JP2002107408A - High-frequency socket for bga - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency socket for BGA having a long life and good high-frequency characteristic. SOLUTION: This high-frequency socket is provided with pogo pins 3, a case having GND (ground)-processed through holes 1 holding the pogo pine 3 inside in no contact with them, and insulating sheets 4 and 4' installed on the opening faces of the through holes to fix the pogo pins.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a BGA (Ball)
The present invention relates to a high-frequency socket used when testing a Grid Array package.

[0002]

2. Description of the Related Art Conventionally, Ball Grid Arr
In order to perform an actual load test of an ay (hereinafter referred to as BGA) package, a socket for electrically connecting a tester and a device is roughly divided into a solder ball 5 and a conductive sheet 11 as shown in FIG. And a sheet type for connecting the measurement substrate 7 and a spring 12 inside as shown in FIG.
There are two types of pogo pins 3 (Pogo pin type) which are connected by holding them with a resin 13 and holding the pogo pins 3 (also referred to as spring pins or spring probe pins) which are connected by contraction when pressed from both sides.

[0003] There are two types of sheet having excellent high frequency characteristics: a thin metal wire embedded type and a conductive rubber type. The former has a problem that much dust is generated due to scraping of metal oxide, and the sheet is expensive and running cost is high. is there. In the latter case, there is a problem that the contact resistance is increased because the metal oxide adheres to the surface.

On the other hand, for the pogo pin type, which is superior in cost, various methods are being studied in order to improve the high frequency characteristics. First, the influence of inductance can be reduced as much as possible by using one having a short length. However, there is no margin in design, durability against mechanical wear is reduced, and the life is shortened. In addition, by using a coaxial structure filled with a dielectric, the effect of inductance can be suppressed and impedance matching can be achieved, but the cost increases, the dielectric constant increases, and the dielectric thickness also varies. Would. By making the pogo pins thinner, the dielectric constant can be suppressed, but on the other hand, the durability is reduced and the life is shortened. In addition, when a thick pogo pin is used, it is not possible to cope with miniaturization of the hole pitch.

[0005]

As described above, the conventional BG
In the high-frequency socket for A, good high-frequency characteristics cannot be obtained unless the size of the pogo pin is reduced, so that there is a problem that a margin is not taken in the design of the pogo pin and the life is short.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a high-frequency socket for a BGA having a long life and good high-frequency characteristics by eliminating the conventional disadvantages.

[0007]

According to the present invention, there is provided a high frequency socket for a BGA according to the present invention, comprising a pogo pin, a housing having a through hole that holds the pogo pin therein without being in contact with the pogo pin, and a GND-processed through-hole. And an insulating sheet for fixing the pogo pins, the insulating sheet being provided on the opening of the through hole.

Further, in the high frequency socket for BGA of the present invention, the housing is made of a conductive material.

Furthermore, in the high frequency socket for BGA of the present invention, the housing is made of a non-conductive material, and is provided with the through hole made of a conductive material.

Further, in the high frequency socket for BGA of the present invention, the through hole is filled with air.

Further, in the high frequency socket for BGA of the present invention, the ratio of the outer diameter d of the pogo pin to the inner diameter D of the through hole satisfies 2.07 ≦ D / d ≦ 2.53. Is what you do.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 1, a device under test (BG
A pogo pin 3 is inserted into a metal jacket 2 made of an aluminum housing having a through hole 1 formed at a position corresponding to the solder ball of the A package). Pogo pin 3
Is fixed by insulating sheets 4 and 4 ′ provided on the opening surface of the through hole 1 of the metal jacket 2, and air is filled around the pogo pins inside the through hole 1. On the insulating sheet 4, solder balls 5 of the package are provided.
For positioning, a seating seat 6 made of an insulator is provided. Note that all the through holes 1 are subjected to GND processing in the entire metal jacket 2.

The high-frequency socket for BGA thus constructed is set on a measuring board (tester) 7, and the device 8 to be measured is set at a predetermined position of the seat 6 so that the solder balls 5 are arranged. I do. In this way, the measurement substrate (tester) 7 and the device under test 8 are electrically connected,
Perform a measurement.

The high frequency socket for BGA of the present invention has a coaxial structure in which air filled between the metal jacket and the pogo pin is used as a dielectric, and uses a small pogo pin having a small design margin and a short life in the conventional art. Similar properties can be obtained with long-lived pogo pins. In addition, a dielectric layer having a uniform thickness can be obtained without using a high-cost pogo pin with a dielectric. Therefore, the life is three to four times longer than the conventional one, and the running cost can be greatly reduced.

FIG. 2 is a top view and an enlarged cross-sectional view showing an inner diameter D of the through hole 1 and an outer diameter d of the pogo pin 3.
The ratio is to reduce the dielectric constant and maintain the coaxial structure,
It is preferable that 2.07 ≦ D / d ≦ 2.53.

Further, the housing is not limited to a metal (conductive material) such as Al, but a non-conductive material can also be used.

As shown in FIG. 3, the housing is composed of a printed circuit board 9 (FR-4) made of a non-conductive material, and a copper pattern 10 is formed inside the through hole 1 formed in the printed circuit board 9 by plating. , And each is subjected to GND processing. The pogo pins 3 are inserted as in the case where the metal jacket is used. The pogo pins 3 are similarly fixed by insulating sheets 4 and 4 ′ installed on the opening surfaces of the through holes 1 of the printed circuit board 9, and air is filled around the pogo pins inside the through holes 1. A seating sheet 6 made of an insulating material is similarly provided on the insulating sheet 4 for positioning the solder balls 5 of the package. The measurement is performed by the high frequency socket for BGA thus configured in the same manner as when the metal jacket is used.

In this embodiment, the printed circuit board FR-4 is used for the housing. However, other non-conductive materials such as an epoxy board containing glass fiber such as FR-5 and BT resin can be used. Although the copper pattern is formed inside the through hole, any conductive material that can take GND can be used.

As described above, when the non-conductive material is used for the housing, the same effect as when the metal jacket is used can be obtained, and furthermore, the GND is independent and the signal lines are separated. Therefore, better high-frequency characteristics can be obtained.

[0021]

According to the present invention, it is possible to provide a high frequency socket for BGA having a long life and good high frequency characteristics.

[Brief description of the drawings]

FIG. 1 is a view showing a cross section of a high-frequency socket for BGA of the present invention.

FIG. 2 is a diagram showing a top surface and a cross section of a high frequency socket for BGA of the present invention.

FIG. 3 is a diagram showing a cross section of a high-frequency socket for BGA of the present invention.

FIG. 4 is a view showing a cross section of a conventional high frequency socket for BGA using short pogo pins.

FIG. 5 is a view showing a cross section of a conventional sheet type high frequency socket for BGA.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Through hole 2 Metal jacket 3 Pogo pin 4, 4 'Insulation sheet 5 Solder ball 6 Seating sheet 7 Measurement board (tester) 8 Device under test 9 Printed circuit board 10 Copper pattern 11 Conductive sheet 12 Spring 13 Resin

Claims (5)

[Claims] 1. A pogo pin, a housing that holds the pogo pin inside without contacting the pogo pin, and has a through-hole subjected to GND processing, and a pogo pin installed on the through-hole opening surface of the housing, A high frequency socket for BGA, comprising: an insulating sheet to be fixed. 2. The high frequency socket for BGA according to claim 1, wherein said housing is made of a conductive material. 3. The high frequency socket for a BGA according to claim 1, wherein the housing is made of a non-conductive material and includes the through hole made of a conductive material. 4. The high frequency socket for a BGA according to claim 1, wherein the through hole is filled with air. 5. The method according to claim 1, wherein a ratio of an outer diameter d of the pogo pin to an inner diameter D of the through hole satisfies 2.07 ≦ D / d ≦ 2.53. Item 2. The high frequency socket for BGA according to item 1.