 2]
【0067】以上の結果から明らかなように、実施例1
で得られたコンデンサー用ポリエステルフィルムは、耐
ブロッキング性が良好であり、しかも、ヘイズ値が低
く、透明性が良好であった。また、このコンデンサー用
フィルムを用いて得られた巻き取り型コンデンサーは、
熱接着性樹脂層と導電層の密着性が優れているため、耐
久性が良好であった。As is clear from the above results, Example 1
The polyester film for capacitors obtained in (1) had good blocking resistance, low haze value, and good transparency. In addition, winding type capacitors obtained using this capacitor film are
Since the adhesion between the heat-adhesive resin layer and the conductive layer was excellent, the durability was good.
【0068】これに対して、比較例1で得たコンデンサ
ー用ポリエステルフィルムは、実施例1で得たフィルム
と比べると、透明性が劣るものであった。また、このフ
ィルムを用いて得られた巻き取り型コンデンサーは、熱
接着性が悪く、耐久性が不十分であった。On the other hand, the polyester film for a capacitor obtained in Comparative Example 1 was inferior in transparency to the film obtained in Example 1. Further, the wound-type capacitor obtained by using this film had poor heat adhesion and was insufficient in durability.
【0069】比較例2と比較例3のコンデンサー用ポリ
エステルフィルムは、耐ブロッキング性が良好でヘイズ
値も実施例のものと同様に低く、透明性は良好であった
が、熱接着性が悪いため、コンデンサーの耐久性は劣る
ものであった。The polyester films for capacitors of Comparative Examples 2 and 3 had good blocking resistance and a low haze value as in the examples, and had good transparency, but had poor heat adhesion. The durability of the condenser was inferior.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01G 4/32 301 H01G 4/32 301B // B32B 27/36 B32B 27/36 Fターム(参考) 4F006 AA35 AB35 AB76 BA01 CA08 DA04 4F100 AA20B AA20H AA29A AA29H AK41A AK41B AK41J AL01B AL05 BA02 BA03 BA06 BA10B BA13 CA23A CA23B EH46B EJ38A GB41 JA12B JA13B JB04B JB07 JJ03 JL00 JL01 JL12B JN01 JN02 YY00 YY00A YY00B YY00H 4J002 CF031 CF061 CF081 DE126 GQ00 4J004 AA15 AA18 AB01 AB03 CA06 CC02 EA01 FA05 5E082 AB05 BC19 BC23 EE03 EE07 EE37 FF15 FG06 FG36 FG51 FG54 MM22 MM24 PP03 PP06──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01G 4/32 301 H01G 4/32 301B // B32B 27/36 B32B 27/36 F term (reference) 4F006 AA35 AB35 AB76 BA01 CA08 DA04 4F100 AA20B AA20H AA29A AA29H AK41A AK41B AK41J AL01B AL05 BA02 BA03 BA06 BA10B BA13 CA23A CA23B EH46B EJ38A GB41 JA12B JA13B JB04B JB07 JJ03 JL00 JL01 JL12B JN01 JN02 YY00 YY00A YY00B YY00H 4J002 CF031 CF061 CF081 DE126 GQ00 4J004 AA15 AA18 AB01 AB03 CA06 CC02 EA01 FA05 5E082 AB05 BC19 BC23 EE03 EE07 EE37 FF15 FG06 FG36 FG51 FG54 MM22 MM24 PP03 PP06
Claims (7)
少なくとも片面に熱接着性樹脂層を積層した熱接着性ポ
リエステルフィルムであって、 該熱接着性樹脂層が非晶性ポリエステル系共重合樹脂及
び球状の不活性粒子を主たる構成成分とし、該熱接着性
樹脂層表面の表面自由エネルギーにおける水素結合力成
分項γshが5〜15mN/m且つ水素分散力成分項γ
sdが30〜45mN/mであり、該不活性粒子が該非
晶性ポリエステル系共重合樹脂100重量部に対して1
〜15重量部配合されていることを特徴とするコンデン
サー用ポリエステルフィルム。1. A heat-adhesive polyester film in which a heat-adhesive resin layer is laminated on at least one surface of a base film made of a polyester resin, wherein said heat-adhesive resin layer is made of an amorphous polyester-based copolymer resin and a spherical resin. And the hydrogen bonding force component γsh in the surface free energy of the surface of the thermo-adhesive resin layer is 5 to 15 mN / m and the hydrogen dispersing force component γ
sd is 30 to 45 mN / m, and the inactive particles are 1 to 100 parts by weight of the amorphous polyester copolymer resin.
