JP2002043775A - Unit for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a variety size of packages suitable for a circuit scale by attaching a plurality of backpanels on different positions each other depending on the size of assembled packages. SOLUTION: The plurality of backpanels 20, 30, and 40 are attached on the different positions each other within a unit frame 11 of a unit 10 corresponding to the size of assembled packages 50, 60.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device unit used for a communication device or the like.

[0002]

2. Description of the Related Art FIG. 3 is a simplified sectional view showing a conventional electronic device unit, showing an example in which packages of the same size are mounted.

The unit 100 includes a unit frame 101,
It comprises a single back panel 106 mounted on the unit frame 101 and having a plurality of connectors 102 to 105 mounted on both sides.

A package 201 on which connectors 202 and 203 are mounted and a package 301 on which connectors 304 and 305 are mounted are inserted from both opening surfaces of the unit 100, and the connectors 102, 202, 103 and 20 are inserted.
3, 104 and 304, 105 and 305 are physically and electrically coupled, and packages 201 and 301 are mounted on both sides.

[0005] Each of the packages 201 and 301 is electrically connected via a back panel 106 on which necessary printed wiring is formed, and constitutes an electronic device.

FIG. 4 is a simplified sectional view showing a conventional electronic device unit, showing an example in which packages of different sizes are mounted.

The unit 110 has a single back panel 116 in which a plurality of connectors 112 to 115 are mounted in a unit frame 111. FIG. 3 shows the back panel 11
6 is different in mounting position.

Accordingly, a package 211 having a small size and a small size and a package 311 having a large size and a large size can be mounted on both sides of the back panel 116.

The connectors 112 to 115 of the unit 111
And connectors 212 and 21 of packages 211 and 311
3, 314, 315 are connected as in FIG.

[0010]

However, in the conventional unit, the package is mounted via one built-in back panel. Therefore, in the case of packages of the same size, the back panel is attached to the center of the unit. ,
In the case of a package having a different size depending on the circuit scale, it is necessary to change the mounting position of the back panel according to the package size.

[0011] Therefore, the package size is restricted, and it is difficult to design a flexible circuit suitable for the circuit scale.

[0012]

In order to solve the above-mentioned problems, the present invention provides a method for controlling the size of a package to be mounted.
It has a plurality of back panels attached at different positions.

[0013]

FIG. 1 is a simplified sectional view showing an embodiment of the present invention.

The unit 10 includes a unit frame 11 and a plurality of back panels 20, 30, 40 mounted on the unit frame 11 so as not to be on the same plane but at positions different from each other in accordance with the size of the package to be mounted. It has.

A plurality of connectors 21 and 22 are respectively mounted on both surfaces of the back panel 20 as required. The connectors 31 and 32 are similarly mounted on the back panel 30, and the connectors 41 and 42 are similarly mounted on the back panel 40. Is installed.

A package 50 and a package 60 are mounted from both opening surfaces of the unit 10 as shown by arrows. The package 50 has connectors 51 and 52 mounted thereon, and the package 60 has connectors 61 and 62 mounted thereon, each having a stepped shape.

The back panel 30 is attached to a position where the connector 51 of the package 50 and the connector 31 of the back panel 30 are fitted. The back panel 40 includes a connector 52 of the package 50 and a connector 4 of the back panel 40.
1 are fitted, and the connector is mounted at a position where the connector 62 of the package 60 and the connector 42 of the back panel 40 are fitted. The back panel 20 includes a connector 61 of the package 60.
And the connector 22 of the back panel 20 is attached at a position where the connector 22 fits.

As described above, the plurality of back panels 20, 3
0 and 40 are not the same plane, but the package 5 to be mounted.
They are mounted so that their built-in positions are different from each other corresponding to sizes such as 0 and 60.

FIG. 2 is a perspective view showing a mounted state of the embodiment of the present invention, in which a unit frame is omitted.

The packages 50 and 60 are large-scale circuits and large in size, and are omitted in FIG. 1. However, the package 70 is a medium-scale circuit with a medium size, and the package 80 is a small-scale circuit with a small size. .

The connector 51 of the package 50 is fitted with the connector 31 (FIG. 1) of the back panel 30, and the connector 5
2 is fitted with the connector 41 (FIG. 1) of the back panel 40, and the package 50 is mounted.

The connector 61 of the package 60 is fitted with the connector 22 of the back panel 20, and the connector 62 is fitted with one connector 42 of the back panel 40, so that the package 60 is mounted.

The connector 71 of the package 70 is fitted to the connector 32 of the back panel 30 to mount the package 70, and the connector 81 of the package 80 is fitted to the other connector 42 mounted on the back panel 40. The package 80 is mounted.

Although not shown, the back panels 20, 30, and 40 are electrically connected by a flexible cable or the like as necessary, and the packages 50, 60, 70, and 80 are connected to the back panels 20, 30, 40, respectively. The electronic device is configured by being connected by the printed wiring formed in the electronic device.

In FIG. 2, the packages 50, 60, 70, 8
0 is mounted one by one, but it goes without saying that a plurality of 0s are mounted depending on the configuration of the electronic device.

Although the packages are mounted on both sides of the back panels 30 and 40, they may be mounted on one side like the back panel 20, or all the back panels may be mounted on both sides. In the case of single-side mounting, a connector may be mounted on only one side of the back panel, or a connector may be mounted on both sides.

As can be seen from FIG. 2, the embodiment of the present invention provides a large-scale circuit package 60 and a medium-scale circuit package 7 on one side of each of the back panels 20, 30, and 40.
0 and the package 80 of the small-scale circuit can be mixed and mounted, so that if the package size is adjusted to the large-scale circuit as in the related art, wasteful space is generated in the package of the small-scale circuit, and When a large-scale circuit is configured in size, there is no inconvenience of expensive high-density mounting.

[0028]

As described above, according to the present invention, a plurality of back panels are provided according to the size of a package in which the back panels are mounted.
Since they are mounted so that their positions are different from each other, packages of various sizes suitable for the circuit scale can be mounted, and a flexible design is realized.

[Brief description of the drawings]

FIG. 1 is a simplified sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a mounted state of the embodiment of the present invention.

FIG. 3 is a simplified sectional view showing a conventional electronic device unit.

FIG. 4 is a simplified cross-sectional view showing a conventional electronic device unit.

[Explanation of symbols]

 10 Unit 11 Unit Frame 20, 30, 40 Back Panel 21, 22, 31, 32, 41, 42 Connector 50, 60, 70, 80 Package 51, 52, 61, 62, 71, 81 Connector

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shigeto Wada 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. F-term (reference) 5E348 EF06

Claims (2)

[Claims] An electronic device unit incorporating a back panel and mounting a package on the back panel, comprising: a plurality of back panels mounted so as to be different from each other in accordance with the size of the package to be mounted. A unit for an electronic device, comprising: 2. The electronic device according to claim 1, wherein connectors are mounted on both sides of at least one of the plurality of back panels, and the package is mounted on both sides. Unit.