CN219227437U - Frequency conversion cabinet and HVAC equipment - Google Patents

Abstract

The utility model discloses a frequency conversion cabinet and heating and ventilation equipment, wherein the frequency conversion cabinet comprises: the cabinet body is provided with an accommodating cavity; the control board is arranged in the accommodating cavity; the wireless communication module is arranged in the cabinet body and is in signal transmission with the control panel; wherein, at least one of wireless communication module and the control panel range upon range of in the medial surface of holding chamber. Above-mentioned frequency conversion cabinet, at least one of wireless communication module and the control panel stacks in the medial surface of holding chamber, can improve the space utilization of product, the heat dissipation of being convenient for.

Description

Frequency conversion cabinet and HVAC equipment

technical field

The utility model relates to the technical field of frequency conversion devices, in particular to a frequency conversion cabinet and heating and ventilation equipment.

Background technique

The frequency conversion cabinet control cabinet, referred to as the frequency conversion cabinet, can be widely used in metallurgy, chemical industry, petroleum, water supply, mining, building materials, motor industries and other pumps, fans, compressors, rolling mills, injection molding machines, belt conveyors and other medium voltage electrical appliances. machine equipment.

In the related art, the frequency conversion cabinet includes a plurality of electronic components such as frequency conversion cabinet power components, frequency conversion cabinet control components, and frequency conversion cabinet control components.

Utility model content

The embodiment of the utility model provides a frequency conversion cabinet and heating and ventilation equipment.

The frequency conversion cabinet of the embodiment of the utility model includes:

A cabinet body, the cabinet body is provided with an accommodating cavity;

a control board, the control board is arranged in the accommodating cavity;

A wireless communication module, the wireless communication module is arranged in the cabinet and transmits signals with the control panel;

Wherein, at least one of the wireless communication module and the control board is stacked on the inner surface of the accommodating cavity.

At least one of the frequency conversion cabinet, the wireless communication module and the control board is stacked on the inner surface of the accommodating cavity, which can improve the space utilization rate of the product and facilitate heat dissipation.

In some embodiments, the wireless communication module and the control board are stacked on the same side wall of the accommodating cavity.

In some embodiments, the wireless communication module and the control board are integrated into the same circuit board, and the circuit board is stacked on the inner surface of the accommodating cavity;

Or, the wireless communication module and the control board have a split structure.

In some embodiments, the accommodating chamber includes a first chamber and a second chamber, and the frequency conversion cabinet further includes:

a first radiator, the first radiator is arranged in the first cavity, and is configured to reduce the temperature in the first cavity by air cooling;

The second heat sink is configured to dissipate heat for the electronic devices in the second cavity through heat conduction;

The airflow driving part is arranged in the first chamber and configured to drive the heat dissipation airflow to flow through the electronic devices in the first chamber and the first heat sink.

In some embodiments, at least one of the wireless communication module and the control board is disposed in the first cavity and stacked on the side wall of the first cavity; or the wireless communication module and At least one of the control boards is arranged in the second cavity and stacked on the side wall of the second cavity.

In some embodiments, a partition is provided in the cabinet, and the partition separates the first cavity and the second cavity in the accommodating cavity, and the wireless communication module and the control At least one of the panels is laminated on the partition or on the side wall of the cabinet.

In some embodiments, the partition is arranged in the cabinet, and forms the first cavity with the side wall and the backboard of the cabinet, and the partition is arranged in the cabinet At one side close to the backboard, at least one of the wireless communication module and the control board is stacked on one of the partition board and the side wall of the cabinet.

In some embodiments, at least one of the wireless communication module and the control board is stacked on the side wall of the cabinet and arranged on the front side of the partition.

In some embodiments, the frequency conversion cabinet includes a fan power board, and the fan power board is electrically connected to the airflow driving member.

In some embodiments, the airflow driver includes a plurality of fans, the fan power supply board includes a plurality of fans, the plurality of fan power supply boards are respectively corresponding to and electrically connected to the plurality of fans, and the plurality of fan power supply boards are respectively corresponding and electrically connected to the plurality of fans. At least one of the fans is stacked on the inner side of the cabinet.

