JP2002033338A5 - - Google Patents

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Publication number
JP2002033338A5
JP2002033338A5 JP2000213096A JP2000213096A JP2002033338A5 JP 2002033338 A5 JP2002033338 A5 JP 2002033338A5 JP 2000213096 A JP2000213096 A JP 2000213096A JP 2000213096 A JP2000213096 A JP 2000213096A JP 2002033338 A5 JP2002033338 A5 JP 2002033338A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000213096A
Other languages
Japanese (ja)
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JP2002033338A (ja
JP4501093B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2000213096A priority Critical patent/JP4501093B2/ja
Priority claimed from JP2000213096A external-priority patent/JP4501093B2/ja
Publication of JP2002033338A publication Critical patent/JP2002033338A/ja
Publication of JP2002033338A5 publication Critical patent/JP2002033338A5/ja
Application granted granted Critical
Publication of JP4501093B2 publication Critical patent/JP4501093B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000213096A 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法 Expired - Lifetime JP4501093B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000213096A JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000213096A JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2002033338A JP2002033338A (ja) 2002-01-31
JP2002033338A5 true JP2002033338A5 (cg-RX-API-DMAC7.html) 2007-06-14
JP4501093B2 JP4501093B2 (ja) 2010-07-14

Family

ID=18708907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000213096A Expired - Lifetime JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Country Status (1)

Country Link
JP (1) JP4501093B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115910838A (zh) * 2021-12-10 2023-04-04 江苏柒捌玖电子科技有限公司 一种芯片封装结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220483B2 (ja) * 1991-09-12 2001-10-22 松下電器産業株式会社 ボンディング装置
JPH07221138A (ja) * 1994-02-07 1995-08-18 Fujitsu Ltd ボンディング装置及びボンディング方法
JP3262683B2 (ja) * 1995-01-20 2002-03-04 松下電器産業株式会社 半導体実装装置
JPH10340931A (ja) * 1997-06-05 1998-12-22 Toray Eng Co Ltd チップボンディングツール
JP3497078B2 (ja) * 1998-03-31 2004-02-16 株式会社日立ハイテクインスツルメンツ ダイボンダ
JP3328878B2 (ja) * 1998-10-26 2002-09-30 澁谷工業株式会社 ボンディング装置

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