JP2002094294A - Substrate carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate carrier in which interference with other apparatus can be prevented surely regardless of the size or the orientation in the X-Y plane of a stage. SOLUTION: When a substrate 10 to be carried is mounted on a stage 11 in a substrate carrier, a controller 13 controls a stage drive mechanism 12 to move the substrate mounted on the stage 11 to the compression position of electronic component. The controller 13 compares a limit value set in a register 13a with the coordinate at the target position of the stage 11 and controls the stage drive mechanism 12 if the target position does not exceed the limit value otherwise stops control of the stage drive mechanism 12. Based on the detection results from a stage angle detecting section 15 and a stage size detecting section 16 and a content stored in a storage unit 14, the controller 13 switches the limit value depending on the extending state in the X-Y plane of the stage 11 (orientation in the X-Y plane of the stage 11 and size in the X-Y plane of a stage 11 being fixed currently).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for manufacturing a liquid crystal panel and the like, and more particularly, to a board transfer apparatus for transferring a board to be mounted.

[0002]

2. Description of the Related Art Generally, as a component mounting apparatus for manufacturing a liquid crystal panel or the like, a component mounting apparatus for mounting electronic components on a substrate is known. In such a component mounting apparatus, generally, a substrate supplied from a substrate supply device is positioned at an electronic component crimping position by a substrate transport device, and the electronic component crimping device including a thermocompression tool or the like is used to mount the electronic component on an electrode of the substrate. The lead is pressure-bonded via an adhesive member such as an ACF. Here, the substrate transfer device includes a stage on which the substrate is mounted, and a stage driving mechanism for moving the stage in the XY plane. , Can be transported to the adhesive member attaching position. In such a substrate transfer device, a stage and other devices (such as an electronic component crimping device, a cleaning device, and an adhesive member attaching device) are used.
May cause mechanical interference with
In general, the movement range is regulated in advance.

[0003]

However, in the conventional substrate transfer apparatus described above, the allowable range of the stage movement is determined without considering the orientation, size, etc. of the stage in the XY plane. Mechanical interference may occur depending on the orientation, size, and the like of the stage in the XY plane.

[0004] The present invention has been made in view of such a point, and regardless of the orientation, size, and the like of the stage in the XY plane, it is compatible with other devices (electronic component crimping device and cleaning device). It is an object of the present invention to provide a substrate transfer device capable of reliably preventing interference between the substrates.

[0005]

According to the present invention, there is provided a holding mechanism for holding a substrate, a moving mechanism for moving the holding mechanism to a predetermined target position within a substrate holding surface, and a method for moving the holding mechanism within a predetermined moving range. A controller that controls the moving mechanism so as to move the storage mechanism, and a storage device that stores a plurality of limit values for regulating a moving range of the holding mechanism in accordance with an extension state of the holding mechanism in the substrate holding surface. The controller switches a limit value in accordance with a state of extension of the holding mechanism in the substrate holding surface, based on a storage content of the storage device, and sets the switched limit value and a target of the holding mechanism. A substrate transfer device is provided, wherein the moving mechanism is controlled based on a position.

In the present invention, the substrate holding surface of the holding mechanism is a horizontal plane, and the length of the holding mechanism in the horizontal plane varies depending on its orientation. It is preferable that the limit value is switched according to the direction of the holding mechanism in the horizontal plane, and the moving mechanism is controlled based on the switched limit value and the target position of the holding mechanism. Further, the substrate holding surface of the holding mechanism is a horizontal plane, the size of the holding mechanism in the horizontal plane varies depending on the type thereof, and the controller switches a limit value according to the type of the holding mechanism. Preferably, the moving mechanism is controlled based on the switched limit value and the target position of the holding mechanism. Further, it is preferable that the holding mechanism is a rectangular stage.

According to the present invention, the range of movement of the holding mechanism is regulated in accordance with the state of extension of the holding mechanism within the substrate holding surface (such as the orientation and size of the holding mechanism within the substrate holding surface). Since the limit value is switched, it is possible to reliably prevent interference with other devices (such as an electronic component crimping device, a cleaning device, and an adhesive member attaching device) regardless of the state of extension of the holding mechanism within the substrate holding surface. be able to.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 are views for explaining an embodiment of the substrate transfer device according to the present invention.

As shown in FIG. 1, a board transfer apparatus 10 according to the present embodiment is used by being incorporated in a component mounting apparatus for mounting electronic components on a board, and has a rectangular stage (holding mechanism). ) 11 and a stage drive mechanism (moving mechanism) 12 for moving the stage 11 to an electronic component crimping position (target position) in an XY plane (horizontal plane) which is a substrate holding surface. The stage drive mechanism 12
The X axis servo motor (not shown) and the Y axis servo motor (not shown) for moving the stage 11 in the XY plane which is the substrate holding surface,
And a θ-axis servomotor (not shown) for rotating around an axis. As shown in FIG. 2, the stage 11 has different vertical and horizontal lengths (L1, L2) in the XY plane according to the outer shape of the substrate 20. The stage 11 is removably attached to the stage drive mechanism 12, and a plurality of types of stages having different sizes are attached according to the size of the substrate 20.

Here, a controller 13 is connected to the stage driving mechanism 12, so that the stage driving mechanism 12 can be controlled so that the stage 11 moves within a predetermined moving range. Note that a storage device 14 is connected to the controller 13. Storage device 14
In the figure, the limit value for regulating the movement range of the stage 11 (the upper and lower limit values in the X direction and the Y direction of the movement range) is determined by the extension state of the stage 11 in the XY plane (XY of the stage 11). A plurality of data are stored according to the orientation in the plane and the size of the currently mounted stage 11 in the XY plane), and one of them is read and set in the register 13a in the controller 13. It has become.

A stage angle detector 15 and a stage size detector 16 are connected to the controller 13, and the detection results are input to the controller 13. In addition, as the stage angle detection unit 15, an encoder or the like incorporated in the θ-axis servo motor of the stage drive mechanism 12 can be used. As the stage size detection unit 16, for example, a set of a plurality of optical sensors arranged at predetermined intervals in the X direction and a plurality of optical sensors arranged at predetermined intervals in the Y direction can be used. Based on the output state of each optical sensor when the stage 11 is positioned at the measurement position by the stage size detection unit 16, the size of the stage 11 (length and width L
1, L2) is measured.

In the controller 13, based on the detection results of the stage angle detector 15 and the stage size detector 16 and the contents stored in the storage device 14, the extension state of the stage 11 in the XY plane is determined. The limit value can be switched according to (the orientation of the stage 11 in the XY plane and the size of the currently mounted stage 11 in the XY plane). The stage driving mechanism 12 can be controlled based on the limit value and the target position of the stage 11.

Next, the operation of the present embodiment having such a configuration will be described.

In the substrate transfer apparatus 10 shown in FIG. 1, when a substrate to be transferred is placed on the stage 11, the controller 13 controls the stage drive mechanism 12 to
The substrate placed on the stage 11 is moved to the electronic component crimping position (see reference numerals 30 in FIGS. 4A, 5B, and 5C and FIGS. 5A and 5B).

At this time, the controller 13 compares the limit value set in the register 13a with the coordinates of a target position (electronic component crimping position) of the stage 11, and if the target position does not exceed the limit value, the stage 13 Drive mechanism 1
2; otherwise, the stage drive mechanism 12
The control of is stopped.

Here, since the stage 11 has different lengths (L1, L2) in the XY plane depending on its orientation, it is shown in FIGS. 4 (a), 4 (b) and 4 (c). So, stage 1
Assuming that the movement allowable range R0 of the outer shape 1 is constant, the movement allowable ranges R1, R2, and R3 (based on the center position C of the stage 11) in accordance with the direction (angle) of the stage 11 in the XY plane. That are different). For this reason,
For example, when the limit value is set on the premise of the allowable movement range in the horizontally long state (see reference numeral R1 in FIG. 4A), when the stage 11 is used in the vertically long state, the electronic component crimping position 30 is set. There is a possibility of hitting the electronic component crimping device located at

Since a plurality of types of stages having different sizes are mounted as the stage 11, FIG.
As shown in (a) and (b), assuming that the allowable movement range R0 of the outer shape of the stage 11 is constant, the allowable movement ranges R4 and R5 (based on the center position C of the stage 11) are determined according to the size of the stage 11. That are different). For this reason, for example, when the limit value is set on the premise of the allowable movement range of the small-sized stage 11 (see reference numeral R5 in FIG. 5B), when the large-sized stage 11 is used. Therefore, there is a possibility that an electronic component crimping device located at the electronic component crimping position 30 may be hit.

For this reason, in the controller 13,
Stage angle detector 15 and stage size detector 1
6 based on the detection result of the storage device 14 and the contents stored in the storage device 14, the extension state of the stage 11 in the XY plane (the orientation of the stage 11 in the XY plane, 11 in the XY plane).

FIG. 3 is a flowchart for explaining a method of setting a limit value in the substrate transfer apparatus shown in FIG. Here, the case where two types of large size and small size are used as the stage 11 will be described as an example.

As shown in FIG. 3, first, the type of the stage 11 is determined on the basis of the detection result by the stage size detector 16 (step 101), and when it is determined that the stage 11 is a large-sized stage, Is Step 1
Go to 02. Then, in step 102, the stage 1 is detected based on the detection result by the stage angle detection unit 15.
1 is determined in the XY plane (horizontal state, vertical state, and other states), and in each case, the corresponding limit value stored in the storage device 14 is read and set in the register 13a. (Steps 104 to 10
6). In an actual crimping operation of the electronic component crimping apparatus, the direction of the stage 11 is basically in one of a horizontal state and a vertical state although there is a predetermined error (about ± 5 degrees). Therefore, here, the following three types of limit values are simply prepared instead of preparing limit values for each stage angle. That is, (1) a value that does not cause interference even when tilted ± 5 degrees in the horizontal state (limit value in the case of the horizontal state), (2)
A value that does not interfere even if the stage is tilted by 5 degrees (limit value in the case of the vertically long state), and (3) a value that does not interfere even if the stage is tilted at any angle (the limit value in other cases).

On the other hand, if it is determined in step 101 that the stage 11 is a small-sized stage, the process proceeds to step 103. In step 103, similarly to step 102, the stage angle detection unit 15
The orientation (horizontal state, vertical state, and other states) of the stage 11 in the XY plane is determined on the basis of the detection result by the above, and in each case, the corresponding limit value stored in the storage device 14 is determined. It is read and set in the register 13a (steps 107 to 109).

When the limit value is set in the register 13a in this manner, the controller 13 controls the stage driving mechanism 12 based on the limit value set in this way and the target position of the stage 11. . Thus, the substrate placed on the stage 11 is transported to the electronic component crimping position 30. Then, the relative displacement between the substrate and the electronic component is detected using a camera or the like, and after the detected displacement is corrected, the electronic component crimping device located at the electronic component crimping position 30 is used to fix the substrate. The lead of the electronic component is pressed on the electrode via an adhesive member such as ACF.

As described above, according to the present embodiment, the extended state of the stage 11 in the XY plane (the X
Since the limit value (movable allowable range of the stage 11) is switched according to the orientation in the Y plane and the size of the currently mounted stage 11 in the XY plane, the X- Irrespective of the orientation or size in the Y plane, interference with other devices (such as an electronic component crimping device) can be reliably prevented.

In the above-described embodiment, the case where the substrate placed on the stage 11 is transported to the electronic component crimping apparatus has been described as an example. However, the present invention is not limited to this.
The present invention can be similarly applied to a case where the substrate placed on the stage 11 is transported to another device (a cleaning device, a bonding member pressing device, or the like).

In the above-described embodiment, the stage angle detector 15 and the stage size detector 16
Although the limit value is set based on the detection result by the above, the present invention is not limited to this, and the limit value may be set based on input information input through an operation panel or the like.

Further, in the above-described embodiment,
Although the stage 11 on which the substrate is placed has been described as an example of the holding mechanism, the present invention is not limited to this, and an arm or the like that lifts and holds the substrate may be used.

In the above-described embodiment, a case where two types of large and small sizes are used as the stage 11 has been described as an example.
One size may be three or more types. In addition, the limit value for the direction of the stage 11 is simply 3
Although the case of setting the type of limit value has been described as an example, the limit value may be set for each predetermined angle.

[0028]

As described above, according to the present invention, the holding mechanism can be adjusted in accordance with the state of extension of the holding mechanism within the substrate holding surface (such as the orientation and size of the holding mechanism within the substrate holding surface). Since the limit value for restricting the movement range is switched, regardless of the state of extension of the holding mechanism within the substrate holding surface, it can be connected to other devices (such as an electronic component crimping device, a cleaning device, and an adhesive member attaching device). Interference can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating an embodiment of a substrate transfer device according to the present invention.

FIG. 2 is a view for explaining a relationship between a stage and a substrate mounted thereon.

FIG. 3 is a flowchart for explaining a method of setting a limit value in the substrate transfer device shown in FIG. 1;

FIG. 4 is a diagram for explaining the relationship between the direction of the stage and the allowable movement range.

FIG. 5 is a diagram for explaining the relationship between the size of the stage and the allowable movement range.

[Explanation of symbols]

Reference Signs List 10 substrate transfer device 11 stage (holding mechanism) 12 stage driving mechanism (moving mechanism) 13 controller 13a register 14 storage device 15 stage angle detector 16 stage size detector 20 substrate 30 electronic component pressing position C center position of stage R0 stage Permissible range of movement of outer shape R1, R2, R3, R4, R5 Permissible range of center position of stage

Claims (4)

[Claims] 1. A holding mechanism for holding a substrate, a moving mechanism for moving the holding mechanism to a predetermined target position within a substrate holding surface, and a moving mechanism for moving the holding mechanism within a predetermined moving range. A controller for controlling, and a storage device for storing a plurality of limit values for regulating a moving range of the holding mechanism in accordance with an extension state of the holding mechanism within the substrate holding surface, wherein the controller A limit value is switched in accordance with a state of extension of the holding mechanism in the substrate holding surface based on the storage content of the device, and the moving mechanism is switched based on the switched limit value and a target position of the holding mechanism. A substrate transport device characterized by controlling the following. 2. The substrate holding surface of the protection mechanism is a horizontal plane, and the holding mechanism has different vertical and horizontal lengths in the horizontal plane depending on the orientation thereof. 2. The substrate transfer apparatus according to claim 1, wherein a limit value is switched according to the direction, and the moving mechanism is controlled based on the switched limit value and a target position of the holding mechanism. 3. The substrate holding surface of the protection mechanism is a horizontal plane, the size of the holding mechanism in the horizontal plane differs according to the type of the protection mechanism, and the controller sets a limit value according to the type of the holding mechanism. 2. The substrate transfer apparatus according to claim 1, wherein the switching mechanism is controlled, and the moving mechanism is controlled based on the switched limit value and a target position of the holding mechanism. 4. The substrate transfer apparatus according to claim 1, wherein said holding mechanism is a rectangular stage.