In some embodiments, also include:

a door body, the door body is connected to the cabinet body and is configured to open and close the accommodating cavity,

Wherein, electronic devices are arranged on the door body.

The HVAC equipment provided by the embodiment of the utility model includes:

The frequency conversion cabinet of any of the above-mentioned embodiments;

An air-conditioning unit, the air-conditioning unit is connected with the frequency conversion cabinet.

In some embodiments, the unit control board of the air-conditioning unit is integrated on the frequency conversion cabinet, and the unit control board and the air-conditioning unit transmit signals.

At least one of the HVAC equipment, the wireless communication module and the control board is stacked on the inner surface of the accommodating cavity, which can improve the space utilization rate of the product and facilitate heat dissipation.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

Fig. 1 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention, wherein the door body is closed.

Fig. 2 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention, wherein the door is opened.

Fig. 3 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

Fig. 4 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

Fig. 6 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

Reference signs: frequency conversion cabinet 100, cabinet body 10, opening 12, back panel 14, side panel 16, door body 18, first installation board 101, second installation board 102, third installation board 103, fourth installation board 104 , the accommodation cavity 20, the first cavity 201, the first radiator 2011, the second cavity 202, the second radiator 2021, the airflow driver 22, the electronic device 30, the circuit board 32, the control board 40, the wireless communication module 42, Partition plate 44, fan power board 46.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model, but should not be construed as limiting the present utility model.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", Orientation indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operation, and therefore cannot be construed as a limitation of the utility model. In the description of the present utility model, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a flexible connection. Disassemble the connection, or connect in one piece. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, and may also include the first and second features being in direct contact with each other. The features are not in direct contact but through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The disclosure herein provides many different implementations or examples for realizing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described herein. Of course, they are only examples, and the purpose is not to limit the utility model. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Referring to FIGS. 1-6 , the frequency conversion cabinet 100 according to the embodiment of the present invention includes a cabinet body 10 , a control board 40 and a wireless communication module 42 . Wherein, cabinet body 10 is provided with accommodating chamber 20; Control board 40, and control board 40 is arranged in accommodating chamber 20; Wireless communication module 42, wireless communication module 42 is arranged in cabinet body 10, and with control board 40 signal transmission . Wherein, at least one of the wireless communication module 42 and the control board 40 is stacked on the inner surface of the accommodating cavity 20 .

At least one of the frequency conversion cabinet 100, the wireless communication module 42 and the control board 40 is stacked on the inner surface of the accommodating cavity 20, which can improve the space utilization rate of the product and facilitate heat dissipation.

Specifically, referring to FIGS. 2-4 , the front side of the accommodating cavity 20 in the cabinet 10 has an opening 12 , and the rear side has a backboard 14 . Above, the side of the opening 12 of the cabinet body 10 shown in the figure is the left and right direction of the cabinet body 10 along the short side direction, and the side of the opening 12 of the cabinet body 10 shown in the figure is the up and down direction of the cabinet body 10 along the long side direction. The accommodating cavity 20 provided in the cabinet body 10 is used for accommodating the electronic device 30 . In order to facilitate the installation and maintenance of the electronic device 30 , an opening 12 is provided on the front side of the accommodating cavity 20 . A backboard 14 is arranged on the rear side of the cabinet body 10 , and a sideboard 16 is arranged on the side. The accommodating cavity 20 provided in the cabinet body 10 is provided with a control board 40 , and the cabinet body 10 is provided with a wireless communication module 42 , and the wireless communication module 42 communicates with the control board 40 for signal transmission. In this way, at least one of the wireless communication module 42 and the control board 40 is stacked on the inner surface of the accommodating cavity 20 to facilitate heat dissipation and improve the space utilization rate of the product.

The electronic device 30 in the accommodating chamber 20 may include the electronic device 30 housed in the accommodating chamber 20 may include an electric control board, a 2G module, a display screen, an emergency stop button, a control board 40, a guide vane fan board, a control board 40, Terminal block, smart telegraph, transformer, circuit breaker, 24V power board, driver board, control board 40, 380V power board, APF, filter board, absorption resistor, capacitor, IGBT, transformer, snubber resistor, fan, evaporator, reactance transformers, transformers, diodes. Among them, the high-voltage components may include absorption resistors, capacitors, IGBTs, transformers, snubber resistors, fans, evaporators, reactors, transformers, and diodes. Weak current devices can include electric control board, 2G module, display screen, emergency stop button, control board 40, guide vane fan board, control board 40, terminal block, smart telegraph, transformer, circuit breaker, 24V power supply board, drive board, Control board 40, 380V power board, APF, filter board.

In some implementations, the electronic devices 30 are arranged in layers along the front-to-back direction, and the layers are distinct, which can be realized by installing the electronic devices 30 on multiple mounting boards arranged in layers along the front-to-back direction in the cabinet body 10 . Referring to Fig. 3, in this embodiment, there are a plurality of mounting plates in the cabinet 10, the first mounting plate 101, the second mounting plate 102, the third mounting plate 103 and the fourth mounting plate 104, and the four mounting plates are stacked on the There are gaps between the front side of the backboard 14 and the first installation board 101 , the second installation board 102 , the third installation board 103 and the fourth installation board 104 and the back board 14 . The electronic devices 30 are mounted on the first mounting board 101 , the second mounting board 102 , the third mounting board 103 and the fourth mounting board 104 , so that the electronic devices 30 are arranged in layers along the front and back direction, and the layers are distinct.

In some embodiments, referring to FIG. 5 and FIG. 6 , the wireless communication module 42 and the control board 40 are stacked on the same side wall of the accommodating cavity 20 .

In this way, the signal transmission between the wireless communication module 42 and the control board 40 is facilitated, and the structure of the frequency conversion cabinet 100 is compact, which improves the space utilization rate.

Specifically, the wireless communication module 42 and the control board 40 are stacked on the same side wall of the accommodating cavity 20 . In one embodiment, the wireless communication module 42 and the control board 40 are stacked on the left side wall of the accommodating cavity 20, and the wireless communication module 42 and the control board 40 are arranged adjacent to each other, so as to facilitate signal transmission between the wireless communication module 42 and the control board 40 . The arrangement of the wireless communication module 42 and the control on the same side also makes the structure of the frequency conversion cabinet 100 compact and improves the space utilization rate of the cabinet body 10 .

In some embodiments, referring to FIG. 5 and FIG. 6, the wireless communication module 42 and the control board 40 are integrated into the same circuit board 32, and the circuit board 32 is stacked on the inner side of the accommodating cavity 20; or, the wireless communication module 42 and the control panel 40 are split structures.

In this way, when the wireless communication module 42 and the control board 40 are integrated into the same circuit board 32, and the circuit board 32 is stacked on the inner side of the accommodating cavity 20, the structure of the frequency conversion cabinet 100 is compact, and the space utilization rate is improved. When the wireless communication module 42 and the control board 40 are in a split structure, it is convenient to produce and maintain a single electronic device 30 .

Specifically, when the wireless communication module 42 and the control board 40 are integrated into the same circuit board 32, and the circuit board 32 is stacked on the inner side of the accommodating cavity 20, due to the signal transmission between the wireless communication module 42 and the control board 40, the two When the former is integrated into one circuit board 32, the integration degree of the circuit board 32 is higher, so that the structure of the frequency conversion cabinet 100 is compact, and the space utilization rate is improved. When the wireless communication module 42 and the control board 40 are in a split structure, if a single electronic device 30 is damaged and needs to be repaired or replaced, it is easier to implement. In this way, the production and maintenance of a single electronic device 30 are facilitated.

In some embodiments, referring to FIGS. 4-6 , the accommodating chamber 20 includes a first chamber 201 and a second chamber 202, and the frequency conversion cabinet 100 further includes: a first radiator 2011, a second radiator 2021 and an airflow driver 22, wherein, the first heat sink 2011 is arranged in the first chamber 201, and is configured to reduce the temperature in the first chamber 201 through air cooling; the second heat sink 2021 is configured to heat the second chamber 202 through heat conduction The electronic device 30 inside dissipates heat; the airflow driver 22 is located in the first chamber 201 and is configured to drive the heat dissipation airflow to flow through the electronic device 30 and the first heat sink 2011 in the first chamber 201 .

In this way, heat dissipation of the electronic device 30 in the first cavity 201 and the second cavity 202 is facilitated, and the operation stability and service life of the electronic device 30 in the first cavity 201 and the second cavity 202 can be improved.

