JP2002042660A - Correction method and device for pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a defect correcting method and device capable of correcting even if the width of a rib defect of a flat display is narrow. SOLUTION: The width of a rib defect 21 is widened with a cutting laser 2, and the widened width is coated with correcting paste with a paste coating mechanism 3 to correct the defect.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern repairing device, and more particularly, to a pattern repairing method and a pattern repairing device for repairing a rib defect occurring in a process of manufacturing a rib (partition wall) of a plasma display (hereinafter referred to as a PDP). About.

[0002]

2. Description of the Related Art FIGS. 9 to 11 are views for explaining a conventional method of correcting a rib defect of a PDP.

As shown in FIG. 9, a PDP glass substrate 2
A rib 21 as a structural element has a height of 150
The width is about 60 μm and the size is about 60 μm. In the manufacturing process of the PDP, a rib defect 22 in which a part of the rib 2 is missing may occur. Even if such a rib defect 22 occurs, it is repaired in order to increase the yield, and the appropriately corrected one is used as a product.

As a method of making such a correction, for example, as described in Japanese Patent Application Laid-Open No. 08-292442, a paste is attached to a needle having a flat tip to form a rib defect 22 portion. , And apply a paste to correct the defective portion.

In Japanese Patent Application No. 11-109517,
A method is described in which the applied paste is baked with a laser beam, and excess paste that has protruded from a defective portion is removed by a scratch needle mechanism.

[0006]

However, FIG.
(A) As shown in FIG.
When the thickness is about 0 μm or less, as shown in FIG.
The correction paste cannot be filled inside the defect by the application needle 23, and satisfactory correction cannot be performed.

[0007] This is because the defect width is small as shown in FIG. 11 (a), so that the repair paste adhered to the coating needle 23 is applied to the shoulder portions on both sides of the rib chip 22 as shown in FIG. 11 (b). This is because they do not adhere to the inside of the defect. By making the tip of the coating needle 23 extremely fine, 10
Slight correction is possible even at 0 μm or less, but this also has limitations.

SUMMARY OF THE INVENTION Therefore, a main object of the present invention is to provide a pattern correcting method and a pattern correcting apparatus which can correct even if a rib defect width of a flat display is small.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a method of correcting a pattern, which lacks a table for horizontally moving a substrate having ribs, which are structural elements of a flat display, and ribs of the substrate. An application unit for applying a correction member to a defective portion, a laser irradiation mechanism for irradiating a laser beam for firing the applied correction member or removing the defective portion, and a scratch needle mechanism for removing a rib are provided. After expanding the width of the rib in the pattern,
It is characterized in that a correction member is applied.

Another aspect of the present invention is a table for horizontally moving a substrate having ribs, which are structural elements of a flat display, a coating means for coating a correction member on a defective portion of the substrate where a rib is missing, In a pattern correction apparatus including a laser irradiation mechanism for irradiating a laser beam for firing a coated correction member or removing a defective portion, and a scratch needle mechanism for removing a rib, a laser irradiation mechanism and a scratch needle mechanism are provided. After the notch width of the rib is widened using at least one of the above, the correction member is applied by the application unit.

The laser irradiation mechanism includes a YAG laser light source that oscillates at a second harmonic with continuous oscillation.

The laser irradiation mechanism includes a YAG laser light source that oscillates at a second harmonic with giant pulse oscillation.

Further, the laser irradiation mechanism includes a YLF laser light source. Further, the laser irradiation mechanism includes a driving mechanism capable of moving the laser irradiation mechanism in a vertical direction, and the driving mechanism moves the laser irradiation mechanism downward in multiple stages to remove ribs.

Further, the scratch needle mechanism includes a suction mechanism for suctioning remaining residue after removing the rib.

Further, a driving mechanism is provided which can move the scratch needle mechanism up and down, and the driving mechanism moves the scratch needle mechanism downward in multiple stages to remove ribs.

Further, a laser beam is applied to both ends of the width of the rib to be removed by the laser irradiation mechanism to form a cut, and the inside rib material having the cut is removed by the scratch needle mechanism.

[0017]

FIG. 1 is an external view of an embodiment of the present invention. In FIG. 1, an observation optical system unit 1 has a built-in CCD camera or the like and images a rib defect of a PDP. The cutting laser unit 2 irradiates a laser beam for expanding the width of the rib defect. The paste application mechanism 3 applies the paste to the application needle, and applies the paste to the defective portion in contact with the rib defect. The squeegee mechanism 4 is a paste application mechanism 3
This has the effect of smoothing out the protruding part of the paste applied in the above. The scratch mechanism 5 removes ribs with a scratch needle, and is provided with a suction mechanism for removing the removed scum. IR (infrared)
The light source 6 dries the applied paste.

The image processing mechanism 7 performs image processing for recognizing a defect based on an image signal picked up by the observation optical system 1. The host computer 8 controls the entire device,
The control computer 9 controls the operation of the device mechanism.
In addition, an XY table 10 for moving a workpiece to be corrected in the XY directions, a chuck table 11 for holding the workpiece on the XY table 10, an observation optical system unit 1, a cutting laser unit 2, a paste coating mechanism 3, , A Z-axis table 12 that drives the squeegee mechanism 4 and the scratch mechanism 5 in the vertical direction, and a monitor 13 that displays an image captured by the observation optical system 1.

