JP2002083820A5 - - Google Patents
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- JP2002083820A5 JP2002083820A5 JP2001181376A JP2001181376A JP2002083820A5 JP 2002083820 A5 JP2002083820 A5 JP 2002083820A5 JP 2001181376 A JP2001181376 A JP 2001181376A JP 2001181376 A JP2001181376 A JP 2001181376A JP 2002083820 A5 JP2002083820 A5 JP 2002083820A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001181376A JP4780860B2 (ja) | 2000-06-19 | 2001-06-15 | 半導体装置の作製方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-182389 | 2000-06-19 | ||
JP2000182389 | 2000-06-19 | ||
JP2000182389 | 2000-06-19 | ||
JP2001181376A JP4780860B2 (ja) | 2000-06-19 | 2001-06-15 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002083820A JP2002083820A (ja) | 2002-03-22 |
JP2002083820A5 true JP2002083820A5 (ja) | 2008-05-22 |
JP4780860B2 JP4780860B2 (ja) | 2011-09-28 |
Family
ID=26594154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001181376A Expired - Fee Related JP4780860B2 (ja) | 2000-06-19 | 2001-06-15 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4780860B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4403354B2 (ja) * | 2002-09-11 | 2010-01-27 | ソニー株式会社 | 薄膜回路基板 |
TW574448B (en) * | 2002-09-24 | 2004-02-01 | Au Optronics Corp | Method for fabricating a polysilicon layer |
US7696031B2 (en) | 2004-06-14 | 2010-04-13 | Semiconductor Energy Laboratory Co., Ltd | Method for manufacturing semiconductor device |
JP5003277B2 (ja) * | 2007-05-18 | 2012-08-15 | ソニー株式会社 | 薄膜の結晶化方法、薄膜半導体装置の製造方法、電子機器の製造方法、および表示装置の製造方法 |
JP2011228651A (ja) * | 2010-03-30 | 2011-11-10 | Semiconductor Energy Lab Co Ltd | 半導体基板の再生方法、再生半導体基板の作製方法、及びsoi基板の作製方法 |
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2001
- 2001-06-15 JP JP2001181376A patent/JP4780860B2/ja not_active Expired - Fee Related