Specifically, a first heat sink 2011 can be provided in the first cavity 201, and the first heat sink 2011 can provide cooling capacity. When the heat in the first cavity 201 is reduced by air cooling, the first heat sink 2011 The heat in the wind can be taken away, and the airflow can be dissipated in time, so that the airflow can better dissipate heat with the electronic device 30 in the first cavity 201 , and effectively improve the air cooling effect in the first cavity 201 . The heat exchange between the first heat sink 2011 and the electronic device 30 in the first cavity 201 is realized through the airflow, and the temperature in the first cavity 201 is lowered by air cooling.

In order to promote the flow of air in the first chamber 201, the cabinet 10 can also include an airflow driver 22, which can be configured to drive the airflow in the first chamber 201 to form a heat dissipation airflow, and the heat dissipation airflow can be set to flow through the first chamber 201. An electronic device 30 and a first heat sink 2011 in a cavity 201 . When the airflow passes through the first radiator 2011, the heat in the airflow can be exchanged to the first radiator 2011 to lower the temperature of the airflow, and the cooling capacity of the first radiator 2011 can be absorbed for cooling the first cavity 201 Carry out heat dissipation; when the airflow flows through the electronic device 30 in the first chamber 201, the cold energy in the airflow can be exchanged to the electronic device 30 in the first chamber 201, and the heat of the electronic device 30 in the first chamber 201 can be brought to dissipate heat from the electronic device 30 in the first cavity 201. That is to say, the heat of the electronic device 30 in the first cavity 201 is sent to the first heat sink 2011 to realize the heat dissipation of the electronic device 30 in the first cavity 201 .

In addition, the accommodating chamber 20 may further include a second chamber 202 , and the heat dissipation method of the electronic device 30 in the second chamber 202 may be different from that of the electronic device 30 in the first chamber 201 . For example, a second heat sink 2021 corresponding to the second cavity 202 may be provided, and the second heat sink 2021 may be configured to dissipate heat for the electronic device 30 in the second cavity 202 through heat conduction. In this way, the heat dissipation of the electronic device 30 in the second cavity 202 is realized. Through heat conduction, the heat dissipation efficiency and effect can be improved, and rapid heat dissipation can be realized for the electronic device 30 with a relatively high operating temperature.

According to the frequency conversion cabinet 100 of the embodiment of the present invention, a first chamber 201 and a second chamber 202 are provided. The first chamber 201 can use air cooling to exchange heat, and the first radiator 2011 is used to cool the inside of the first chamber 201. temperature of the electronic device 30 in the first cavity 201; and the second heat sink 2021 can be used to reduce the temperature of the electronic device 30 in the second cavity 202, and different methods can be used to dissipate heat, which can be targeted for different The heat dissipation of the electronic devices 30 of different types can reduce the heat conduction between different electronic devices 30 and improve the stability of the operation of each electronic device 30. 30, improve the stability of the frequency conversion cabinet 100, and reduce the failure rate.

In some embodiments of the present utility model, the first chamber 201 is a closed chamber, which constructs a closed flow channel in the cabinet body 10, which can be realized by combining the airflow driving member 22 and the first heat sink 2011 Heat dissipation for the electronic device 30 in the first cavity 201 . And the second cavity 202 can be set to the form of opening, for example, the space outside the first cavity 201 in the cabinet body 10 is set to the second cavity 202, this moment because the second cavity 202 is an open space, can facilitate the second cavity Installation and maintenance of the electronic device 30 in the second cavity 202. In addition, a door body 18 can be installed on the cabinet body 10 , and the cabinet body 10 can be opened and closed through the door body 18 . Specifically, in some embodiments, the door body 18 can be used to open and close the second chamber 202. When the door body 18 is opened, the second chamber 202 is opened, which can facilitate the access to the electronic device 30 in the second chamber 202. Installation and enclosure, and it is convenient to check the operating status of the frequency conversion cabinet 100 through the electronic device 30 in the second cavity 202, and at this time, the first cavity 201 is in a closed state, which will not affect the space in the second cavity 202, In the second chamber 202, it can be maintained in an environment with low humidity and less dust, and its heat dissipation effect and operation stability are relatively high; when the door body 18 is closed, the second chamber 202 is closed, and at this time, A relatively closed environment will be formed in the second chamber 202. At this time, under the action of natural convection or other methods, the temperature in the second chamber 202 can be relatively uniform everywhere, and the second chamber can also be realized to a certain extent. Heat dissipation of electronic device 30 in 202 .

In addition, in the second chamber 202 of the present invention, no airflow driving structure such as a fan may be provided, so that the electronic device 30 in the second chamber 202 will operate under the noise of the bottom, effectively reducing the noise of the frequency conversion cabinet 100, and It can avoid the introduction of external high-humidity air, dust-laden airflow, etc. into the second chamber 202, so as to prolong the service life of the electronic device 30 in the second chamber 202; of course, the second chamber 202 can also be provided with an airflow driving structure such as a fan In this way, sufficient heat exchange of the electronic device 30 in the second chamber 202 can be achieved, the temperature environment of the electronic device 30 in the second chamber 202 can be maintained, and the operation stability and service life of the electronic device 30 in the second chamber 202 can be improved.

The first cavity 201 in the utility model can be set as a heat dissipation channel in the form of a straight line, a curve, or a broken line, and the first heat sink 2011 is used to take away the heat through the driving action of the airflow driver 22, for example, to dissipate heat. The airflow can enter from one end of the first cavity 201 and flow out from the second end of the first cavity 201. Of course, at this time, it may have an adverse effect on the surrounding environment, and also cause the dust-laden airflow in the external environment to enter. into the first cavity 201, affecting the operating environment in the first cavity 201.

In addition, the utility model is provided with a first radiator 2011 to take away the heat in the first cavity 201, and when the heat dissipation air flow in the first cavity 201 circulates, the first radiator 2011 can be used to take away the heat in the second cavity 202. The heat of the electronic device 30 . Therefore, in order to reduce the impact on the surrounding environment during the heat dissipation process in the present utility model, the first cavity 201 can be configured as an annular cavity, and the airflow in the first cavity 201 is suitable for circulating under the driving action of the airflow driving member 22 to dissipate heat . Through the circulation of the air flow, the temperature in the first cavity 201 can be effectively reduced, heat dissipation of the electronic device 30 in the first cavity 201 can be realized, and a better temperature environment can be provided for the operation of the electronic device 30 in the first cavity 201, and at the same time The influence of the heat in the first chamber 201 on the surrounding environment can be reduced, especially the influence of the heat in the first chamber 201 on the electronic device 30 in the second chamber 202 can be reduced, and the stability of the entire frequency conversion cabinet 100 can be improved. In addition, the first heat sink 2011 also has a condensation function, and the first heat sink 2011 can be used to adjust the humidity in the first cavity 201 and optimize the humidity environment of the electronic device 30 in the first cavity 201 .

The first chamber 201 in the utility model can be set as a circular cavity, an elliptical ring, a polygonal ring or other irregularly shaped ring cavity. The first cavity 201 of a specific embodiment of the utility model will be described below with reference to the accompanying drawings.

In some embodiments, at least one of the wireless communication module 42 and the control board 40 is disposed in the first chamber 201 and stacked on the side wall of the first chamber 201; or the wireless communication module 42 and the control board 40 At least one is disposed in the second cavity 202 and stacked on the sidewall of the second cavity 202 .

In this way, heat dissipation of the wireless communication module 42 or the control board 40 by the first cavity 201 or the second cavity 202 can be realized.

Specifically, when at least one of the wireless communication module 42 and the control board 40 is disposed in the first cavity 201 and stacked on the side wall of the first cavity 201, the first radiator 2011 disposed in the first cavity 201 can be To provide cooling capacity, when the heat in the first chamber 201 is reduced by air cooling, the first radiator 2011 can take away the heat in the wind and dissipate the airflow in time, so that the airflow can better communicate with the first chamber At least one of the wireless communication module 42 and the control board 40 in the 201 dissipates heat, effectively improving the air cooling effect in the first cavity 201 . The heat exchange between the first heat sink 2011 and at least one of the wireless communication module 42 and the control board 40 in the first cavity 201 is realized through the airflow, and the temperature in the first cavity 201 is lowered by air cooling. The airflow driver 22 can be configured to drive the airflow in the first cavity 201 to form a cooling airflow, and the cooling airflow can be set to flow through the wireless communication module 42 and the control board 40 in the first cavity 201 and the first radiator 2011 . When the airflow passes through the first radiator 2011, the heat in the airflow can be exchanged to the first radiator 2011 to lower the temperature of the airflow, and the cooling capacity of the first radiator 2011 can be absorbed for cooling the first cavity 201 heat dissipation; when the air flow passes through the wireless communication module 42 and the control board 40 in the first chamber 201, the cold energy in the air flow can be exchanged to the wireless communication module 42 and the control board 40 in the first chamber 201, and the second The heat in the cavity 201 is taken away, so as to realize the heat dissipation of the wireless communication module 42 and the control board 40 . That is to say, the heat in the first chamber 201 is sent to the first heat sink 2011 to realize the heat dissipation of the wireless communication module 42 and the control board 40 .

When at least one of the wireless communication module 42 and the control board 40 is arranged in the second cavity 202 and stacked on the side wall of the second cavity 202, the heat dissipation of the wireless communication module 42 and the control board 40 in the second cavity 202 The method may be different from the heat dissipation method in the first cavity 201 . For example, a second radiator 2021 corresponding to the second cavity 202 may be provided, and the second radiator 2021 may be configured to dissipate heat in the second cavity 202 through heat conduction. In this way, the heat dissipation of the wireless communication module 42 and the control board 40 is realized. Through heat conduction, the heat dissipation efficiency and effect can be improved, and rapid heat dissipation can be realized for the wireless communication module 42 and the control board 40 with high working temperature.

In some embodiments, referring to FIG. 5 and FIG. 6 , a partition 44 is provided inside the cabinet body 10, and the partition 44 separates the first cavity 201 and the second cavity 202 in the accommodating cavity 20, and the wireless communication module 42 and At least one of the control boards 40 is stacked on the partition 44 or on the side wall of the cabinet 10 .

In this way, the partition board 44 separates the internal space of the cabinet body 10 to achieve a better heat dissipation effect.

Specifically, the partition 44 divides the inner space of the cabinet body 10 into two parts, which can facilitate the heat dissipation of the electronic devices 30 on both sides, and a certain degree of heat exchange can also be performed between the two parts, improving the efficiency and effect of heat dissipation. The partitions 44 can be arranged to extend along the circumferential direction of the cabinet body 10 , and are respectively connected to the peripheral wall and the backboard 14 of the cabinet body 10 so as to cooperate with the peripheral wall and the backboard 14 .

In some embodiments, referring to Fig. 5 and Fig. 6, the partition 44 is arranged in the cabinet body 10, and forms the first cavity 201 between the side wall and the backboard 14 of the cabinet body 10, and the partition board 44 is arranged on At one side of the cabinet body 10 close to the backboard 14 , at least one of the wireless communication module 42 and the control board 40 is stacked on one of the partition board 44 and the side wall of the cabinet body 10 .

In this way, heat dissipation of at least one of the wireless communication module 42 and the control board 40 is facilitated.

Specifically, the first cavity 201 including the first heat sink 2011 forms the first cavity 201 between the partition plate 44 and the side wall and the back plate 14 of the cabinet body 10, and at least one of the wireless communication module 42 and the control board 40 is laminated On one of the partition 44 and the side wall of the cabinet body 10 . In this way, at least one of the wireless communication module 42 and the control board 40 can be radiated by the first heat sink 2011 in the first cavity 201 , so as to facilitate the heat dissipation of the circuit board 32 .

Specifically, the circuit board 32 stacked on the side wall of the cabinet body 10 is facilitated to be affected by the first heat sink 2011 , so that the heat dissipation effect is better.

In some embodiments, referring to FIG. 5 and FIG. 6 , at least one of the wireless communication module 42 and the control board 40 is stacked on the side wall of the cabinet body 10 and disposed on the front side of the partition 44 .

In this way, heat dissipation of at least one of the wireless communication module 42 and the control board 40 is facilitated.

Specifically, at least one of the wireless communication module 42 and the control board 40 stacked on the side wall of the cabinet body 10 is facilitated to be affected by the first heat sink 2011 , so that the heat dissipation effect is better.

In some implementations, referring to FIG. 3 and FIG. 4 , the frequency conversion cabinet 100 includes a fan power board 46 , and the fan power board 46 is electrically connected to the airflow driver 22 .

In this way, the fan power board 46 can supply power to the airflow driver 22 so that the airflow driver 22 can drive the airflow in the first chamber 201 or the second chamber 202 to become a heat dissipation airflow, so as to realize the heat dissipation function.

Specifically, the fan power board 46 electrically connected to the airflow driver 22 can supply power to the airflow driver 22, and the airflow driver 22 can drive the airflow in the first chamber 201 or the second chamber 202 to become a heat dissipation airflow, so as to realize the heat dissipation function.

In some embodiments, referring to FIG. 3 and FIG. 4 , the airflow driver 22 includes a plurality of fans, and the fan power board 46 includes a plurality, and the plurality of fan power boards 46 correspond to and are electrically connected to the plurality of fans, and the plurality of At least one of the fans is stacked on the inner surface of the cabinet body 10 .

In this way, the plurality of fan power boards 46 can supply power to the plurality of fans so that the plurality of fans can drive the airflow in the first chamber 201 or the second chamber 202 to become a heat dissipation airflow, which is convenient for realizing the heat dissipation function.

Specifically, referring to FIG. 3 and FIG. 4, the two airflow drivers 22 can be two fans, the first fan and the second fan. In combination with the above, the first cavity 201 is a closed annular cavity, and along the peripheral wall of the cabinet body 10 set, and the first cavity 201 is set around the second cavity 202, multiple fan power boards 46 can supply power to multiple fans so that multiple fans drive the airflow in the first cavity 201 or the second cavity 202 to become a cooling airflow, realizing the Heat dissipation of the electronic device 30 .

In some embodiments, referring to FIG. 3 , it further includes: a door body 18 connected to the cabinet body 10 and configured to open and close the accommodating chamber 20 , wherein the door body 18 is provided with an electronic device 30 .

In this way, referring to the above, the setting of the door body 18 is convenient for opening and closing the accommodating cavity 20 .

Specifically, in addition, a door body 18 can be installed on the cabinet body 10 , and the cabinet body 10 can be opened and closed through the door body 18 . Specifically, in some embodiments, the door body 18 can be used to open and close the second chamber 202. When the door body 18 is opened, the second chamber 202 is opened, which can facilitate the access to the electronic device 30 in the second chamber 202. Installation and enclosure, and it is convenient to check the operating status of the frequency conversion cabinet 100 through the electronic device 30 in the second cavity 202, and at this time, the first cavity 201 is in a closed state, which will not affect the space in the second cavity 202, In the second chamber 202, it can be maintained in an environment with low humidity and less dust, and its heat dissipation effect and operation stability are relatively high; when the door body 18 is closed, the second chamber 202 is closed, and at this time, A relatively closed environment will be formed in the second chamber 202. At this time, under the action of natural convection or other methods, the temperature in the second chamber 202 can be relatively uniform everywhere, and the second chamber can also be realized to a certain extent. Heat dissipation of electronic device 30 in 202 . In some embodiments, the door body 18 is provided with at least one of a communication module, a display module, a low voltage control module and an emergency stop button.

In this way, the setting of at least one of the communication module, the display module, the low-voltage control module and the emergency stop button can realize the function of the corresponding module.

Specifically, the door body 18 is provided with at least one of a communication module, a display module, a low-voltage control module, and an emergency stop button. On the one hand, the structure of the frequency conversion cabinet 100 is made compact; Realize the corresponding function.

The HVAC equipment provided by the embodiment of the utility model includes: the frequency conversion cabinet 100 and the air conditioning unit in any of the above embodiments, and the air conditioning unit is connected to the frequency conversion cabinet 100 .

The aforementioned HVAC equipment, at least one of the wireless communication module 42 and the control board 40 are stacked on the inner surface of the accommodating cavity 20, which can improve the space utilization rate of the product and facilitate heat dissipation.

Specifically, for the HVAC equipment including the frequency conversion cabinet 100 in any of the above-mentioned embodiments, the circuit board 32 in the frequency conversion cabinet 100 is stacked on the inner surface of the accommodating cavity 20, which has a compact structure, facilitates heat dissipation, and improves the power density of electrical components.

In some embodiments, the unit control board 40 of the air-conditioning unit is integrated on the frequency conversion cabinet 100, and the unit control board 40 and the air-conditioning unit transmit signals.

In this way, the unit control board 40 is integrated into the HVAC equipment of the frequency conversion cabinet 100, which has a compact structure and improves power density.

Specifically, the unit control board 40 of the air-conditioning unit is integrated on the frequency conversion cabinet 100, and the unit control board 40 and the air-conditioning unit transmit signals. The unit control board 40 is integrated in the HVAC equipment of the frequency conversion cabinet 100, and has a compact structure and improves power density.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structures, materials or features are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limitations of the present invention, and those skilled in the art are within the scope of the present invention. Variations, modifications, substitutions and variations can be made to the above-described embodiments.

Claims (13)

1. A variable frequency cabinet, characterized by comprising:

the cabinet body is provided with an accommodating cavity;

the control board is arranged in the accommodating cavity;

the wireless communication module is arranged in the cabinet body and is in signal transmission with the control panel;

wherein, at least one of wireless communication module and the control panel range upon range of in the medial surface of holding chamber.

2. The variable frequency cabinet of claim 1, wherein the wireless communication module and the control board are stacked on the same side wall of the receiving cavity.

3. The variable frequency cabinet according to claim 1 or 2, wherein the wireless communication module and the control board are integrated into the same circuit board, and the circuit board is laminated on the inner side surface of the accommodating cavity;

or, the wireless communication module and the control panel are of a split type structure.

4. The variable frequency cabinet of claim 1, wherein the receiving cavity comprises a first cavity and a second cavity, the variable frequency cabinet further comprising:

the first radiator is arranged in the first cavity and is configured to reduce the temperature in the first cavity in an air cooling mode;

a second heat sink configured to dissipate heat by thermal conduction from the electronic device within the second cavity;

and the airflow driving piece is arranged in the first cavity and is configured to drive the heat dissipation airflow to flow through the electronic device in the first cavity and the first radiator.

5. The variable frequency cabinet of claim 4, wherein at least one of the wireless communication module and the control board is disposed within the first cavity and laminated to a side wall of the first cavity; or at least one of the wireless communication module and the control board is arranged in the second cavity and is laminated on the side wall of the second cavity.

6. The variable frequency cabinet of claim 4, wherein a partition is disposed in the cabinet body, the partition separates the first and second chambers within the receiving chamber, and at least one of the wireless communication module and the control board is laminated on the partition or on a side wall of the cabinet body.

7. The variable frequency cabinet of claim 6, wherein the partition is disposed within the cabinet and forms the first cavity with the side wall of the cabinet and the back plate, and the partition is disposed within the cabinet on a side proximate to the back plate, and at least one of the wireless communication module and the control board is laminated to one of the partition and the side wall of the cabinet.

8. The variable frequency cabinet of claim 7, wherein at least one of the wireless communication module and the control board is laminated on a side wall of the cabinet body and is provided on a front side of the partition plate.

9. The variable frequency cabinet of any one of claims 4-8, wherein the variable frequency cabinet comprises a fan power panel electrically connected to the airflow driver.

10. The variable frequency cabinet of claim 9, wherein the airflow driving member comprises a plurality of fans, the fan power panel comprises a plurality of fans, the plurality of fan power panels are respectively corresponding to and electrically connected with the plurality of fans, and at least one of the fans is laminated on the inner side surface of the cabinet body.

11. The variable frequency cabinet of claim 1, further comprising:

the door body is connected with the cabinet body and is configured to open and close the accommodating cavity,

wherein, be equipped with electronic device on the door body.

12. A heating ventilation apparatus, comprising:

the variable frequency cabinet of any one of claims 1-11;

and the air conditioning unit is connected with the variable frequency cabinet.

13. The heating ventilation apparatus of claim 12, wherein a unit control board of the air conditioning unit is integrated on the variable frequency cabinet, and the unit control board is in signal communication with the air conditioning unit.

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