FIG. 2 is a diagram showing a procedure for correcting a rib defect according to one embodiment of the present invention. As shown in FIG. 2A, if the rib defect is small and the width is 100 μm or less, satisfactory results cannot be obtained by applying the paste by the paste applying mechanism 9 as described with reference to FIG. Therefore, as shown in FIG. 2 (b), before applying the paste, the chip width of the rib defect 22 is expanded, and the expanded portion is filled with the paste by the paste application mechanism 3 as shown in FIG. 2 (c). By doing so, the rib defect 22 is corrected. As described above, the method of widening the rib defect 22 includes a method of cutting with a laser and a method of notching with a scratch needle as described below.

FIG. 3 is a diagram showing a method of widening a rib defect using the cutting laser unit 2. In FIG. 3, a laser light source used for the cutting laser unit 2 is YAG.
The second harmonic (wavelength: 532 nm) high-frequency oscillation type (oscillation frequency: 1000 Hz) is used. As a method for irradiating a laser beam, for example, a method described in JP-A-2000-42764 can be used. In addition, as a laser light source, a laser beam of the second harmonic giant pulse type of YAG can be cut. Further, although the YAG fundamental wave can be cut, it is not preferable because the fundamental wave is infrared light and the discoloration of the rib material due to heat is large.

As shown in FIG. 3A, the image focus by the observation optical system unit 1 is made coincident with the top of the rib to be cut, and the portion is irradiated with laser light from the cutting laser unit 2, and FIG. As shown in ()), the rib 21 is cut to a position of about half the height. Next, as shown in FIG. 3C, the top of the rib 21 cut to about half is focused, and as shown in FIG. 3D, the rib 21 is cut to the end.

Since the height of the rib 21 is as large as about 150 μm, unlike the conventional electrode cut, it is difficult to completely cut the rib 21 down to the bottom (glass substrate 1) while focusing on the top of the rib 21. In addition, it takes time to cut. This is because the focus shifts toward the lower side of the rib 21 and the energy density of the laser decreases. Therefore, in the method shown in FIG. 3, the above-described problem is reduced by performing focus adjustment in two stages.

In the example shown in FIG. 3, the cutting of the ribs 21 is performed by laser in two stages. However, by increasing the number of stages to three or four, it is possible to prevent a reduction in the energy density of the laser during cutting. Although it is possible, the number of times of focus movement increases accordingly, so that the focus movement takes time.

Since the optimum number of times of focus movement changes depending on the height of the rib 21 and the laser power, it is desirable to perform cutting with the optimum number of times as appropriate for the object to be cut.
The cutting of the rib 21 by the laser beam can be performed even after the firing of the rib 21 to be cut or after the drying.

FIG. 4 shows a rib defect 22 using a scratch needle.
FIG. 4 is a diagram showing a method of widening the width of the image. This method is basically different from the laser beam cutting shown in FIG. 3 and can be basically applied only to the dried rib 21. FIG. 4 (a)
As shown in (1), the scratch needle 51 is moved in a direction perpendicular to the rib 21 and the rib 21 near the rib defect 22 is removed by scraping. At this time, if the scratch needle 51 is inserted too deep in the height direction with respect to the rib 21,
Care must be taken because the ribs 21 are largely chipped. By repeating this method while changing the height of the scratch needle 51, the rib 21 can be removed. This method needs to be repeated,
Since the amount of removal at one time is large, it is possible to remove the rib 21 in a shorter time than cutting with a laser beam.

FIG. 5 is a diagram showing a method of widening a rib defect by using a laser beam and a scratch needle. First, FIG.
As shown in (a), laser light is applied to both ends of the width of the rib 21 to be removed through the objective lens 25, and a slit-like cut is made to the bottom of the rib 21. As a result, FIG.
As shown in (b), a slit 23 is formed in the rib 21 by the laser beam. Next, as shown in FIG.
By moving the scratch needle 51 in a direction perpendicular to the rib 21, the inner rib which has been slit as shown in FIG. 5D is removed. In this method, the scratch needle 5
Since the number of removals by 1 may be small, the ribs 21 having a large width can be removed in a short time. This method can be used not only for ribs after drying but also for ribs after firing.

FIG. 6 is a diagram showing a method of correcting the electrode after drying. In FIG. 6A, the I
A TO electrode 32 is formed, and an electrode 33 after drying is formed on the ITO electrode 32. Electrode 33 after drying
The present invention can also be applied to a case where a foreign matter defect 34 is generated on the upper side and the foreign matter defect 34 is removed. That is, the dried silver electrode 33 is irradiated with laser light via the objective lens 25 so as to sandwich the foreign matter defect 34, thereby forming a slit-like cut. Then, as shown in FIG. 6B, the inside of the cut is removed with a scratch needle 51. In this manner, by forming a slit in the slit shape with the laser light, the removal shape when the laser beam is removed by the scratch needle 51 can be stabilized.

