JP2002059060A - Application method, applicator, and method for forming coating film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that, in a conventional application method, uniformity in the surface of a formed liquid film is not enough, especially the difference between the liquid film thickness at the end part of a substrate and the film thickness at the middle part of the substrate is apt to occur to cause the nonuniformity of the film thickness, and the inclusion of bubbles and the breakage of the film are generated dependently on the thickness of the substrate and the material of the film. SOLUTION: In an application method in which, while an application means 2 is moved relatively to a substrate stage 1 for holding the substrate W, and a coating liquid P is supplied from the application means 2 to the substrate W held on the substrate stage 1 to form a coating film on the substrate, the substrate is mounted on the substrate holding part 5 of the substrate stage 1 having the substrate holding part 5 and peripheral parts 1A-1C which can move vertically in relation to the substrate holding part 5, the position of the substrate holding part 5 in relation to the peripheral parts 1A-1C is decided by a change means 5A for changing the height of the substrate, and the liquid film is formed so that an application range covers the peripheral parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of applying a liquid film for forming a liquid film in a process of manufacturing an electronic device such as a liquid crystal display or a semiconductor device, a coating apparatus, and a method of forming a film.

[0002]

2. Description of the Related Art In a process of manufacturing a liquid crystal display, a semiconductor device, or the like, there is a step of forming various kinds of films. Examples of such a film include a photosensitive film such as a photoresist used for photolithography, an alignment film in a liquid crystal display, a colored film of a color filter, and an interlayer insulating film in a semiconductor device.

[0003] These coatings have been produced from a coating liquid film (liquid film) formed by a spin coating method, but recently, a die coating method has attracted attention as one of the liquid film forming methods. The die coating method uses two die blades,
Using a coating head (die head) having slits formed by parallel edges of about 0 to 100 μm, the coating liquid is extruded from the slits by pressure feeding or a pump or the like, and discharged, and flat glass or a substrate such as a semiconductor wafer or the like is discharged. Is a method of forming a liquid film by directly applying a coating liquid to a liquid, and is sometimes referred to as a slit coating method.

[0004] A die coating method (slit coating method) and an apparatus therefor are described in JP-A-10-012710 and JP-A-11-090295.

[0005] The die coating method can greatly reduce the amount of a coating liquid to be used, as compared with a conventionally used spin coating method. In addition, in a liquid crystal display using a rectangular substrate, a necessary portion of the substrate is required. There is an advantage such that a liquid film can be formed only on this.

[0006]

However, the above-mentioned die coating method is suitable for a rectangular substrate typified by a glass substrate used in a liquid crystal display or the like, but is not suitable for the structure of a coating head for discharging a coating liquid. It has been difficult to apply a circular non-square substrate such as a silicon wafer or a recording disk only to the substrate.

In addition, in the conventional coating method, the in-plane uniformity of the formed liquid film is insufficient irrespective of the square substrate or the non-square substrate, and especially the thickness of the liquid film on the edge of the substrate is insufficient. However, unevenness in film thickness different from the thickness of the liquid film on the central portion of the substrate was likely to occur.

Furthermore, depending on the thickness of the substrate and the material and thickness of the liquid film, there are cases where bubbles are entrapped or the liquid film is broken.

Another object of the present invention is to provide a liquid film coating method, a liquid film coating apparatus, and a film forming method capable of forming a liquid film or a film having better film thickness uniformity in a substrate surface than in the past. Is to do.

[0010]

According to the present invention, there is provided a method for coating a liquid film, the method comprising: moving a coating means relative to a substrate stage for holding a substrate; In a coating method of supplying a coating liquid on the substrate to form a film of the coating liquid on the substrate, the substrate stage having a substrate holding portion and a peripheral portion that can be moved up and down relatively to the substrate holding portion. Placing the substrate on the substrate holding portion, determining the relative position of the substrate holding portion with respect to the peripheral portion, forming the film so that the coating range extends over the peripheral portion, It is characterized by including.

The liquid film coating apparatus of the present invention includes a substrate stage for holding a substrate, and coating means for supplying a coating liquid onto the substrate, and moves the coating means and the substrate stage relative to each other. In the coating apparatus, the coating liquid is supplied from the coating unit onto the substrate held on the substrate stage to form a film of the coating liquid on the substrate. In the coating apparatus, the substrate stage holds the substrate. And a peripheral portion which can be moved up and down relative to the substrate holding portion and to which a coating liquid is applied, in order to change a relative position between the peripheral portion and the substrate holding portion. Is provided.

[0012] A method for producing a coating film according to the present invention is characterized by comprising a step of forming a film of the coating liquid on a substrate by the above-mentioned coating method and a step of baking the coating liquid film.

(Function) According to the present invention, when a liquid film is applied to a substrate, the liquid is applied so that the periphery of the substrate stage having a surface close to the surface on which the film is to be formed is also within the application range. By applying the coating liquid, it is possible to suppress the occurrence of uneven film thickness on the edge of the substrate.

Since the relative position between the substrate holding portion and the peripheral portion can be adjusted, it is possible to prevent air bubbles from being caught at the edge of the substrate and breakage of the liquid film.

[0015]

Embodiments of the present invention will be described with reference to the drawings.

A coating method typified by a die coating method is suitable for a square substrate, but is applied to a circular non-square substrate such as a silicon wafer or a recording disk due to the structure of a coating head for discharging a coating liquid. However, it was difficult to apply only on a circular substrate.

[0017] Regardless of the square substrate and the non-square substrate,
The in-plane uniformity of the liquid film formed on the substrate is insufficient,
In particular, the thickness of the liquid film on the edge of the substrate is likely to be uneven, which is different from the thickness of the liquid film on the center of the substrate.

Therefore, the height of the peripheral portion of the substrate stage is increased, the upper surface of the peripheral portion of the substrate stage is brought close to the surface on which the film is to be formed on the substrate, and the coating solution is extended so as to extend to the peripheral portion of the substrate stage. Was applied, the uniformity of the thickness of the liquid film formed on the substrate could be improved.

However, depending on the relative position of the film deposition surface of the substrate with respect to the peripheral portion, bubbles may be trapped between the liquid film and the substrate, or the liquid film may break at the end surface of the substrate to have an undesirable shape. Sometimes.

For example, if the film formation surface of the substrate is at a position lower than the upper surface of the peripheral portion, it is easy to embrace bubbles, and if it is at a higher position, the liquid film is liable to break. The relative height relationship between the film-forming surface of the substrate and the upper surface of the peripheral portion, that is, the optimum condition of the relative position in the normal direction of the surface of the substrate depends on the physical properties (for example, viscosity) of the coating liquid to be applied and the liquid. It depends on the thickness of the film.

Therefore, the present invention provides a structure in which the peripheral portion of the substrate stage and the substrate holding portion can be moved up and down relatively, and a change means capable of changing and adjusting their relative positions is provided. In addition, the liquid film can be formed with a uniform thickness without entrapping bubbles or breaking the liquid film.

(Embodiment 1) FIG. 1 is a perspective view showing a schematic configuration of an embodiment of a liquid film coating apparatus according to the present invention.
FIG. 2 is a sectional view thereof.

FIG. 3 is a schematic flow chart showing a liquid film forming and liquid removing step by the die coating method according to the present invention.

The liquid film coating apparatus according to the present invention is shown in FIG.
As shown in FIG. 2, a substrate stage 1 for holding a substantially disk-shaped substrate W such as a wafer, and an application unit 2 for applying a coating liquid to the substrate W held on the substrate stage 1 are provided.

The substrate stage 1 is configured such that a portion on which the substrate W is placed is a concave portion. This recess is formed on the substrate W
In order to hold the substrate W, the substrate W may have a depth substantially corresponding to the size of the substrate W and a depth such that the film formation surface of the substrate W substantially coincides with the peripheral surfaces 1A, 1B, and 1C of the substrate stage 1. As described above, the peripheral part 1A, 1B, 1C of the substrate stage 1 and the substrate holding part 5 are formed.

This recess has a thickness of, for example, about 0.625 m.
m, about 125 mm diameter wafer (so-called 5-inch wafer)
When coating is performed on a wafer, a size corresponding to the size of the wafer (diameter: about 125 mm, depth: about 0.625 mm)
Becomes

Further, if necessary, the substrate stage 1 is provided with a suction hole 6 communicating with the substrate holding portion 5 so as to hold the substrate W in close contact with the substrate holding portion 5. 7 and is connected to a suction source 7A such as a vacuum pump.

The substrate holding unit 5 is configured to be able to move up and down relatively with respect to the periphery of the substrate stage, and is driven by elevating means (change means) 5A such as a motor, a hydraulic cylinder, and an air cylinder, which will be described later.

The relative elevation between the upper surface of the substrate holding portion 5 and the upper surfaces 1A to 1C of the peripheral portion can be appropriately changed by the elevating means 5A. That is, by transmitting a control signal from a control device (not shown) to the lifting / lowering means, the substrate holding unit 5 in the direction normal to the surface of the substrate placed on the substrate holding unit 5 is transmitted.
Position can be adjusted.

In the embodiment of FIGS. 1 and 2, the structure in which the substrate holder 5 can be moved up and down by the elevating means 5 is shown. However, the substrate holder 5 is fixed and the peripheral parts 1 A to 1 C are moved up and down. It may be configured to be able to move up or down.

The coating means 2 connects a coating head (die head) 8 for coating the substrate W with the coating liquid, a coating liquid supply source 9A for supplying the coating liquid to the coating head 8, and the coating head 8 and the coating liquid supply source 9A. And a liquid supply path 9.

The coating head 8 used here has a slit 8C having a length of 10 μm to 100 μm formed by at least two blades 8A and 8B, and the slit 8C applies a coating liquid. It is formed with a length slightly longer than the maximum width of the substrate W (corresponding to the diameter of the wafer in this case). The coating head 8 is provided so as to be adjustable in the vertical direction so that the coating head 8 can be positioned slightly apart from the surface 1A of the peripheral portion of the substrate stage 1, and
Furthermore, it is configured to be able to translate relatively to the substrate stage 1.

Thus, the coating liquid is discharged from the slit 8C while the coating head 8 and the substrate stage 1 are relatively moved in parallel along the surface on which the substrate W is to be formed, so that the substrate stage 1 is attracted. A liquid film can be formed on the substrate W by applying the coating liquid on the entire upper surface of the held substrate W.

Next, an embodiment in which a coating film is formed by applying a coating liquid to the substrate held by suction on the substrate stage by using the coating apparatus having the above-described structure will be described with reference to the process chart shown in FIG. explain.

First, as shown in FIG. 3A, a substrate W such as a semiconductor wafer or a recording disk is placed on the bottom surface of the substrate holder 5 of the substrate stage 1, and the vacuum suction source 7A is operated. The pressure in the suction hole 6 is reduced to a pressure lower than the atmospheric pressure, and the substrate W
Is attracted to the substrate holding unit 5 to hold the substrate W on the substrate stage 1. At this time, before and / or after the suction, the film formation surface of the substrate W is moved to the surfaces 1A and 1B of the peripheral portion of the substrate stage 1.
The substrate holder 5 is moved up and down so as to be on the same plane as above, and the position is adjusted.

Next, as shown in FIG. 3B, the application unit 2 is operated to discharge the coating liquid P from the slit portion 8C of the coating head 8 and to move the coating head 8 onto the substrate W on the substrate stage 1. The coating liquid P is applied to a region including the entire surface of the substrate W on which the film is to be formed by moving the slit portion 8C in a direction perpendicular to the length direction of the slit portion 8C.

At this time, the coating liquid is applied so that the coating range extends to the peripheral portion as shown in the figure.

In particular, as shown in the figure, the coating start position is set as the surface of the peripheral portion 1B of the substrate stage, the approach distance to the edge of the substrate W is set, and the coating end position is set as the surface of the peripheral portion 1A of the substrate stage. , An extension distance from the edge of the substrate W may be provided.

Separately, as shown in the figure, the length of the slit portion 8C is made longer than the maximum width of the slit portion of the substrate W in the scanning direction (here, the diameter of the circular substrate), so that the head moves in the moving direction. On the other hand, it is also preferable that the coating liquid is applied to the peripheral portion 1C of the substrate stage on both sides of the substrate W.

Then, the peripheral portions 1A, 1
It is even more preferable that the coating liquid P is applied to the surfaces B and 1C and the entire surface of the substrate W on which the film is formed.

After the application, the suction operation of the substrate W by the vacuum suction source 7A is released, and the inside of the suction hole 6 is returned to the atmospheric pressure.
Is taken out of the substrate holding unit 5 of the substrate stage 1.

Before the suction operation is released, the substrate W may be easily taken out from the substrate holding portion 5 of the substrate stage 1 by raising the substrate holding portion 5 to a position where the back surface of the substrate is higher than the peripheral portion. Further, it is also preferable to provide a lift member that can move up and down through the substrate holding unit so as to separate the substrate from the substrate holding unit.

Thus, a substrate W having a liquid film formed on the entire upper surface is obtained.

Further, since the coating liquid adheres to the peripheral portion of the substrate stage 1 after the removal of the substrate W, it is desirable to remove it for the next processing.

A uniform liquid film can be formed on the film-forming surface of the substrate W by applying the coating liquid such that the edge of the liquid film to be formed is located on the surface of the peripheral portion of the substrate stage. .
This will be described with reference to FIG.

FIG. 4A shows a peripheral portion of the substrate stage 1.
A state in which a substrate is placed on a stage having a configuration in which the surfaces of 1A and 1B are lower than the surface of the substrate W by the thickness of the substrate, and a liquid film is applied only to the film formation surface of the substrate W FIG.

On the other hand, FIG. 4B shows a state in which the substrate is placed on a stage in which the surfaces of the peripheral portions 1A and 1B of the substrate stage 1 are substantially flush with the surface of the substrate W. FIG. 9 is a schematic cross-sectional view showing a state in which a liquid film is formed on the surfaces of peripheral portions 1A and 1B together with the film-forming surface of a substrate W.

In any case, the film thickness at the end P1 of the liquid film is larger than the film thickness at the center P2 of the liquid film. In the case of (a), the thick portion P1 is disposed on the end of the substrate W, whereas in the case of (b), the thick portion P1 of the liquid film is located on the peripheral portions 1A and 1B of the substrate stage. As a result, the thickness of the liquid film on the edge of the substrate W is the same as the thickness of the liquid film on the center of the substrate W. Thus, a uniform liquid film can be formed on the entire surface of the substrate W.

Preferably, the surface of the substrate W and the surface of the peripheral portion of the substrate stage are as flush as possible, so that the liquid film embraces bubbles at the boundary between the peripheral portion and the substrate. It is desirable that the liquid film does not break or break. Although it depends on the viscosity of the coating solution and the thickness of the liquid film, the upper surface of the peripheral portion with respect to the film formation surface of the substrate is +10 μm or more.
If the difference is about -200 μm, it is possible to prevent entrapped air bubbles and disruption of the liquid film when applying a coating liquid used in this field. Thus, it is possible to form a liquid film having a uniform thickness in the plane.

Depending on the material of the liquid film and the material of the substrate surface,
In some cases, it may be preferable to make a difference in elevation. Also in this case, the position of the substrate holding section may be adjusted by the elevating means so that a predetermined height difference is obtained.

In order to set the relative position between the film formation surface of the substrate and the upper surface of the peripheral portion of the substrate stage as described above, ±
It is desirable that the substrate holder can be moved up and down with an accuracy of about 3 μm. Such a high-accuracy adjustment can be sufficiently performed by using a servo motor or a stepping motor as described later.

(Embodiment 2) Next, another embodiment of the liquid film coating apparatus of the present invention will be described with reference to FIGS. FIG. 5 is a schematic perspective view of a substrate stage of the coating apparatus, and FIG. 6 is a sectional view thereof.

The substrate stage 1 is supported on a support 20 by support columns 21. The substrate holding unit 5 is configured to be able to move up and down relatively to the substrate stage peripheral parts 1A to 1C.

The substrate holder 5 has a gear 23 below it.
And movable member 24 having a hollow portion
Has been fixed. A movable guide member 25 is fixed to the movable member 24 by an arm 27. The support 20 is provided with a motor (drive source) 22 such as a servo motor or a stepping motor, and a bearing 28. When the motor 22 rotates, the gear 23 rotates, and the movable member 24 engaged with the gear 23 receives a force to move up and down along the rotation axis of the gear 23. At this time, the movable guide member 25
Is moved up and down by being guided by a linear guide 29 fixed to the support base 20 and the peripheral portion of the substrate stage, and accordingly, the movable members 24 and 26 and the substrate holding unit 5 move up and down.

The operation of the motor 22 is controlled by the control device 22A. The control device 22A, which has received an instruction from the operator, sends a predetermined control signal or drive signal to the motor 22, and moves the substrate holder 5 to an appropriate height. Raise and lower until.

In the present embodiment, the process of applying a coating liquid to the substrate held by suction on the substrate stage to form a liquid film is performed in the same manner as in the above-described embodiment. That is, the substrate W is placed on the substrate holding unit 5 of the substrate stage 1, and the inside of the suction hole 6 is set to a negative pressure to suck and hold the substrate W.

Then, the substrate W is moved up and down by the operation of the motor 22 so as to be positioned at an appropriate position, and the coating liquid P is applied to the area including the entire surface of the substrate W by the coating means 2 (not shown in FIGS. 5 and 6). I do. After that, the substrate W is raised to a position where it can be easily taken out, the vacuum suction source 7A is stopped, and the suction hole is removed.
The inside of the substrate 6 is returned to the atmospheric pressure, the substrate W is released, and the substrate W is taken out from the substrate holding part 5, whereby the substrate W having a liquid film formed on the entire surface is obtained.

(Embodiment 3) Next, still another embodiment of the liquid film coating apparatus of the present invention will be described with reference to FIGS. FIG. 7 is a schematic perspective view of a substrate stage of the coating apparatus, and FIG. 8 is a sectional view thereof.

The substrate stage 1 is supported on a support 20 by support columns 21. The substrate holding unit 5 is configured to be able to move up and down relatively to the substrate stage peripheral parts 1A to 1C.

A movable block 34 having a lower slope is attached below the substrate holding unit 5. A movable block 33 having an upper inclined surface and a motor 31 for moving the movable block 33 in parallel with the substrate are attached to the support base 20, and the movable block 34 moves up and down together with the substrate holding unit 5 in accordance with the movement of the movable block 33. It is configured to move to.

The operation of the motor 31 is controlled by the control device 31A, and the control device 31A, which has received an instruction from the operator, sends a predetermined control signal or drive signal to the motor 31, and raises the substrate holder 5 to an appropriate height. Raise and lower until.

In this embodiment, the process of forming a liquid film by applying a coating liquid to the substrate held by suction on the substrate stage is performed in the same manner as in the above-described embodiment. That is, the substrate W is placed on the substrate holding unit 5 of the substrate stage 1, and the inside of the suction hole 6 is set to a negative pressure to suck and hold the substrate W.

Then, the substrate W is moved up and down by the operation of the motor 31 to be set at an appropriate position, and the coating liquid P is applied to a range including the entire surface of the substrate W by the coating means 2 (not shown in FIGS. 7 and 8). I do. After that, the substrate W is raised to a position where it can be easily taken out, the vacuum suction source 7A is stopped, and the suction hole is removed.
The inside of the substrate 6 is returned to the atmospheric pressure, the substrate W is released, and the substrate W is taken out from the substrate holding part 5, whereby the substrate W having a liquid film formed on the entire surface is obtained. In the present invention, the shape of the substrate holding portion provided on the substrate stage may be a square concave so that a rectangular substrate such as a glass substrate can be held. In this case, the slit portion has the same length as the maximum width of the substrate on which the coating liquid is applied (here, the width of the rectangular substrate, and the length along the length direction of the slit portion), or is slightly longer than that. Good to do.

Other configurations and coating methods are the same as those of the above-described embodiment.

The present invention is not limited to the above-described embodiments, and the materials of various constituent elements may be changed or additional means may be added as long as the object of the present invention is achieved. Also, various components may be replaced with equivalents.

Examples of the substrate used in the present invention include semiconductor wafers such as silicon, silicon carbide, silicon germanium, gallium arsenide, and indium arsenide; insulating substrates such as quartz, sapphire, alumina, glass, and resin;
It may be a metal substrate of aluminum, stainless steel, or the like, on which various elements, wiring, various thin films, and the like are formed.

