JP2004072076A
(ja)
*
|
2002-06-10 |
2004-03-04 |
Nikon Corp |
露光装置及びステージ装置、並びにデバイス製造方法
|
SG115631A1
(en)
*
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Lithographic projection assembly, load lock and method for transferring objects
|
US7812283B2
(en)
|
2004-03-26 |
2010-10-12 |
Semiconductor Energy Laboratory Co., Ltd. |
Laser irradiation method, laser irradiation apparatus, and method for fabricating semiconductor device
|
US8525075B2
(en)
*
|
2004-05-06 |
2013-09-03 |
Semiconductor Energy Laboratory Co., Ltd. |
Laser irradiation apparatus
|
CN101667538B
(zh)
*
|
2004-08-23 |
2012-10-10 |
株式会社半导体能源研究所 |
半导体器件及其制造方法
|
JP2006269941A
(ja)
*
|
2005-03-25 |
2006-10-05 |
Canon Inc |
導光装置、露光装置、並びにデバイス製造方法
|
KR101284201B1
(ko)
*
|
2005-05-02 |
2013-07-09 |
가부시키가이샤 한도오따이 에네루기 켄큐쇼 |
레이저 조사 장치 및 레이저 조사 방법
|
US20070079936A1
(en)
*
|
2005-09-29 |
2007-04-12 |
Applied Materials, Inc. |
Bonded multi-layer RF window
|
JP2009099873A
(ja)
*
|
2007-10-18 |
2009-05-07 |
Canon Inc |
露光装置およびデバイス製造方法
|
US8669023B2
(en)
|
2008-09-01 |
2014-03-11 |
D2S, Inc. |
Method for optical proximity correction of a reticle to be manufactured using shaped beam lithography
|
US8057970B2
(en)
|
2008-09-01 |
2011-11-15 |
D2S, Inc. |
Method and system for forming circular patterns on a surface
|
US9323140B2
(en)
|
2008-09-01 |
2016-04-26 |
D2S, Inc. |
Method and system for forming a pattern on a reticle using charged particle beam lithography
|
US8473875B2
(en)
|
2010-10-13 |
2013-06-25 |
D2S, Inc. |
Method and system for forming high accuracy patterns using charged particle beam lithography
|
US7901850B2
(en)
|
2008-09-01 |
2011-03-08 |
D2S, Inc. |
Method and system for design of a reticle to be manufactured using variable shaped beam lithography
|
US9341936B2
(en)
|
2008-09-01 |
2016-05-17 |
D2S, Inc. |
Method and system for forming a pattern on a reticle using charged particle beam lithography
|
US20120219886A1
(en)
|
2011-02-28 |
2012-08-30 |
D2S, Inc. |
Method and system for forming patterns using charged particle beam lithography with variable pattern dosage
|
US8039176B2
(en)
|
2009-08-26 |
2011-10-18 |
D2S, Inc. |
Method for fracturing and forming a pattern using curvilinear characters with charged particle beam lithography
|
JP2010232217A
(ja)
*
|
2009-03-25 |
2010-10-14 |
Canon Inc |
露光システム、露光装置のテスト方法及びデバイス製造方法
|
US8339573B2
(en)
*
|
2009-05-27 |
2012-12-25 |
3M Innovative Properties Company |
Method and apparatus for photoimaging a substrate
|
TWI496182B
(zh)
*
|
2009-08-26 |
2015-08-11 |
D2S Inc |
以可變束模糊技術使用帶電粒子束微影術製造表面之方法及系統
|
US20120278770A1
(en)
|
2011-04-26 |
2012-11-01 |
D2S, Inc. |
Method and system for forming non-manhattan patterns using variable shaped beam lithography
|
US9164372B2
(en)
|
2009-08-26 |
2015-10-20 |
D2S, Inc. |
Method and system for forming non-manhattan patterns using variable shaped beam lithography
|
US9448473B2
(en)
|
2009-08-26 |
2016-09-20 |
D2S, Inc. |
Method for fracturing and forming a pattern using shaped beam charged particle beam lithography
|
US20110089345A1
(en)
*
|
2009-10-21 |
2011-04-21 |
D2S, Inc. |
Method and system for manufacturing a surface using charged particle beam lithography
|
US9612530B2
(en)
|
2011-02-28 |
2017-04-04 |
D2S, Inc. |
Method and system for design of enhanced edge slope patterns for charged particle beam lithography
|
US9057956B2
(en)
|
2011-02-28 |
2015-06-16 |
D2S, Inc. |
Method and system for design of enhanced edge slope patterns for charged particle beam lithography
|
US9034542B2
(en)
|
2011-06-25 |
2015-05-19 |
D2S, Inc. |
Method and system for forming patterns with charged particle beam lithography
|
US9343267B2
(en)
|
2012-04-18 |
2016-05-17 |
D2S, Inc. |
Method and system for dimensional uniformity using charged particle beam lithography
|
KR102154105B1
(ko)
|
2012-04-18 |
2020-09-09 |
디2에스, 인코포레이티드 |
하전 입자 빔 리소그라피를 이용하여 패턴들을 형성하기 위한 방법 및 시스템
|
US20140129997A1
(en)
|
2012-11-08 |
2014-05-08 |
D2S, Inc. |
Method and system for dimensional uniformity using charged particle beam lithography
|
JP6189933B2
(ja)
|
2012-04-18 |
2017-08-30 |
ディー・ツー・エス・インコーポレイテッドD2S, Inc. |
荷電粒子ビームリソグラフィを用いる限界寸法均一性のための方法およびシステム
|
CN113777888A
(zh)
*
|
2020-06-10 |
2021-12-10 |
京东方科技集团股份有限公司 |
数字化曝光控制方法及装置
|