JP2002043672A - Semiconductor laser device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor laser device structure capable of being smoothly mounted on an optical pickup or the like. SOLUTION: A semiconductor laser device 1 is equipped with a semiconductor laser element 4, a frame 6 possessed of an element mount 6a on which the element 4 is mounted, and a resin 5 surrounding the element mount 6a, where the resin 5 is provided with a window 5a, through which a laser beam is projected outside, at its front and smaller in width at its front edge than at its rear edge.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor laser device.

[0002]

2. Description of the Related Art A semiconductor laser device using a package made of a frame and a resin has been attracting attention because of its excellent price and mass productivity. When such a semiconductor laser device is used for an optical pickup or the like, the package is often inserted and set in the same direction as the emission direction of the laser light. Therefore, the resin portion of the semiconductor laser device often hits or gets caught on the insertion opening of the optical pickup body at the time of insertion.

In addition, a part of the frame is projected out of the resin in a direction perpendicular to the emission direction of the laser beam, and the end surface on the emission side is used as a reference surface when incorporated in an optical pickup. Therefore, when the semiconductor laser device is reduced in size and width is reduced, there is a problem that the reference plane is also reduced.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a structure which can be mounted on an optical pickup or the like smoothly. Another object is to provide a structure capable of providing a large reference surface even when the package is downsized.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor laser device which surrounds a semiconductor laser element, a frame having an element arrangement portion for disposing the element, and a periphery of the element arrangement portion. In a semiconductor laser device provided with a resin, the resin is provided with a laser emission window of the semiconductor laser element in front, and a width of a front end is smaller than a width of a rear end.

Further, as set forth in claims 2 to 4, the resin may have tapered surfaces at both front ends thereof, and the frame may have tapered surfaces at both front ends thereof. The frame may have a tapered surface above or below its front end surface.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.
This will be described with reference to the drawings. FIG. 1 is a perspective view of the semiconductor laser device 1, FIG. 2 is a front view, FIG. 3 is a rear view, and FIG. 4 is a cross-sectional view along the laser light emission direction X (optical axis X).

In the semiconductor laser device 1 of this embodiment, a submount 3 is disposed and fixed on the upper surface of a frame 2, and a semiconductor laser element 4 is disposed and fixed on the upper surface of the submount 3. Fixed.

The frame 2 is made of a metal having good heat conductivity and conductivity, and is formed in a plate shape by processing copper, iron, an alloy thereof, or the like. The frame 2 is composed of a main frame 6 on which a semiconductor laser element is mounted, and a plurality of sub-frames 7 and 8 for wiring independent of the frame 6, and these are integrated by the resin 5 to form a frame package. Is composed.

The main frame 6 is integrally provided with an element arrangement portion 6a, a lead portion 6b serving as a current path, and left and right wing portions 6c and 6d used for heat radiation and positioning. The thickness of the main frame 6 is such that the element arrangement portion 6a on which the semiconductor laser element 3 is mounted and the wing portions 6c and 6d are partially thick.
A portion of the leads 6b and 6d and the lead portion 6b are thin. In this example, a thick portion 6e is located forward of the boundary, and a thin portion 6f is located behind the boundary, with the base portion of the lead portion 6b, that is, the vicinity of the connection portion between the element arrangement portion 6a and the lead portion 6b as the border. Since the sub-frames 7 and 8 are formed to be thin like the lead portions 6b, fine processing can be easily performed when the frames are formed by punching out the frames by pressing. Therefore, the size of the device can be reduced by keeping the interval between the lead portions small.

As described above, the thickness of the frame 2 changes along the emission direction of the laser light, and accordingly, a step 9 is formed in a direction orthogonal to the emission direction of the laser. The step 9 is on the back surface of the frame opposite to the surface on which the semiconductor laser element 4 is mounted, but may be formed on the same side as the surface on which the element 4 is mounted.

Since the thick portion 6e of the main frame 6 is formed over the entire width of the main frame 6 across the element arrangement portion 6a and the left and right wing portions 6c and 6d, the strength of the frame 2 is to be increased. Can be. Therefore, it is possible to prevent the wings 6c, 6d from being deformed when the left and right wings 6c, 6d are inserted into the grooves and mounted. In addition, as shown by a broken line in FIG. 2 between the element arrangement portion 6a and the left and right wing portions 6c and 6d,
Although a hole 6i for connecting the resin 5 up and down is formed, since this hole can be formed in the thick portion 6e,
A large hole 6i for resin communication can be secured.

The resin 5 is formed, for example, by insert molding so as to sandwich the front and rear surfaces of the frame 2. The front side of the resin 5 is provided with a window 5a for emitting a laser beam, and is in the form of a U-shaped frame 5b with an open front. This frame 5b
Is smaller than the width B on the rear side. Tapered surfaces 5c are formed at both front ends of the frame 5b. The presence of the tapered surface 5c makes it possible to smoothly insert the semiconductor laser device 1 at a predetermined position. The circular hole 6i for connecting the resin is formed in the tapered surface 5 in order to arrange the resin in a wide portion.
It is arranged behind c.

The back side of the resin 5 has a solid flat surface 5d so as to cover the element arrangement portion 6a, and has an outer shape equivalent to the outer shape of the resin on the front side. That is, the width A on the front side is smaller than the width B on the rear side. A tapered surface 5e is formed at both front end portions on the back surface of the resin. Due to the presence of the tapered surface 5e, insertion can be performed smoothly when the semiconductor laser device is arranged at a predetermined position. Further, since the resin back surface 5d constituting the back surface of the laser device 1 is a support plane having a larger area than the thick element placement portion 6a, the stability when the laser device 1 is disposed on a predetermined plane. Can be increased.

Since the width of the tip portion of the resin 5 is reduced, the length of the front end surfaces of the wing portions 6c and 6d located on both sides of the resin can be made longer than in the case where the taper 5c does not exist. Therefore, a wide reference surface can be secured when the front end surfaces of the wing portions 6c and 6d are used as position determination references. In particular, the front end surface of the wing portion is thicker than the lead portion 6b or the sub-frames 7, 8, and a wide positioning reference can be secured. Useful for doing.

The portions of the main frame 6 where the resin 5 does not exist are exposed. Then, the semiconductor laser element 4 is arranged and fixed on the exposed element arrangement portion 6a via the submount 3.
Thereafter, wiring is performed between the semiconductor laser element 4, the submount 3, and the subframes 7 and 8 by a wire bond wire or the like.

The submount 3 is a light receiving element using Si as a base material, and can monitor the light emitted from the rear surface of the semiconductor laser element 4. Besides, for example, AlN, SiC,
Ceramics, metal materials, and the like having excellent heat conductivity, such as Cu, can be used. If the light receiving element cannot be built into the submount, mount the light receiving element separately. The submount 3 is fixed to the frame 2 using a solder material such as Au-Sn, Pb-Sn, or an Ag paste.

The semiconductor laser element 4 is made of Au-Sn, Pb
It is fixed to a predetermined position of the submount 3 using a solder material such as -Sn or an Ag paste.

In the above embodiment, the tapered surfaces 5c and 5e are formed at the front end portions on both sides of the resin 5 on the front side or the back side. However, as shown in FIG. Surface 6g can be formed. The tapered surfaces 6g, 6g are formed at the front end portions of both sides of the main frame 6. Also, as shown in FIG. 6, a tapered surface 6h can be formed on the front end surfaces of the wing portions 6c and 6d on at least one of the upper and lower sides. Due to the presence of these tapered surfaces, the operation when inserting the device 1 can be performed more smoothly, as in the above embodiment.

[0020]

As described above, according to the present invention, workability when inserting a semiconductor laser device into an optical pickup or the like can be improved. Further, when a part of the frame is used as a positioning reference, a large area can be secured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a front view of the embodiment.

FIG. 3 is a rear view of the embodiment.

FIG. 4 is a sectional view of the same embodiment.

FIG. 5 is a rear view of another embodiment.

FIG. 6 is a side view of another embodiment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor laser device 2 frame 4 semiconductor laser element 5 resin 6 main frame 7 subframe 8 subframe 9 step

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yasuhiro Watanabe 3-201 Minamiyoshikata, Tottori-shi, Tottori Sanyo Electric Co., Ltd. (72) Inventor Masaharu Honda 3-201 Minamiyoshikata, Tottori-shi, Tottori Sanyo Tottori F-term (reference) in Denki Co., Ltd. 5F073 BA04 FA02 FA13 FA22 FA27 FA28

Claims (4)

[Claims] 1. A semiconductor laser device comprising: a semiconductor laser element; a frame having an element arrangement section for disposing the element; and a resin surrounding a periphery of the element arrangement section; A semiconductor laser device comprising an emission window, wherein a width of a front end is smaller than a width of a rear end. 2. The semiconductor laser device according to claim 1, wherein the resin has a tapered surface at both front ends. 3. The semiconductor laser device according to claim 1, wherein said frame has a tapered surface at both front ends. 4. The semiconductor laser device according to claim 3, wherein said frame has a tapered surface above or below a front end surface thereof.