JP2002050634A5 - - Google Patents

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Publication number
JP2002050634A5
JP2002050634A5 JP2001125785A JP2001125785A JP2002050634A5 JP 2002050634 A5 JP2002050634 A5 JP 2002050634A5 JP 2001125785 A JP2001125785 A JP 2001125785A JP 2001125785 A JP2001125785 A JP 2001125785A JP 2002050634 A5 JP2002050634 A5 JP 2002050634A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001125785A
Other languages
Japanese (ja)
Other versions
JP2002050634A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001125785A priority Critical patent/JP2002050634A/ja
Priority claimed from JP2001125785A external-priority patent/JP2002050634A/ja
Publication of JP2002050634A publication Critical patent/JP2002050634A/ja
Publication of JP2002050634A5 publication Critical patent/JP2002050634A5/ja
Withdrawn legal-status Critical Current

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JP2001125785A 2000-04-28 2001-04-24 半導体装置の作製方法 Withdrawn JP2002050634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001125785A JP2002050634A (ja) 2000-04-28 2001-04-24 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000131353 2000-04-28
JP2000-131353 2000-04-28
JP2001125785A JP2002050634A (ja) 2000-04-28 2001-04-24 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2002050634A JP2002050634A (ja) 2002-02-15
JP2002050634A5 true JP2002050634A5 (ko) 2008-05-08

Family

ID=26591284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001125785A Withdrawn JP2002050634A (ja) 2000-04-28 2001-04-24 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP2002050634A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI288443B (en) 2002-05-17 2007-10-11 Semiconductor Energy Lab SiN film, semiconductor device, and the manufacturing method thereof
JP4627971B2 (ja) * 2002-05-17 2011-02-09 株式会社半導体エネルギー研究所 半導体装置の作製方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249627A (ja) * 1985-08-28 1987-03-04 Nec Corp 半導体装置の製造方法
JP4162727B2 (ja) * 1994-07-01 2008-10-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH09270412A (ja) 1996-04-01 1997-10-14 Canon Inc 洗浄装置及び洗浄方法
JPH09321009A (ja) * 1996-05-29 1997-12-12 Toshiba Corp 半導体装置の製造方法
JPH1064861A (ja) * 1996-08-22 1998-03-06 Sony Corp ウエハの洗浄方法および装置
JP3122061B2 (ja) * 1997-07-22 2001-01-09 株式会社カイジョー 超音波式浮揚搬送機構を備えたクラスターツール型枚葉処理装置
JP3580104B2 (ja) 1997-12-03 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス基板およびその製造方法、並びに液晶表示装置
AU5233199A (en) 1998-07-29 2000-02-21 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using ozonated process fluids

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