FIG. 7 shows an example of removal when there is no cut by a laser beam. In this case, the shape removed by the scratch needle 51 is not stable, and there is a possibility that a necessary portion is removed.

On the other hand, as shown in FIG.
In this embodiment, the damage to the lower ITO electrode 32 is limited to the portion cut into a slit shape by the laser beam, so that the damage can be minimized.

FIG. 8 shows a damage state 36 on the lower ITO electrode 32 when all of the silver electrodes are cut by laser light.
Is shown.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[0032]

As described above, according to the present invention, in repairing a rib chipping defect, the rib chipping width is widened and then the paste is applied to correct the chipping defect. Has been difficult to correct, but the present invention can correct defects of 100 μm or less.

Further, when the width of the rib defect is increased by the laser beam, the rib defect is moved in multiple stages in the vertical direction, so that the rib defect can be efficiently removed in a short time.

Further, by using a needle for widening the rib defect width, the width can be widened in a short time.

Further, by using a laser beam and a needle together to widen the rib defect width, even when the removal width is large, the removal can be performed in a short time. Then, it can be carried out regardless of whether the rib is fired or dried.

Further, by adding a mechanism for sucking the removed scum to the scratch needle mechanism for removing the rib, it is possible to keep the corrected portion clean after the correction.

Further, the removal method using a laser beam and a needle is used for the silver electrode after drying, so that the ITO under the silver electrode can be removed.
It is possible to remove silver electrode defects with little electrode damage.

[Brief description of the drawings]

FIG. 1 is an external view of an embodiment of the present invention.

FIG. 2 is a diagram showing a defect repair method according to an embodiment of the present invention.

FIG. 3 is a diagram illustrating a method of removing a rib defect using a laser beam.

FIG. 4 is a diagram showing a method of removing a rib defect using a scratch needle.

FIG. 5 is a diagram showing a method of removing a rib defect using a laser beam and a scratch needle.

FIG. 6 is a view showing a method of removing a foreign matter defect of a silver electrode.

FIG. 7 is a diagram showing an electrode when a foreign matter defect is removed without using a laser beam.

FIG. 8 is a diagram showing a state of damage to an ITO electrode when all silver electrodes are cut by laser light.

FIG. 9 is a view showing rib defects of a PDP.

FIG. 10 is a diagram for explaining a conventional rib defect repair method.

FIG. 11 is a view showing a conventional method of removing a paste for a rib defect.

[Explanation of symbols]

1 observation optical system section, 2 laser section for cutting, 3 paste application mechanism, 4 squeegee mechanism, 5 scratch mechanism,
6 IR light source, 7 image processing mechanism, 8 host computer, 9 control computer, 10 XY table,
11 chuck base, 12 Z-axis table, 13 monitors.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F040 AA12 AA32 AB20 CA03 DB02 DB07 5C012 AA09 5C040 FA01 FA02 GF19 JA26 MA23

Claims (9)

[Claims] 1. A table for horizontally moving a substrate on which ribs, which are structural elements of a flat display, are formed; coating means for coating a correction member on a defective portion of the substrate where ribs are missing; A laser irradiation mechanism for irradiating a laser beam for firing the repaired member or removing a defective portion, and a scratch needle mechanism for removing the rib, after increasing a notch width of the rib. Applying a correction member to the pattern. 2. A table for horizontally moving a substrate on which ribs, which are structural elements of a flat display, are formed; coating means for coating a correction member on a defective portion of the substrate where ribs are missing; A laser irradiation mechanism for irradiating a laser beam for baking the repaired member or removing a defective portion, and a scratch needle mechanism for removing the rib, wherein the laser irradiation mechanism and the scratch are provided. A pattern correcting device, characterized in that after increasing the notch width of the rib using at least one of the needle mechanisms, a correction member is applied by the application means. 3. The pattern correction apparatus according to claim 2, wherein the laser irradiation mechanism includes a YAG laser light source that oscillates a second harmonic with continuous oscillation. 4. The pattern correction apparatus according to claim 2, wherein the laser irradiation mechanism includes a YAG laser light source that oscillates a second harmonic with giant pulse oscillation. 5. The pattern correction device according to claim 2, wherein the laser irradiation mechanism includes a YLF laser light source. 6. A driving mechanism capable of moving the laser irradiation mechanism in a vertical direction, wherein the driving mechanism moves the laser irradiation mechanism downward in multiple stages to remove the rib. The pattern correcting apparatus according to claim 3. 7. The pattern correction device according to claim 2, wherein the scratch needle mechanism includes a suction mechanism for sucking remaining residue from which the rib has been removed. 8. The apparatus according to claim 8, further comprising a driving mechanism capable of vertically moving the scratch needle mechanism, wherein the driving mechanism moves the scratch needle mechanism downward in multiple stages to remove the rib. The pattern correcting apparatus according to claim 1, 2, or 7. 9. The laser irradiation mechanism irradiates a laser beam to both ends of the width of the rib to be removed to form a cut, and the scratch needle mechanism removes the rib material inside the cut. The pattern correction apparatus according to claim 2, wherein the pattern correction apparatus is characterized in that: