JP2002052494A - Drilling method for printed circuit board and drill - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem of consuming a burr prevention sheet having a same size as a circuit board per each printed circuit board so as to produce a lot of sheet material wastes in manufacturing the printed circuit. SOLUTION: The printed circuit board 1 is continuously drilled by a drill 7, while the belt-shaped burr prevention sheet 3 put on the printed circuit board 1 is intermittently carried at prescribed pitches relative to the drilling position of the printed circuit board 1 by the drill 7. This method can drastically improve the using efficiency of the burr prevention sheet material so as to drastically reduce the sheet material wastes and be expected of the reduction effect of the manufacturing cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board drilling method and a drilling apparatus for drilling holes in a printed circuit board.

[0002]

2. Description of the Related Art Drilling is a technique for drilling holes such as vias for connection between layers and jig holes in an electronic board such as a copper-clad printed board. In the drilling by the drilling, in order to suppress the generation of burrs around the hole, as shown in FIG.
0.2mm thin aluminum sheet or thickness 0.4
Sheet material 13 such as a hard resin sheet of about 0.8 mm
While the drill is relatively moved in the X direction and the Y direction with respect to the printed circuit board 11, the drilling of the printed circuit board 11 by the drill together with the sheet material 13 is continuously performed from above the sheet material 13. .

[0003] However, in the burr prevention measures using this sheet material, at least for each printed circuit board to be drilled, a sheet material of a size that can cover at least all the hole processing positions on the substrate surface is at least as large as the number of manufacturing substrates. It is necessary to have a limited preparation. Used sheet materials are disposed of as industrial waste, which results in a large amount of waste.In addition, depending on the type of printed circuit board and the purpose of the holes, a very small number of holes can be drilled. However, since one sheet material of the same size as the printed circuit board is consumed, the sheet material use efficiency is further deteriorated, and this is a factor that wastes production costs.

[0004]

As described above, in the conventional printed circuit board drilling method, one board is required.
Since one sheet for preventing burrs having the same size as the substrate is consumed, there is a problem that a large amount of industrial waste is generated in manufacturing the substrate.

An object of the present invention is to solve such a problem and to provide a method and an apparatus for punching a printed circuit board capable of greatly improving the use efficiency of a sheet material for preventing burrs. With the goal.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies for realizing the above-mentioned object, and as a result, have arrived at the present invention having the following features.

That is, in the method for drilling a printed circuit board according to the present invention, a method for drilling a printed circuit board is described in which a sheet for preventing burrs is placed on the printed circuit board and drilling is performed on the sheet with a drill or a laser. A band-shaped sheet is prepared as a sheet for preventing the burr, and while the band-shaped sheet is intermittently conveyed at a predetermined pitch with respect to a drilling position of the printed circuit board by the drill or the laser, The method is characterized in that drilling in the printed circuit board by a drill or a laser is performed continuously.

Further, the printed circuit board punching apparatus according to the present invention is a printed circuit board punching apparatus for placing a sheet for preventing burrs on the printed board and performing drilling or laser drilling from the sheet. A sheet feeding mechanism for intermittently conveying the strip-shaped sheet for preventing burrs at a predetermined pitch with respect to a drilling position of the printed circuit board by the drill or the laser is provided.

According to the present invention, the efficiency of use of a sheet material for preventing burrs used in punching a printed circuit board can be greatly improved, and a great reduction in sheet material waste can be achieved. An effect of cost reduction can be expected.

[0010]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B show a configuration of a printed circuit board punching apparatus according to an embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes a double-sided copper-clad printed circuit board. The double-sided copper-clad printed circuit board 1 is fed on a table (not shown) in the X / Y-axis direction to perform precise positioning.

Reference numeral 2 denotes a reel for paying out a strip-shaped sheet 3 (see FIG. 2) for preventing burrs wound in a roll shape, and reference numeral 4 denotes a reel for winding the same band-shaped sheet 3. Here, as the belt-shaped sheet 3, an aluminum sheet having a thickness of 0.15 mm and a width of 5 to 10 mm can be used. Of course, a sheet made of a material other than aluminum can be used.

A plurality of guide rollers 5 are formed between the reels 2 and 4 to form a conveying path for the belt-shaped sheet 3.
The reels 3 are intermittently fed at a constant pitch along the transport path. For example, a driving force for rotation is applied to the reel 4 on the take-up side, and the driving speed and timing are controlled by an NC control device (not shown).

Reference numeral 6 denotes a main body of the rotary spindle. The main body 6 of the drill rotation spindle drives a spindle motor (not shown) for driving the drill rotation spindle, a drill 7 having a diameter of about 0.3 to 6.0 mm attached to the tip of the rotation spindle, and vertically drives the drill rotation spindle. It is composed of a mechanism, a dust collecting device 8, a pressure foot 9, and the like. And drill 7
The up-down movement speed and period can be controlled by an NC controller (not shown).

The belt-like sheet 3 is fed by a plurality of guide rollers 5 so as to pass through a section close to the surface of the printed circuit board 1. The main body 6 of the drill rotating spindle is arranged above the section near the substrate surface.

Next, a method of punching a printed circuit board by using such a punching device will be described.

As shown in FIG. 3, when drilling holes in the printed circuit board 1 by the drill 7, the pressure foot 9 is lowered and the belt-shaped sheet 3 is brought into close contact with the surface of the printed circuit board 1 at the tip end surface of the pressure foot 9. It is performed in a state where it is pressed down from above. Reference numeral 10 denotes a hole formed in the belt-shaped sheet 3 by drilling the printed circuit board 1. At this time, since the band-shaped sheet 3 is drilled with the drill 7 in a state of being in close contact with the surface of the printed circuit board 1,
Drilling is performed without generating burrs around the holes on the substrate surface.

When one drilling is completed and the drill 7 and the pressure foot 9 are lifted, the reel 4 on the winding side is driven, and the belt-shaped sheet 3 is wound up at a predetermined pitch. After the completion of the winding, the pressure foot 9 descends again, and the drilling process by the drill 7 is performed. By repeating such an operation, drilling in the printed circuit board 1 is continuously performed.

Next, the value required for the conveyance pitch of the belt-shaped sheet 3 will be discussed with reference to FIG. Here, the diameter of the drill 7 is 0.5 mm, and the inner diameter of the pressure foot 9 is 2.0 mm. Since it is desirable that there is no hole 10 in the band-shaped sheet 3 already formed by drilling in the printed circuit board 1 in a region corresponding to the inner diameter portion of the pressure foot 9, the conveyance pitch of the band-shaped sheet 3 is 1.25 mm. It can be said that it is good if it is above. Further, the width of the band-shaped sheet 3 only needs to be large enough to allow sufficient pressure by the pressure foot 9. From the above points,
According to the method for forming a hole in a printed circuit board according to the present embodiment, the sheet size consumed for one processing hole can be significantly reduced, and a significant reduction in the amount of sheet material waste can be achieved.

The method for drilling a printed circuit board according to the above-described embodiment can be applied to a case where a printed circuit board is directly drilled using a laser beam. In this case, it is desirable for the purpose of preventing burrs to use a resin band-like sheet having a high laser absorptivity as the sheet material. If the surface of the substrate is glossy like a copper-clad printed circuit board, the glossy surface It is also desirable to prevent the laser oscillation device from being destroyed by the laser reflection from the laser.

As described above, according to the method of punching a printed circuit board of the present embodiment, the use efficiency of the sheet material for preventing burrs can be greatly improved. Further, by shifting the attachment position of the sheet roll to the reels 2 and 4 from the last use to the left and right, the band-like sheet 3 can be reused, and the sheet material use efficiency can be further improved.
As a result, sheet material waste can be significantly reduced, and an effect of reducing manufacturing costs can be expected.

[0023]

As described above, according to the present invention,
It is possible to greatly improve the efficiency of using sheet materials to prevent burrs used in drilling holes on printed circuit boards, achieve significant reductions in sheet material waste, and expect to reduce manufacturing costs. it can.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a printed circuit board punching apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a roll of a belt-like sheet.

FIG. 3 shows a state of drilling a printed circuit board by the drilling apparatus of FIG. 1;

FIG. 4 is a view for explaining a conveyance pitch of a belt-shaped sheet.

FIG. 5 is a view for explaining a sheet material used in a conventional drilling process on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Feeding reel 3 Strip-shaped sheet 4 Take-up reel 5 Guide roller 6 Drill rotating spindle main body 7 Drill 8 Dust collector 9 Pressure foot 10 Strip-shaped sheet hole

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H05K 3/00 H05K 3/00 KM N 3/46 3/46 X // B23K 101: 42 B23K 101: 42

Claims (2)

[Claims] 1. A method for drilling a printed circuit board, comprising placing a sheet for preventing burrs on a printed circuit board and drilling the sheet with a drill or a laser. Prepared, and while the belt-shaped sheet is intermittently transported at a predetermined pitch to a drilling position of the printed circuit board by the drill or the laser, a hole is drilled in the printed circuit board by the drill or the laser. The method of punching printed circuit boards, characterized in that the steps are performed continuously. 2. A printed circuit board punching device for placing a sheet for preventing burrs on a printed circuit board and drilling the sheet with a drill or a laser from the sheet. An apparatus for punching a printed circuit board, comprising: a sheet feeding mechanism for intermittently transporting the printed circuit board at a predetermined pitch with respect to a drilling position of the printed circuit board by a drill or a laser.