JP2002026557A - Cooling structure of control panel - Google Patents

Cooling structure of control panel

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Publication number
JP2002026557A
JP2002026557A JP2000202411A JP2000202411A JP2002026557A JP 2002026557 A JP2002026557 A JP 2002026557A JP 2000202411 A JP2000202411 A JP 2000202411A JP 2000202411 A JP2000202411 A JP 2000202411A JP 2002026557 A JP2002026557 A JP 2002026557A
Authority
JP
Japan
Prior art keywords
heat
panel
air
duct
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000202411A
Other languages
Japanese (ja)
Other versions
JP4324312B2 (en
Inventor
Nobuhiko Ieto
伸彦 家藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DMG Mori Co Ltd
Original Assignee
Mori Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mori Seiki Co Ltd filed Critical Mori Seiki Co Ltd
Priority to JP2000202411A priority Critical patent/JP4324312B2/en
Publication of JP2002026557A publication Critical patent/JP2002026557A/en
Application granted granted Critical
Publication of JP4324312B2 publication Critical patent/JP4324312B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide the cooling structure of a control panel capable of reducing the size of a box while securing the amount of heat radiated outside the panel and eliminating a difference in temperature in the panel. SOLUTION: The inside of a box 2 is vertically divided into an amplifier receiving portion 6 having a large amount of heat and a power source receiving portion 5 having a small amount of heat and an air duct 20 for connecting a lower duct 21 between the power source receiving portion 5 and the amplifier receiving portion 6, a rear duct 22 behind the amplifier receiving portion 6, and an upper duct 23 above the amplifier receiving portion 6 is formed and a cooling fan is disposed in the air duct 20. Heat radiating fins 25, 26 are provided in the lower and the upper ducts 21, 23, respectively, and in-panel fins 27b extending radially from the center to the outside are arranged in the power source receiving portion 5 and the amplifier receiving portion 6 and circulating fans 31, 32 are arranged in the centers of the in-panel fins 27b, respectively.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、筐体内に発熱要素
としてのアンプ,電源等を収納配置してなる制御盤に関
し、詳細には上記アンプ,電源等から発生する熱を盤外
に放熱するとともに、盤内全体に万遍なく分散させるよ
うにした冷却構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control panel in which an amplifier, a power supply and the like as heat generating elements are housed and arranged in a housing, and more specifically, radiates heat generated from the amplifier, the power supply and the like to the outside of the panel. In addition, the present invention relates to a cooling structure that is uniformly dispersed throughout the panel.

【0002】[0002]

【従来の技術】例えばNC工作機械では、各種の駆動モ
ータ,油圧ポンプ等を駆動制御する制御盤を備えてい
る。この種の制御盤には、スピンドルアンプ,パワーサ
プライモジュール,トランス,リアクトル等の発熱機
器,発熱部品が収納されることから、これらから発生す
る熱を盤外に放熱して盤内での異常温度上昇を抑制する
熱交換器が配設される場合がある。
2. Description of the Related Art For example, an NC machine tool is provided with a control panel for driving and controlling various drive motors, hydraulic pumps and the like. This type of control panel houses heating devices and components such as spindle amplifiers, power supply modules, transformers, and reactors. The heat generated from these components is radiated outside the panel, causing abnormal temperatures inside the panel. In some cases, a heat exchanger for suppressing the rise is provided.

【0003】このような熱交換器を盤内に配設するにあ
たっては、発熱機器,発熱部品の配置位置,あるいは配
線の関係から筐体の内側に取付けることが困難であり、
このため、従来、図5に示すように、筐体50のドア5
1に熱交換器52を取付けるのが一般的となっている
(例えば、特許公報第2876583号参照)。
In disposing such a heat exchanger in a panel, it is difficult to mount the heat exchanger inside the housing due to the arrangement of the heat-generating devices and heat-generating components, or the wiring.
Therefore, conventionally, as shown in FIG.
It is common to attach a heat exchanger 52 to the first heat exchanger 1 (see, for example, Japanese Patent Publication No. 2876583).

【0004】上記熱交換器52は、盤外ファン53によ
り盤外の冷却空気を吸い込んで下端口54から盤外に吐
き出し、盤内ファン55により吸い込んだ盤内空気を上
端口56から吐き出す際に放熱板57を介して冷却する
ようになっている。
The heat exchanger 52 draws in cooling air outside the panel by the fan 53 outside the panel and discharges it out of the panel from the lower end port 54, and discharges the air in the panel sucked by the fan 55 in the panel from the upper end port 56. Cooling is performed via the heat radiating plate 57.

【0005】[0005]

【発明が解決しようとする課題】ところが、上記従来の
ように熱交換器をドアに取付ける構造とした場合、熱交
換器の分だけドアの奥行き寸法が大きくなり、制御盤が
大型化するという問題がある。
However, in the case where the heat exchanger is mounted on the door as in the prior art, the depth of the door is increased by the size of the heat exchanger, resulting in an increase in the size of the control panel. There is.

【0006】また上記従来のように盤内空気を下端部か
ら吸い込んで放熱させた後上端部から吐き出す構造とし
た場合には、吐き出し口付近しか空気の流れがなく、盤
内の全域が撹拌されることはなく、その結果、盤内での
温度の高い部分と低い部分との温度差が大きくなるとい
う問題がある。
Further, when the air in the panel is sucked from the lower end to release the heat and then discharged from the upper end as in the prior art, air flows only in the vicinity of the discharge port, and the whole area in the panel is agitated. As a result, there is a problem that a temperature difference between a high temperature portion and a low temperature portion in the panel becomes large.

【0007】本発明は、上記従来の状況に鑑みてなされ
たもので、盤外への放熱量を確保しながら筐体を小型化
できるとともに、盤内での温度差を解消できる制御盤の
冷却構造を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and it is possible to reduce the size of a housing while securing the heat radiation outside the panel and to cool a control panel capable of eliminating a temperature difference inside the panel. It is intended to provide structure.

【0008】[0008]

【課題を解決するための手段】本発明は、筐体内にアン
プ,電源等の発熱要素を収納配置してなる略密閉状の制
御盤の上記発熱要素からの熱を外部に排出する冷却構造
において、上記筐体内を発熱量の大きい第1発熱要素が
収納される第1発熱要素収納部と、該第1発熱要素より
発熱量の小さい第2発熱要素が収納される第2発熱要素
収納部とに上下に区分けし、該筐体に上記第1,第2発
熱要素収納部の間に位置する下側ダクト部と、該下側ダ
クト部に続いて第1発熱要素収納部の後側に位置する後
側ダクト部と、該後側ダクト部に続いて第1発熱要素収
納部の上側に位置する上側ダクト部とを連通接続してな
るエアダクト部を形成し、該エアダクト部内に上記下側
ダクト部の空気吸込口から吸い込んだ空気をエアダクト
部内を流通させて上記上側ダクト部の空気吐出口から排
出する冷却ファンを配設し、少なくとも上記上側ダクト
部に放熱フィンを配設し、該放熱フィンを上記上側ダク
ト部内に位置する盤外フィンと上記第1発熱要素収納部
内に位置する盤内フィンとを備えたものとし、さらに該
盤内フィンを中心部から外方に放射状に延びるよう配置
するとともに、該盤内フィンの中心部に循環ファンを配
設したことを特徴としている。
According to the present invention, there is provided a cooling structure for discharging heat from the heat-generating elements to the outside of a substantially hermetically sealed control panel in which heat-generating elements such as an amplifier and a power supply are housed and arranged in a housing. A first heat-generating element housing for accommodating a first heat-generating element having a large calorific value, and a second heat-generating element housing for accommodating a second heat-generating element having a smaller calorific value than the first heat generating element. A lower duct portion which is located between the first and second heat generating element storage portions in the housing; and a lower duct portion which is located on the rear side of the first heat generation element storage portion following the lower duct portion. Forming an air duct portion formed by connecting a rear duct portion to be connected and an upper duct portion located above the first heat generating element storage portion following the rear duct portion, and the lower duct portion is formed in the air duct portion. Through the air duct through the air sucked from the air inlet A cooling fan for discharging air from an air discharge port of the upper duct portion; a radiating fin disposed at least in the upper duct portion; and a fin outside the panel located in the upper duct portion and the first heat generating fin. And a fin in the panel located in the element storage portion. Further, the fins in the panel are arranged so as to extend radially outward from the center, and a circulation fan is provided in the center of the fins in the panel. It is characterized by:

【0009】[0009]

【発明の作用効果】本発明にかかる制御盤の冷却構造に
よれば、筐体内を発熱量の大きい第1発熱要素収納部と
これより発熱量の小さい第2発熱要素収納部とに上下に
区分けし、該第1発熱要素収納部の下部,後部及び上部
をエアダクト部で囲んだので、発熱量の大きい第1発熱
要素からの発熱を集中的に放熱することができ、盤外へ
の放熱効率を高めることにより盤内の温度上昇を抑制で
き、従来の熱交換器を不要にできる。その結果、盤外へ
の放熱量を確保しながら筐体の寸法を縮小でき、制御盤
全体を小型化できる。
According to the control panel cooling structure of the present invention, the inside of the housing is vertically divided into a first heat-generating element accommodating portion having a large heat value and a second heat-generating element accommodating portion having a smaller heat value. Since the lower, rear, and upper portions of the first heat-generating element housing portion are surrounded by the air duct, heat generated from the first heat-generating element having a large amount of heat can be radiated intensively, and the heat radiation efficiency to the outside of the panel can be improved. By increasing the temperature, the rise in the temperature inside the panel can be suppressed, and the conventional heat exchanger can be eliminated. As a result, the dimensions of the housing can be reduced while securing the heat radiation outside the panel, and the entire control panel can be reduced in size.

【0010】また下側,上側ダクト部内に放熱フィンを
配設したので、筐体の放熱面積を増加させることがで
き、しかもエアダクト部内に冷却空気を強制的に流通さ
せる冷却ファンを配置したので、熱交換効率をさらに高
めることができ、盤内温度の異常上昇を抑制することが
できる。もって筐体の表面積を縮小した場合の放熱量の
低下を回避でき、さらなる小型化を可能にできる。
Further, since the radiation fins are disposed in the lower and upper ducts, the radiation area of the housing can be increased, and the cooling fan for forcibly circulating the cooling air is disposed in the air duct. The heat exchange efficiency can be further increased, and an abnormal rise in the temperature inside the panel can be suppressed. Accordingly, it is possible to avoid a decrease in the amount of heat radiation when the surface area of the housing is reduced, and it is possible to further reduce the size.

【0011】本発明では、上記放熱フィンを下側,上側
ダクト部内に位置する盤外フィンと第1,第2発熱要素
収納部内に位置する盤内フィンとから構成し、各盤内フ
ィンを中心部から外方に放射状に延びるよう配置すると
ともに、該盤内フィンの中心部に循環ファンを配設した
ので、発熱要素からの熱を吸引して昇温した空気は循環
ファンにより盤内フィンの中心部に吸い込まれて攪拌さ
れ、外端部から吐き出される。このように空気が筐体の
内周面に沿うように下方に吐き出され、下方にて中心側
に移動して上昇し、循環ファンで再び吐出される。この
ようにして発熱要素からの熱が外方に放射状に万遍なく
分散されることとなり、盤内での温度分布の差を小さく
することができる。このように発熱要素の放熱効率を高
めることができる。その結果、筐体の寸法を縮小でき、
制御盤全体を小型化できる。
In the present invention, the radiating fins are composed of outer fins located in the lower and upper ducts and inner fins located in the first and second heat generating element housings. And the circulation fan is arranged at the center of the fins in the panel. It is sucked into the center and agitated, and exhaled from the outer end. In this way, the air is discharged downward along the inner peripheral surface of the housing, moves downward to the center side, rises, and is discharged again by the circulation fan. In this way, the heat from the heating elements is radially and uniformly distributed outward, and the difference in temperature distribution in the panel can be reduced. Thus, the heat radiation efficiency of the heat generating element can be increased. As a result, the dimensions of the housing can be reduced,
The entire control panel can be downsized.

【0012】[0012]

【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて説明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0013】図1ないし図4は、本発明の一実施形態に
よる制御盤の冷却構造を説明するための図であり、図1
は制御盤の全体斜視図、図2は制御盤の筐体の断面側面
図、図3は筐体内下方から見た放熱フィンの盤内フィン
の平面図、図4は放熱フィンの断面正面図である。
FIGS. 1 to 4 are views for explaining a control panel cooling structure according to an embodiment of the present invention.
Is an overall perspective view of the control panel, FIG. 2 is a cross-sectional side view of a casing of the control panel, FIG. 3 is a plan view of the fins in the panel of the radiating fin as viewed from below the inside of the casing, and FIG. is there.

【0014】図において、1は不図示のNC工作機械に
配設される制御盤であり、これは機械本体に組み込まれ
た各駆動モータ,油圧ポンプ等を駆動制御するものであ
る。この制御盤1は、前面にドア開口2aを有する直方
体状の筐体2と、該筐体2のドア開口2aを開閉する前
面ドア3とからなる概略構造のものであり、該前面ドア
3によりドア開口2aは気密に閉塞されている。なお、
3aはドア閉時に盤内のメインブレーカに係合するブレ
ーカハンドルであり、3bはドアヒンジである。
In FIG. 1, reference numeral 1 denotes a control panel provided on an NC machine tool (not shown), which controls driving of each drive motor, a hydraulic pump and the like incorporated in the machine main body. The control panel 1 has a schematic structure including a rectangular parallelepiped housing 2 having a door opening 2a on the front surface and a front door 3 for opening and closing the door opening 2a of the housing 2. The door opening 2a is airtightly closed. In addition,
3a is a breaker handle which engages with a main breaker in the panel when the door is closed, and 3b is a door hinge.

【0015】上記筐体2内は隔壁2b,2cにより下か
ら順に制御機器収納部4,電源収納部(第2発熱要素収
納部)5,アンプ収納部(第1発熱要素収納部)6に上
下に区分けされている。この制御機器収納部6内には不
図示の各種制御機器が収納配置されており、上記電源収
納部5内には第2発熱要素としての不図示のトランス,
リアクトル及びメインブレーカ,コンタクタ等が収納配
置されている。
The inside of the housing 2 is vertically moved by partition walls 2b and 2c into a control device storage section 4, a power supply storage section (second heating element storage section) 5, and an amplifier storage section (first heating element storage section) 6 from the bottom. Are divided into Various control devices (not shown) are housed and arranged in the control device housing 6, and a transformer (not shown) as a second heating element is provided in the power supply housing 5.
The reactor, main breaker, contactor, etc. are housed and arranged.

【0016】また上記アンプ収納部6内には第1発熱要
素としてのアンプ15が収納配置されている。このアン
プ15は、スピンドルアンプ,パワーサプライモジュー
ル等からなり、アンプケース16の後壁に放熱フィン1
7を接続固定した構造となっている。この放熱フィン1
7はアンプケース16に固定された平面視T字形状のベ
ース部17aの両面に上下方向に延びる多数のフィン板
17bを間隔をあけて一体形成した構造のものである。
An amplifier 15 as a first heating element is housed in the amplifier housing 6. The amplifier 15 includes a spindle amplifier, a power supply module, and the like.
7 is connected and fixed. This radiation fin 1
Reference numeral 7 denotes a structure in which a large number of fin plates 17b extending in the vertical direction are integrally formed on both surfaces of a base portion 17a having a T-shape in a plan view and fixed to the amplifier case 16 at intervals.

【0017】上記筐体2にはエアダクト部20が形成さ
れている。このエアダクト部20は上記電源収納部5と
アンプ収納部6との間に位置するよう形成された下側ダ
クト部21と、該下側ダクト部21の後端に続いてアン
プ収納部6の後側に位置するよう形成された後側ダクト
部22と、該後側ダクト部22の上端に続いてアンプ収
納部6の上側に位置するよう形成された上側ダクト部2
3とを略気密に連通接続して構成されている。
The housing 2 has an air duct section 20 formed therein. The air duct section 20 includes a lower duct section 21 formed between the power supply storage section 5 and the amplifier storage section 6, and a rear end of the lower duct section 21 and a rear end of the amplifier storage section 6. The rear duct portion 22 formed to be located on the side, and the upper duct portion 2 formed to be located above the amplifier housing portion 6 following the upper end of the rear duct portion 22
3 is connected substantially airtightly.

【0018】上記エアダクト部20は側面視でアンプ収
納部6を囲むようにコ字状に形成されており、かつアン
プ収納部6の全幅に渡って形成されている。
The air duct section 20 is formed in a U shape so as to surround the amplifier housing section 6 in a side view, and is formed over the entire width of the amplifier housing section 6.

【0019】上記下側ダクト部21は、上記隔壁2cを
構成する上隔壁2c′及び下隔壁2c″とで形成された
空気通路を有している。上記前面ドア3の下側ダクト部
21の前端開口21aに臨む部分には空気吸込口3eが
形成されており、前面ドア3を閉じたときに空気吸込口
3eと前端開口21aとが気密に連通するようになって
いる。
The lower duct portion 21 has an air passage formed by an upper partition 2c 'and a lower partition 2c "constituting the partition 2c. An air inlet 3e is formed in a portion facing the front end opening 21a, and when the front door 3 is closed, the air inlet 3e and the front end opening 21a communicate with each other in an airtight manner.

【0020】上記前面ドア3内の空気吸込口3eには吸
い込み空気を濾過するフィルタ24が配設されている。
また上記空気吸込口3eは多数のスリット3cが設けら
れた蓋3dにより開閉可能となっており、この蓋3dを
あけることにより、前面ドア3を閉じた状態でフィルタ
24の交換作業を行うことができ、メンテナンスを容易
にできる。
At the air inlet 3e in the front door 3, a filter 24 for filtering the sucked air is provided.
The air inlet 3e can be opened and closed by a lid 3d provided with a number of slits 3c. By opening the lid 3d, the filter 24 can be replaced with the front door 3 closed. And maintenance can be facilitated.

【0021】上記後側ダクト部22は、筐体2の背板2
fとアンプ収納部6の後壁6aとで形成された空気通路
を有しており、この後側ダクト22内には上記アンプ1
5の放熱フィン17が上記後壁6aに形成された開口6
bを挿通して収納配置されている。
The rear duct portion 22 is provided on the back plate 2 of the housing 2.
f, and an air passage formed by the rear wall 6a of the amplifier housing portion 6.
The radiation fins 17 are formed in the openings 6 formed in the rear wall 6a.
b is inserted and stored.

【0022】上側ダクト部23は、アンプ収納部6の上
壁6dに筐体2の天井部を構成する箱状の天板部材2g
を配置することにより形成された空気通路を有してい
る。上記前面ドア3の上側ダクト部23の前端開口23
aに臨む部分には空気吐出口3gが形成されている。ま
た下側,上側ダクト部21,23の断面積は後側ダクト
部22の断面積より小さく設定されており、これにより
下側,上側ダクト部21,23を通る空気の流速を速め
ることにより冷却性を高めている。
The upper duct section 23 is provided on the upper wall 6d of the amplifier housing section 6 with a box-shaped top plate member 2g constituting the ceiling of the housing 2.
Have an air passage formed by arranging them. Front end opening 23 of upper duct portion 23 of front door 3
An air discharge port 3g is formed in a portion facing a. The cross-sectional area of the lower and upper duct portions 21 and 23 is set smaller than the cross-sectional area of the rear duct portion 22, thereby increasing the flow velocity of the air passing through the lower and upper duct portions 21 and 23 to cool the air. Is increasing the character.

【0023】上記後側ダクト部22の下流側の放熱フィ
ン17の上側には冷却ファン30が配置されている。こ
の冷却ファン30により上記空気吸込口3eから空気を
吸い込みエアダクト部20内を流通させて上記空気吐出
口3gから排出するように構成されている。
A cooling fan 30 is disposed above the heat radiation fins 17 on the downstream side of the rear duct portion 22. The cooling fan 30 sucks air from the air suction port 3e, circulates through the air duct section 20, and discharges the air from the air discharge port 3g.

【0024】上記下側ダクト部21及び上側ダクト部2
3には放熱フィン25,26が配設されている。この放
熱フィン25,26は、仕切り板27aの下面に盤内フ
ィン27bを形成するとともに、上面に盤外フィン27
cを形成した構造のものである。
The lower duct 21 and the upper duct 2
Radiation fins 25 and 26 are provided on 3. The radiating fins 25 and 26 have an inner fin 27b formed on the lower surface of the partition plate 27a, and an outer fin 27b formed on the upper surface.
This is a structure in which c is formed.

【0025】上側の放熱フィン26は、盤内フィン27
bがアンプ収納部6内に位置し、かつ盤外フィン27c
が上側ダクト部23内に位置するように配置されてお
り、上壁6dに形成されたフィン開口35の周縁に仕切
り板27aを固定することにより支持されている。上記
各盤外フィン27cは空気の流通方向に延び、かつ幅方
向に所定間隔をあけて配列されている。
The upper radiation fin 26 is provided with a fin 27 inside the panel.
b is located in the amplifier housing 6 and the fins 27c outside the panel
Are arranged in the upper duct portion 23, and are supported by fixing a partition plate 27a to a peripheral edge of a fin opening 35 formed in the upper wall 6d. The outer fins 27c extend in the direction of air flow and are arranged at predetermined intervals in the width direction.

【0026】また下側の放熱フィン25は、盤内フィン
27bが電源収納部5内に位置し、かつ盤外フィン27
cが下側ダクト部21内に位置するように配置されてお
り、下隔壁2c〃に形成されたフィン開口35の周縁に
仕切り板27aを固定することにより支持されている。
The lower radiating fins 25 are arranged such that the fins 27b inside the panel are located in the power supply housing 5 and the fins 27 outside the panel.
c is disposed in the lower duct portion 21 and is supported by fixing a partition plate 27a to a peripheral edge of a fin opening 35 formed in the lower partition 2c #.

【0027】そして、上記各盤内フィン27bは仕切り
板27aの中心部から外方に放射状に延びるよう所定の
角度間隔をあけて配置されており、各盤内フィン27b
の外端部27b´は筐体2の内壁に近接している。また
上記仕切り板27aの中心部には循環ファン31,32
が挿入配置されており、この各盤内ファン31,32は
盤内フィン27bを挟み込むように仕切り板27aに長
いビスで直接固定されている。これにより循環ファン3
1,32により吸い込んだ空気を各盤内フィン27b間
を通って外端部27b´に導き、ここから吐き出すよう
になっている。そして各盤内フィン27bの外端部27
b´が筐体2の全内周に渡って位置していることから,
各外端部27b´から吐き出された空気は筐体2の全内
周に沿うように均等に分散されつつ下方に流れ、ここか
ら内方に流れた後上昇して上記循環ファン31,32に
吸引される(図2の破線矢印参照)。
The inner fins 27b are arranged at predetermined angular intervals so as to extend radially outward from the center of the partition plate 27a.
The outer end portion 27b ′ of the right side of FIG. Circulating fans 31, 32 are provided at the center of the partition plate 27a.
The in-panel fans 31, 32 are directly fixed to the partition plate 27a with long screws so as to sandwich the in-panel fins 27b. This makes the circulation fan 3
The air sucked in by the first and the second 32 passes between the fins 27b in the panel, is guided to the outer end 27b ', and is discharged therefrom. And the outer end 27 of each fin 27b in the panel
Since b 'is located over the entire inner circumference of the housing 2,
The air discharged from each outer end portion 27b 'flows downward while being uniformly distributed along the entire inner periphery of the housing 2, flows inward from here, and rises to the circulation fans 31, 32. It is aspirated (see dashed arrows in FIG. 2).

【0028】次に本実施形態の作用効果について説明す
る。
Next, the operation and effect of this embodiment will be described.

【0029】本実施形態の制御盤1は、冷却ファン30
が前面ドア3の空気吸込口3eから下側ダクト部21内
に空気を吸い込む。この空気が下側ダクト部21内にて
盤外フィン27cを介して電源部の熱を吸収しつつ後側
ダクト部22内に流入し、該後側ダクト部22内にて放
熱フィン17を介してアンプ15の熱を吸収する。冷却
ファン30により後側ダクト部22内の空気を吸い込む
とともに、上側ダクト部23に吐き出し、吐き出された
空気が上側ダクト部23内にて盤外フィン27cを介し
てアンプ部の熱を吸収しつつ空気吐出口3gから前方に
排出される(図2の実線矢印参照)。
The control panel 1 of this embodiment includes a cooling fan 30
Sucks air into the lower duct portion 21 from the air inlet 3 e of the front door 3. This air flows into the rear duct portion 22 while absorbing the heat of the power supply portion via the outer fins 27 c in the lower duct portion 21, and flows through the radiation fins 17 in the rear duct portion 22. To absorb the heat of the amplifier 15. The cooling fan 30 sucks the air in the rear duct portion 22 and discharges the air into the upper duct portion 23, and the discharged air absorbs the heat of the amplifier portion through the outside fins 27 c in the upper duct portion 23. The air is discharged forward from the air discharge port 3g (see the solid arrow in FIG. 2).

【0030】また、循環ファン31,32が電源収納部
5,アンプ収納部6の盤内熱を吸い込み、該吸い込んだ
空気を各盤内フィン27b間を通って外端部27b´か
ら吐き出し、吐き出された空気が筐体2の全内周に沿う
ように均等に分散されつつ下方に流れ、ここから内方に
流れた後上昇し、循環する。このようにして盤内温度を
所定温度以下、例えば盤外温度のプラス10度以下に保
持する。
The circulating fans 31, 32 suck heat inside the power supply housing 5 and the amplifier housing 6 and discharge the sucked air from the outer end 27b 'through the space between the fins 27b. The collected air flows downward while being evenly distributed along the entire inner periphery of the housing 2, flows inward from here, and then rises and circulates. In this way, the temperature inside the panel is kept at a predetermined temperature or less, for example, at plus 10 degrees below the temperature outside the panel.

【0031】このように本実施形態によれば、筐体2内
を下から順に制御機器収納部4,電源収納部5,アンプ
収納部6に区分けし、該アンプ収納部6をエアダクト部
20により囲むとともに、該エアダクト部20の下側ダ
クト部21をアンプ収納部6と電源収納部5との間に配
置したので、発熱量の大きいアンプ15の熱を集中的に
放熱することができるとともに、電源部の熱を下側ダク
ト部21を介して放熱することができる。これにより、
盤外への放熱効率を高めることができ、従来の熱交換器
を不要にできる。その結果、盤外への放熱量を確保しな
がら筐体2の寸法を縮小でき、制御盤全体を小型化でき
る。
As described above, according to the present embodiment, the inside of the housing 2 is divided into the control equipment storage section 4, the power supply storage section 5, and the amplifier storage section 6 in this order from the bottom, and the amplifier storage section 6 is separated by the air duct section 20. Since the lower duct portion 21 of the air duct portion 20 is disposed between the amplifier housing portion 6 and the power supply housing portion 5, the heat of the amplifier 15 having a large calorific value can be radiated intensively. The heat of the power supply unit can be radiated through the lower duct unit 21. This allows
The heat radiation efficiency to the outside of the panel can be increased, and the conventional heat exchanger can be eliminated. As a result, the dimensions of the housing 2 can be reduced while securing the heat radiation outside the panel, and the entire control panel can be reduced in size.

【0032】またエアダクト部20内に放熱フィン1
7,25,26を配置するとともに、空気を強制的に流
通させる冷却ファン30を配置したので、熱交換率を高
めることができ、盤内温度の上昇を抑制することができ
る。もって筐体2の表面積を縮小した場合の放熱量の低
下を回避でき、さらなる小型化を可能にできる。
The radiating fins 1 are provided in the air duct section 20.
Since the cooling fans 30 for forcibly circulating the air are arranged in addition to the arrangement of the cooling fans 7, 25, and 26, the heat exchange rate can be increased and the rise in the temperature inside the panel can be suppressed. Thus, it is possible to avoid a decrease in the amount of heat radiation when the surface area of the housing 2 is reduced, and it is possible to further reduce the size.

【0033】本実施形態では、上記放熱フィン25,2
6を下側,上側ダクト部21,23内に位置する盤外フ
ィン27cと、電源収納部5,アンプ収納部6内に位置
する盤内フィン27bとから構成したので、熱交換効率
をさらに高めることができる。
In this embodiment, the radiation fins 25, 2
6 is composed of the outer fins 27c located in the lower and upper duct portions 21 and 23, and the inner fins 27b located in the power supply storage portion 5 and the amplifier storage portion 6, so that the heat exchange efficiency is further improved. be able to.

【0034】本実施形態では、上記各盤内フィン27b
を仕切り板27aの中心部から外方に放射状に延びるよ
う配置するとともに、各外端部27b´を筐体2の全内
周面に位置させ、盤内フィン27bの中心部に循環ファ
ン31,32を配置したので、発熱量の大きい電源,ア
ンプ15等から発生した熱は循環ファン31,32によ
り各盤内フィン27bに沿って万遍なく分散して流れる
こととなり、盤内での温度差を小さくすることができ
る。このようにして電源,アンプ15等の放熱効率を高
めることができ、筐体の寸法を縮小でき、制御盤全体を
小型化できる。
In the present embodiment, the above-mentioned fins 27b in each panel
Are arranged so as to extend radially outward from the center of the partition plate 27a, and the outer ends 27b 'are located on the entire inner peripheral surface of the housing 2, and the circulation fans 31, 32, the heat generated from the power source, the amplifier 15 and the like having a large amount of heat is distributed and distributed uniformly along the fins 27b in each panel by the circulation fans 31 and 32, and the temperature difference in the panel. Can be reduced. In this manner, the heat radiation efficiency of the power supply, the amplifier 15, and the like can be increased, the size of the housing can be reduced, and the entire control panel can be downsized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態による制御盤の斜視図であ
る。
FIG. 1 is a perspective view of a control panel according to an embodiment of the present invention.

【図2】上記制御盤の筐体の断面側面図である。FIG. 2 is a sectional side view of a casing of the control panel.

【図3】上記筐体内下方から見た放熱フィンの盤内フィ
ンの平面図である。
FIG. 3 is a plan view of an in-panel fin of the radiation fin as viewed from below the inside of the housing.

【図4】上記放熱フィンの断面正面図である。FIG. 4 is a sectional front view of the radiation fin.

【図5】従来の熱交換器を備えた制御盤の概略図であ
る。
FIG. 5 is a schematic view of a control panel provided with a conventional heat exchanger.

【符号の説明】[Explanation of symbols]

1 制御盤 2 筐体 5 電源収納部(第2発熱要素
収納部) 6 アンプ収納部(第1発熱要
素収納部) 15 アンプ(第1発熱要素) 20 エアダクト部 21 下側ダクト部 22 後側ダクト部 23 上側ダクト部 25,26 放熱フィン 27b 盤内フィン 27c 盤外フィン 30 冷却ファン 31,32 盤内ファン
REFERENCE SIGNS LIST 1 control panel 2 housing 5 power supply storage section (second heat generation element storage section) 6 amplifier storage section (first heat generation element storage section) 15 amplifier (first heat generation element) 20 air duct section 21 lower duct section 22 rear duct Part 23 upper duct part 25, 26 radiating fin 27b inner fin 27c outer fin 30 cooling fan 31, 32 internal fan

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 筐体内にアンプ,電源等の発熱要素を収
納配置してなる略密閉状の制御盤の上記発熱要素からの
熱を外部に排出する冷却構造において、上記筐体内を発
熱量の大きい第1発熱要素が収納される第1発熱要素収
納部と、該第1発熱要素より発熱量の小さい第2発熱要
素が収納される第2発熱要素収納部とに上下に区分け
し、該筐体に上記第1,第2発熱要素収納部の間に位置
する下側ダクト部と、該下側ダクト部に続いて第1発熱
要素収納部の後側に位置する後側ダクト部と、該後側ダ
クト部に続いて第1発熱要素収納部の上側に位置する上
側ダクト部とを連通接続してなるエアダクト部を形成
し、該エアダクト部内に上記下側ダクト部の空気吸込口
から吸い込んだ空気をエアダクト部内を流通させて上記
上側ダクト部の空気吐出口から排出する冷却ファンを配
設し、少なくとも上記上側ダクト部に放熱フィンを配設
し、該放熱フィンを上記上側ダクト部内に位置する盤外
フィンと上記第1発熱要素収納部内に位置する盤内フィ
ンとを備えたものとし、さらに該盤内フィンを中心部か
ら外方に放射状に延びるよう配置するとともに、該盤内
フィンの中心部に循環ファンを配設したことを特徴とす
る制御盤の冷却構造。
1. A cooling structure for discharging heat from the heat-generating elements of a substantially hermetically-closed control panel in which heat-generating elements such as an amplifier and a power supply are housed and arranged in a housing. A first heat-generating element accommodating portion for accommodating a large first heat-generating element and a second heat-generating element accommodating portion for accommodating a second heat-generating element having a smaller heating value than the first heat generating element; A lower duct located on the body between the first and second heating element housings; a rear duct located on the rear side of the first heating element housing following the lower duct; An air duct portion is formed by connecting the upper duct portion located above the first heat generating element storage portion following the rear duct portion, and the air duct portion is sucked into the air duct portion from the air suction port of the lower duct portion. Allows air to flow through the air duct to discharge air from the upper duct. A cooling fan to be exhausted from a mouth, a radiating fin disposed at least in the upper duct portion, the radiating fin being located in the upper duct portion and an outer fin located in the first heat generating element storage portion. A control fin provided with an inner fin, wherein the fin in the panel is radially extended outward from the center, and a circulation fan is provided in the center of the fin in the panel. Cooling structure.
JP2000202411A 2000-07-04 2000-07-04 Control panel cooling structure Expired - Fee Related JP4324312B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000202411A JP4324312B2 (en) 2000-07-04 2000-07-04 Control panel cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000202411A JP4324312B2 (en) 2000-07-04 2000-07-04 Control panel cooling structure

Publications (2)

Publication Number Publication Date
JP2002026557A true JP2002026557A (en) 2002-01-25
JP4324312B2 JP4324312B2 (en) 2009-09-02

Family

ID=18699939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000202411A Expired - Fee Related JP4324312B2 (en) 2000-07-04 2000-07-04 Control panel cooling structure

Country Status (1)

Country Link
JP (1) JP4324312B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069347A1 (en) * 2007-11-26 2009-06-04 Nippon Light Metal Company, Ltd. Heat exchanger, electronic apparatus receiving box, and electronic apparatus testing box
EP1798629A3 (en) * 2005-12-13 2009-12-02 Fujitsu Limited Electronic apparatus
JP2012124521A (en) * 2012-02-20 2012-06-28 Nippon Light Metal Co Ltd Heat exchanger
JP2013128046A (en) * 2011-12-19 2013-06-27 Dkk Toa Corp Housing for measurement apparatus
JP2015220360A (en) * 2014-05-19 2015-12-07 株式会社日立国際電気 Electronic device
JP2021022644A (en) * 2019-07-26 2021-02-18 パナソニックIpマネジメント株式会社 Control device and information providing device
CN117395853A (en) * 2023-10-08 2024-01-12 广州南威电子有限公司 Air-cooled radiating power amplification plate radiator

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1798629A3 (en) * 2005-12-13 2009-12-02 Fujitsu Limited Electronic apparatus
US8256495B2 (en) 2005-12-13 2012-09-04 Fujitsu Limited Electronic apparatus including removable dust catcher
WO2009069347A1 (en) * 2007-11-26 2009-06-04 Nippon Light Metal Company, Ltd. Heat exchanger, electronic apparatus receiving box, and electronic apparatus testing box
JP2009130146A (en) * 2007-11-26 2009-06-11 Nippon Light Metal Co Ltd Heat exchanger, electronic apparatus receiving box, and electronic apparatus testing box
JP2013128046A (en) * 2011-12-19 2013-06-27 Dkk Toa Corp Housing for measurement apparatus
JP2012124521A (en) * 2012-02-20 2012-06-28 Nippon Light Metal Co Ltd Heat exchanger
JP2015220360A (en) * 2014-05-19 2015-12-07 株式会社日立国際電気 Electronic device
JP2021022644A (en) * 2019-07-26 2021-02-18 パナソニックIpマネジメント株式会社 Control device and information providing device
CN117395853A (en) * 2023-10-08 2024-01-12 广州南威电子有限公司 Air-cooled radiating power amplification plate radiator

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