JP2002064278A - Multilayer wiring board and electronic part module using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that conventionally capacitive elements having large capacitance cannot be formed in a multilayer wiring board and an electronic part module cannot be miniaturized in the multilayer wiring board, where an organic material is set to be an insulating layer. SOLUTION: In the multilayer wiring board 4, a plurality of insulating layers 1a to 1e constituted of the organic materials are laminated on upper and lower parts, and wiring conductors 2 are stuck to the surfaces of the insulating layers 1a to 1e. At least one layer in the insulating layers 1a to 1e is set to be the insulating layer 1c including conductive resin powders and dielectric powders, whose relative dielectric constant is not less than 20. The insulating layer 1c is oppositely sandwiched by the wiring conductors 2, stuck on the upper/lower faces of the layer so as to form the capacitive element A. The capacitance of the capacitive element A can be increased and consequently the area of the confronted electrodes of the capacitive element A can be reduced. Thus, the electronic part module 5 can be miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for use in electronic devices such as various AV devices, home appliances, communication devices, computers and their peripheral devices, and an electronic component module using the same.

[0002]

2. Description of the Related Art Conventionally, an electronic component module such as a hybrid integrated circuit, in which a large number of active components such as semiconductor elements and passive components such as capacitance elements and resistance elements are mounted to constitute a predetermined electronic circuit, is usually used. Semiconductor elements, capacitance elements, resistance elements, etc. are mounted on the surface of a wiring board in which a plurality of wiring conductors made of a high melting point metal powder such as tungsten and molybdenum are formed inside and on the surface of an insulating substrate made of a ceramic material such as alumina. It is formed by attaching and connecting these electrodes to each wiring conductor.

However, in such a wiring board, the wiring conductor is formed by printing and applying a conductive paste made of a refractory metal powder such as tungsten or molybdenum in a predetermined pattern by employing a thick film technique such as screen printing. Therefore, there is a problem that it is difficult to miniaturize the wiring conductor and it is not possible to form the wiring conductor with high density.

Further, the conventional wiring board has a problem that a large number of active parts such as semiconductor elements and passive parts such as capacitance elements and resistance elements are mounted on the surface thereof, and the size of the board increases according to the number of mounted parts. Had also.

In order to solve such a problem, Japanese Patent Application Laid-Open No. H11-68319 discloses that a plurality of organic material insulating layers and a plurality of thin film wiring conductors are alternately laminated in a multilayer, and a high dielectric constant powder is used. There has been proposed a multilayer wiring board in which a capacitive element is formed by using an organic material insulating layer containing the same and a counter electrode sandwiching the same.

According to this multilayer wiring board, since the wiring conductor is formed of a thin film, the wiring can be miniaturized, the wiring can be formed at an extremely high density, and a capacitor element is provided inside the multilayer wiring board. Due to the formation, when mounting electronic components such as semiconductor elements, capacitors and resistors on the multilayer wiring board to manufacture electronic component modules such as hybrid integrated circuit devices, a large number of separate capacitive elements are mounted on the multilayer wiring board. As a result, the number of components mounted on the multilayer wiring board is reduced, and the size of the electronic component module can be reduced.

[0007]

However, although this multilayer wiring board forms a capacitive element using an organic material insulating layer containing a high dielectric constant powder, the ratio of the organic material constituting the organic material insulating layer is low. Since the dielectric constant is as low as about 2 to 5, the relative permittivity of the high-permittivity powder contained cannot be sufficiently expressed, and the relative permittivity of the organic material insulating layer containing the high-permittivity powder is about 10 As a result, in order to obtain a capacitive element having a large capacitance, it is necessary to increase the area of the counter electrode, and it is not possible to sufficiently respond to the recent demand for miniaturization of electronic component modules. Had a point.

As another method for obtaining a large capacitance, when the distance between the opposed electrodes is shortened, that is, when the thickness of the organic material insulating layer is reduced, the insulating layer is required to obtain a desired large capacitance. It is necessary to make the thickness of the precursor sheet extremely thin, so that the strength of the precursor sheet forming the insulating layer is weakened. As a result, the sheet is broken when forming this sheet, or the dispersion of the high dielectric constant powder is performed. There is a problem that unevenness occurs and a uniform capacitance cannot be obtained.

The present invention has been devised in view of the problems of the prior art, and has as its object to provide a small-sized multilayer wiring board having a built-in capacitive element having a large capacitance and an electronic component module using the same. Is to provide.

[0010]

The multilayer wiring board according to the present invention is a multilayer wiring board comprising a plurality of insulating layers made of an organic material laminated and a wiring conductor formed on the surface of the insulating layers. At least one of the layers contains a conductive resin powder and a dielectric powder having a relative dielectric constant of 20 or more, and the capacitive element is formed by sandwiching the insulating layer oppositely with wiring conductors attached on both upper and lower surfaces thereof. It is characterized by the following.

Further, in the multilayer wiring board of the present invention, in the above structure, the insulating layer on which the capacitive element is formed has a conductive resin powder of 1 to 30% by volume, and a dielectric constant of 10 to 70% by volume having a relative dielectric constant of 20 or more. It is characterized by comprising a dielectric powder and 10 to 89% by volume of an organic material.

Further, in the multilayer wiring board of the present invention, in the above structure, the relative dielectric constant between the wiring conductors of the insulating layer on which the capacitive element is formed is 1.1 times the relative dielectric constant in the direction perpendicular to the direction.
It is characterized by being at least twice.

Further, an electronic component module according to the present invention is characterized in that an electronic component is mounted on the multilayer wiring board and an electric circuit including a capacitor and an electronic component is formed as a circuit element. is there.

According to the multilayer wiring board of the present invention, since at least one of the insulating layers contains the conductive resin powder and the dielectric powder having a relative dielectric constant of 20 or more, the insulating layer is sandwiched between the wiring conductors. When a voltage is externally applied to the capacitive element formed in the above manner, the conductive resin powder efficiently separates electric charges due to electric conductivity and functions as a conductor, and serves as a conductor in the thickness direction of the insulating layer of the conductive resin powder. The thickness of the insulating layer that contributes to the capacitance can be substantially reduced by the length of the insulating layer. As a result, the capacitance can be increased to a desired value without extremely reducing the thickness of the insulating layer. The area of the counter electrode forming the element can be reduced, and the multilayer wiring board can be reduced in size.

Further, according to the multilayer wiring board of the present invention, the insulating layer on which the capacitance element is formed is made of a conductive resin powder of 1 to 30% by volume and a dielectric resin of 10 to 70% by volume having a relative dielectric constant of 20 or more. Because it is composed of body powder and 10-89% by volume of organic material,
The conductive resin powder and the dielectric powder can be uniformly and satisfactorily dispersed in the insulating layer, and a capacitance element having no variation in capacitance can be obtained.

Further, according to the multilayer wiring board of the present invention,
Since the dielectric layer in which the capacitive element is formed has a relative dielectric constant of at least 1.2 times the relative dielectric constant in the direction between the wiring conductors in the direction orthogonal to the wiring conductor, the relative dielectric constant of the dielectric powder contained in the insulating layer is The ratio can be efficiently developed in the direction between the wiring conductors. As a result, by sandwiching the insulating layer between the wiring conductors, a capacitance element having a large capacitance can be obtained.

Further, according to the electronic component module of the present invention, since the electronic component is mounted on the above-mentioned multilayer wiring board and an electric circuit including the capacitor element and the electronic component is configured as a circuit element, the multilayer wiring board is formed. Semiconductor elements and capacitance elements
When electronic components such as a hybrid integrated circuit device are manufactured by mounting electronic components such as resistive elements, it is not necessary to separately mount a large number of capacitive elements on a multilayer wiring board.
The number of components mounted on the multilayer wiring board is reduced, and the size of the electronic component module can be reduced.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a multilayer wiring board of the present invention and an electronic component module using the same will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an electronic component module when a semiconductor element is mounted as an electronic component on the multilayer wiring board of the present invention. In this figure, 1 is an insulating base, 2 is a wiring conductor, 3 is an electronic component such as a semiconductor element,
The multilayer wiring board 4 of the present invention is mainly composed of the insulating base 1 and the wiring conductor 2.
Thus, the electronic component module 5 of the present invention is configured.

In this embodiment, the insulating substrate 1 is formed by laminating insulating layers 1a, 1b, 1c, 1d, and 1e made of five organic materials. The component 3 is connected and fixed via a connecting material 6 such as solder. Also,
In this example, the wiring conductor 2 includes a wiring conductor layer 2a formed on the surface of each of the insulating layers 1a, 1b, 1c, 1d, and 1e and the insulating layers 1a, 1b, 1c, and 1d.
A through conductor 2b that penetrates 1e and electrically connects each wiring conductor layer 2a. Furthermore, in this example, at least one of the insulating layers 1a, 1b, 1c, 1d, and 1e (the insulating layer 1c in this example) constituting the insulating base 1 has a conductive resin powder and a relative dielectric constant of 20 or more. Wiring conductor layer containing dielectric powder of
Capacitor element A is formed by being sandwiched in opposition in 2a.

The insulating substrate 1 is made of an electronic component 3 such as a semiconductor element.
Has a function as a support for supporting the insulating substrate 1
The insulating layers 1a, 1b, 1c, 1d, and 1e constituting the above are formed of an organic material.

As the organic material forming the insulating layers 1a, 1b, 1c, 1d, 1e, a thermosetting resin such as an epoxy resin, a phenol resin, a polyimide resin, a thermosetting polyphenylene ether resin, a bismaleimide triazine resin, or a liquid crystal is used. Polyester, fluororesin, polyphenylene ether resin,
A thermoplastic resin such as a polyester resin is used, and in particular, workability when forming the insulating layers 1a, 1b, 1c, 1d, 1e
From the viewpoint of the insulating properties, heat resistance properties, mechanical properties, etc. of the insulating layers 1a, 1b, 1c, 1d, 1e, thermosetting resins such as epoxy resins, polyimide resins, and thermosetting polyphenylene ether resins may be used. preferable.

The insulating layers 1a, 1b, 1d, and 1e may be provided with aluminum oxide, silicon nitride, aluminum nitride, silicon carbide, or the like as necessary for the purpose of reducing the change in thermal expansion or improving the mechanical strength. Titanium oxide, barium oxide,
An inorganic insulating powder such as strontium oxide, zirconium oxide, calcium oxide, or zeolite, or a glass cloth in which fibrous glass is woven into a cloth may be contained.

Such an insulating substrate 1 has, for example, a particle size of 0.1.
Inorganic insulating powder such as aluminum oxide, silicon nitride, aluminum nitride, silicon carbide, titanium oxide, barium oxide, strontium oxide, zirconium oxide, calcium oxide, etc.
Conventionally known pastes obtained by adding a thermosetting resin such as polyimide resin, bismaleimide resin, thermosetting polyphenylene ether resin, or a thermoplastic resin such as liquid crystal polyester or polyphenylene ether resin and a solvent, plasticizer, dispersant, etc. By forming a sheet by adopting a sheet forming method such as the doctor blade method, a plurality of precursor sheets to be the insulating layers 1a, 1b, 1d, and 1e in the insulating base 1 are obtained, and the insulating layers 1a, 1b, and 1d are obtained. A suitable punching process is applied to each of the precursor sheet to be 1e and a precursor sheet to be an insulating layer 1c to be described later by using a conventionally well-known punching method as necessary, and the insulating material subjected to these punching processes is applied. Layer 1a
1b, 1c, 1d, 1e are laminated and crimped in a predetermined order, and finally, the laminated and crimped insulating layers 1a, 1b, 1c, 1d, 1e are heated to a temperature of about 100 to 3
It is manufactured by hot-pressing at 00 ° C. under a pressure of 0.4 to 10 MPa for 30 minutes to 24 hours to heat and cure.

The insulating layer 1c is composed of 1 to 30% by volume of a conductive resin powder, 10 to 70% by volume of a dielectric powder having a relative dielectric constant of 20 or more, and 10 to 89% by volume of an organic material. Consisting of an insulating layer 1c
Are sandwiched between the wiring conductor layers 2a attached to the upper and lower surfaces thereof to form the capacitive element A.

According to the multilayer wiring board 4 of the present invention, the insulating layer
Since at least one of the layers 1a, 1b, 1c, 1d, and 1e contains a conductive resin powder and a dielectric powder having a relative dielectric constant of 20 or more, the insulating layer 1c is formed by being sandwiched between the wiring conductor layers 2a. When a voltage is applied to the capacitive element A from the outside, the conductive resin powder efficiently separates electric charges due to electric conductivity and serves as a conductor, and the insulating layer 1c of the conductive resin powder.
The thickness of the insulating layer 1c, which contributes to the capacitance by the length in the thickness direction of the insulating layer 1c, can be substantially reduced. As a result, the desired capacitance can be obtained without making the thickness of the insulating layer 1c extremely thin. As a result, the area of the counter electrode forming the capacitive element A can be reduced, and the multilayer wiring board 4 can be reduced in size.

This is because the capacitance C of the capacitive element A is C = ε.
ε ₀ (S / d) (where d is the thickness of the insulating layer 1c, S is the area of the counter electrode, ε is the relative permittivity of the insulating layer 1c, and ε ₀ is the permittivity of a vacuum), This is because the capacitance C is increased by substantially reducing the thickness d of the insulating layer 1c that contributes to the capacitance by the length in the thickness direction of the insulating layer 1c of the conductive resin powder.

According to the multilayer wiring board 4 of the present invention, the insulating layer
Since the conductive resin powder is contained in 1c, it is not necessary to make the thickness of the insulating layer 1c extremely thin in order to obtain the capacitive element A having a large capacitance. As a result, the precursor for forming the insulating layer 1c is not required. That the strength of the body sheet becomes weak and the sheet cannot be formed, or that the distribution of the dielectric powder becomes uneven and the distribution of the relative permittivity of the insulating layer 1c becomes uneven, so that a uniform capacitance cannot be obtained. Not even.

When the volume content of the conductive resin powder of the insulating layer 1c becomes less than 1% by volume with respect to the insulating layer 1c, the insulating layer
The effect of increasing the capacitance of 1c tends not to be obtained. On the other hand, when the content exceeds 30% by volume, the conductive resin powders tend to come into contact with each other to lower the insulation resistance of the insulating layer 1c. Therefore, the volume content of the conductive resin powder is 1
It is preferably in the range of 30 to 30% by volume, and more preferably in the range of 1 to 10% by volume in order to further improve insulation reliability.

The average particle size of the conductive resin powder is 0.1
It is preferably in the range of 1515 μm. Average particle size 0.1
If it is less than μm, the specific surface area becomes large, and the viscosity of the kneaded product obtained by adding and mixing the conductive resin powder becomes high,
As a result, when the insulating layer 1c is formed, the thickness of the insulating layer 1c tends to be non-uniform, and it tends to be difficult to achieve a predetermined uniform thickness. On the other hand, if the thickness exceeds 15 μm, irregularities due to the conductive resin powder are formed on the surface of the insulating layer 1c, causing a variation in the relative dielectric constant in a region where the capacitor A is formed, or when performing punching on the insulating layer 1c. Processing accuracy tends to decrease. Therefore, the conductive resin powder contained in the insulating layer 1c preferably has an average particle size in the range of 0.1 to 15 μm, and more preferably 0.3 to 10 μm.

Here, the conductive resin powder refers to an organic resin powder having an electric conductivity of 1 × 10 ³ S / cm or more.

Examples of the conductive resin powder include polyacetylene polymers such as polyacetylene and phenylacetylene / poly (1,6-heptadiyne), and polypyrrole / polypyrrole.
Heterocyclic polymers such as polythiophene / polyfuran / polyselenophene / polytellurophen; ionic polymers such as polyaniline / poly (3-methyl, 4-carboxypyrrole); polyacene / polyacenacene / polyperinaphthalene / polyperianthracene And the like are used.

Examples of the dielectric powder contained in the insulating layer 1c include inorganic dielectric powders such as titanium oxide, barium oxide, strontium oxide, zirconium oxide, and calcium oxide, compounds and mixtures thereof, and potassium titanate whiskers.・ Aluminum borate whisker ・ Acicular titanium oxide ・ Silica alumina fiber ・ Fibrous high dielectric powder such as alumina fiber, barium titanate ・ Calcium titanate ・ Barium stannate ・ Barium zirconate ・ Strontium zirconate etc. Powder is used and has a dielectric constant of 20
If it is lower than (room temperature 1 MHz), the relative dielectric constant of the insulating layer 1c tends to be small, and the capacitance of the capacitor A tends to be too small to be practically used. Accordingly, the dielectric powder contained in the insulating layer 1c preferably has a relative dielectric constant of 20 (room temperature 1 MHz) or more.

When the volume content of the dielectric powder of the insulating layer 1c is less than 10% by volume with respect to the insulating layer 1c, the relative permittivity of the insulating layer 1c becomes small, and the capacitance element A which can be practically used is obtained. It tends to be difficult to form. On the other hand, if the content exceeds 70% by volume, the kneadability with the organic material deteriorates, and
Forming 1c tends to be difficult. Therefore, the volume content of the dielectric powder is preferably in the range of 10 to 70% by volume.

The average particle size of the dielectric powder is preferably in the range of 0.1 to 15 μm, more preferably 0.3 to 10 μm, for the same reason as the conductive resin powder described above.

When the volume content of the organic material of the insulating layer 1c is less than 10% by volume with respect to the insulating layer 1c, the formability of the sheet becomes poor, and it becomes difficult to form the insulating layer 1c. Tend. On the other hand, if the content exceeds 89% by volume, the content of the conductive resin powder and the dielectric powder is reduced as described above, and the relative dielectric constant of the insulating layer 1c is reduced. Tends to be difficult. Therefore, the volume content of the organic material in the insulating layer 1c is
It is preferable to be in the range of 10 to 89% by volume.

According to the multilayer wiring board 4 of the present invention, as described above, the insulating layer 1c containing the conductive resin powder and the dielectric powder is mixed with 1 to 30% by volume of the conductive resin powder and 10 to 70% by volume. % Of the dielectric powder and the organic material of 10 to 89% by volume, the conductive resin powder and the dielectric powder can be uniformly dispersed in the insulating layer.
It is possible to obtain the capacitance element A without uneven capacitance.

It is preferable that the relative dielectric constant of the insulating layer 1c in the direction between the opposing electrodes forming the capacitive element A be 1.2 times or more the relative dielectric constant in the direction perpendicular to the direction.

The insulating layer 1c has a relative dielectric constant in the direction between the opposing electrodes of 1.2 times or more as large as the relative dielectric constant in a direction perpendicular to the opposite electrode, so that the dipole moment of the dielectric powder contained in the insulating layer 1c is increased. Can easily be aligned with the direction between the opposing electrodes, and the relative dielectric constant of the dielectric powder can be sufficiently developed in the direction between the opposing electrodes. The relative permittivity in the direction between the opposing electrodes is 1.2 times the relative permittivity in the direction orthogonal to the direction.
If the ratio is less than twice, the directions of the dipole moments of the dielectric powder become difficult to be uniform, and it tends to be difficult to sufficiently develop the relative permittivity of the dielectric powder in the direction between the opposed electrodes. Therefore, it is preferable that the relative permittivity of the insulating layer 1c in the direction between the opposing electrodes is 1.2 times or more the relative permittivity in the direction orthogonal to the opposite electrode.

As the organic material used for the insulating layer 1c, a thermosetting resin such as an epoxy resin, a phenol resin, a polyimide resin, a thermosetting polyphenylene ether resin, a bismaleimide triazine resin, a liquid crystal polyester, a fluororesin, etc. Thermoplastic resins such as polyphenylene ether resin and polyester resin are used,
It is preferable that the organic material has an oriented site in the molecule and has a ratio ε _p / ε _v of the relative permittivity ε _p in the main axis direction and the relative permittivity ε _v orthogonal to the main axis direction of 1.2 or more.

Here, the orienting site mainly comprises a rigid para-substituted aromatic ring or a linear biphenyl or cyclohexyl / substituted naphthyl aromatic ring. By having a sexual site, the molecule becomes elongated rod-like or plate-like and has good orientation.

The principal axis direction of a molecule is the direction in which the relative dielectric constant of the molecule is expressed highest, and is usually the direction of the main chain in which the atoms in the molecule are the longest. Further, the direction orthogonal to the molecule indicates all directions orthogonal to each other.

Note that ε _p / ε _v of the organic material of the insulating layer 1c is 1.2
If it is less than this, it will be difficult to align the main axis direction to the direction between the opposing electrodes even if a high DC voltage is applied from outside as described later, and the relative permittivity in the direction between the opposing electrodes will be orthogonal to the direction. There is a tendency that it is difficult to make the relative permittivity 1.2 times or more of the above. Therefore, ε _p / ε _v of the organic material of the insulating layer 1c is
It is preferably 1.2 or more.

The insulating layer 1c has, for example, an average particle size of 0.1 to 15
Dielectric powders such as barium titanate, calcium titanate, barium stannate, barium zirconate, strontium zirconate, etc. Adopts a paste obtained by adding a thermosetting resin or a thermoplastic resin such as liquid crystal polyester or polyphenylene ether-based resin and a suitable solvent, plasticizer, dispersant, etc., using a sheet forming method such as the well-known doctor blade method. To make a sheet, and 60 to 10
Heating at a temperature of 0 ° C. for 5 minutes to 3 hours to obtain a semi-cured precursor sheet to be the insulating layer 1c, and a plating method or a transfer method of transferring a metal foil to the upper and lower surfaces of the semi-cured precursor sheet. Etc., and a metal electrode is adhered.
By applying a DC voltage of 1 to 20 KV / mm at a temperature of 30 ° C. for 30 minutes to 24 hours, the molecules of the organic material are oriented in the direction to which the DC voltage is applied, and finally, the metal electrode is removed by etching or lapping. Then, a precursor sheet for the insulating layer 1c is manufactured.

Further, for the purpose of reducing the change in thermal expansion or improving the mechanical strength, the insulating layer 1c may be made of aluminum oxide, silicon nitride, aluminum nitride, silicon carbide, titanium oxide, barium oxide, An inorganic insulating powder such as strontium oxide, zirconium oxide, calcium oxide, or zeolite, or a glass cloth in which fibrous glass is woven into a cloth may be contained.

The insulating layers 1a and 1b constituting the insulating base 1
In 1c ・ 1d ・ 1e, the insulating layers 1a ・ 1b ・ 1c ・ 1d ・ 1e are used to increase the affinity between the organic material and the inorganic insulating powder, to improve their bonding properties and to increase the mechanical strength of the insulating substrate 1. One or more coupling agents such as a silane coupling agent and a titanate coupling agent may be added.

Further, the insulating base 1 composed of the insulating layers 1a, 1b, 1c, 1d, and 1e is provided on the surface of the insulating layers 1a, 1b, 1c, 1d, and 1e with the wiring conductor layers 2a and the respective wiring conductor layers 2a electrically connected to each other. A through conductor 2b is formed to be electrically connected.

The wiring conductor 2 composed of the wiring conductor layer 2a and the through conductor 2b has a function of electrically connecting an electronic component 3 such as a semiconductor element mounted on the multilayer wiring board 4 to an external electric circuit (not shown). And a function of forming the capacitive element A by sandwiching the insulating layer 1c between the wiring conductor layers 2a attached to the upper and lower surfaces thereof.

Such a wiring conductor layer 2a is formed by adding a low-resistance metal such as copper, silver, or gold to a plurality of precursor sheets serving as the insulating layers 1a, 1b, 1c, 1d, and 1e in the insulating base 1. Adopt a method of forming by screen printing, a method of depositing and forming a metal foil composed of patterned copper, gold, etc. by a transfer method, etc., adopt a thin film forming method such as electroless plating, vapor deposition, sputtering, etc. Formed by

In the multilayer wiring board 4 of the present invention, since the wiring conductor layer 2a is formed of a thin film, the wiring can be miniaturized. 4 can be set.

The through conductor 2b is formed of the insulating layers 1a, 1b, 1c,
After a plurality of precursor sheets 1d and 1e are punched by a punching method or the like, a conductive paste made of copper, silver, gold, or the like is embedded in the through holes by a screen printing method or the like.

The wiring conductor layer 2a and the penetrating conductor 2b are formed by coating a metal having excellent corrosion resistance, such as nickel and gold, and having good conductivity with a thickness of 1.0 to 20 μm by plating on the exposed surface. In addition, it is possible to effectively prevent the oxidative corrosion of the wiring conductor layer 2a and the through conductor 2b, and at the same time, the wiring conductor of the electronic component 3 such as the semiconductor element and the external electric circuit (not shown). Can be firmly and electrically connected. Therefore, on the exposed surfaces of the wiring conductor layer 2a and the through conductor 2b, a metal having excellent corrosion resistance such as nickel or gold and having good conductivity is preferably applied to a thickness of 1.0 to 20 μm by plating. preferable.

According to the multilayer wiring board 4 of the present invention, since such a capacitive element A is formed, the electronic component 3 such as a semiconductor element, a capacitive element, and a resistive element is mounted on the multilayer wiring board 4 to form a hybrid integrated circuit. When manufacturing an electronic component module 5 such as a circuit device, it is not necessary to separately mount a large number of capacitive elements A on the multilayer wiring board 4, and as a result, the number of components mounted on the multilayer wiring board 4 decreases, and The component module 5 can be downsized.

The capacitance value of such a capacitive element A is determined by the function required of the multilayer wiring board 4, and includes the contents of the conductive resin powder and the dielectric powder, the relative permittivity of the contained dielectric powder, It is determined by appropriately determining the thickness of the insulating layer 1c, the area of the wiring conductor 2 forming the capacitive element A, and the like.

Thus, according to the multilayer wiring board 4 of the present invention, since the dielectric powder and the conductive resin powder are contained in the insulating layer 1c on which the capacitive element A is formed, a voltage is externally applied to the capacitive element A. In this case, the conductive resin powder efficiently separates electric charges due to electrical conductivity and functions as a conductor, and the insulation that contributes to the capacitance by the length in the thickness direction of the insulating layer 1c of the conductive resin powder. The thickness of the layer 1c can be substantially reduced. As a result, the capacitance of the insulating layer 1c can be increased to a desired value without making the thickness of the insulating layer 1c extremely small, and the opposite The area of the electrode can be reduced, and the multilayer wiring board 4 can be reduced in size.

The electronic component module 5 of the present invention
Wiring conductor 2 formed on the surface of the multilayer wiring board 4
Are formed by electrically connecting and fixing the electrodes of the electronic component 3 such as a semiconductor element, a capacitance element and a resistance element via a connection member 6.

The connecting material 6 is made of gold, lead-tin, tin-
When the connecting material 6 is made of lead-tin, for example, made of a conductive material such as zinc, tin-silver-bismuth, the paste is printed on the wiring conductor 2 on the surface of the multilayer wiring board 4 by screen printing. Is formed on the wiring conductor 2.
Further, the electronic component 3 is placed on the connection member 6, and the wiring conductor 2 is electrically connected to each electrode of the electronic component 3 such as a semiconductor element, a capacitance element, and a resistance element through a reflow furnace.
The electronic component module 5 of the present invention is provided.

In order to protect the connection member 6 and firmly fix the electronic component 3 to the multilayer wiring board 4, the electronic component 3
An underfill material made of a thermosetting resin and a filler may be injected between the substrate and the multilayer wiring board 4.

Thus, the electronic component module 5 of the present invention
According to the method, the electronic component 3 is mounted on the multilayer wiring board 4 and an electric circuit is formed by the wiring conductor 2 and the electronic component 3 forming the capacitive element A. When an electronic component module 5 such as a hybrid integrated circuit device is manufactured by mounting the electronic components 3 such as elements and resistance elements, it is not necessary to separately mount a large number of capacitive elements on the multilayer wiring board 4. The number of components mounted on the wiring board 4 is reduced, and the size of the electronic component module 5 can be reduced. Further, for example, when the electronic component 3 is a semiconductor element,
By connecting one electrode of the wiring conductor 2 forming the capacitive element A to the power supply electrode of the semiconductor element and connecting the other electrode to the ground electrode of the semiconductor element, the decoupling for preventing the diffusion of the high frequency power supply current is strengthened. Therefore, malfunction of the semiconductor element can be effectively prevented.

The multilayer wiring board 4 and the electronic component module 5 of the present invention are not limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention. In the above-described embodiment, the insulating base 1 is manufactured by stacking five insulating layers 1a, 1b, 1c, 1d, and 1e. However, three, four, or six or more insulating layers are stacked. The insulating base 1 may be manufactured. Further, in the above-described embodiment, the insulating layer including the dielectric powder and the conductive resin powder is one layer, but may be two or more layers (including a continuous layer).

In the above-described embodiment, the capacitor A has the counter electrode formed by sandwiching one insulating layer containing the dielectric powder and the conductive resin powder, but is formed by sandwiching two or more layers. May be.

Further, the insulating layers 1a, 1b, 1c, 1d, 1e
Light stabilizers such as antioxidants for improving thermal stability and ultraviolet absorbers for improving light resistance, halogen-based or phosphoric-based flame retardants for improving flame retardancy, antimony-based Compounds and flame retardant aids such as zinc borate, barium metaborate, and zirconium oxide; and external lubricant effects such as higher fatty acids, higher fatty acid esters, higher fatty acid metal salts, and fluorocarbon surfactants to improve lubricity One or more of these may be added.

[0063]

According to the multilayer wiring board of the present invention, at least one of the insulating layers has a conductive resin powder and a relative dielectric constant of at least 20.
Due to the inclusion of the above dielectric powder, when a voltage is externally applied to a capacitive element formed by sandwiching the insulating layer between the wiring conductors, the electric charge is efficiently reduced due to the electrical conductivity of the conductive resin powder. Well separated and serve as conductor,
The thickness of the insulating layer contributing to the capacitance can be substantially reduced by the length of the conductive resin powder in the thickness direction of the insulating layer. As a result, even if the thickness of the insulating layer is not extremely thinned, By setting the capacitance to a desired large value, the area of the counter electrode forming the capacitor can be reduced, and the multilayer wiring board can be reduced in size.

According to the multilayer wiring board of the present invention, the insulating layer on which the capacitive element is formed is made of a conductive resin powder of 1 to 30% by volume and a dielectric resin of 10 to 70% by volume having a relative dielectric constant of 20 or more. Because it is composed of body powder and 10-89% by volume of organic material,
The conductive resin powder and the dielectric powder can be uniformly and satisfactorily dispersed in the insulating layer, and a capacitance element having no variation in capacitance can be obtained.

Further, according to the multilayer wiring board of the present invention,
Since the dielectric layer in which the capacitive element is formed has a relative dielectric constant of at least 1.2 times the relative dielectric constant in the direction between the wiring conductors in the direction orthogonal to the wiring conductor, the relative dielectric constant of the dielectric powder contained in the insulating layer is The ratio can be efficiently developed in the direction between the wiring conductors. As a result, by sandwiching the insulating layer between the wiring conductors, a capacitance element having a large capacitance can be obtained.

According to the electronic component module of the present invention, since the electronic component is mounted on the above-described multilayer wiring board and an electric circuit including the capacitor element and the electronic component is configured as a circuit element, the multilayer wiring board is formed. Semiconductor elements and capacitance elements
When electronic components such as a hybrid integrated circuit device are manufactured by mounting electronic components such as resistive elements, it is not necessary to separately mount a large number of capacitive elements on a multilayer wiring board.
The number of components mounted on the multilayer wiring board is reduced, and the size of the electronic component module can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an electronic component module when a semiconductor element is mounted as an electronic component on a multilayer wiring board of the present invention.

[Explanation of symbols]

1 ... Insulating base 1a 1b 1d 1e ... Insulating layer 1c ... Insulating layer (insulating layer containing conductive resin powder and dielectric powder) 2. ······················································································ ····· Multilayer wiring board 5 ······· Electronic component module A ······ Capacitance element

Claims (4)

[Claims] 1. A multilayer wiring board comprising a plurality of insulating layers made of an organic material laminated on each other and a wiring conductor formed on the surface of the insulating layers, wherein at least one of the insulating layers has a conductive resin powder and a conductive resin powder. A multilayer wiring board comprising a dielectric element having a dielectric constant of 20 or more, and a capacitor element formed by sandwiching the insulating layer between the wiring conductors applied to the upper and lower surfaces thereof. 2. The method according to claim 1, wherein the insulating layer on which the capacitive element is formed has a thickness of
30% by volume of the conductive resin powder and 10 to 70% by volume
2. The multilayer wiring board according to claim 1, comprising said dielectric powder and 10 to 89% by volume of said organic material. 3. The insulating layer on which the capacitive element is formed, wherein a relative dielectric constant in a direction between the wiring conductors is 1.2 times or more as large as a relative dielectric constant in a direction orthogonal to the wiring conductor. 1
Or the multilayer wiring board according to claim 2. 4. An electronic circuit comprising: the electronic component mounted on the multilayer wiring board according to claim 1; and an electric circuit including the capacitor and the electronic component as circuit elements. Electronic component module featuring.