JP2002102771A - Device and method for coating and device and method for manufacturing color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for coating, by which the time (tact time) necessary for treating a piece of a base board is remarkably reduced without increasing the cost for the equipment and labor by using a die coater having a structure for treating the base board intermittently with a set of a die and a device, and a method for manufacturing a color filter. SOLUTION: In the coating method for forming a coating film on the surface of the base board by moving a coater having a discharge port for discharging the coating liquid to a coating position of the substrate held on a table and discharging a coating liquid from the coater, the table is capable of holding plural base boards without overlapping, and while the coating film is formed on the base board placed at an optional base board holding position on the table, the discharge of the base bard and/or the placing of the base board is carried out at other base board holding position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is preferably used in the field of manufacturing color filters for liquid crystal displays, optical filters, panels for plasma displays and the like. The present invention relates to a coating apparatus and a coating method for applying a coating liquid in a tact time, and a color filter manufacturing apparatus and a manufacturing method using the same.

[0002]

2. Description of the Related Art As means for applying a coating liquid with high precision,
There is a die coater coating in which a coating liquid is discharged from a die having a slit-shaped discharge port to a base material separated at a fixed interval to perform coating.
In recent years, in addition to a continuous substrate such as a film, it has been applied to application to a sheet-like substrate such as glass. The application to the sheet-like substrate is different from the continuous application to the sheet-like substrate. In addition to the application to each substrate as shown in Japanese Patent Application Laid-Open No. 8-182951, the substrate is placed on a table and discharged. Various processing operations, such as movement of a table or a die, and cleaning of a die discharge port to stably obtain a predetermined film thickness at an application start portion are required. In order to improve the productivity in the coating process on a single-wafer substrate, the time required for processing one substrate (tact time) may be shortened. It is necessary to reduce the processing time.

Since it is not so easy to shorten the processing time of each processing, one of means for greatly reducing the tact time without changing the time is disclosed in JP-A-2000-117.
179 is disclosed. here,
By applying the die coater to the plurality of substrates continuously arranged on the stage without intermittent operation, the tact time per substrate can be shortened regardless of the work time of each processing.

[0004] As a means of the same idea, Japanese Patent Laid-Open No.
There is one disclosed in Japanese Patent Publication No. 0-216599.
Here, a plurality of dies and a substrate are arranged in a single die coater, and are thereby applied to a plurality of substrates simultaneously to make the substrate 1
The tact time per sheet has been reduced.

Further, a means for shortening the tact time per substrate by simply arranging a plurality of die coaters and coating the substrates in parallel can be included in the same category.

[0006]

However, the above conventional means have not been put to practical use because of the following problems. In the case of a means in which a plurality of substrates are continuously arranged on a stage and the coating is performed continuously without intermittent, when the substrates are separated after coating, the liquid separation between the substrates is not performed uniformly, and the film thickness distribution at the edge of the substrate. Becomes uneven. Further, there is a problem in that the coating liquid flows around the back surface of the substrate, thereby soiling the substrate.

Next, when a plurality of dies are simultaneously coated on a substrate, the size of the apparatus is increased and the cost of the apparatus is increased. In particular, an ultra-large die coater is required to support a meter-sized substrate, which is expected to become mainstream in the future.
It is practically impossible to increase the size while maintaining a predetermined machine precision. Further, since the application liquid filling operation, the assembling operation, and the application operation management of a plurality of dies are required, human costs are also increased.

Further, the means for simply arranging a plurality of die coaters increases the equipment cost and the human cost required for maintenance and coating work by the increased number of die coaters.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a general die coater for intermittently processing a substrate with a single die. An object of the present invention is to provide a low-cost coating apparatus and a coating method capable of greatly reducing time, and a color filter manufacturing apparatus and a manufacturing method using the same.

[0010]

In order to achieve the above object, the present invention employs the following constitution. That is, (1) a table having a substrate holding position for holding a plurality of substrates so as not to overlap each other, an applicator having a discharge port for discharging a coating liquid onto the substrate surface, and a discharge port cleaning for cleaning the discharge port. An apparatus, a coating liquid supply mechanism for supplying a coating liquid to the coating device, a moving unit for moving the coating device to a coating position of a substrate held at a substrate holding position, and a substrate mount for mounting the substrate on the table. Mounting means, a substrate discharging means for discharging the substrate from the table, and mounting the substrate to another substrate holding position while discharging the coating liquid from the applicator onto the substrate mounted at an arbitrary substrate holding position. And / or a control unit for discharging.

(2) The coating apparatus according to (1), wherein the substrate holding position is provided at two positions.

(3) The above (1) or (2), wherein the whole or a part of the application liquid supply mechanism and the discharge port cleaning device are arranged in the moving means. The coating device according to the above.

(4) The above (1) to (3), wherein two cleaning heads attached to the discharge port cleaning device for removing the coating liquid adhering to the discharge ports are arranged.
The coating device according to any one of the above.

(5) The coating device according to any one of (1) to (4), wherein the coating device has a plurality of the discharge ports.

(6) A color filter manufacturing apparatus, wherein a color filter is manufactured using the coating apparatus according to any one of the above (1) to (5).

(7) By discharging the coating liquid from the coating device while moving the coating device having a discharge port for discharging the coating liquid to the coating position of the substrate held on the table,
In the coating method for forming a coating film on a substrate surface, the table can hold a plurality of substrates without overlapping, and forms the coating film on a substrate placed at an arbitrary substrate holding position on the table. And discharging the substrate and / or placing the substrate at another substrate holding position during the application.

(8) The coating method according to (7), wherein the moving directions of the coating device at the time of forming the coating film are opposite at adjacent substrate holding positions.

(9) The coating film is formed while moving all or a part of the coating liquid supply mechanism for supplying the coating liquid to the coating device (7) or (8). Coating method.

(10) The coating method according to any one of (7) to (9), wherein the cleaning of the discharge port is performed while moving the coating device.

(11) A method for producing a color filter, comprising producing a color filter using the coating method according to any one of (7) to (10).

According to the coating apparatus and the coating method of the present invention, a die coater having a general configuration for intermittently processing a substrate with one die performs a coating step and other steps at different positions. Since the parallel processing can be performed at the same time, the tact time can be significantly reduced as compared with the related art.

Further, according to the color filter manufacturing apparatus and the manufacturing method according to the present invention, since the coating apparatus and the coating method of the present invention are used, high productivity can be achieved without increasing equipment and human costs. A color filter can be manufactured.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an example of a die coater which is a coating apparatus of the present invention, and FIG. 2 is a cross-sectional view showing an example when a stage portion of the die coater is cut perpendicularly to a coating direction. 3 is a cross-sectional view showing an example when the stage portion of the die coater is broken perpendicularly to the coating width direction, and FIG. 4 is a cross-sectional view showing an example of a die used in the die coater.

As shown in FIG. 1, the die coater 10 includes a stage 20, a die elevating unit 40, a coating liquid supply unit 60, a die 80, a transfer device 200, and a sequencer 150 for controlling the operation of these units. .

Referring to FIGS. 1 and 2, the stage 20 has substrate holders 22A and 22B mounted on a base 21 in parallel. On the base 21, a pair of linear sliders 23 and a linear motor 24 are further installed. A gate-shaped column 26 is attached to the linear slider 23 via a column base 25.
6, the die holding member 50 of the die elevating unit 40 at the center
Die 80 is attached. Therefore, die 80
Is the arrow 27 by the linear motor 24 with the support 26
It can reciprocate freely in directions A and 27B.

The die elevating section 40 has a built-in linear guide and a linear driving device for elevating and lowering the die holding member 50, so that the die 80 can be raised and lowered freely.

Substrate holder 22 located below die 80
A and 22B can suck and hold the substrate 300 at a position where they do not overlap with each other by suction holes (not shown) provided on the upper surface. As means for sucking the substrate 300,
Instead of the suction hole, a groove or a combination of the groove and the suction hole may be used.

Further, the substrate holders 22A and 22B have
Lift pins 28A, 28B and board guide pins 29A, 2
9B is built in. The lift pins 28A and 28B are connected to an AC servomotor (not shown), and freely reciprocate between predetermined positions to move the substrate 300 to the substrate holding table 22A.
It can be raised and lowered on the upper surface of 22B.