A polyester film for a capacitor, which is blended in an amount of 15 to 15 parts by weight.
基材フィルムに積層された熱接着性樹脂層の乾燥塗布量
が0.1g/m2〜2.0g/m2であり、かつ熱傾斜測
定器による熱接着開始温度が80〜120℃であること
を特徴とする請求項1記載のコンデンサー用ポリエステ
ルフィルム。2. A heat-adhesive resin layer is formed by a coating method,
Dry coating amount of the heat adhesive resin layer laminated on the base film is 0.1g / m 2 ~2.0g / m 2 , and the thermal bonding start temperature due to thermal gradient meter is 80 to 120 ° C. The polyester film for a capacitor according to claim 1, wherein:
1又は2に記載のコンデンサー用ポリエステルフィル
ム。3. The polyester film for a capacitor according to claim 1, wherein the inert particles are silicon dioxide particles.
伸フィルムであり、該基材フィルム中に三酸化アンチモ
ンがアンチモン元素として100〜300ppm含まれ
ていることを特徴とする請求項1〜3のいずれかに記載
のコンデンサー用ポリエステルフィルム。4. The method according to claim 1, wherein the base film is a biaxially stretched film of a polyester resin, and the base film contains 100 to 300 ppm of antimony trioxide as an antimony element. The polyester film for a capacitor according to any one of the above.
〜30μmである請求項1〜4のいずれかに記載のコン
デンサー用ポリエステルフィルム。5. A heat-adhesive polyester film having a thickness of 3
The polyester film for a capacitor according to any one of claims 1 to 4, which has a thickness of from 30 to 30 µm.
が5%以下である請求項1〜5のいずれかに記載のコン
デンサー用ポリエステルフィルム。6. The polyester film for a capacitor according to claim 1, wherein the haze value of the heat-adhesive polyester film is 5% or less.
サー用ポリエステルフィルムと、金属箔または金属蒸着
プラスチックフィルムとを、該ポリエステルフィルムの
熱接着性樹脂層と金属箔または金属蒸着面とが接するよ
うに重ねて巻き取り、加熱圧着して得られる、巻き取り
型コンデンサー。7. The polyester film for a capacitor according to any one of claims 1 to 6, and a metal foil or a metal-deposited plastic film, wherein the heat-adhesive resin layer of the polyester film and the metal foil or the metal-deposited surface are provided. A winding type capacitor obtained by winding and heating and crimping in contact with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000303779A JP2002110449A (en) | 2000-10-03 | 2000-10-03 | Capacitor and polyester film therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000303779A JP2002110449A (en) | 2000-10-03 | 2000-10-03 | Capacitor and polyester film therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002110449A true JP2002110449A (en) | 2002-04-12 |
Family
ID=18784934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000303779A Pending JP2002110449A (en) | 2000-10-03 | 2000-10-03 | Capacitor and polyester film therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002110449A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004231915A (en) * | 2003-02-03 | 2004-08-19 | Lintec Corp | Adhesive sheet |
EP3736841A4 (en) * | 2018-01-25 | 2021-11-24 | Murata Manufacturing Co., Ltd. | Film capacitor, and exterior case for film capacitor |
-
2000
- 2000-10-03 JP JP2000303779A patent/JP2002110449A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004231915A (en) * | 2003-02-03 | 2004-08-19 | Lintec Corp | Adhesive sheet |
JP4579498B2 (en) * | 2003-02-03 | 2010-11-10 | リンテック株式会社 | Adhesive sheet |
EP3736841A4 (en) * | 2018-01-25 | 2021-11-24 | Murata Manufacturing Co., Ltd. | Film capacitor, and exterior case for film capacitor |
US11437190B2 (en) | 2018-01-25 | 2022-09-06 | Murata Manufacturing Co., Ltd. | Film capacitor, and exterior case for film capacitor |
US11791099B2 (en) | 2018-01-25 | 2023-10-17 | Murata Manufacturing Co., Ltd. | Film capacitor, and outer case for film capacitor |
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