JP2002041585A - Designing method for electronic equipment - Google Patents

Designing method for electronic equipment

Info

Publication number
JP2002041585A
JP2002041585A JP2000220440A JP2000220440A JP2002041585A JP 2002041585 A JP2002041585 A JP 2002041585A JP 2000220440 A JP2000220440 A JP 2000220440A JP 2000220440 A JP2000220440 A JP 2000220440A JP 2002041585 A JP2002041585 A JP 2002041585A
Authority
JP
Japan
Prior art keywords
wiring board
case
design
dimensional
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000220440A
Other languages
Japanese (ja)
Inventor
Yumiko Matsushima
由美子 松島
Taichi Harada
太一 原田
Masahiro Deguchi
正浩 出口
Etsuo Tsujimoto
悦夫 辻本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000220440A priority Critical patent/JP2002041585A/en
Publication of JP2002041585A publication Critical patent/JP2002041585A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To make the relation of the component of a wiring board and a case or the like suitably designable on the wiring board, on which parts are packaged. SOLUTION: When packaging components 3-6 on a printed wiring board 2 provided inside a case 1, the data of the components 3-6 are previously combined in a three-dimensional state to the data of the printed wiring board 2 and further three-dimensionally combined with the information of the case 1 in such a state so that it can be examined whether the relation of the components 3-6 and the case 1 is suitably located or not.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電子機器の設計方法
に関するものであって、配線板上に部品が実装されたも
のにおいて配線板の部品とケースとの関係などが適切に
設計出来るようにすることを目的とするものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for designing an electronic device, and more particularly to a method for mounting electronic components on a wiring board so that the relationship between components of the wiring board and a case can be appropriately designed. The purpose is to do so.

【0002】[0002]

【従来の技術】通常、配線板は2次元CADシステムを
利用し、一方配線板が納められるケースは3次元CAD
システムを利用して設計される。配線板の設計において
は部品外形形状、ランド形状、レジスト形状、シルク形
状、そして自動挿入機ヘッド・カッター形状、自動実装
機ヘッド形状、リード線形状等の2次元図形要素をグル
ープ化した2次元部品図形をあらかじめデータベースに
登録し、その後配線板外形形状、銅箔パターン形状と共
に2次元CADシステムで入力し、編集後配線板の設計
が終了する。ケース設計においてはケースの三面図入
力、ワイヤーフレームモデル展開、サーフェースモデル
展開を行い、ソリッドモデルを作成し設計が終了する。
2. Description of the Related Art Usually, a wiring board uses a two-dimensional CAD system, while a case in which a wiring board is stored is a three-dimensional CAD system.
Designed using the system. In the design of printed wiring boards, two-dimensional components are grouped into two-dimensional graphic elements such as component external shapes, land shapes, resist shapes, silk shapes, and automatic inserter head / cutter shapes, automatic mounting machine head shapes, and lead wire shapes. The figures are registered in the database in advance, and then input together with the outer shape of the wiring board and the shape of the copper foil pattern using a two-dimensional CAD system. After the editing, the designing of the wiring board is completed. In case design, three-sided view input of the case, wireframe model development, and surface model development are performed, a solid model is created, and the design is completed.

【0003】2次元CADシステムを用いて処理された
配線板データは通常、図形要素及び図形要素グループで
構成される。また、3次元CADシステムを用いて処理
されたケース形状データも同様に、図形要素及び図形要
素グループで構成される。
[0003] Wiring board data processed using a two-dimensional CAD system is usually composed of graphic elements and graphic element groups. Similarly, the case shape data processed by using the three-dimensional CAD system is composed of graphic elements and graphic element groups.

【0004】通常、異種CADシステム間で2次元・3
次元データ交換を行う場合、これらの図形要素・図形要
素グループを最小図形要素に分解し、その要素情報を情
報交換用フォーマットに準じファイルに書出し、そのフ
ァイルを3次元CADシステムで読込ませ、情報交換用
フォーマットに従い再度図形要素に変換するという手法
が取られている。2次元CADシステムで処理された図
形要素・図形要素グループを持つ2次元形状データは情
報交換用フォーマットファイル書出しに際し、最小図形
要素に展開され、要素名・座標値・中心点・回転角とい
った図形要素情報がファイル出力される。その後、ファ
イルは3次元CADに読込まれ、3次元CADシステム
上で2次元図形要素に復元された上で3次元図形要素が
付加される。
[0004] Usually, two-dimensional and three-dimensional
When performing dimensional data exchange, these graphic elements and graphic element groups are decomposed into minimum graphic elements, the element information is written to a file according to an information exchange format, and the file is read by a three-dimensional CAD system to exchange information. There is a technique of converting to a graphic element again according to the format for use. The two-dimensional shape data having the graphic elements and the graphic element groups processed by the two-dimensional CAD system are developed into the minimum graphic elements when the information exchange format file is written, and the graphic elements such as element names, coordinate values, center points, and rotation angles are obtained. Information is output to a file. Thereafter, the file is read into a three-dimensional CAD, restored to a two-dimensional graphic element on a three-dimensional CAD system, and then a three-dimensional graphic element is added.

【0005】その後、3次元CADシステム上で配線板
データとケースデータを組合わせて配線板上の部品とケ
ースとの干渉チェック・配線板表裏の自動実装挿入機ヘ
ッド・カッター、リード線形状の製造基準チェックを行
っている。
[0005] Thereafter, the wiring board data and the case data are combined on a three-dimensional CAD system to check for interference between parts on the wiring board and the case, an automatic mounting / inserting machine head / cutter on the front and back of the wiring board, and manufacture of lead wire shapes. Checking standards.

【0006】[0006]

【発明が解決しようとする課題】上記従来例において
は、配線板上の部品とケースとの干渉チェック、配線板
表裏の製造基準チェックを行う際、異機種CADシステ
ム側で展開された部品外形形状、ランド形状、レジスト
形状、シルク形状、そして自動挿入機ヘッド・カッター
形状、自動実装機ヘッド形状、リード線形状等は図形要
素に分解されており、部品単位で移動させられないた
め、部品を画面上で移動させて詳細なチェックを行う
際、チェック精度が十分に得られなかった。本発明は配
線板の部品とケースとの関係などが適切に設計出来るよ
うにすることを目的としたものである。
In the above conventional example, when checking interference between components on a wiring board and a case, and checking manufacturing standards on the front and back of the wiring board, the external shape of a component developed on a CAD system of a different model is used. , Land shape, resist shape, silk shape, automatic insertion machine head cutter shape, automatic mounting machine head shape, lead wire shape, etc. are disassembled into graphic elements and cannot be moved in parts, so parts can be displayed on the screen When performing a detailed check by moving the above, sufficient check accuracy was not obtained. SUMMARY OF THE INVENTION An object of the present invention is to make it possible to appropriately design the relationship between components of a wiring board and a case.

【0007】[0007]

【課題を解決するための手段】そしてこの目的を達成す
るために本発明は、2次元CADシステムで登録する2
次元部品図形の登録名称と3次元CADシステムで登録
する3次元部品図形の登録名称を同一部品同一名称に
し、ケース内に設けた配線板上に部品が実装されるもの
において、あらかじめ配線板のデータに部品のデータを
3次元状態で組み合わせ、さらにその状態でケースの情
報と3次元に組み合わせることによって部品とケースと
の関係が適切に配置されるかを検討するものである。
In order to achieve the above object, the present invention provides a method for registering in a two-dimensional CAD system.
The registered name of the three-dimensional part figure and the registered name of the three-dimensional part figure registered by the three-dimensional CAD system are the same part and the same name, and the parts are mounted on the wiring board provided in the case. It is intended to examine whether the relationship between the component and the case is appropriately arranged by combining the component data in a three-dimensional state and further combining the case information and the three-dimensional data in that state.

【0008】これにより、信頼性のある設計を行う事が
できる。
As a result, a reliable design can be performed.

【0009】[0009]

【発明の実施の形態】図1は本発明の一実施形態の電子
機器を示したものである。図1において1は樹脂製のケ
ースであって、この樹脂製のケース1内にはプリント配
線板2が固定されている。このプリント配線板2の表裏
面にはそれぞれ複数個の部品の3,4,5,6が設けら
れている。これらの部品3〜6のうち、部品4は非常に
背の高いものであって、この背の高い部品4はケース1
との間にわずかなすきましか形成できないものである。
つまり、すきまが十分でないとプリント配線板2をケー
ス1内に適切に実装できなくなるものである。そこでこ
の様に部品4とケース1との関係を適切なものであかる
どうかをあらかじめ設計段階で確認しておく必要があ
る。図2はその設計手法を示したものである。まず図2
において左側にはブノント配線板2のCADシステムが
書かれ、中央部には部品3〜6に関するデータが登録さ
れ、さらに右側にはケース1についての情報が書かれて
いる。まず、図2に示す様にプリント基板CADシステ
ムにおいては、7で配線板設計開始が行われ、次に2次
元部品図形作成が8で行われ、9で基板外形座標入力が
行われ、10で部品配置座標入力、11でパターン座標
入力、12で設計基準をチェックし、13で部品情報を
抽出し、14でファイルの書出しを行う。この状態にお
いて部品3〜6の情報は図2の15で部品図形登録がな
され、それに基づいて16で3次元部品図形が作成され
る。一方17部分においてはケース1の筐体設計が開始
され、18で三面図入力、19でワイヤーフレーム展
開、20でサーフェースモデル展開、21でソリッドモ
デル展開が行われる。この様な状態で14のファイル書
出しが行われたものは22においてファイル転送が23
部分に行われる。この23部分はファイル読込みであっ
て、その後24で部品図形配置命令手順ファイル作成が
行われ、16で行われた3次元部品図形作成からのデー
タを基に25において部品配置処理が行われる。そして
26において25における部品配置情報と21のソリッ
ドモデル展開との図形合成が行われる。27において干
渉チェック、具体的には図1における部品4とケース1
の間の情報などがチェックされるものである。28で製
造基準チェックが行われ、29で終了となるものであ
る。すなわち、終了に至った状態では図1に示す様に大
きな部品4であったとしてもケース1との間に適切な隙
間が確保されており、この様な状態では適切な電子機器
が完成されるものである。
FIG. 1 shows an electronic apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a resin case, in which a printed wiring board 2 is fixed. A plurality of components 3, 4, 5, and 6 are provided on the front and back surfaces of the printed wiring board 2, respectively. Of these parts 3 to 6, part 4 is very tall, and this tall part 4 is the case 1
And only a small gap can be formed between them.
That is, if the clearance is not sufficient, the printed wiring board 2 cannot be properly mounted in the case 1. Thus, it is necessary to confirm in advance at the design stage whether the relationship between the component 4 and the case 1 is appropriate. FIG. 2 shows the design method. First, FIG.
In the figure, the CAD system of the Bunont wiring board 2 is written on the left side, data on the components 3 to 6 are registered in the center, and information on the case 1 is written on the right side. First, as shown in FIG. 2, in the printed circuit board CAD system, a wiring board design is started at 7, a two-dimensional component graphic is created at 8, a board outline coordinate is input at 9, and a board outline coordinate is input at 10. Input of component arrangement coordinates, input of pattern coordinates at 11, check of design criteria at 12, extraction of component information at 13, writing of file at 14. In this state, the information of the parts 3 to 6 is registered as a part figure at 15 in FIG. 2, and based on the information, a three-dimensional part figure is created at 16. On the other hand, the housing design of the case 1 is started in part 17, a three-view drawing input is made in 18, a wire frame is developed in 19, a surface model is developed in 20, and a solid model is developed in 21. In the case where the writing of 14 files has been performed in such a state, the file transfer is performed at 23
Done in parts. This 23 portion is a file read, and thereafter, a part graphic arrangement command procedure file is created in 24, and a part arrangement process is performed in 25 based on the data from the three-dimensional part graphic creation performed in 16. Then, at 26, a graphic synthesis of the component arrangement information at 25 and the development of the solid model at 21 is performed. 27, an interference check, specifically, the part 4 and the case 1 in FIG.
The information between them is checked. At 28, a manufacturing standard check is performed, and at 29, the process ends. That is, in the state where the process has been completed, an appropriate gap is secured between the case 1 and the large part 4 as shown in FIG. 1, and in such a state, an appropriate electronic device is completed. Things.

【0010】なお図2において※1〜※6は次の説明が
付記される。 ※1:単純なテキストファイルで情報をやり取りする
為、ほとんどのCADシステムで処理が可能であり、汎
用性がある。 ※2:電気部品は機構CADシステム上に3次元部品図
形として登録されている為、自由に部品単位での移動が
可能である。従って、部品を移動・回転させて、あらゆ
る角度からの干渉チェックが行える。 ※3:2次元部品図形(プリント配線板CAD)と3次
元部品図形(機構CADシステム)の部品図形名称は同
一である。 ※4:完全な3次元部品図形が配置される為、自動挿入
・実装のシミュレーションが簡単に可能になる。 ※5:テキストファイルに出力するデータの内容。極め
て単純なテキストファイル。 ※6:部品図形情報を基に自動部品配置を行うための手
順ファイルを作成し、実装する。これらの処理は特別な
プログラムを作成する必要がなく、機構CADシステム
の部品配置コマンドを列記したもの。
In FIG. 2, * 1 to * 6 are additionally described as follows. * 1: Since information is exchanged in a simple text file, it can be processed by most CAD systems, and is versatile. * 2: Since electrical components are registered as three-dimensional component graphics on the mechanical CAD system, they can be freely moved in component units. Therefore, interference check from all angles can be performed by moving and rotating the component. * 3: The two-dimensional part graphic (printed circuit board CAD) and the three-dimensional part graphic (mechanical CAD system) have the same part graphic name. * 4: Since a complete three-dimensional part figure is arranged, simulation of automatic insertion and mounting can be easily performed. * 5: Contents of data output to text file. A very simple text file. * 6: Create and mount a procedure file for automatic component placement based on component graphic information. These processes do not require the creation of a special program, and list component placement commands for the mechanical CAD system.