On the other hand, the board guide pins 29A and 29B are arranged along the edge of the board 300, and
Since it can be freely moved up and down by being connected to the air cylinder,
The substrate 300 can be positioned at a predetermined position on the upper surfaces of the substrate holding tables 22A and 22B. In addition, other than an air cylinder, any mechanism such as a motor drive may be used for the lifting mechanism. The positioning of the substrate 300 is performed by using the substrate guide pins 2.
This is performed by lowering the lift pins 28A, 28B supporting the substrate 300 with the 9A, 29B protruding.

Further, a coating liquid supply unit 60 is provided near the stage 20. The coating liquid supply unit 60 includes a tank 61 for supplying the coating liquid, a syringe pump 62 for feeding a constant volume of the coating liquid, a suction hose 63 connecting the tank 61 and the syringe pump 62, a syringe pump 62 and a die 80. It is constituted by a supply hose 64 connecting between the two. On the way of each of the hoses 63, 64, an on-off valve 65A, 6
5B is provided, and the application liquid in the tank 61 is supplied to the die 80 by the operation of the syringe pump 62 and the respective on-off valves 65A and 65B.

Here, referring to FIG. 2, the syringe pump 6
The 2 and the on-off valve 65B are attached to a support base 25 connected to the support 26, and have a structure capable of reciprocating on the base 21 simultaneously with the support 26 and the die 80.
As a result, even when the die 80 is moved, the supply hose 64 moves in synchronism, so that no vibration occurs, and there is no unevenness in the amount of liquid supply caused by the vibration. Does not vary, and a highly accurate film thickness distribution can be obtained.

The entire coating solution supply section 60 may be attached to the support base 25. Further, as a means for supplying a constant volume of the coating liquid, air pumping may be used in addition to a syringe pump, in addition to a gear pump, a diaphragm pump, and a tube pump.

Now, the die 80 has the cross section shown in FIG. 4, and the lip A81, the spacer 83, and the lip B82 are combined and tightened with the bolt 84 to form a slit 86 equal in thickness to the spacer 83. The lip A81 has a manifold 87 formed on a surface facing the lip B82, and is connected to an inlet 85 through which the coating liquid flows. The coating liquid supply unit 6 is
0 supply hose 64 is connected.

The coating solution flowing from the inflow port 85 spreads in the longitudinal direction of the die 80 by the manifold 87, and then is discharged from the discharge port 90 through the slit 86.
If the coating liquid flows out of the discharge port 90 while moving the die 80 in the direction of the arrow 27A or 27B, the coating liquid can be coated on the substrate.

Next, referring to FIG.
A discharge port cleaning device 100 for cleaning the vicinity of the discharge port 90 of No. 0 is also attached. The discharge port cleaning device 100 includes a cleaning unit 110, a unit holding member 101, a driving unit 120.
Consists of

The cleaning unit 110 includes a cleaning tool 111,
A cleaning tool holding member 112 for holding the liquid;
Consists of The cleaning tool 111 is provided at the discharge port 90 of the die 80.
It has a shape that can be in close contact with the vicinity, and is brought into contact with the discharge port 90 and moved in the longitudinal direction of the die.
The coating solution adhering to the periphery of the area 0 is scraped off. The scraped application liquid accumulates in the liquid receiver 114 and is discharged from the liquid receiver 114 by a suction device (not shown). Also,
The material of the cleaning tool 111 is preferably made of a polymer resin that does not damage the discharge port 90.

The movement of the cleaning unit 110 is performed by a driving unit 120 connected to the cleaning unit 110 via a unit holding member 101.

The driving section 120 is attached to the support 26 and extends in the longitudinal direction of the die 80.
1. It is composed of a linear guide 122. The cleaning unit 110 can reciprocate freely under the control of the linear motor 121. The discharge port 90 is cleaned by the die 8.
If the cleaning tool 111 is moved in the longitudinal direction of 0, it can be performed from either side. In addition, since the driving unit 120 is attached to the support 26, parallel operations such as operating the cleaning unit 110 while the die 80 is moving can be performed, which contributes to a reduction in tact time.

Referring again to FIG. 1, the die coater 10
Transfer devices 200A and 200B for carrying the substrate 300 into and out of the substrate holding tables 22A and 22B are installed on the upstream side and the downstream side in the substrate transfer direction. Transfer device 200
Reference numerals A and 200B denote robots 201A and 201B and hands 202A and 202B supporting the back surface of the substrate 300, respectively.
The substrate can be carried in and out at an arbitrary timing. Here, the robot 201A, 2
01B may be of any type, such as an articulated arm robot or a cylindrical coordinate robot. In addition, the hands 202A and 202B may hold the back surface of the substrate by suction, but it is preferable to simply support the back surface without using suction in order to save the suction operation time during the transfer of the substrate.

With the above-described apparatus configuration, it is possible to simultaneously carry in and carry out the substrate into and out of the other substrate holding table while coating the substrate held by the one substrate holding table. , Tact time can be greatly reduced.

Next, an example of the coating method of the present invention will be described with reference to FIG.

First, when the origin return of each operating portion in the die coater is performed, the die 80 moves to the standby position (above the coating start position P1). At this time, tank 6
The coating liquid has already been filled from 1 to the die 80, and the so-called air bleeding operation of discharging the coating liquid with the die facing upward and discharging the residual air inside the die has already been completed. Then, the lift pins 28A rise on the surface of the substrate holding table 22A, and wait for the placement of the substrate 300 from the hand 202A. From here, coating is performed according to the following procedures (1) to (5).

(1) The transfer device 200A is operated by a signal from the sequencer 150, and the substrate 300 is gripped by the hand 202A of the upstream transfer device 200A from the upstream device in the substrate transport direction (not shown). take out,
Next, it is mounted on the lift pins 28A. It should be noted that the thickness of the substrate 300 has been measured and the thickness data has been transferred to the sequencer 150 at the time of the upstream step (not shown). Then, based on the transferred data, the sequencer 1
At 50, the die 80 is lowered to a position where the clearance between the substrate 300 and the die 80 has a preset value.

Next, the lift pins 28A are lowered, and the substrate 300 is placed on the upper surface of the substrate holder 22A while being positioned by the substrate guide pins 29A. Then, a suction source such as a vacuum pump is operated, and the substrate 300
Is sucked and held on the substrate holding table 22A, and then the substrate guide pins 29A are lowered and retracted. (Substrate Placement on Substrate Holder 22A) (2) Next, the die 80 is horizontally moved to the application start position P1 and stopped. At the same time, the application liquid is sent from the syringe pump 62 to the die 80. Simultaneously with the start of the application liquid feeding operation of the syringe pump, a timer in the sequencer 150 starts, and after a predetermined time, a start signal is issued from the sequencer 150, and the die 80 moves horizontally to the application end position P2 at the set application speed. The movement is started, and the application is started.

When the die 80 reaches a preset position near the coating end position P2, the syringe pump 6
2 is stopped, and after the discharge of the application liquid is finished, the die elevating unit 4
0 is operated to move the die 80 upward at a high speed.

On the other hand, during this coating operation, the substrate holder 2
Another substrate is placed on 2B by the transfer device 200A. (Application on the substrate holder 22A and the substrate holder 22B
(3) After the coating on the substrate holder 22A is completed, the speed of the die 80 is increased by the linear motor 24, and the die 80 is horizontally moved to the coating start position P3 of the substrate holder 22B.

In the meantime, on the substrate holding table 22A, the coated substrate 300 is taken out. That is, the substrate 300
Is lifted, the substrate 300 is lifted by the lift pins 28, and the substrate 300 is moved to the downstream transfer device 200B.
, And carried out to the next step (not shown).

