JP2002050606A - 基板用リンス液及び基板処理方法 - Google Patents

基板用リンス液及び基板処理方法

Info

Publication number
JP2002050606A
JP2002050606A JP2000233252A JP2000233252A JP2002050606A JP 2002050606 A JP2002050606 A JP 2002050606A JP 2000233252 A JP2000233252 A JP 2000233252A JP 2000233252 A JP2000233252 A JP 2000233252A JP 2002050606 A JP2002050606 A JP 2002050606A
Authority
JP
Japan
Prior art keywords
substrate
ultrapure water
polishing
chelating agent
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000233252A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002050606A5 (hu
Inventor
Haruko Ono
晴子 大野
Akira Fukunaga
明 福永
Ichiro Katakabe
一郎 片伯部
Sachiko Kihara
幸子 木原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000233252A priority Critical patent/JP2002050606A/ja
Publication of JP2002050606A publication Critical patent/JP2002050606A/ja
Publication of JP2002050606A5 publication Critical patent/JP2002050606A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2000233252A 2000-08-01 2000-08-01 基板用リンス液及び基板処理方法 Pending JP2002050606A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000233252A JP2002050606A (ja) 2000-08-01 2000-08-01 基板用リンス液及び基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000233252A JP2002050606A (ja) 2000-08-01 2000-08-01 基板用リンス液及び基板処理方法

Publications (2)

Publication Number Publication Date
JP2002050606A true JP2002050606A (ja) 2002-02-15
JP2002050606A5 JP2002050606A5 (hu) 2005-08-11

Family

ID=18725797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000233252A Pending JP2002050606A (ja) 2000-08-01 2000-08-01 基板用リンス液及び基板処理方法

Country Status (1)

Country Link
JP (1) JP2002050606A (hu)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051101A (ja) * 2003-07-30 2005-02-24 Ses Co Ltd 基板の洗浄方法
WO2006106677A1 (ja) 2005-03-30 2006-10-12 National Printing Bureau, Incorporated Administrative Agency 印刷物、該印刷物の検知方法及び検知装置、並びに認証方法及び認証装置
US9136104B2 (en) 2010-11-15 2015-09-15 Kurita Water Industries Ltd. Method for cleaning silicon wafer and apparatus for cleaning silicon wafer
JP2015213196A (ja) * 2012-10-19 2015-11-26 エア プロダクツ アンド ケミカルズ インコーポレイテッドＡｉｒ Ｐｒｏｄｕｃｔｓ Ａｎｄ Ｃｈｅｍｉｃａｌｓ Ｉｎｃｏｒｐｏｒａｔｅｄ シャロートレンチアイソレーション（ｓｔｉ）用の化学機械研磨（ｃｍｐ）組成物、及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051101A (ja) * 2003-07-30 2005-02-24 Ses Co Ltd 基板の洗浄方法
WO2006106677A1 (ja) 2005-03-30 2006-10-12 National Printing Bureau, Incorporated Administrative Agency 印刷物、該印刷物の検知方法及び検知装置、並びに認証方法及び認証装置
US9136104B2 (en) 2010-11-15 2015-09-15 Kurita Water Industries Ltd. Method for cleaning silicon wafer and apparatus for cleaning silicon wafer
JP2015213196A (ja) * 2012-10-19 2015-11-26 エア プロダクツ アンド ケミカルズ インコーポレイテッドＡｉｒ Ｐｒｏｄｕｃｔｓ Ａｎｄ Ｃｈｅｍｉｃａｌｓ Ｉｎｃｏｒｐｏｒａｔｅｄ シャロートレンチアイソレーション（ｓｔｉ）用の化学機械研磨（ｃｍｐ）組成物、及びその製造方法

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