US4749450A - Apparatus for plating metal strip in electrolytic cell - Google Patents
Apparatus for plating metal strip in electrolytic cell Download PDFInfo
- Publication number
- US4749450A US4749450A US06/935,454 US93545486A US4749450A US 4749450 A US4749450 A US 4749450A US 93545486 A US93545486 A US 93545486A US 4749450 A US4749450 A US 4749450A
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- United States
- Prior art keywords
- metal strip
- supporting
- electrodes
- distance
- deflecting
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- Expired - Fee Related
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- 239000002184 metal Substances 0.000 title claims abstract description 129
- 238000007747 plating Methods 0.000 title claims abstract description 32
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 7
- 239000010959 steel Substances 0.000 claims abstract description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010802 sludge Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Definitions
- the present invention relates generally to an apparatus for plating a metal strip in an electrolytic cell. More specifically the invention relates to an apparatus for plating a metal strip, which apparatus can generate an deposit of consistent thickness on the surface of the metal strip.
- deflector rolls In a horizontal pass-line type of apparatus for simultaneously plating the upper and lower surface of a metal strip, deflector rolls have been generally used near the opposing inside walls in a plating bath in order to deflect the flow direction of the metal strip fed from a point outside of the plating bath.
- the distance between the deflectors is relatively large, the metal strip will be warped across its width and may have a large catenary longitudinally, so that the distance between the metal strip and electrodes of the apparatus is not constant.
- a deposit of uneven thickness tends to occur on the surfaces of the metal strip. Therefore, a conventional apparatus is provided with deflector rolls as well as snubber rolls or presser rolls, which clamp the metal strip, so as to decrease the warp in the lateral and longitudinal catenary of the metal strip.
- an apparatus for plating a metal strip is provided with at least one support roll between the deflector rolls.
- This support roll is disposed at a predetermined distance from the deflector rolls and/or the other support rolls so that the distance between the metal strip and electrodes of the apparatus is substantially constant.
- an apparatus for plating a metal strip in an electrolytic cell comprises: a processing bath filled out with electrolytic solution, first means for deflecting said metal strip, a pair of electrodes for electroplating the metal strip, second means for suspending the electrodes and for conducting electricity for the electrodes, and third means for supporting the metal strip so as to be disposed at a predetermined distance from the first means, thereby reducing the longitudinal catenary of the metal strip.
- the first means may be a deflector roll having an axis extending horizontally
- the second means may be a pair of bus bars
- the third means may be at least one supporting roll having an axis extending horizontally.
- the electrodes may also be upper and lower electrodes essentially parallel to each other, between which the metal strip passes.
- the distance is preferably determined so that the catenary is 0.04 or less times of the distance between the upper and lower electrodes.
- the distance l (mm) between the support roll and the deflector roll and/or between the support rolls is preferably subject to the following formula: ##EQU2## in which the distance between the upper and lower electrodes is ⁇ D (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm) and the tension applied to the metal strip being T (kg).
- the process for plating a metal strip in an electrolytic cell comprises the steps of: introducing the metal strip into a processing bath filled out with electrolytic solution, deflecting the metal strip by means of first deflecting means so that the metal strip is essentially horizontal, electroplating the metal strip by means of a pair of upper and lower electrodes parallel to each other, supporting the metal strip so as not to have relatively large catenary by means of supporting means apart from the first deflecting means by a predetermined distance, deflecting the metal strip by means of second deflecting means separated from the supporting means by a predetermined distance, and taking the metal strip out of the processing bath.
- FIG. 1 is a schematic diagram of a preferred embodiment of an apparatus for plating a metal strip in an electrolytic cell according to the present invention.
- FIG. 2 is a schematic diagram of another preferred embodiment using a long plating bath.
- FIG. 3 is a graph showing the thickness of the deposit relative to the position of the metal strip according to an apparatus of the present invention and prior art.
- the preferred embodiment of an apparatus for plating a metal strip can plate a metal strip 4 in a processing bath 1, such as a plating bath.
- the processing bath 1 is filled out with electrolytic solution 9.
- the processing bath 1 is provided with deflector rolls 2a and 2b near its opposing inside walls.
- the metal strip 4 is deflected by means of the deflector rolls 2a and 2b so as to be essentially horizontal between the deflector rolls 2a and 2b in the processing bath 1.
- Two pair of electrodes 5a, 5b and 6a, 6b are provided between the deflector rolls 2a and 2b in series.
- the electrode 5a is essentially parallel to the electrode 5b and the electrode 6a is essentially parallel to the electrode 6b, so that the metal strip 4 can be disposed between the electrodes 5a and 5b and between the electrodes 6 a and 6b.
- the electrodes 5a, 5b, 6a and 6b are connected to bus bars 7a, 7b, 8a and 8b, through which electric currents flow for the electrodes 5a, 5b, 6a and 6b, and suspended by the bus bars 7a, 7b, 8a and 8b.
- a support roll 3 is provided between two pair of electrodes 5a, 5b and 6a, 6b, said support roll 3 disposed at a predetermined distance from the deflector rolls and supports the metal strip 4.
- the metal strip 4 is supported by the support roll 3 so as to be essentially horizontal, thus the longitudinal catenary and warpage in the lateral axis of the metal strip 4 can be reduced.
- the catenary ⁇ h 1 (mm) of the metal strip 4 between the deflector roll 2a or 2b and the support roll 3 can be expressed as follows: ##EQU3## wherein w denotes the unit weight (kg/mm) of the metal strip 4, and l is the length of a pass, that is, the distance (mm) between the deflector roll 2a or 2b and the support roll 3, which supports the metal strip 4 passing through the space between the electrodes 5a and 5b and between the electrodes 6a and 6b.
- At least one support roll is provided between the deflector rolls so as to be disposed at a predetermined distance from the deflector rolls 2a and 2b and/or the other support rolls, a deposit of essentially uniform thickness across the lateral axis of diposit on the surface of the metal strip 4 may be obtained.
- the distance is preferably determined so that the catenary ⁇ h 1 is equal to or less than 0.04 ⁇ D.
- the length of a pass l can be obtained from this result and the expression (1).
- the unit weight w can be expressed by the following formula:
- the pass length l (mm) can be obtained from the formula (5) as follows: ##EQU6##
- a metal strip was plated by electrolytic Ni-plating by using an apparatus for plating according to the present invention shown in FIG. 1.
- the thickness of the deposit was essentially equal near the center and edges on the surface of the metal strip 4.
- the unit weight of the deposit was 0.06 g/m 2 near the center and edges on the surface of the metal strip and its scattering was lower than ⁇ 5%.
- the thickness of the deposit on the surface of the metal strip is similar to the aforementioned results with respect to longitudinal direction.
- a plurality of support rolls 3 can also be used in the apparatus for plating a metal strip as shown in FIG. 2.
- the distance between the axes of the support rolls is preferably similar to l shown in formula (6).
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
An apparatus for plating a metal strip in an electrolytic cell is provided with a supporting roll. The support roll is disposed apart from the deflector rolls by a predetermined distance and supports the metal strip in such a way that the catenary of the metal strip can be reduced. The distance is determined so that the catenary is 0.04 or less times of the distance between upper and lower electrodes in the electrolytic cell. When the metal strip is a steel plate having a density of 7.85×10-6 (kg/mm3), the predetermined distance l (mm) between the axis of the deflector roll and that of the supporting roll is subject to the following formula: ##EQU1## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm) and the tension applied to the metal strip being T (kg).
Description
1. Field of the Invention
The present invention relates generally to an apparatus for plating a metal strip in an electrolytic cell. More specifically the invention relates to an apparatus for plating a metal strip, which apparatus can generate an deposit of consistent thickness on the surface of the metal strip.
2. Description of the Prior Art
In a horizontal pass-line type of apparatus for simultaneously plating the upper and lower surface of a metal strip, deflector rolls have been generally used near the opposing inside walls in a plating bath in order to deflect the flow direction of the metal strip fed from a point outside of the plating bath. However, when the distance between the deflectors is relatively large, the metal strip will be warped across its width and may have a large catenary longitudinally, so that the distance between the metal strip and electrodes of the apparatus is not constant. In this condition, when the metal strip is plated in the plating bath, a deposit of uneven thickness tends to occur on the surfaces of the metal strip. Therefore, a conventional apparatus is provided with deflector rolls as well as snubber rolls or presser rolls, which clamp the metal strip, so as to decrease the warp in the lateral and longitudinal catenary of the metal strip.
However, since the deflector rolls and snubber rolls in the aforementioned apparatus rotate so that one presses against another under a predetermined pressure in the electrolytic solution, there is a problem in that the rolls do not tend to clamp only the metal strip but also foreign matter, such as sludge and slimes, in the plating bath, thereby marring the metal strip.
It is therefore a principle object of the present invention to eliminate the aforementioned problems in conventional apparatus for plating a metal strip in an electrolytic cell and provide an apparatus which can generate a deposit of even thickness on the surface of the metal strip.
In order to accomplish the aforementioned and other specific objects, an apparatus for plating a metal strip, according to the present invention, is provided with at least one support roll between the deflector rolls. This support roll is disposed at a predetermined distance from the deflector rolls and/or the other support rolls so that the distance between the metal strip and electrodes of the apparatus is substantially constant.
According to one aspect of the present invention, an apparatus for plating a metal strip in an electrolytic cell comprises: a processing bath filled out with electrolytic solution, first means for deflecting said metal strip, a pair of electrodes for electroplating the metal strip, second means for suspending the electrodes and for conducting electricity for the electrodes, and third means for supporting the metal strip so as to be disposed at a predetermined distance from the first means, thereby reducing the longitudinal catenary of the metal strip. The first means may be a deflector roll having an axis extending horizontally, the second means may be a pair of bus bars and the third means may be at least one supporting roll having an axis extending horizontally. The electrodes may also be upper and lower electrodes essentially parallel to each other, between which the metal strip passes. The distance is preferably determined so that the catenary is 0.04 or less times of the distance between the upper and lower electrodes. In addition, when the metal strip is a steel plate having a density of 7.85×10-6 (kg/mm3), the distance l (mm) between the support roll and the deflector roll and/or between the support rolls is preferably subject to the following formula: ##EQU2## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm) and the tension applied to the metal strip being T (kg).
According to another aspect of the invention, the process for plating a metal strip in an electrolytic cell comprises the steps of: introducing the metal strip into a processing bath filled out with electrolytic solution, deflecting the metal strip by means of first deflecting means so that the metal strip is essentially horizontal, electroplating the metal strip by means of a pair of upper and lower electrodes parallel to each other, supporting the metal strip so as not to have relatively large catenary by means of supporting means apart from the first deflecting means by a predetermined distance, deflecting the metal strip by means of second deflecting means separated from the supporting means by a predetermined distance, and taking the metal strip out of the processing bath.
The present invention will be understood more fully from the detailed description given herebelow and from the accompanying drawings of the preferred embodiment of the invention. The drawings are not intended to imply limitation of the invention to this specific embodiment, but are for explanation and understanding only.
In the drawings:
FIG. 1 is a schematic diagram of a preferred embodiment of an apparatus for plating a metal strip in an electrolytic cell according to the present invention.
FIG. 2 is a schematic diagram of another preferred embodiment using a long plating bath.
FIG. 3 is a graph showing the thickness of the deposit relative to the position of the metal strip according to an apparatus of the present invention and prior art.
Referring now to the drawings, particularly to FIG. 1, the preferred embodiment of an apparatus for plating a metal strip, according to the present invention, can plate a metal strip 4 in a processing bath 1, such as a plating bath. The processing bath 1 is filled out with electrolytic solution 9. The processing bath 1 is provided with deflector rolls 2a and 2b near its opposing inside walls. The metal strip 4 is deflected by means of the deflector rolls 2a and 2b so as to be essentially horizontal between the deflector rolls 2a and 2b in the processing bath 1. Two pair of electrodes 5a, 5b and 6a, 6b are provided between the deflector rolls 2a and 2b in series. The electrode 5a is essentially parallel to the electrode 5b and the electrode 6a is essentially parallel to the electrode 6b, so that the metal strip 4 can be disposed between the electrodes 5a and 5b and between the electrodes 6 a and 6b. The electrodes 5a, 5b, 6a and 6b are connected to bus bars 7a, 7b, 8a and 8b, through which electric currents flow for the electrodes 5a, 5b, 6a and 6b, and suspended by the bus bars 7a, 7b, 8a and 8b. According to the preferred embodiment of the present invention, a support roll 3 is provided between two pair of electrodes 5a, 5b and 6a, 6b, said support roll 3 disposed at a predetermined distance from the deflector rolls and supports the metal strip 4. The metal strip 4 is supported by the support roll 3 so as to be essentially horizontal, thus the longitudinal catenary and warpage in the lateral axis of the metal strip 4 can be reduced.
It is described below how to determine the optimum distance between the axis of the deflector roll 2a or 2b and that of the support roll 3 in the processing bath 1.
When the metal strip 4 runs in the processing bath 1 by means of the deflector rolls 2 so that the the metal strip 4 has a predetermined tension T (kg), the catenary Δh1 (mm) of the metal strip 4 between the deflector roll 2a or 2b and the support roll 3 can be expressed as follows: ##EQU3## wherein w denotes the unit weight (kg/mm) of the metal strip 4, and l is the length of a pass, that is, the distance (mm) between the deflector roll 2a or 2b and the support roll 3, which supports the metal strip 4 passing through the space between the electrodes 5a and 5b and between the electrodes 6a and 6b.
Furthermore, the relationship between the catenary Δh1 and the thickness distribution of the deposit on the surface of the metal strip 4 was tested by using a pilot arrangement. As a result, a deposit of essentially uniform thickness across the lateral axis of deposit on the surface of the metal strip 4 was obtained when the relationship between the catenary Δh1 and the distance ΔD between the electrodes was expressed by the following formula:
(Δh.sub.1 /ΔD)≦0.04 (2)
Therefore, if at least one support roll is provided between the deflector rolls so as to be disposed at a predetermined distance from the deflector rolls 2a and 2b and/or the other support rolls, a deposit of essentially uniform thickness across the lateral axis of diposit on the surface of the metal strip 4 may be obtained. The distance is preferably determined so that the catenary Δh1 is equal to or less than 0.04×ΔD. The length of a pass l can be obtained from this result and the expression (1).
If the width of the metal strip 4 is labelled with W (mm), its thickness labelled with t (mm) and its density labelled with γ (kg/mm3), the unit weight w can be expressed by the following formula:
w=γ×W×t (3)
In addition, the following formula can be obtained from the formulae (1) and (3). ##EQU4## Therefore, from the formulae (2) and (4), the following formula can be obtained. ##EQU5##
If the metal strip 4 is a steel plate, γ=7.85×10-6 (kg/mm3). Therefore, the pass length l (mm) can be obtained from the formula (5) as follows: ##EQU6##
If the pass length l is determined as the formula (6), a deposit of uniform thickness can be generated on the surface of the metal strip 4.
A metal strip was plated by electrolytic Ni-plating by using an apparatus for plating according to the present invention shown in FIG. 1. As shown in FIG. 3, the thickness of the deposit was essentially equal near the center and edges on the surface of the metal strip 4. The unit weight of the deposit was 0.06 g/m2 near the center and edges on the surface of the metal strip and its scattering was lower than ±5%. Furthermore, the thickness of the deposit on the surface of the metal strip is similar to the aforementioned results with respect to longitudinal direction.
According to another preferred embodiment of the present invention, a plurality of support rolls 3 can also be used in the apparatus for plating a metal strip as shown in FIG. 2. In this case, the distance between the axes of the support rolls is preferably similar to l shown in formula (6).
Claims (12)
1. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
first means for deflecting said metal strip;
upper and lower electrodes essentially parallel to each other, between which said metal strip passes to be electroplated;
second means for suspending said electrodes and for conducting electricity for said electrodes; and
third means for supporting said metal strip and disposed at a predetermined distance from the first means, the distance l (mm) between said first means and said third means being subject to the following formula: ##EQU7## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm), the density thereof being γ (kg/mm3) and the tension applied to the metal strip being T (kg), thereby reducing the longitudinal catenary of said metal strip.
2. An apparatus for plating a metal strip as set forth in claim 1, wherein said first means is a deflector roll having an axis extending horizontally.
3. An apparatus for plating a metal strip as set forth in claim 2, wherein said second means are a pair of bus bars.
4. An apparatus for plating a metal strip as set forth in claim 2, wherein said third means is at least one supporting roll having an axis extending horizontally.
5. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
a pair of deflector rolls, each of which has an axis extending in an essentially horizontal direction, for deflecting said metal strip;
upper and lower electrodes essentially parallel to each other, between which said metal strip passes to be electroplated;
means for suspending said electrodes and for conducting electricity for said electrodes; and
at least one supporting roll which has an axis extending in an essentially horizontal direction for supporting said metal strip, the distance l (mm) between the axis of said supporting roll and that of said deflector roll and/or between the axes of said supporting rolls being determined so that the catenary is 0.04 or less times the distance between the upper and lower electrodes.
6. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
first means for deflecting said metal strip;
a pair of electrodes for electroplating said metal strip;
second means for suspending said electrodes and for conducting electricity for said electrodes; and
third means for supporting said metal strip so as to be disposed at a predetermined distance from the first means, thereby reducing the longitudinal catenary of said metal strip wherein said third means is at least one supporting roll having an axis extending horizontally wherein, when the metal strip is a steel plate having a density of 7.85×10-6 (kg/mm3), the distance l (mm) between the axis of said deflector roll and that of said supporting roll and/or between the axis of said supporting rolls is subject to the following formula ##EQU8## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm) and the tension applied to the metal strip being T (kg).
7. A process for plating a metal strip in a electrolytic cell comprising the steps of:
introducing the metal strip into a processing bath containing an electrolytic solution;
deflecting the metal strip by means of first deflecting means so that the metal strip is essentially horizontal;
electroplating the metal strip by means of a pair of upper and lower electrodes parallel to each other;
supporting the metal strip so as not to have a relatively large catenary by means of supporting means apart from said first deflecting means by a predetermined distance;
deflecting the metal strip by means of second deflecting means separated from said supporting means by a predetermined distance, said predetermined distances l (mm) between the axis of said supporting means and that of said first and second deflecting means and/or between the axes of said supporting means being subject to the following formula: ##EQU9## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm), the tension applied to the metal strip being T (kg) and the metal strip being a steel plate having a density of 7.85×10-6 (kg/mm3), thereby reducing the longitudinal catenary of said metal strip; and
taking the metal strip out of said processing bath.
8. A process for plating a metal strip in an electrolytic cell comprising the steps of:
introducing the metal strip into a processing bath containing an electrolytic solution;
deflecting the metal strip by means of first deflecting means so that the metal strip is essentially horizontal;
electroplating the metal strip by means of a pair of upper and lower electrodes parallel to each other;
supporting the metal strip so as not to have a relatively large catenary by means of supporting means apart from said first deflecting means by a predetermined distance;
deflecting the metal strip by means of second deflecting means separated from said supporting means by a predetermined distance, the predetermined distances being determined so that the catenary is 0.04 or less times of the distance between the upper and lower electrodes; and taking the metal strip out of said processing bath.
9. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
a pair of deflector rolls, each of which has an axis extending in an essentially horizontal direction, for deflecting said metal strip;
upper and lower electrodes essentially parallel to each other, between which said metal strip passes to be electroplated;
means for suspending said electrodes and for conducting electricity for said electrodes; and
at least one supporting roll having an axis extending in an essentially horizontal direction, for supporting said metal strip, the distance l (mm) between the axis of said supporting roll and that of said deflector roll and/or between the axes of said supporting rolls being subject to the following formula: ##EQU10## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm), the tension applied to the metal strip being T (kg) and the metal strip being a steel plate having a density of 7.85×10-6 (kg/mm3), thereby reducing the longitudinal catenary of said metal strip.
10. An apparatus for plating a metal strip as set forth in claim 9, wherein said means are a pair of bus bars.
11. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
a pair of deflector rolls for deflecting said metal strip;
upper and lower electrodes essentially parallel to each other, between which said metal strip passes to be electroplated;
means for suspending said electrodes and for conducting electricity for said electrodes; and
at least one supporting roll for supporting said metal strip, the distance l (mm) between the axis of said supporting roll and that of said deflector roll and/or between the axes of said supporting rolls being essentially subject to the following formula: ##EQU11## in which the distance between the upper and lower electrodes is ΔD (mm), the thickness of the metal strip being t (mm), the width thereof being W (mm), the tension applied to the metal strip being T (kg) and the metal strip being a steel plate having a density of 7.85×10-6 (kg/mm3), thereby reducing the longitudinal catenary of said metal strip.
12. An apparatus for plating a metal strip in an electrolytic cell comprising:
a processing bath containing an electrolytic solution;
a pair of deflector rolls for deflecting said metal strip;
upper and lower electrodes essentially parallel to each other, between which said metal strip passes to be electroplated;
means for suspending said electrodes and for conducting electricity for said electrodes; and
at least one supporting roll for supporting said metal strip, the distance l (mm) between the axis of said supporting roll and that of said deflector roll and/or between the axes of said supporting rolls being determined so that the catenary is essentially 0.04 of the distance between the upper and lower electrodes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60268116A JPS62127495A (en) | 1985-11-28 | 1985-11-28 | Electrolytic treatment apparatus for metallic strip |
| JP60-268116 | 1985-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4749450A true US4749450A (en) | 1988-06-07 |
Family
ID=17454107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/935,454 Expired - Fee Related US4749450A (en) | 1985-11-28 | 1986-11-26 | Apparatus for plating metal strip in electrolytic cell |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4749450A (en) |
| EP (1) | EP0227533B1 (en) |
| JP (1) | JPS62127495A (en) |
| AU (1) | AU603779B2 (en) |
| CA (1) | CA1331744C (en) |
| DE (1) | DE3681266D1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR448243A (en) * | 1912-07-15 | 1913-01-25 | Federico Werth | Device for uniform galvanizing of bands, metal wires, etc., in continuous succession |
| US1917657A (en) * | 1929-01-04 | 1933-07-11 | Acme Steel Co | Galvanizing process and apparatus |
| FR889657A (en) * | 1942-09-11 | 1944-01-17 | Maurice Damien | Method and apparatus for the electrolytic treatment of continuous metal bands |
| US2936278A (en) * | 1955-03-07 | 1960-05-10 | Kolene Corp | Molten salt bath apparatus for electrolytic cleaning of metals |
| US4248674A (en) * | 1979-09-20 | 1981-02-03 | Leyh Henry W | Anodizing method and apparatus |
| US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149795A (en) * | 1984-01-12 | 1985-08-07 | Sumitomo Metal Ind Ltd | Continuous electroplating device |
-
1985
- 1985-11-28 JP JP60268116A patent/JPS62127495A/en active Pending
-
1986
- 1986-11-25 AU AU65680/86A patent/AU603779B2/en not_active Ceased
- 1986-11-26 US US06/935,454 patent/US4749450A/en not_active Expired - Fee Related
- 1986-11-27 CA CA000524016A patent/CA1331744C/en not_active Expired - Fee Related
- 1986-11-28 EP EP86402652A patent/EP0227533B1/en not_active Expired
- 1986-11-28 DE DE8686402652T patent/DE3681266D1/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR448243A (en) * | 1912-07-15 | 1913-01-25 | Federico Werth | Device for uniform galvanizing of bands, metal wires, etc., in continuous succession |
| US1917657A (en) * | 1929-01-04 | 1933-07-11 | Acme Steel Co | Galvanizing process and apparatus |
| FR889657A (en) * | 1942-09-11 | 1944-01-17 | Maurice Damien | Method and apparatus for the electrolytic treatment of continuous metal bands |
| US2936278A (en) * | 1955-03-07 | 1960-05-10 | Kolene Corp | Molten salt bath apparatus for electrolytic cleaning of metals |
| US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
| US4248674A (en) * | 1979-09-20 | 1981-02-03 | Leyh Henry W | Anodizing method and apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0227533A1 (en) | 1987-07-01 |
| JPS62127495A (en) | 1987-06-09 |
| EP0227533B1 (en) | 1991-09-04 |
| AU603779B2 (en) | 1990-11-29 |
| DE3681266D1 (en) | 1991-10-10 |
| AU6568086A (en) | 1987-06-04 |
| CA1331744C (en) | 1994-08-30 |
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