【0011】[0011]

【発明の効果】以上のように本発明は配線板の情報にあ
らかじめこの配線板に実装される部品の3次元情報を組
み合わせ、さらに部品実装した配線板をケースに組み込
むことが行われるので、実際に組み合わされた際の配線
板の部品とケースとの関係などが確認され、適切な設計
が行われたものである。
As described above, according to the present invention, the information of the wiring board is previously combined with the three-dimensional information of the components mounted on the wiring board, and the wiring board on which the components are mounted is incorporated into the case. The relationship between the parts of the wiring board and the case when combined with each other was confirmed, and an appropriate design was performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態によって製造した電子機器
の断面図
FIG. 1 is a sectional view of an electronic device manufactured according to an embodiment of the present invention.

【図2】設計情報を示すCADデータ図FIG. 2 is a CAD data diagram showing design information.

【符号の説明】[Explanation of symbols]

1 ケース 2 プリント配線板 3,4,5,6 部品 1 case 2 printed wiring board 3,4,5,6 parts

───────────────────────────────────────────────────── フロントページの続き (72)発明者 出口 正浩 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 辻本 悦夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5B046 AA08 DA09 FA07  ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masahiro 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Term (reference) 5B046 AA08 DA09 FA07

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ケースと、このケース内に収納される配
線板と、この配線板に実装される部品とを備えた電子機
器の設計方法において、前記配線板の設計は、コンピュ
ータで2次元部品図形を作成し、次いで配線板の外形の
座標、部品配置座標、配線パターン座標を順次入力し、
その後設計基準をチェックして終了し、別途コンピュー
タで部品図形を登録するとともに部品外形や配線板の裏
面情報などを前記2次元部品図形と名称を同一にして3
次元部品図形を作成し、別途コンピュータで前記ケース
の設計として三面図を入力し、ワイヤーフレームモデル
展開およびサーフェースモデル展開さらにソリッドモデ
ル展開を行ってこのケースの設計を終了し、上記配線板
の設計情報により部品図形配置命令手順を作成した後、
部品図形情報を読込んで部品配置処理を行い、ケースの
設計情報を読込んで図形合成を行い、部品とケースの干
渉をチェックした上で製造基準チェックするようにした
電子機器の設計方法。
In a method of designing an electronic device comprising a case, a wiring board housed in the case, and components mounted on the wiring board, the wiring board is designed by a computer using a two-dimensional component. Create a figure, then input the coordinates of the external shape of the wiring board, the coordinates of the parts arrangement, and the coordinates of the wiring pattern in order,
After that, the design criteria are checked and the processing is completed, and the part graphics are separately registered by the computer, and the external shape of the parts and the back surface information of the wiring board are made the same as the names of the two-dimensional part figures.
Create a 3D part figure, input a three-sided view as a design of the case separately with a computer, develop a wire frame model, develop a surface model, and develop a solid model, finish the design of this case, and design the wiring board After creating the part figure placement instruction procedure based on the information,
A method of designing an electronic device in which component graphic information is read and component placement processing is performed, case design information is read, graphic synthesis is performed, and interference between the component and the case is checked before manufacturing standards are checked.
JP2000220440A 2000-07-21 2000-07-21 Designing method for electronic equipment Pending JP2002041585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000220440A JP2002041585A (en) 2000-07-21 2000-07-21 Designing method for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000220440A JP2002041585A (en) 2000-07-21 2000-07-21 Designing method for electronic equipment

Publications (1)

Publication Number Publication Date
JP2002041585A true JP2002041585A (en) 2002-02-08

Family

ID=18715049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000220440A Pending JP2002041585A (en) 2000-07-21 2000-07-21 Designing method for electronic equipment

Country Status (1)

Country Link
JP (1) JP2002041585A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126317A1 (en) * 2007-03-30 2008-10-23 Fujitsu Limited Method for detecting clearance, cad program, and cad system
CN100440480C (en) * 2002-12-20 2008-12-03 国际商业机器公司 Method and system for calibrating attribute of complete model of research system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100440480C (en) * 2002-12-20 2008-12-03 国际商业机器公司 Method and system for calibrating attribute of complete model of research system
WO2008126317A1 (en) * 2007-03-30 2008-10-23 Fujitsu Limited Method for detecting clearance, cad program, and cad system
JP4823355B2 (en) * 2007-03-30 2011-11-24 富士通株式会社 Gap detection method, CAD program, and CAD system

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