JP2002060994A - Electrolytic treating device for belt-like metal - Google Patents

Electrolytic treating device for belt-like metal

Info

Publication number
JP2002060994A
JP2002060994A JP2000247452A JP2000247452A JP2002060994A JP 2002060994 A JP2002060994 A JP 2002060994A JP 2000247452 A JP2000247452 A JP 2000247452A JP 2000247452 A JP2000247452 A JP 2000247452A JP 2002060994 A JP2002060994 A JP 2002060994A
Authority
JP
Japan
Prior art keywords
strip
sink roll
electrolytic
shaped metal
electrode plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000247452A
Other languages
Japanese (ja)
Other versions
JP4505113B2 (en
Inventor
Takeharu Kataoka
毅晴 片岡
Katsuhiko Koura
克彦 小浦
Yusuke Noda
雄祐 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP2000247452A priority Critical patent/JP4505113B2/en
Publication of JP2002060994A publication Critical patent/JP2002060994A/en
Application granted granted Critical
Publication of JP4505113B2 publication Critical patent/JP4505113B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an electrolytic treating device for a belt-like metal which can suppress the fluctuation in a plating coating weight by eliminating the biasing of the belt-like metal between electrode plates and can improve the quality of products and reduce a plating alloy cost. SOLUTION: This electrolytic treating device 10 is provided with a sink roll 15 for guiding the belt-like metal 13 within an electrolytic cell 12 containing an electrolyte 11 and is arranged with aperture of electrode plates 17a, 17b, 18a and 18b respectively on the inlet side and outlet side of the sink roll 15 across the belt-like metal 13. The electrode plate 18a on the sink roll 15 side of a pair of the electrode plates 18a and 18b arranged on the outlet side of the sink roll 15 is formed longer than the other electrode plate 18b.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、帯状金属の洗浄や
電気めっき等を行う際の電解処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic processing apparatus for cleaning or electroplating strip metal.

【0002】[0002]

【従来の技術】従来、熱延及び冷間圧延を行った帯状金
属は、建材、自動車等の用途に応じて、その表面に亜
鉛、錫、ニッケル等のめっきが施される。帯状金属への
めっき処理には、水平型電解装置や竪型電解装置が用い
られているが、設備の小型化及び通板の高速化の観点か
ら竪型電解装置が多く採用されている。この竪型電解装
置には、図4に示すように、電解液20を入れた電解処
理槽21の上方の両側に帯状金属(薄鋼板)29を案内
するコンダクターロール22、23が配置され、電解処
理槽21の内部にシンクロール24が配置されており、
帯状金属29は、入り側のコンダクターロール22から
シンクロール24に案内され、コンダクターロール23
を通って系外に出て、次工程に搬送される。電解液20
を入れた電解処理槽21内には、通常入り側のコンダク
ターロール22とシンクロール24間に帯状金属29を
挟んで一対の電極板25、26を配置し、シンクロール
24と出側のコンダクターロール23間にも帯状金属2
9を挟んだ一対の電極板27、28を配置し、電極間と
帯状金属29の間隔や電流値等の調整を行うことによ
り、帯状金属29の表面に均一にめっきを施されるよう
電解処理を行っている。しかし、帯状金属29に幅方向
の反りや振れ、電解液20の不均一な流れ等の発生によ
って、帯状金属29が電極間で片寄りを生じるため、帯
状金属29の幅方向のめっき量が変動し、製品価値の低
下やめっき量(目付量)の増加に伴う合金コストの上昇
を招く等の問題がある。この対策として、特開昭58−
123898号公報に記載されているように、ポンプで
昇圧しためっき液を電極板と帯状金属の間に噴出し、噴
出しためっき液の圧力により、帯状金属と電極板の接触
を防止し、金属イオンのめっき面への拡散を促進するこ
とが行われている。更に、実開平5−69167号公
報、実開平5−96068号公報に記載されているよう
に、電極板の上部に電極板の厚み方向に導通する溝を設
け、高速通板時に、電極板の間に供給されるめっき液を
安定させることにより、めっき量(目付け量)を帯状金
属に幅方向に均一にすることが行われている。また、実
開平5−62575号公報に記載されているように、竪
型電解装置の電解処理槽を走行する帯状金属に対向して
めっき液面上から懸垂した電極板の上部に、帯状金属の
幅方向の範囲でめっき液を流通させるための切り欠き溝
を設けることにより、帯状金属の高速引き上げに伴うめ
っき液の上昇(液のヘッドアップ)を抑制し、電極板間
の帯状金属位置の片寄りを防止して帯状金属の幅方向の
めっき量を均一にすることが行われている。
2. Description of the Related Art Conventionally, a hot rolled and cold rolled strip metal is plated with zinc, tin, nickel, or the like, depending on the application of the material, such as a building material or an automobile. A horizontal electrolyzer and a vertical electrolyzer are used for the plating treatment on the band-shaped metal, but a vertical electrolyzer is often used from the viewpoint of downsizing of the equipment and speeding up the passage. As shown in FIG. 4, in this vertical electrolytic device, conductor rolls 22 and 23 for guiding a strip-shaped metal (thin steel plate) 29 are arranged on both sides above an electrolytic treatment tank 21 containing an electrolytic solution 20. A sink roll 24 is disposed inside the processing tank 21,
The strip-shaped metal 29 is guided from the conductor roll 22 on the entry side to the sink roll 24, and
Through the system and transported to the next step. Electrolyte 20
Is placed in the electrolytic treatment tank 21, a pair of electrode plates 25 and 26 are arranged between the conductor roll 22 and the sink roll 24 on the normal entrance side with the band-shaped metal 29 interposed therebetween, and the sink roll 24 and the conductor roll on the exit side are disposed. Metal strip 2 between 23
Electrode treatment is performed by disposing a pair of electrode plates 27 and 28 sandwiching the electrode 9 and adjusting the distance between the electrodes and the band-shaped metal 29, the current value, and the like, so that the surface of the band-shaped metal 29 is evenly plated. It is carried out. However, since the band-shaped metal 29 is displaced between the electrodes due to the warpage or deflection of the band-shaped metal 29 in the width direction and the uneven flow of the electrolytic solution 20, the amount of plating of the band-shaped metal 29 in the width direction fluctuates. However, there are problems such as a decrease in product value and an increase in alloy cost due to an increase in plating amount (basis weight). As a countermeasure against this, Japanese Patent Laid-Open No.
As described in Japanese Patent Publication No. 123898, a plating solution pressurized by a pump is jetted between the electrode plate and the strip metal, and the pressure of the jetted plating solution prevents contact between the strip metal and the electrode plate, thereby preventing metal ions. Has been promoted to spread to the plating surface. Further, as described in Japanese Utility Model Application Laid-Open No. 5-69167 and Japanese Utility Model Application Laid-Open No. 5-96068, a groove conducting in the thickness direction of the electrode plate is provided on the upper portion of the electrode plate, and between the electrode plates during high-speed passing. By stabilizing the supplied plating solution, the plating amount (basis weight) is made uniform in the width direction of the strip-shaped metal. Further, as described in Japanese Utility Model Application Laid-Open No. 5-62575, on the upper part of the electrode plate suspended from above the plating solution surface, facing the strip metal running in the electrolytic treatment tank of the vertical electrolytic device, the strip metal is placed. By providing a notch groove for flowing the plating solution in the width direction, a rise of the plating solution (solution head-up) due to a high-speed pulling of the strip metal is suppressed, and a piece of the strip metal position between the electrode plates is suppressed. It has been practiced to prevent deviation and make the plating amount of the strip-shaped metal uniform in the width direction.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、特開昭
58−123898号公報に記載された方法では、めっ
き液を昇圧するポンプの設置と特殊な電極板を要し、装
置の大幅な改造が必要になり、設備費用が増大する。し
かも、シンクロールの回転に伴なって形成されるめっき
液流れに帯状金属が引き寄せられて発生する帯状金属の
電極板間の片寄りを確実に防止することができない。更
に、実開平5−69167号公報、実開平5−9606
8号公報、実開平5−62575号公報に記載された竪
型電解装置を用いた場合、電極板の間を通過する帯状金
属の引き上げに伴って、めっき液面が上昇するのを抑制
することはできるが、シンクロールの回転方向に形成さ
れるめっき液の流れに帯状金属が引き寄せられ、帯状金
属と電極板の間隔が変動する。特に、板反りがある場合
に、加電圧の調整を行っても帯状金属の表面のめっき付
着量にバラツキが発生する。しかも、電極板を切り欠い
ているので、通電断面積が減少し、ジュール熱による通
電時の発熱が増大し、電極板及びめっき液の温度が上昇
し、めっき液の温度を一定に保つための冷却装置の負荷
が増加したり、めっき付着量の変動を招く等の問題があ
る。
However, the method described in Japanese Patent Application Laid-Open No. 58-123898 requires the installation of a pump for increasing the pressure of the plating solution and a special electrode plate. And equipment costs increase. In addition, it is not possible to reliably prevent the strip metal from being offset between the electrode plates by the strip metal being drawn by the flow of the plating solution formed as the sink roll rotates. Further, Japanese Utility Model Laid-Open No. 5-69167 and Japanese Utility Model Laid-Open No. 5-9606.
No. 8 and Japanese Utility Model Application Laid-Open No. 5-62575, when a vertical electrolytic device is used, it is possible to suppress a rise in the plating solution level with the lifting of the strip-shaped metal passing between the electrode plates. However, the strip metal is attracted to the flow of the plating solution formed in the rotation direction of the sink roll, and the distance between the strip metal and the electrode plate fluctuates. In particular, when there is sheet warpage, even when the applied voltage is adjusted, the amount of plating applied to the surface of the strip-shaped metal varies. Moreover, since the electrode plate is notched, the cross-sectional area of the current is reduced, the heat generated during energization by Joule heat is increased, the temperature of the electrode plate and the plating solution is increased, and the temperature of the plating solution is kept constant. There are problems such as an increase in the load on the cooling device and a change in the amount of deposited plating.

【0004】本発明はかかる事情に鑑みてなされたもの
で、帯状金属の電極板間の片寄りを無くしてめっき付着
量の変動を抑制し、製品の品質向上及びめっき合金コス
トの低減を図ることができる帯状金属の電解処理装置を
提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and aims at eliminating deviation of a strip-shaped metal between electrode plates, suppressing a change in the amount of plating, improving the quality of a product, and reducing the cost of a plating alloy. It is an object of the present invention to provide an apparatus for electrolytically treating a strip-shaped metal.

【0005】[0005]

【課題を解決するための手段】前記目的に沿う第1の発
明の帯状金属の電解処理装置においては、電解液を入れ
た電解槽内に帯状金属を案内するシンクロールを設け、
該シンクロールの入り側と出側のそれぞれに、前記帯状
金属を挟んで一対の電極板を配置した電解処理装置にお
いて、前記シンクロールの出側に配置された前記一対の
電極板のうちシンクロール側の電極板を他の電極板より
長くしている。これにより、電解槽内のシンクロールの
回転に随伴する電解液(めっき液)の内側に向う流れを
シンクロール側(内側)の電極板によって遮断すること
ができ、帯状金属が内側の電極板側に引き寄せられるの
を防止することができる。
According to the first aspect of the present invention, there is provided an apparatus for electrolytically treating a strip-shaped metal, wherein a sink roll for guiding the strip-shaped metal is provided in an electrolytic tank containing an electrolytic solution.
In an electrolytic treatment apparatus in which a pair of electrode plates are disposed on both the entrance side and the exit side of the sink roll with the strip-shaped metal interposed therebetween, the sink roll of the pair of electrode plates disposed on the exit side of the sink roll The electrode plate on the side is longer than the other electrode plates. Thus, the flow toward the inside of the electrolytic solution (plating solution) accompanying the rotation of the sink roll in the electrolytic cell can be blocked by the electrode plate on the sink roll side (inside), and the band-shaped metal is cut off on the inner electrode plate side. Can be prevented.

【0006】更に、前記目的に沿う第2の発明の帯状金
属の電解処理装置においては、電解液を入れた電解槽内
に帯状金属を案内するシンクロールを設け、該シンクロ
ールの入り側と出側のそれぞれに、前記帯状金属を挟ん
で一対の電極板を配置した電解処理装置において、前記
出側に配置した一対の電極板は、その長さを同じにし、
該電極板のうちシンクロール側の電極板に前記電解液の
流れを抑制する遮断板を設けている。電極板の下端に、
遮断板を連結しているので、シンクロールの回転に随伴
した電解液の内側に向う流れによる帯状金属の片寄りを
抑制できる。しかも、帯状金属の電解処理に作用する電
極板を同一の長さにしているので、帯状金属へのめっき
量を均一にすることができる。
According to a second aspect of the present invention, there is provided an apparatus for electrolytically treating a strip-shaped metal according to the second aspect of the present invention, wherein a sink roll for guiding the strip-shaped metal is provided in an electrolytic tank containing an electrolytic solution, and an inlet and an outlet of the sink roll. In each of the sides, in the electrolytic processing apparatus arranged a pair of electrode plates sandwiching the band-shaped metal, the pair of electrode plates disposed on the output side, the length is the same,
Among the electrode plates, an electrode plate on the sink roll side is provided with a blocking plate for suppressing the flow of the electrolytic solution. At the lower end of the electrode plate,
Since the blocking plate is connected, it is possible to suppress the displacement of the strip-shaped metal due to the flow toward the inside of the electrolytic solution accompanying the rotation of the sink roll. Moreover, since the electrode plates acting for the electrolytic treatment of the band-shaped metal have the same length, the amount of plating on the band-shaped metal can be made uniform.

【0007】更に、前記遮断板は絶縁素材から形成する
ことが好ましい。これにより、電解液の流れを抑制し、
同時に帯状金属へのめっき量を安定して均一にすること
ができる。
Further, it is preferable that the blocking plate is formed of an insulating material. This suppresses the flow of the electrolyte,
At the same time, the amount of plating on the strip-shaped metal can be made stable and uniform.

【0008】[0008]

【発明の実施の形態】続いて、添付した図面を参照しつ
つ、本発明を具体化した実施の形態につき説明し、本発
明の理解に供する。図1は本発明の一実施の形態に係る
帯状金属の電解処理装置の全体図、図2は同電解処理装
置の変形例に係る遮断板を取付けた電極板の断面図、図
3は同電解処理装置の電解液の流れを表す模式図であ
る。図1に示すように、本発明の一実施の形態に係る帯
状金属の電解処理装置10は、電解液の一例であるSn
溶解液11を入れた鋼鉄製の電解槽12を有し、帯状金
属の一例である薄鋼板13を電解槽12内に案内するた
めに、それぞれが図示しない駆動源に連結したコンダク
ターロール14、16及びシンクロール15を備えてい
る。更に、電解槽12の上方で、薄鋼板13の入り側に
配置したコンダクターロール14と電解槽12の内部に
配置したシンクロール15の間には、薄鋼板13を挟ん
で図示しない電源装置に連接した一対の電極板17a、
17bを配置し、電解槽12の上方で薄鋼板13の出側
に配置したコンダクターロール16とシンクロール15
の間には、薄鋼板13を挟んで電源装置に連接した一対
の電極板18a、18bを備えている。電極板17a、
17bは、長さが1500〜1800mm、幅が120
0〜1500mmの範囲で、それぞれ同じ寸法のものを
用いている。電極板18a、18bについては、幅は1
200〜1500mmの範囲で同じ寸法であるが長さは
シンクロール15側(内側)に設けた電極板18aが、
電極板18b(1500〜1800mmの長さ)に対し
て100〜270mm長くなっている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. FIG. 1 is an overall view of a strip-shaped metal electrolytic processing apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of an electrode plate with a blocking plate according to a modification of the electrolytic processing apparatus, and FIG. It is a schematic diagram showing the flow of the electrolytic solution of the processing apparatus. As shown in FIG. 1, a strip-shaped metal electrolytic treatment apparatus 10 according to one embodiment of the present invention includes a Sn metal, which is an example of an electrolytic solution.
Conductor rolls 14, 16 each having a driving source (not shown) for guiding a thin steel plate 13, which is an example of a strip-shaped metal, into the electrolytic bath 12 having a steel electrolytic bath 12 containing a solution 11 therein. And a sink roll 15. Further, above the electrolytic cell 12, a conductor roll 14 disposed on the entry side of the thin steel sheet 13 and a sink roll 15 disposed inside the electrolytic cell 12 are connected to a power supply device (not shown) with the thin steel sheet 13 interposed therebetween. A pair of electrode plates 17a,
17b and a conductor roll 16 and a sink roll 15 arranged above the electrolytic cell 12 and on the exit side of the thin steel plate 13.
Between them, there is provided a pair of electrode plates 18a and 18b connected to the power supply device with the thin steel plate 13 interposed therebetween. Electrode plate 17a,
17b has a length of 1500 to 1800 mm and a width of 120
The same size is used in the range of 0 to 1500 mm. The width of the electrode plates 18a and 18b is 1
The electrode plate 18a provided on the sink roll 15 side (inside) has the same size in the range of 200 to 1500 mm,
It is longer by 100 to 270 mm than the electrode plate 18b (length: 1500 to 1800 mm).

【0009】次に、本発明の一実施の形態に係る帯状金
属の電解処理装置の動作について説明する。入り側のコ
ンダクターロール14、シンクロール15及び出側のコ
ンダクターロール16を回転させ、薄鋼板13をSn溶
解液11を入れた電解槽12内に、略400〜600m
/分の速度で搬送する。電解槽12内に搬送された薄鋼
板13は、シンクロール15の入り側に設けた一対の電
極板17a、17b間を通過する際に、電極板17a、
17bに流れる電流によって、Sn溶解液11中のSn
が薄鋼板13の表面に析出してめっきされる。更に、シ
ンクロール15によって方向転換した薄鋼板13は、シ
ンクロール15の出側に設けられた100〜270mm
の延長部19を有する内側の電極板18aと通常の長さ
の電極板18bの間を通過し、前述した電極板17a、
17bと同様の働きにより、薄鋼板13の表面にめっき
が施される。この薄鋼板13には、板幅方向に反りが生
じる場合があり、電極板17a、17b、電極板18
a、18bを通過する際に、この反りを考慮して電流値
の調整を行い、薄鋼板13の幅方向のめっき量のバラツ
キを小さくしている。
Next, the operation of the apparatus for electrolytically treating a strip-shaped metal according to one embodiment of the present invention will be described. The conductor rolls 14 and sink rolls 15 on the entry side and the conductor roll 16 on the exit side are rotated, and the thin steel plate 13 is placed in the electrolytic bath 12 containing the Sn solution 11 for approximately 400 to 600 m.
/ Min speed. When the thin steel sheet 13 conveyed into the electrolytic cell 12 passes between a pair of electrode plates 17a and 17b provided on the entry side of the sink roll 15, the thin steel plate 13
17b, the Sn in the Sn solution 11
Precipitates on the surface of the thin steel plate 13 and is plated. Further, the thin steel sheet 13 turned by the sink roll 15 has a thickness of 100 to 270 mm provided on the exit side of the sink roll 15.
Pass between the inner electrode plate 18a having the extension portion 19 and the electrode plate 18b of the normal length, and the electrode plates 17a,
By the same operation as 17b, the surface of the thin steel plate 13 is plated. The thin steel plate 13 may be warped in the width direction, and the electrode plates 17a and 17b and the electrode plate 18 may be warped.
When passing through a and 18b, the current value is adjusted in consideration of the warpage, so that the variation in the plating amount in the width direction of the thin steel plate 13 is reduced.

【0010】しかし、図3に示すように、シンクロール
15が矢印(図中点線)の方向に回転しているため、こ
の回転方向に随伴したSn溶解液11の流れ(図中一点
鎖線矢印)が発生する。従って、電極板18aの延長部
19によって、この流れを遮断することにより、シンク
ロール15の回転に伴って発生する内側への流れを極力
小さくでき、薄鋼板13が電極板18a側に引き寄せら
れるのを防止することができる。その結果、電極板18
aと電極板18bの間に向かう流れが均等化され、しか
も、薄鋼板13の反りやSn溶解液11の流れ等の影響
を受けて薄鋼板13が、電極板18aに近接したり、接
触するのを防止することができる。そして、電極板18
a、18bとの間隔の変動を小さくして通板した薄鋼板
13の表面には、均一なSnめっきが施され、単位面積
当たりのSnめっき量のバラツキが小さくなり、製品品
質の向上やめっき合金コストを低減することができ、操
業も安定化できる。更に、電極板18a、18bに特定
の加工(溝等)を施さないのでSn溶解液11、電極板
18a、18bの温度の上昇が抑制され、Sn溶解液1
1の冷却装置の負荷を軽減することができる。
However, as shown in FIG. 3, since the sink roll 15 is rotating in the direction of the arrow (dotted line in the figure), the flow of the Sn solution 11 accompanying this rotation direction (dotted line arrow in the figure). Occurs. Therefore, by blocking this flow by the extension portion 19 of the electrode plate 18a, the inward flow generated by the rotation of the sink roll 15 can be minimized, and the thin steel plate 13 is drawn to the electrode plate 18a side. Can be prevented. As a result, the electrode plate 18
a and the flow toward the electrode plate 18b are equalized, and the thin steel plate 13 approaches or comes into contact with the electrode plate 18a under the influence of the warpage of the thin steel plate 13, the flow of the Sn solution 11, and the like. Can be prevented. Then, the electrode plate 18
The surface of the thin steel plate 13 that has been passed through with a small variation in the distance between the a and 18b is subjected to uniform Sn plating, the variation in the amount of Sn plating per unit area is reduced, and the quality of the product is improved. Alloy costs can be reduced and operations can be stabilized. Furthermore, since the electrode plates 18a and 18b are not subjected to specific processing (grooves and the like), a rise in the temperature of the Sn solution 11 and the electrode plates 18a and 18b is suppressed.
The load on the first cooling device can be reduced.

【0011】次に、本実施の形態に係る帯状金属の電解
処理装置の電極板18aの変形例である電極板18cに
ついて説明する。図2に示すように、電極板18cは延
長部19を有する電極板18aのかわりに、電極板18
bと対となるように電解槽12内に配置されている。電
極板18cは電極板18bと同一の幅、長さを有し、下
端には遮断板19aを設けている。遮蔽板19aは、1
00〜270mmの長さを有し、電極板18cの下端に
取付けた図示しない支持部材にボルト、ナット等の一般
に用いる締結手段によって固定されている。その結果、
電極板18cと電極板18bの間に向かう流れが均等化
され、しかも、薄鋼板13の反りやSn溶解液11の流
れ等の影響を受けて薄鋼板13が、電極板18cに近接
したり、接触するのを防止することができる。そして、
通板した薄鋼板13の表面に施されるSnめっきを均一
にでき、Snめっき量のバラツキを抑制して操業の安定
化を図ることができる。特に、薄鋼板13に作用する両
側の電極面積を等しくできるので、電極板の長さの差に
起因するめっき量の変動を無くすことができ、より好ま
しい結果が得られる。遮蔽板19aに用いる素材は、絶
縁素材である例えばアクリル、セラミック、塩化ビニ
ル、FRP等を用いることができる。なお、本発明の帯
状金属の電解処理装置は、電解液としてSnめっき液を
用いたが、その他、Znめっき、Niめっき、Zn系の
合金めっき等の電解処理、あるいは電解脱脂や電解洗浄
等に適用することができる。
Next, an electrode plate 18c which is a modified example of the electrode plate 18a of the strip-shaped metal electrolytic processing apparatus according to the present embodiment will be described. As shown in FIG. 2, the electrode plate 18c is replaced with an electrode plate 18a having an extension 19 instead of the electrode plate 18a.
It is arranged in the electrolytic cell 12 so as to be paired with b. The electrode plate 18c has the same width and length as the electrode plate 18b, and has a blocking plate 19a at the lower end. The shielding plate 19a
It has a length of 00 to 270 mm and is fixed to a support member (not shown) attached to the lower end of the electrode plate 18c by commonly used fastening means such as bolts and nuts. as a result,
The flow between the electrode plate 18c and the electrode plate 18b is equalized, and the thin steel plate 13 approaches the electrode plate 18c under the influence of the warp of the thin steel plate 13, the flow of the Sn solution 11, and the like. Contact can be prevented. And
Sn plating applied to the surface of the passed thin steel plate 13 can be made uniform, and variation in the amount of Sn plating can be suppressed to stabilize the operation. In particular, since the electrode areas on both sides acting on the thin steel plate 13 can be made equal, fluctuations in the plating amount due to the difference in the length of the electrode plates can be eliminated, and more favorable results can be obtained. As a material used for the shielding plate 19a, for example, acrylic, ceramic, vinyl chloride, FRP, or the like, which is an insulating material, can be used. The electrolytic treatment apparatus for a strip-shaped metal according to the present invention uses a Sn plating solution as an electrolytic solution, but is also applicable to electrolytic treatment such as Zn plating, Ni plating, and Zn-based alloy plating, or electrolytic degreasing or electrolytic cleaning. Can be applied.

【0012】以上、本発明の実施の形態を説明したが、
本発明は、上記した形態に限定されるものでなく、要旨
を逸脱しない条件の変更等は全て本発明の適用範囲であ
る。例えば、帯状金属として、薄鋼板の他に、アルミニ
ウム鋼板、銅板等を電解処理に用いることができる。更
に、遮蔽板の取付けは、予め電極に支持部材を取付けて
おき、この支持部材に遮蔽板を組みこむことにより、電
極に一体に取付けることもできる。
The embodiment of the present invention has been described above.
The present invention is not limited to the above-described embodiment, and all changes in conditions that do not depart from the gist are within the scope of the present invention. For example, in addition to a thin steel plate, an aluminum steel plate, a copper plate, or the like can be used for the electrolytic treatment as the band-shaped metal. Further, the shield plate can be attached integrally to the electrode by attaching a support member to the electrode in advance and incorporating the shield plate into the support member.

【0013】[0013]

【発明の効果】請求項1〜3記載の帯状金属の電解処理
装置は、電解液を入れた電解槽内に帯状金属を案内する
シンクロールを設け、シンクロールの入り側と出側のそ
れぞれに、帯状金属を挟んで一対の電極板を配置した電
解処理装置において、シンクロールの出側に配置された
一対の電極板のうちシンクロール側の電極板を他の電極
板より長くしているので、シンクロールの回転に随伴す
る電解液の流れによる帯状金属の片寄りを無くしてめっ
き量のバラツキを抑制し、めっき合金の節減や製品品質
の向上と、安定した操業を行うことができる。
According to the present invention, there is provided an apparatus for electrolytically treating a strip-shaped metal, wherein a sink roll for guiding the strip-shaped metal is provided in an electrolytic tank containing an electrolytic solution, and the sink roll is provided on each of an inlet side and an outlet side. In an electrolytic treatment apparatus in which a pair of electrode plates are disposed with a band-shaped metal interposed therebetween, the electrode plate on the sink roll side of the pair of electrode plates disposed on the output side of the sink roll is longer than the other electrode plates. In addition, it is possible to eliminate unevenness of the strip-shaped metal due to the flow of the electrolytic solution accompanying the rotation of the sink roll, suppress the variation in the plating amount, save the plating alloy, improve the product quality, and perform a stable operation.

【0014】特に、請求項2記載の帯状金属の電解処理
装置は、電解液を入れた電解槽内に帯状金属を案内する
シンクロールを設け、シンクロールの入り側と出側のそ
れぞれに、帯状金属を挟んで一対の電極板を配置した電
解処理装置において、出側に配置した一対の電極板は、
その長さを同じにし、電極板のうちシンクロール側の電
極板に電解液の流れを抑制する遮断板を設けているの
で、簡単な構造で電解液の内側に向う流れを抑制し、し
かも、帯状金属へのめっき量を均一にすることができ
る。
[0014] In particular, in the apparatus for electrolytically treating a strip-shaped metal according to the present invention, a sink roll for guiding the strip-shaped metal is provided in an electrolytic bath containing an electrolytic solution, and a strip-shaped metal is provided on each of the entrance side and the exit side of the sink roll. In an electrolytic treatment apparatus in which a pair of electrode plates are disposed with a metal interposed therebetween, the pair of electrode plates disposed on the output side is
Its length is the same, and among the electrode plates, a shield plate that suppresses the flow of the electrolyte is provided on the electrode plate on the sink roll side, so that the flow toward the inside of the electrolyte is suppressed with a simple structure, and The amount of plating on the strip-shaped metal can be made uniform.

【0015】請求項3記載の帯状金属の電解処理装置
は、遮断板が絶縁素材からなるので、電解液の流れを抑
制し、同時に帯状金属へのめっき量をより均一にし、製
品品質や操業の安定性等をより高めることができる。
According to the third aspect of the present invention, since the blocking plate is made of an insulating material, the flow of the electrolytic solution is suppressed, and at the same time, the amount of plating on the strip metal is made more uniform, thereby improving the product quality and operation. Stability and the like can be further improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態に係る帯状金属の電解処
理装置の全体図である。
FIG. 1 is an overall view of an apparatus for electrolytically treating a strip-shaped metal according to an embodiment of the present invention.

【図2】同電解処理装置の変形例に係る遮断板を取付け
た電極板の断面図である。
FIG. 2 is a cross-sectional view of an electrode plate to which a blocking plate according to a modification of the electrolytic processing apparatus is mounted.

【図3】同電解処理装置の電解液の流れを表す模式図で
ある。
FIG. 3 is a schematic diagram showing a flow of an electrolytic solution in the electrolytic processing apparatus.

【図4】従来例に係る竪型電解装置の全体図である。FIG. 4 is an overall view of a vertical electrolytic device according to a conventional example.

【符号の説明】[Explanation of symbols]

10:電解処理装置、11:Sn溶解液、12:電解
槽、13:薄鋼板、14:コンダクターロール、15:
シンクロール、16:コンダクターロール、17a:電
極板、17b:電極板、18a:電極板、18b:電極
板、18c:電極板、19:延長部、19a:遮断板
10: electrolytic treatment apparatus, 11: Sn solution, 12: electrolytic tank, 13: thin steel plate, 14: conductor roll, 15:
Sink roll, 16: conductor roll, 17a: electrode plate, 17b: electrode plate, 18a: electrode plate, 18b: electrode plate, 18c: electrode plate, 19: extension, 19a: blocking plate

───────────────────────────────────────────────────── フロントページの続き (72)発明者 野田 雄祐 福岡県北九州市戸畑区飛幡町1番1号 新 日本製鐵株式会社八幡製鐵所内 Fターム(参考) 4K024 AA03 AA05 AA07 BC01 CB06 CB08 CB10 CB16 CB21 CB26 EA03  ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yusuke Noda 1-1, Hibata-cho, Tobata-ku, Kitakyushu-shi, Fukuoka Prefecture F-term in the Nippon Steel Corporation Yawata Works (reference) 4K024 AA03 AA05 AA07 BC01 CB06 CB08 CB10 CB16 CB21 CB26 EA03

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電解液を入れた電解槽内に帯状金属を案
内するシンクロールを設け、該シンクロールの入り側と
出側のそれぞれに、前記帯状金属を挟んで一対の電極板
を配置した電解処理装置において、前記シンクロールの
出側に配置された前記一対の電極板のうちシンクロール
側の電極板を他の電極板より長くしていることを特徴と
する帯状金属の電解処理装置。
1. A sink roll for guiding a strip-shaped metal is provided in an electrolytic cell containing an electrolytic solution, and a pair of electrode plates are arranged on each of the entrance side and the exit side of the sink roll with the strip-shaped metal interposed therebetween. In the electrolytic processing apparatus, the electrode plate on the sink roll side of the pair of electrode plates disposed on the outlet side of the sink roll is longer than the other electrode plates.
【請求項2】 電解液を入れた電解槽内に帯状金属を案
内するシンクロールを設け、該シンクロールの入り側と
出側のそれぞれに、前記帯状金属を挟んで一対の電極板
を配置した電解処理装置において、前記出側に配置した
一対の電極板は、その長さを同じにし、該電極板のうち
シンクロール側の電極板に前記電解液の流れを抑制する
遮断板を設けていることを特徴とする帯状金属の電解処
理装置。
2. A sink roll for guiding a strip-shaped metal is provided in an electrolytic cell containing an electrolytic solution, and a pair of electrode plates are arranged on each of the entrance side and the exit side of the sink roll with the strip-shaped metal interposed therebetween. In the electrolytic treatment apparatus, the pair of electrode plates disposed on the outlet side have the same length, and a shield plate for suppressing the flow of the electrolytic solution is provided on the electrode plate on the sink roll side of the electrode plates. An apparatus for electrolytically treating a strip-shaped metal.
【請求項3】 請求項2記載の帯状金属の電解処理装置
において、前記遮断板が絶縁素材からなることを特徴と
する帯状金属の電解処理装置。
3. An apparatus for electrolytically treating a strip-shaped metal according to claim 2, wherein said blocking plate is made of an insulating material.
JP2000247452A 2000-08-17 2000-08-17 Strip metal electrolytic treatment equipment Expired - Fee Related JP4505113B2 (en)

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JP2000247452A JP4505113B2 (en) 2000-08-17 2000-08-17 Strip metal electrolytic treatment equipment

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Application Number Priority Date Filing Date Title
JP2000247452A JP4505113B2 (en) 2000-08-17 2000-08-17 Strip metal electrolytic treatment equipment

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ID=18737542

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9725817B2 (en) 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11413123B2 (en) * 2017-12-26 2022-08-16 Kuraray Noritake Dental Inc. Mill blank and dental prosthesis, and methods respectively for producing these products

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023470U (en) * 1988-06-21 1990-01-10
JPH0554554U (en) * 1991-12-26 1993-07-20 川崎製鉄株式会社 Immersion type plating tank
JPH09241887A (en) * 1996-03-08 1997-09-16 Nippon Steel Corp Dipping type treating vessel of belt-like material such as steel sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH023470U (en) * 1988-06-21 1990-01-10
JPH0554554U (en) * 1991-12-26 1993-07-20 川崎製鉄株式会社 Immersion type plating tank
JPH09241887A (en) * 1996-03-08 1997-09-16 Nippon Steel Corp Dipping type treating vessel of belt-like material such as steel sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9725817B2 (en) 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts

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