These substrates include semiconductor elements, LSIs, liquid crystal elements, optical disks, magnetic disks, magneto-optical disks,
It is used for manufacturing color filters, micro lenses, and the like.

The coating formed by the present invention includes a water-repellent film, an oil-repellent film, a photosensitive film, an insulating film, a thermosetting film,
Photocurable film and alignment film. For example, the photosensitive film is a photoresist used for forming a photolithography or a color filter. The insulating film is an insulating film between wirings used for an LSI or a liquid crystal element.

Specifically, acrylic resin, epoxy resin, phenol resin, polyimide, fluorinated polyimide, polyvinyl alcohol, polyimide, HSQ (Hy
drogen Silsesquioxan), BCB (Benzocyclobuten)
e), MSQ (Methyl Silsesquioxane), PTFE (Poly
tetrafluoroethylene), polyaryl ethers, fluorinated polyaryl ethers and the like.

These films are baked at an appropriate temperature, for example, at a temperature of 50 ° C. or higher, to form a liquid film formed by the coating method according to each of the above-described embodiments, thereby evaporating a solvent or a dispersion medium to make the film strong. . In the case of a photo-curable resin, light such as ultraviolet rays is further applied to form a strong film.

As the coating liquid used in the present invention, a starting material obtained by dissolving or dispersing the above-mentioned raw materials in a solvent or a dispersion medium can be used. These viscosities depend on the starting materials, but can be selected from the range of about 10 cps to 100,000 cps.

The thickness of the liquid film is 0.3 μm to 200 μm, and the thickness is reduced by baking after the formation of the liquid film. Therefore, it is appropriately selected according to the thickness of the target film and the starting material to be used. Should.

As a coating means used in the present invention, a head or a roller used in the aforementioned die coating method or roll coating method is used.

The application means and the substrate stage need only be relatively moved during the application, so that only the head or roll can be moved in one direction, or only the substrate stage can be moved in one direction. Alternatively, both may be moved individually.

The height of the peripheral portion of the substrate stage is substantially the same as the film formation surface of the substrate as described above. When the peripheral portion is higher than the substrate, the liquid film tends to take in bubbles, and when the peripheral portion is lower than the substrate, the liquid film is likely to be divided. Depending on the viscosity of the coating liquid and the thickness of the liquid film, if the height of the peripheral portion is about +10 μm to −200 μm on the basis of the film formation surface of the substrate, it is possible to sufficiently suppress the occurrence of such a problem. it can.

The distance between the coating start position on the periphery of the substrate stage and the edge of the substrate may be 1 mm or more, and more preferably, 5 mm to 30 mm. on the other hand,
The distance between the opposite substrate edge and the coating end position is 1 mm
That is all. In any case, as the distance is increased, the consumption of the coating liquid increases. Therefore, the upper limit of the distance may be determined in consideration of this point. Similarly, it is preferable that the length of the slit portion is 1 mm or more longer than the width of the substrate.

The substrate stage may be configured to hold a plurality of substrates W at the same time. Further, as the substrate W, not only a non-square substrate such as a wafer or a disk as shown in the figure but also a square substrate such as a glass substrate may be used. The length of the coating means is equal to or slightly larger than the maximum array width (length along the length direction of the slit portion) of the arrayed substrate group. Thus, the liquid film is formed so as to extend not only to the substrate W but also to at least a part of the peripheral portion of the substrate stage.

[0078]

As described above, according to the present invention,
Since the relative position between the peripheral portion of the substrate stage and the surface on which the film is to be formed can be adjusted, when trying to form a liquid film having a uniform thickness, it is difficult for air bubbles to be caught or the liquid film to be broken. Become.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of an embodiment of a liquid film coating apparatus according to the present invention.

FIG. 2 is a cross-sectional view showing a schematic configuration of an embodiment of a liquid film coating apparatus according to the present invention.

FIG. 3 is a schematic process diagram showing a liquid film forming process by a die coating method according to the present invention.

FIG. 4 is a cross-sectional view of a liquid film obtained by a comparative example and a coating method of the present invention.

FIG. 5 is a perspective view showing a substrate stage in one embodiment of a liquid film coating apparatus according to the present invention.

FIG. 6 is a cross-sectional view showing a substrate stage in one embodiment of a liquid film coating apparatus according to the present invention.

FIG. 7 is a perspective view showing a substrate stage in another embodiment of the liquid film coating apparatus according to the present invention.

FIG. 8 is a sectional view showing a substrate stage in another embodiment of the liquid film coating apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate stage 1A, 1B, 1C peripheral part 2 Coating means 3 Liquid removing means 5 Substrate holding part 5A Elevating means 6 Suction hole 7 Suction tube 7A Vacuum suction source 8 Coating head (die head) 8A, 8B Blade 8C Slit part 9 Liquid supply Path 9A Coating liquid supply source 20 Support base 21 Support column 22, 31 Motor 22A, 31A Controller 23 Gear 24, 26 Movable member 25 Movable guide member 27 Arm 28 Bearing 29 Linear guide 33, 34 Movable block W Substrate (wafer) P Coating liquid

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Toshinori Furusawa 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term (reference) in Canon Inc. 2H025 AB16 AB17 EA04 4D075 AC04 AC82 AC93 AC95 CA47 DA08 DB14 DC22 EA05 4F041 AA06 AB01 BA05 BA22 4F042 AA06 BA08 CB03 DF09 DF34 5F046 JA01 JA27

Claims (14)

[Claims] 1. A coating liquid is supplied from the coating means onto a substrate held on the substrate stage while the coating means is relatively moved with respect to a substrate stage for holding the substrate, and the coating liquid is supplied onto the substrate. In a coating method for forming a liquid film, a step of mounting the substrate on the substrate holding portion of the substrate stage having a substrate holding portion and a peripheral portion that can move up and down relatively to the substrate holding portion; A coating method comprising: determining a relative position of the substrate holding unit with respect to the peripheral portion; and forming the film so that an application range extends over the peripheral portion. 2. The coating method according to claim 1, wherein the substrate holding section sucks the substrate by a suction hole. 3. The coating method according to claim 1, wherein the substrate is a non-square substrate. 4. The coating method according to claim 1, wherein the coating start position and the coating end position are on the peripheral portion of the substrate stage. 5. The coating method according to claim 1, wherein the coating unit has a slit, and the coating liquid is discharged from the slit to form the film. 6. The coating means has a slit portion longer than a maximum width of the substrate, discharges the coating liquid from the slit portion, and controls the coating means in a direction perpendicular to a length direction of the slit portion. The coating method according to claim 1, wherein the film is formed by being relatively moved. 7. A substrate stage for holding a substrate, and a coating unit for supplying a coating liquid onto the substrate, wherein the coating liquid is applied from the coating unit while the coating unit and the substrate stage are relatively moved. In a coating apparatus that supplies the coating liquid on the substrate held on the substrate stage to form a film of the coating liquid on the substrate, the substrate stage includes a substrate holding unit that holds the substrate, and a substrate holding unit. A peripheral portion to which the coating liquid is applied, which can be relatively raised and lowered with respect to the substrate holding portion; and a changing portion for changing a relative position between the peripheral portion and the substrate holding portion. A coating device characterized by the above-mentioned. 8. The coating apparatus according to claim 7, wherein the substrate holding section sucks the substrate by a suction hole. 9. The coating apparatus according to claim 7, wherein the substrate holding section is non-square. 10. The coating apparatus according to claim 7, wherein the operation of the coating unit and the substrate stage is controlled such that the coating start position and the coating end position are on the peripheral portion of the substrate stage. . 11. The coating apparatus according to claim 7, wherein said coating means has a slit portion, and discharges said coating liquid from said slit portion to form said liquid film. 12. The coating means has a slit portion longer than the maximum width of the substrate, discharges the coating liquid from the slit portion, and applies the coating means in a direction perpendicular to the length direction of the slit portion. The coating device according to claim 7, wherein the film is formed by being relatively moved. 13. A method for producing a film, comprising: a step of forming a film of the coating liquid on a substrate by the coating method according to claim 1; and a step of baking the film of the coating liquid. 14. The film according to claim 1, wherein the film is a film selected from a water-repellent film, an oil-repellent film, a photosensitive film, an insulating film, a thermosetting film, a photocurable film, and an alignment film. Item 14. A method for producing a film according to Item 13.