During the horizontal movement of the die 80, the syringe pump 62 is operated to charge the coating liquid in the tank 61 to the syringe pump 62 side, and the liquid is slightly adhered to the discharge port 90 after the filling is completed. A small amount of the coating liquid is discharged. Then, the cleaning tool 111 is moved in the longitudinal direction of the die 80 while being in contact with the discharge port 90, and the discharge port 90 is cleaned. (Take out the substrate at the substrate holder 22A, move and clean the die 80 horizontally) (4) Next, the coating is performed on the substrate holder 22B on which the new substrate 300 is already placed. The application is performed by moving the die 80 horizontally toward the application start position P3 to the application end position P4 while applying the application start position P1 to the syringe pump.
The same operation as when the coating is performed up to the coating end position P2 is performed and executed.

Further, during the application on the substrate holding table 22B,
The substrate 300 to be applied next is placed on the substrate holding table 22A by the transfer device 200A on the upstream side. (Application on the substrate holder 22B and placement of the substrate on the substrate holder 22A) (5) If the application is completed at the application end position P4, the die 80
Is horizontally moved to the application start position P1, and at the same time, the substrate is taken out of the substrate holding table 22B by using the transfer device 200B on the downstream side. Further, the suction operation of the syringe pump and the cleaning of the discharge port 90 of the die 80 described in (3) above are performed. However, the moving direction of the cleaning tool 111 at this time is opposite to the case of the above (3). (Removal of Substrate by Substrate Holder 22B and Horizontal Movement and Cleaning of Die 80) When the operation (5) is completed, the operation returns to the operation (2), and a series of operations (2) to (5) thereafter. Is repeated to apply the substrate sequentially.

FIG. 6 is a time chart showing a series of operations when a substrate is processed according to the above-described coating method.

FIG. 7 is a schematic diagram of Japanese Patent Application Laid-Open No. 8-182295.
It is a perspective view of a conventional die coater shown in Japanese Patent Publication No.
FIG. 8 is a time chart showing a series of operations performed by the die coater of FIG. 7 and 8, in the conventional die coater 400, first, the substrate holding table 40
While the transfer device 410 is mounting the substrate on the die 2, the die 4
Cleaning of the discharge port 03 is performed. Next, the coating liquid is discharged from the stationary die 403 while moving the substrate holding table 402 to perform coating on the substrate. After coating, substrate holder 4
02 is transferred to the transfer device 411. After the transfer of the substrates, the substrate holder returns to the initial position, and thereafter, the same operation is repeated to process the substrates one by one.

A comparison of the series of operations shown in FIGS. 6 and 8 reveals that the coating method of the present invention (FIG. 6) allows two substrates to be coated within a fixed time, whereas the conventional coating method In the method (FIG. 8), only one substrate was applied. Therefore, the time required for processing one substrate by the coating method of the present invention (tact time) can be reduced to half that of the conventional coating method, even if the respective operation times are the same. In addition, since both are comprised of only one die coater and one die, the apparatus cost and the human cost for setup and maintenance before the coating operation are the same.

In the above embodiment, the case where the number of the substrate holders is two has been described, but three or more substrate holders may be provided.

Next, another embodiment of the present invention will be described. FIG. 9 is a side sectional view showing a state in which a die 180 having two discharge ports is disassembled, and FIG. 10 is a side sectional view when a coating liquid is applied onto a substrate.

Referring to FIG. 9, the die 180 has a lip A18.
1, spacers 183A, 183 between lip B182
B and lip C193 are combined and tightened with bolts 184 to form slits 190A, 190B equal to spacers 183A, 183B. Slit 190A,
Two discharge ports 194A and 194B are formed at the tip of 190B. A notch 189 having a sharp edge at the tip of the lip C193 is provided.

The lip A 181 and the lip B 182 have respective manifolds 191 A and 191 B on the surface facing the lip C 193. The manifolds 191A and 191B are provided at the inlet 1 through which the coating solution flows.
85A and 185B. Further, each inlet 185A, 185B is connected to a die connection hose 187A, 187B.
Through B, it is connected to a switching valve 188 attached to the syringe pump 62. This switching valve 1
By controlling 88, the coating liquid sent from the syringe pump 62 can be selectively sent to the inlets 185A and 185B. The coating using the die 180 is performed by flowing the coating liquid from the inlet 185A when moving in the direction of arrow 27A, and by flowing the coating liquid from the inlet 185B when moving in the direction of arrow 27B.

This embodiment is effective when the die coater 10 shown in FIG. 1 cannot be applied unless the tip of the discharge port of the die 80 is asymmetric. In particular, in order to stabilize the liquid pool 192 formed between the tip of the die 180 and the substrate 300 even at high speed, it is known that the tip of the lip on the downstream side of the liquid pool should have a sharp edge shape. ,
In the embodiment shown in FIG. 10, either application direction 27A, 27
Also in B, since the lip shape on the downstream side of the liquid pool 192 is arranged so as to have a sharp edge, the coating speed can be increased, which is effective for further shortening the tact time.

In this embodiment, the case where the die 180 is connected to one constant volume liquid feed pump (not shown) has been described. However, the switching valve 188 is not provided, and the respective die connection hoses 187A and 187B are separately provided. It may be connected to a liquid sending pump such as a syringe pump.

The tip shape of the lip C193 is not limited to the cutout portion 189 shown in FIG. 9, but may be any shape as long as it has a sharp edge shape.

The coating method when using the die 180 is as follows. According to the coating direction, the inflow ports 185A, 185B of the die 180 are used as the liquid sending destination from the syringe pump 62.
Select Others are exactly the same as the above-mentioned coating method.

Further, another embodiment of the present invention will be described. FIG. 11 shows another cleaning unit 1 according to the present invention.
FIG. 3 is a schematic front view when 30 is viewed from a coating direction. In the present embodiment, the cleaning unit 130 includes cleaning tools 131A and 131B arranged so as to face each other, cleaning tool holding members 132A and 132B for holding these tools, and discharge ports 9 for these.
Air cylinder 133 that moves up and down in the direction away from and close to 0
A, 133B and a liquid receiver 134. This cleaning unit 130 is used instead of the cleaning unit 110 shown in FIG.

Here, the cleaning tools 131A and 131B have a shape that is in line contact with the discharge port 90, and the cleaning unit 130 is moved in the direction of 135A or 135B while making contact with the discharge port 90 so that the discharge port is formed. The coating liquid adhering around 90 is scraped off. When moving in the direction of 135A, the cleaning tool 131A is brought into contact with the discharge port 90 when moving in the direction of 135B. In this way, by bringing the cleaning tool into linear contact with the discharge port 90 in the optimum posture in each moving direction, the coating liquid can be reliably removed by one operation. This embodiment is different from the die coater 10 shown in FIG.
When removing the coating liquid adhering to 0, if the angle of the cleaning tool has directionality, one cleaning tool can only scrape in one direction, and the tact time increases due to the return operation. It is valid.

The coating liquid to which the present invention can be applied has a viscosity of 1 cps to 100,000 cps, preferably 10 cp.
s to 50,000 cps, and Newtonian is preferable from the viewpoint of applicability, but it can also be applied to a coating solution having thixotropic properties. The present invention is particularly suitable for a slit die for applying a black matrix, a coating solution for each of R, G, and B pixels, a resist solution, and an overcoat agent used in a color filter manufacturing process in a sheet-by-sheet manner.

The substrate size to which the present invention can be applied has a diagonal length of 100 mm to 2000 mm, more preferably 500 mm to 1600 mm. The substrate material may be a metal plate such as aluminum, a ceramic plate, a silicon wafer, or the like, in addition to glass.

The coating conditions to be further used include a clearance of 40 to 500 μm, more preferably 80 to 30 μm.
0 μm, coating speed 0.1 m / min to 10 m / min, more preferably 0.5 m / min to 6 m / min, die slit width 50 to 1000 μm, more preferably 100 to 600 μm
m, coating thickness is 5 to 400 μm, more preferably 20 to
250 μm.

In addition to the die coater, the present invention can be applied to nozzle coating or spray coating using a die as a nozzle or spray nozzle.

[0068]

EXAMPLE 1 On a 360 × 465 mm non-alkali glass substrate having a thickness of 0.7 mm, a pitch of 254 μm in the width direction of the substrate, a pitch of 85 μm in a longitudinal direction of the substrate, a line width of 20 μm, and the number of RGB pixels Is 4800 (substrate longitudinal direction) x 1200 (substrate width direction), diagonal length is 20 inches (305 m in substrate width direction)
m, 406 mm in the longitudinal direction of the substrate), and a black matrix film having a thickness of 1 μm was formed. The black matrix film used titanium oxynitride as a light-shielding material and polyamic acid as a binder.

Subsequently, after removing particles on the substrate by wet cleaning, a polyamic acid was used as a binder and γ-
A mixture of butyrolactone, N-methyl-2-pyrrolidone and 3-methyl-3-methoxybutanol was mixed at a solid concentration of 10% using a solvent, Pigment Red 177 as a pigment, and the viscosity was adjusted to 50 cps. The coating solution of the color was applied to the die coater 10 in FIG. 1 under the coating conditions of 100 μm in clearance and 3 m / min in coating speed.
μm was applied over the entire surface.

Here, the die has one discharge port, the discharge port length is 360 mm, and the slit width is 100 μm.
m, and a discharge port cleaning device provided with one silicon rubber cleaning tool at the tip was used.

Subsequently, after vacuum drying was carried out at 80 ° C. for 20 seconds, a resist solution having a viscosity of 8% was applied to a thickness of 10 μm using the same die, application speed, and clearance as described above, and then 90
After drying on a hot plate at 10 ° C. for 10 minutes, exposure, development, and peeling were performed to leave a color coating film only on the R pixel portion.

The same color coating film was formed for G and B colors using the same die and coating conditions as above. Here, for the G color coating solution, an R color coating solution was used to make pigment Green 36 and the viscosity was adjusted to 40 cps at a solid concentration of 10%, and for the B color coating solution, the R color coating solution was used. The pigment was adjusted to Pigment Blue 15 with a solid content of 10% and the viscosity adjusted to 50 cps.
Was used.

After forming the R, G, and B pixel films, the substrate was heated on a hot plate at 260 ° C. for 30 minutes to cure.

Finally, ITO was deposited by sputtering.

By the above steps, 100 color filters were continuously formed.

Here, the tact time for applying R, G, B and resist was 15 seconds on average. Further, the obtained color filter was uniform in chromaticity over the entire surface of the substrate, and was excellent in quality.

Comparative Example 1 In this comparative example, a color filter was manufactured under exactly the same conditions as in Example 1 except that the die coater of FIG. 7 was used as a die coater for applying R, G, B, and resist. Here, the tact time for applying R, G, B and resist was 30 seconds on average.

[0078]

As described above, in the coating apparatus and the coating method of the present invention, while coating is performed at one of a plurality of substrate holding positions, the substrate is placed or discharged at another substrate holding position. A plurality of substrates can be processed most effectively in parallel by one die coater, and the tact time can be greatly reduced.

Further, in consideration of the directionality, the die discharge port can be cleaned during the movement of the die, or the die can be coated with a die having a plurality of discharge ports. In addition, the application speed can be increased.

Further, according to the color filter manufacturing apparatus and the manufacturing method of the present invention, the substrate can be processed in a short tact time by using one die coater and a die, so that the apparatus and the manpower are not increased. Color filters can be manufactured with high productivity.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a die coater of the present invention.

FIG. 2 is a sectional view of a stage portion when the die coater of the present invention is broken perpendicularly to a coating direction.

FIG. 3 is a sectional view of a stage portion when the die coater of the present invention is broken perpendicularly to a coating width direction.

FIG. 4 is a cross-sectional view when applying using the die of the present invention.

FIG. 5 is a schematic view showing one example of a coating method of the present invention.

FIG. 6 is a time chart according to the coating method of the present invention.

FIG. 7 is a schematic perspective view showing a coating apparatus of a conventional invention.

FIG. 8 is a time chart according to a coating method of a conventional invention.

FIG. 9 is a side sectional view showing an exploded state of another die of the present invention.

FIG. 10 is a side cross-sectional view when applying using another die of the present invention.

FIG. 11 is a schematic front view showing another cleaning unit of the present invention.

[Explanation of symbols]

 10: Die coater 20: Stage 21: Base 22A, 22B: Substrate holder 23: Linear slider 24: Linear motor 25: Post base 26: Post 27A, 27B: Coating direction 28A, 28B: Lift pins 29A, 29B: Substrate guide pins 40 : Die lifting / lowering part 50: Die holding material 60: Application liquid supply part 61: Tank 62: Syringe pump 63: Suction hose 64: Supply hose 65A, 65B: Open / close valve 80: Die 81: Lip A 82: Lip B 83: Spacer 84: Bolt 85: Inlet 86: Slit 87: Manifold 90: Discharge port 100: Discharge port cleaning device 101: Unit holding member 110: Cleaning unit 111: Cleaning tool 112: Cleaning tool holding member 114: Liquid receiver 120: Drive unit 121: Linear motor 122: Linear guide 1 30: Cleaning unit 131A, 131B: Cleaning tool 132A, 132B: Cleaning tool holding member 133A, 133B: Air cylinder 134: Liquid receiver 150: Sequencer 135A, 135B: Moving direction 180: Die 181: Lip A 182: Lip B 183A, 183B: Spacer 184: Bolt 185A, 185B: Inlet 187A, 187B: Die connecting hose 188: Switching valve 189: Notch 190A, 191B: Slit 191A, 191B: Manifold 192: Pool 193: Lip C 194A, 194B: Discharge port 200, 200A, 200B: Transfer device 201A, 201B: Robot 202A, 202B: Hand 300: Substrate 400: Die coater 402: Substrate holder 403: Die 410, 411: Transfer device P1, P3: coating start position P2, P4: coating end position

Continued on the front page F term (reference) 2H048 BA43 BA45 BB02 BB42 4D075 AC02 AC73 AC78 AC86 AC88 CA47 DA06 DB07 DB13 DB14 DC24 EA45 EB39 4F041 AA05 AB01 BA05 BA13 BA22 BA60 4F042 AA06 BA08 DF15 DF28 DF29 ED03

Claims (11)

[Claims] 1. A table having a substrate holding position for holding a plurality of substrates so as not to overlap each other, an applicator having a discharge port for discharging a coating liquid onto the surface of the substrate, and a discharge port cleaning for cleaning the discharge port. An apparatus, a coating liquid supply mechanism for supplying a coating liquid to the coating device, a moving unit for moving the coating device to a coating position of a substrate held at a substrate holding position, and a substrate mount for mounting the substrate on the table. Mounting means, a substrate discharging means for discharging the substrate from the table, and mounting the substrate to another substrate holding position while discharging the coating liquid from the applicator onto the substrate mounted at an arbitrary substrate holding position. And / or a control unit for discharging. 2. The coating apparatus according to claim 1, wherein said substrate holding position has two positions. 3. The coating apparatus according to claim 1, wherein all or a part of the coating liquid supply mechanism and the discharge port cleaning device are arranged in the moving unit. . 4. The cleaning apparatus according to claim 1, further comprising two cleaning heads attached to said discharge port cleaning device for removing a coating liquid adhering to said discharge ports. Coating device. 5. The coating device according to claim 1, wherein said coating device has a plurality of said discharge ports. 6. A color filter manufacturing apparatus for manufacturing a color filter using the coating apparatus according to claim 1. 7. A coating film is discharged from the coating device while moving the coating device having a discharge port for discharging the coating solution to a coating position of the substrate held on a table, thereby forming a coating film on the substrate surface. In the coating method for forming, the table is capable of holding a plurality of substrates without overlapping, and while forming a coating film on a substrate placed at an arbitrary substrate holding position on the table, another table is formed. A coating method characterized by discharging a substrate and / or mounting a substrate at a substrate holding position. 8. The coating method according to claim 7, wherein the moving directions of the coating device at the time of forming the coating film are opposite at adjacent substrate holding positions. 9. The coating according to claim 7, wherein the coating is formed while moving all or a part of the coating liquid supply mechanism for supplying the coating liquid to the coating device. Method. 10. The coating method according to claim 7, wherein the cleaning of the discharge port is performed while moving the coating device. 11. A method for manufacturing a color filter, comprising manufacturing a color filter using the coating method according to claim 7. Description: