CN219068072U - Variable frequency cabinet and heating and ventilation equipment - Google Patents

Variable frequency cabinet and heating and ventilation equipment Download PDF

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Publication number
CN219068072U
CN219068072U CN202320163533.6U CN202320163533U CN219068072U CN 219068072 U CN219068072 U CN 219068072U CN 202320163533 U CN202320163533 U CN 202320163533U CN 219068072 U CN219068072 U CN 219068072U
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board
frequency conversion
mounting plate
conversion cabinet
stacked
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李逸信
贺伟衡
李思源
王坤杰
林琳
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Midea Group Co Ltd
GD Midea Heating and Ventilating Equipment Co Ltd
Chongqing Midea General Refrigeration Equipment Co Ltd
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Midea Group Co Ltd
GD Midea Heating and Ventilating Equipment Co Ltd
Chongqing Midea General Refrigeration Equipment Co Ltd
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Abstract

本实用新型公开了一种变频柜和暖通设备,其中变频柜包括:柜体,所述柜体设有容置腔,所述容置腔的前侧具有开口,且后侧具有背板,所述容置腔配置为容置电子器件;第一安装板,所述第一安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第一安装板与所述背板之间具有间隙;其中,所述第一安装板上层叠安装有多个电路板。上述变频柜,多个电路板层叠安装于第一安装板上,电路板集成度高,减少了单板数量,提高功率密度。

Figure 202320163533

The utility model discloses a frequency conversion cabinet and heating and ventilation equipment, wherein the frequency conversion cabinet comprises: a cabinet body, the cabinet body is provided with an accommodating cavity, the front side of the accommodating cavity has an opening, and the rear side has a backboard, The accommodating cavity is configured to accommodate electronic devices; a first mounting plate, the first mounting plate is arranged in the cabinet, and stacked on the front side of the back plate, and the first mounting plate and the There is a gap between the backboards; wherein, a plurality of circuit boards are stacked and mounted on the first mounting board. In the above-mentioned frequency conversion cabinet, a plurality of circuit boards are stacked and installed on the first mounting board, the circuit boards are highly integrated, the number of single boards is reduced, and the power density is improved.

Figure 202320163533

Description

变频柜和暖通设备Frequency conversion cabinet and HVAC equipment

技术领域technical field

本实用新型涉及变频装置技术领域,特别涉及一种变频柜和暖通设备。The utility model relates to the technical field of frequency conversion devices, in particular to a frequency conversion cabinet and heating and ventilation equipment.

背景技术Background technique

变频柜控制柜,简称变频柜,其可广泛应用于冶金、化工、石油、供水、矿山、建材、电机行业等泵类、风机、压缩机、轧机、注塑机、皮带运输机等各种中压电机设备。The frequency conversion cabinet control cabinet, referred to as the frequency conversion cabinet, can be widely used in metallurgy, chemical industry, petroleum, water supply, mining, building materials, motor industries and other pumps, fans, compressors, rolling mills, injection molding machines, belt conveyors and other medium voltage electrical appliances. machine equipment.

相关技术中,变频柜包含有变频柜功率元件、变频柜控制元件以及变频柜控制元件等多个电子器件,电子器件分布混乱,多个电路板单独分布,具有多个数量的单板。In the related art, the frequency conversion cabinet includes a plurality of electronic devices such as frequency conversion cabinet power components, frequency conversion cabinet control components, and frequency conversion cabinet control components.

实用新型内容Utility model content

本实用新型实施方式提供了一种变频柜和暖通设备。The embodiment of the utility model provides a frequency conversion cabinet and heating and ventilation equipment.

本实用新型实施方式的变频柜包括:The frequency conversion cabinet of the embodiment of the utility model includes:

柜体,所述柜体设有容置腔,所述容置腔的前侧具有开口,且后侧具有背板,所述容置腔配置为容置电子器件;A cabinet body, the cabinet body is provided with an accommodating cavity, the front side of the accommodating cavity has an opening, and the rear side has a backboard, and the accommodating cavity is configured to accommodate electronic devices;

第一安装板,所述第一安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第一安装板与所述背板之间具有间隙;a first mounting plate, the first mounting plate is arranged in the cabinet and stacked on the front side of the back plate, and there is a gap between the first mounting plate and the back plate;

其中,所述第一安装板上层叠安装有多个电路板。Wherein, a plurality of circuit boards are stacked and mounted on the first mounting board.

上述变频柜,多个电路板层叠安装于第一安装板上,电路板集成度高,减少了单板数量,提高功率密度。In the above-mentioned frequency conversion cabinet, a plurality of circuit boards are stacked and installed on the first mounting board, the circuit boards are highly integrated, the number of single boards is reduced, and the power density is improved.

在某些实施方式中,所述多个电路板并排设置,并层叠于所述第一安装板的同一侧。In some embodiments, the plurality of circuit boards are arranged side by side and stacked on the same side of the first mounting board.

在某些实施方式中,所述多个电路板层叠于所述第一安装板的背离所述背板的一侧;In some implementations, the plurality of circuit boards are stacked on a side of the first mounting board away from the backplane;

或,所述多个电路板层叠于所述第一安装板的朝向所述背板的一侧。Or, the plurality of circuit boards are stacked on a side of the first mounting board facing the backplane.

在某些实施方式中,所述多个电路板分别层叠于所述第一安装板上沿前后方向的相对两侧,所述多个电路板中的至少一个层叠于所述第一安装板上面向所述背板的一侧,且至少一个层叠于所述第一安装板上背离所述背板的一侧。In some embodiments, the plurality of circuit boards are respectively stacked on opposite sides of the first mounting board along the front and rear directions, at least one of the plurality of circuit boards is stacked on the first mounting board One side facing the backboard, and at least one stacked on the side of the first mounting board away from the backboard.

在某些实施方式中,所述多个电路板在所述第一安装板的一侧表面上的覆盖率不低于90%;In some embodiments, the coverage of the plurality of circuit boards on one side surface of the first mounting board is not less than 90%;

或,所述多个电路板的总面积,不小于所述第一安装板一侧表面的90%。Or, the total area of the plurality of circuit boards is not less than 90% of one side surface of the first mounting board.

在某些实施方式中,所述变频柜还包括:In some embodiments, the frequency conversion cabinet also includes:

第二安装板,所述第二安装板设于所述柜体内,并层叠于所述第一安装板的前侧,且所述第二安装板与所述第一安装板之间具有间隙。A second mounting plate, the second mounting plate is arranged in the cabinet and stacked on the front side of the first mounting plate, and there is a gap between the second mounting plate and the first mounting plate.

在某些实施方式中,所述变频柜包括空调机组阀控制板和主控板,所述空调机组阀控制板用于连接空调机组的控制阀,所述主控板与所述空调机组阀控制板相连,并设于所述第一安装板上,所述主控板与所述空调机组阀控制板沿前后方向相对。In some embodiments, the frequency conversion cabinet includes an air conditioning unit valve control board and a main control board, the air conditioning unit valve control board is used to connect the control valve of the air conditioning unit, and the main control board and the air conditioning unit valve control The board is connected and arranged on the first installation board, and the main control board is opposite to the valve control board of the air conditioner unit along the front and rear direction.

在某些实施方式中,所述第二安装板在打开位置和关闭位置之间可翻转地设于所述柜体内,所述第二安装板打开时露出所述第一安装板,且关闭时遮盖所述第一安装板。In some embodiments, the second mounting plate is reversibly disposed in the cabinet between an open position and a closed position, the second mounting plate exposes the first mounting plate when opened, and the second mounting plate is exposed when closed Cover the first mounting plate.

在某些实施方式中,所述变频柜还包括:In some embodiments, the frequency conversion cabinet also includes:

第三安装板,所述第三安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第三安装板与所述背板之间具有间隙,所述第三安装板与所述第二安装板并排设置,所述第三安装板上设有第一弱电器件。The third installation board, the third installation board is arranged in the cabinet, and stacked on the front side of the back board, and there is a gap between the third installation board and the back board, the third installation board The installation board is arranged side by side with the second installation board, and the first weak current device is arranged on the third installation board.

在某些实施方式中,所述第三安装板上设有接线插排、走线槽、智能电表中的至少一种。In some embodiments, the third installation board is provided with at least one of a wiring socket, a wiring trough, and a smart meter.

在某些实施方式中,所述变频柜还包括:In some embodiments, the frequency conversion cabinet also includes:

第四安装板,所述第四安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第四安装板与所述背板之间具有间隙,所述第四安装板与所述第一安装板并排设置,所述第四安装板上设有第一弱电器件。A fourth installation plate, the fourth installation plate is arranged in the cabinet and stacked on the front side of the back plate, and there is a gap between the fourth installation plate and the back plate, the fourth The installation board is arranged side by side with the first installation board, and the first weak current device is arranged on the fourth installation board.

在某些实施方式中,所述第四安装板的一部分层叠于所述第三安装板的后侧,且另一部分层叠于第二安装板的后侧。In some embodiments, a part of the fourth mounting board is stacked on the rear side of the third mounting board, and another part is stacked on the rear side of the second mounting board.

在某些实施方式中,所述第三安装板可翻转地与所述第四安装板铰接,以遮盖和显露所述第三安装板后侧的结构。In some embodiments, the third mounting plate is reversibly hinged to the fourth mounting plate, so as to cover and reveal the rear structure of the third mounting plate.

在某些实施方式中,所述容置腔包括第一腔和第二腔,且所述第一腔配置成风道结构,以对所述第一腔内的电子器件散热,所述第二腔与所述第一腔隔开。In some embodiments, the accommodating cavity includes a first cavity and a second cavity, and the first cavity is configured as an air duct structure to dissipate heat from the electronic devices in the first cavity, and the second cavity separated from the first cavity.

在某些实施方式中,还包括:In some embodiments, also include:

气流驱动件,所述气流驱动件设于所述第一腔,并配置成驱动散热气流在第一腔内流通,所述多个电路板中的至少一个与所述气流驱动件电连接。An airflow driving part, the airflow driving part is arranged in the first chamber and configured to drive the cooling airflow to circulate in the first chamber, at least one of the plurality of circuit boards is electrically connected to the airflow driving part.

在某些实施方式中,还包括:In some embodiments, also include:

第一散热器,所述第一散热器设于所述第一腔内,配置为通过风冷的方式降低所述第一腔内的温度,且所述气流驱动件配置成驱动散热气流流经所述第一腔内的电子器件和所述第一散热器。The first radiator, the first radiator is arranged in the first cavity, configured to reduce the temperature in the first cavity by air cooling, and the airflow driver is configured to drive the cooling airflow to flow through The electronic device in the first cavity and the first heat sink.

在某些实施方式中,还包括:In some embodiments, also include:

第二散热器,配置为通过热传导的方式为所述第二腔内的电子器件散热。The second heat sink is configured to dissipate heat for the electronic devices in the second cavity through heat conduction.

在某些实施方式中,还包括:In some embodiments, also include:

门体,所述门体与所述柜体相连,并配置成打开和关闭所述容置腔,a door body, the door body is connected to the cabinet body and is configured to open and close the accommodating cavity,

其中,所述门体上设有电子器件。Wherein, electronic devices are arranged on the door body.

在某些实施方式中,所述门体上设有通讯模块、显示模块、低压控制模块和急停按钮中的至少一种。In some embodiments, at least one of a communication module, a display module, a low-voltage control module and an emergency stop button is provided on the door body.

本实用新型实施方式通过的暖通设备包括:The HVAC equipment adopted in the embodiment of the utility model includes:

上述任一实施方式中的变频柜;The frequency conversion cabinet in any of the above-mentioned embodiments;

空调机组,所述空调机组与所述变频柜相连。An air-conditioning unit, the air-conditioning unit is connected with the frequency conversion cabinet.

在某些实施方式中,所述空调机组的机组控制板集成于所述变频柜上,且所述机组控制板与所述空调机组信号传输。In some embodiments, the unit control board of the air-conditioning unit is integrated on the frequency conversion cabinet, and the unit control board and the air-conditioning unit transmit signals.

上述暖通设备,多个电路板层叠安装于第一安装板上,电路板集成度高,减少了单板数量,提高功率密度。In the above heating and ventilation equipment, a plurality of circuit boards are stacked and installed on the first mounting board, the circuit boards are highly integrated, the number of single boards is reduced, and the power density is improved.

本实用新型的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本实用新型的实践了解到。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

附图说明Description of drawings

图1是本实用新型一个实施例的变频柜的示意图,其中门体关闭。Fig. 1 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention, wherein the door body is closed.

图2是本实用新型一个实施例的变频柜的示意图,其中门体打开。Fig. 2 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention, wherein the door is opened.

图3是本实用新型一个实施例的变频柜的示意图。Fig. 3 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

图4是本实用新型一个实施例的变频柜的示意图。Fig. 4 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

图5是本实用新型一个实施例的变频柜的示意图。Fig. 5 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

图6是本实用新型一个实施例的变频柜的示意图。Fig. 6 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

图7是本实用新型一个实施例的变频柜的示意图。Fig. 7 is a schematic diagram of a frequency conversion cabinet according to an embodiment of the present invention.

附图标记:变频柜100、柜体10、开口12、背板14、侧板16、门体18、第一安装板101、第二安装板102、第三安装板103、第四安装板104、容置腔20、第一腔201、第一散热器2011、第二腔202、第二散热器2021、气流驱动件22、电子器件30、电路板32、空调机组阀控制板40、主控板42、控制阀44。Reference signs: frequency conversion cabinet 100, cabinet body 10, opening 12, back panel 14, side panel 16, door body 18, first installation board 101, second installation board 102, third installation board 103, fourth installation board 104 , accommodating chamber 20, first chamber 201, first radiator 2011, second chamber 202, second radiator 2021, airflow driver 22, electronic device 30, circuit board 32, air conditioning unit valve control board 40, main control Plate 42, control valve 44.

具体实施方式Detailed ways

下面详细描述本实用新型的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本实用新型,而不能理解为对本实用新型的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model, but should not be construed as limiting the present utility model.

在本实用新型的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。在本实用新型的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", Orientation indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operation, and therefore cannot be construed as a limitation of the utility model. In the description of the present utility model, "plurality" means two or more, unless otherwise specifically defined.

在本实用新型的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接。可以是机械连接,也可以是电连接。可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本实用新型中的具体含义。In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a flexible connection. Disassemble the connection, or connect in one piece. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

在本实用新型中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, and may also include the first and second features being in direct contact with each other. The features are not in direct contact but through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

本文的公开提供了许多不同的实施方式或例子用来实现本实用新型的不同结构。为了简化本实用新型的公开,本文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本实用新型。此外,本实用新型可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本实用新型提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The disclosure herein provides many different implementations or examples for realizing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described herein. Of course, they are only examples, and the purpose is not to limit the utility model. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

请参阅图1-图7,本实用新型实施方式的变频柜100包括:柜体10和第一安装板101。其中,柜体10设有容置腔20,容置腔20的前侧具有开口12,且后侧具有背板14,容置腔20配置为容置电子器件30。第一安装板101设于柜体10内,并层叠于背板14的前侧,且第一安装板101与背板14之间具有间隙,其中,第一安装板101上层叠安装有多个电路板32。Referring to FIGS. 1-7 , the frequency conversion cabinet 100 according to the embodiment of the present utility model includes: a cabinet body 10 and a first mounting plate 101 . Wherein, the cabinet body 10 is provided with an accommodating chamber 20 , the accommodating chamber 20 has an opening 12 on the front side, and a backboard 14 on the rear side, and the accommodating chamber 20 is configured to accommodate the electronic device 30 . The first installation board 101 is arranged in the cabinet body 10, and is laminated on the front side of the backboard 14, and there is a gap between the first installation board 101 and the backboard 14, wherein, the first installation board 101 is stacked and installed with multiple circuit board 32 .

上述变频柜100,多个电路板32层叠安装于第一安装板101上,电路板32集成度高,减少了单板数量,提高功率密度。In the frequency conversion cabinet 100 mentioned above, a plurality of circuit boards 32 are stacked and mounted on the first installation board 101 , the circuit boards 32 are highly integrated, the number of single boards is reduced, and the power density is improved.

具体地,参阅图2-图4,柜体10中容置腔20的前侧具有开口12,后侧具有背板14,图中所示柜体10开口12朝向方向在柜体10的前后方向上,图中所示柜体10开口12一侧沿短边方向为柜体10的左右方向,图中所示柜体10开口12一侧沿长边方向为柜体10的上下方向。柜体10内设置的容置腔20用于容置电子器件30,为了便于电子器件30的安装与维修,在容置腔20的前侧设置开口12。柜体10后侧设置背板14,侧边设置侧板16。设于柜体10内的第一安装板101上层叠安装有多个电路板32,如此,集成度高,减少单板数量,提高了功率密度。Specifically, referring to FIGS. 2-4 , the front side of the accommodating cavity 20 in the cabinet 10 has an opening 12 , and the rear side has a backboard 14 . Above, the side of the opening 12 of the cabinet body 10 shown in the figure is the left and right direction of the cabinet body 10 along the short side direction, and the side of the opening 12 of the cabinet body 10 shown in the figure is the up and down direction of the cabinet body 10 along the long side direction. The accommodating cavity 20 provided in the cabinet body 10 is used for accommodating the electronic device 30 . In order to facilitate the installation and maintenance of the electronic device 30 , an opening 12 is provided on the front side of the accommodating cavity 20 . A backboard 14 is arranged on the rear side of the cabinet body 10 , and a sideboard 16 is arranged on the side. A plurality of circuit boards 32 are stacked and mounted on the first mounting board 101 provided in the cabinet body 10 , so that the degree of integration is high, the number of single boards is reduced, and the power density is improved.

容置腔20中的电子器件30可以包括容置腔20内容置的电子器件30可以包括电控板、2G模块、显示屏、急停按钮、控制板、导叶风扇板、控制板、接线端子、智能电报、互感器、断路器、24V电源板、驱动板、控制板、380V电源板、APF、滤波板、吸收电阻、电容、IGBT、变压器、缓冲电阻、风扇、蒸发器、电抗器、互感器、二极管。其中,强电器件可以包括吸收电阻、电容、IGBT、变压器、缓冲电阻、风扇、蒸发器、电抗器、互感器、二极管。弱电器件可以包括电控板、2G模块、显示屏、急停按钮、控制板、导叶风扇板、控制板、接线端子、智能电报、互感器、断路器、24V电源板、驱动板、控制板、380V电源板、APF、滤波板。The electronic device 30 in the accommodating chamber 20 may include the electronic device 30 housed in the accommodating chamber 20 may include an electric control board, a 2G module, a display screen, an emergency stop button, a control board, a guide vane fan board, a control board, and a terminal block. , smart telegraph, transformer, circuit breaker, 24V power board, drive board, control board, 380V power board, APF, filter board, absorption resistor, capacitor, IGBT, transformer, snubber resistor, fan, evaporator, reactor, mutual inductance devices, diodes. Among them, the high-voltage components may include absorption resistors, capacitors, IGBTs, transformers, snubber resistors, fans, evaporators, reactors, transformers, and diodes. Weak current devices can include electric control boards, 2G modules, display screens, emergency stop buttons, control boards, guide vane fan boards, control boards, terminal blocks, smart telegrams, transformers, circuit breakers, 24V power boards, drive boards, and control boards , 380V power board, APF, filter board.

在一些实施方式中,电子器件30沿前后方向分层设置,层次分明,可以通过将电子器件30安装在柜体10内沿前后方向分层布置的多个安装板上来实现。参阅图3,本实施方式中,柜体10中存在多个安装板,第一安装板101、第二安装板102、第三安装板103和第四安装板104,四个安装板分别层叠于背板14的前侧,且第一安装板101、第二安装板102、第三安装板103和第四安装板104与背板14之间具有间隙。在第一安装板101、第二安装板102、第三安装板103和第四安装板104上安装电子器件30,使得电子器件30沿前后方向分层设置,层次分明。In some implementations, the electronic devices 30 are arranged in layers along the front-to-back direction, and the layers are distinct, which can be realized by installing the electronic devices 30 on multiple mounting boards arranged in layers along the front-to-back direction in the cabinet body 10 . Referring to Fig. 3, in this embodiment, there are a plurality of mounting plates in the cabinet 10, the first mounting plate 101, the second mounting plate 102, the third mounting plate 103 and the fourth mounting plate 104, and the four mounting plates are stacked on the There are gaps between the front side of the backboard 14 and the first installation board 101 , the second installation board 102 , the third installation board 103 and the fourth installation board 104 and the back board 14 . The electronic devices 30 are mounted on the first mounting board 101 , the second mounting board 102 , the third mounting board 103 and the fourth mounting board 104 , so that the electronic devices 30 are arranged in layers along the front and back direction, and the layers are distinct.

在某些实施方式中,参阅图5-图7,多个电路板32并排设置,并层叠于第一安装板101的同一侧。In some embodiments, referring to FIGS. 5-7 , multiple circuit boards 32 are arranged side by side and stacked on the same side of the first mounting board 101 .

如此,变频器结构紧凑,集成度高,提高了功率密度。In this way, the frequency converter has a compact structure and a high degree of integration, which improves the power density.

具体地,多个电路板32并排设置并层叠于第一安装板101的同一侧,使得变频柜100的结构变得紧凑,集成度高,提高了功率密度。在一些实施方式中,电路板32包括电源板、驱动板和控制板。电源板、驱动板和控制板层叠于第一安装板101的右侧。Specifically, multiple circuit boards 32 are arranged side by side and stacked on the same side of the first mounting board 101 , so that the structure of the frequency conversion cabinet 100 becomes compact, the integration degree is high, and the power density is improved. In some embodiments, the circuit board 32 includes a power board, a driver board, and a control board. The power supply board, the driving board and the control board are stacked on the right side of the first mounting board 101 .

在某些实施方式中,参阅图5-图7,多个电路板32层叠于第一安装板101的背离背板14的一侧;或,多个电路板32层叠于第一安装板101的朝向背板14的一侧。In some embodiments, referring to FIGS. 5-7 , a plurality of circuit boards 32 are stacked on the side of the first mounting board 101 away from the backplane 14; or, a plurality of circuit boards 32 are stacked on the side of the first mounting board 101 The side facing the back plate 14 .

如此,变频器结构紧凑,集成度高,提高了功率密度。In this way, the frequency converter has a compact structure and a high degree of integration, which improves the power density.

具体地,在多个电路板32层叠于第一安装板101的背离背板14的一侧时,多个电路板32同侧安装,结构紧凑,集成度高,可以提高功率密度。电路板32层叠于第一安装板101背离背板14的一侧,即电路板32朝向容置腔20开口12一侧,便于安装或维修。在多个电路板32层叠于第一安装板101的朝向背板14的一侧时,多个电路板32同侧安装,结构紧凑,集成度高,可以提高功率密度。电路板32层叠于第一安装板101朝向背板14的一侧,即电路板32朝向背板14一侧,便于保护电路板32。Specifically, when a plurality of circuit boards 32 are stacked on the side of the first mounting board 101 away from the backplane 14 , the plurality of circuit boards 32 are installed on the same side, which has a compact structure and a high degree of integration, which can increase power density. The circuit board 32 is stacked on the side of the first mounting board 101 away from the back plate 14 , that is, the side of the circuit board 32 facing the opening 12 of the accommodating cavity 20 is convenient for installation or maintenance. When multiple circuit boards 32 are stacked on the side of the first mounting board 101 facing the backplane 14 , the multiple circuit boards 32 are mounted on the same side, with compact structure and high integration, which can increase power density. The circuit board 32 is stacked on the side of the first mounting board 101 facing the backplane 14 , that is, the side of the circuit board 32 facing the backplane 14 is convenient for protecting the circuit board 32 .

在某些实施方式中,参阅图5-图7,多个电路板32分别层叠于第一安装板101上沿前后方向的相对两侧,多个电路板32中的至少一个层叠于第一安装板101上面向背板14的一侧,且至少一个层叠于第一安装板101上背离背板14的一侧。In some embodiments, referring to FIGS. 5-7 , a plurality of circuit boards 32 are respectively stacked on opposite sides of the first mounting board 101 along the front and rear directions, and at least one of the plurality of circuit boards 32 is stacked on the first mounting board 101 . The upper side of the board 101 faces the backboard 14 , and at least one is stacked on the side of the first mounting board 101 facing away from the backboard 14 .

如此,多个电路板32层叠安装于第一安装板101不同侧,电路板32集成度高,减少了单板数量,提高功率密度。In this way, multiple circuit boards 32 are stacked and mounted on different sides of the first mounting board 101 , the circuit boards 32 are highly integrated, the number of single boards is reduced, and the power density is improved.

具体地,第一安装板101沿前后方向的相对两侧具有多个电路板32。对于层叠于第一安装板101上面向背板14的一侧的电路板32,便于保护该电路板32;对于层叠于第一安装板101上背离背板14的一侧的电路板32,该电路板32朝向开口12,便于维修与安装。Specifically, the first mounting board 101 has a plurality of circuit boards 32 on opposite sides in the front-rear direction. For the circuit board 32 stacked on the first installation board 101 facing the side of the backboard 14, it is convenient to protect the circuit board 32; Plate 32 faces opening 12 for ease of maintenance and installation.

在某些实施方式中,参阅图5-图7,多个电路板32在第一安装板101的一侧表面上的覆盖率不低于90%;或,多个电路板32的总面积,不小于第一安装板101一侧表面的90%。In some embodiments, referring to FIGS. 5-7 , the coverage of the plurality of circuit boards 32 on one side surface of the first mounting board 101 is not less than 90%; or, the total area of the plurality of circuit boards 32, Not less than 90% of the surface of one side of the first installation board 101 .

如此,第一安装板101上的电路板32的覆盖率高,使得变频器结构紧凑,可以提高变频柜100的空间利用率。In this way, the coverage of the circuit board 32 on the first mounting board 101 is high, so that the structure of the frequency converter is compact, and the space utilization rate of the frequency conversion cabinet 100 can be improved.

具体地,在多个电路板32在第一安装板101的一侧表面上的覆盖率不低于90%时,在一些实施方式中,多个电路板32在第一安装板101上并排设置,如此,便于设置电路板32,且结构紧凑,可以提高空间利用率。在多个电路板32的总面积不小于第一安装板101一侧的表面的90%时,在一些实施方式中,多个电路板32在第一安装板101上相互连接,如此,结构紧凑,可以提高空间利用率。Specifically, when the coverage rate of the plurality of circuit boards 32 on one side surface of the first mounting board 101 is not lower than 90%, in some embodiments, the plurality of circuit boards 32 are arranged side by side on the first mounting board 101 In this way, it is convenient to arrange the circuit board 32, and the structure is compact, which can improve the utilization rate of space. When the total area of the plurality of circuit boards 32 is not less than 90% of the surface on one side of the first mounting board 101, in some embodiments, the plurality of circuit boards 32 are connected to each other on the first mounting board 101, so that the structure is compact , can improve space utilization.

在某些实施方式中,参阅图3,变频柜100还包括:第二安装板102,第二安装板102设于柜体10内,并层叠于第一安装板101的前侧,且第二安装板102与第一安装板101之间具有间隙。In some embodiments, referring to FIG. 3 , the frequency conversion cabinet 100 further includes: a second installation board 102, the second installation board 102 is arranged in the cabinet body 10, and stacked on the front side of the first installation board 101, and the second installation board 102 There is a gap between the installation board 102 and the first installation board 101 .

如此,柜体10中第二安装板102的设置便于安装第二安装板102上的第一弱电器件,第二安装板102与第一安装板101之间存在间隙,可以减少电器元件之间的干扰,便于散热。In this way, the setting of the second mounting plate 102 in the cabinet body 10 facilitates the installation of the first weak electric device on the second mounting plate 102, and there is a gap between the second mounting plate 102 and the first mounting plate 101, which can reduce the electrical components. Interference, easy to dissipate heat.

具体地,设于柜体10内的第二安装板102上设置有第一弱电器件,参阅上述,第二安装板102上的第一弱电器件可以包括互感器、断路器、24V电源板、驱动板、控制板、APF、滤波板。在一些实施方式中,互感器、断路器和24V电源板设置在第二安装板102的上侧;驱动板、控制板、APF和滤波板设置在第二安装板102的下侧。Specifically, the first weak current device is provided on the second installation board 102 in the cabinet 10. Referring to the above, the first weak current device on the second installation board 102 may include a transformer, a circuit breaker, a 24V power supply board, a drive board, control board, APF, filter board. In some embodiments, the transformer, circuit breaker and 24V power board are arranged on the upper side of the second installation board 102 ; the driver board, control board, APF and filter board are arranged on the lower side of the second installation board 102 .

在某些实施方式中,参阅图2和图7,变频柜100包括空调机组阀控制板40和主控板42,空调机组阀控制板40用于连接空调机组的控制阀44,主控板42与空调机组阀控制板40相连,并设于第一安装板101上,主控板42与空调机组阀控制板40沿前后方向相对。In some embodiments, referring to FIG. 2 and FIG. 7 , the frequency conversion cabinet 100 includes an air conditioning unit valve control board 40 and a main control board 42 , the air conditioning unit valve control board 40 is used to connect the air conditioning unit control valve 44 , and the main control board 42 It is connected with the valve control board 40 of the air conditioning unit and is arranged on the first installation board 101 . The main control board 42 is opposite to the valve control board 40 of the air conditioning unit along the front and rear direction.

空调机组阀控制板40和主控板42设于第一安装板101上,如此,与第一强电器件分层设置,可以减少电器元件之间的干扰,便于散热。The valve control board 40 and the main control board 42 of the air conditioning unit are arranged on the first mounting board 101 , so that they are layered with the first high-voltage device, which can reduce the interference between electrical components and facilitate heat dissipation.

具体地,空调机组阀控制板40和主控板42分别设置在第一安装板101的两侧。在一些实施方式中,空调机组阀控制板40设置在第一安装板101的左侧,主控板42设置在第一安装板101的右侧。Specifically, the valve control board 40 and the main control board 42 of the air conditioning unit are respectively arranged on two sides of the first installation board 101 . In some embodiments, the valve control board 40 of the air conditioner unit is arranged on the left side of the first installation board 101 , and the main control board 42 is arranged on the right side of the first installation board 101 .

在某些实施方式中,参阅图3,第二安装板102在打开位置和关闭位置之间可翻转地设于柜体10内,第二安装板102打开时露出第一安装板101,且关闭时遮盖第一安装板101。In some embodiments, referring to FIG. 3 , the second mounting plate 102 is reversibly disposed in the cabinet body 10 between the open position and the closed position. When the second mounting plate 102 is opened, the first mounting plate 101 is exposed, and when closed Cover the first installation board 101 at this time.

第二安装板102可翻转地设于柜体10内,打开时露出第一安装板101,且关闭时遮盖第一安装板101。如此,便于安装或维修第一安装板101上的电子器件30。The second mounting plate 102 is reversibly disposed in the cabinet body 10 , exposes the first mounting plate 101 when opened, and covers the first mounting plate 101 when closed. In this way, it is convenient to install or maintain the electronic device 30 on the first mounting board 101 .

具体地,第一安装板101位于第二安装板102后侧,第二安装板102可翻转地设于柜体10内,打开时露出第一安装板101,关闭时遮盖第一安装板101。第一安装板101上安装有第一弱电器件,打开第二安装板102可以安装或维修第一安装板101上的第一弱电器件,关闭第二安装板102可以保护第一安装板101上的第一弱电器件。Specifically, the first mounting plate 101 is located on the rear side of the second mounting plate 102, and the second mounting plate 102 is reversibly disposed in the cabinet body 10. When opened, the first mounting plate 101 is exposed, and when closed, the first mounting plate 101 is covered. The first weak current device is installed on the first installation board 101, the first weak current device on the first installation board 101 can be installed or repaired by opening the second installation board 102, and the first weak current device on the first installation board 101 can be protected by closing the second installation board 102. The first weak current device.

在某些实施方式中,参阅图3,变频柜100还包括:第三安装板103,第三安装板103设于柜体10内,并层叠于背板14的前侧,且第三安装板103与背板14之间具有间隙,第三安装板103与第二安装板102并排设置,第三安装板103上设有第一弱电器件。In some embodiments, referring to FIG. 3 , the frequency conversion cabinet 100 further includes: a third installation board 103, the third installation board 103 is arranged in the cabinet body 10, and stacked on the front side of the backplane 14, and the third installation board 103 There is a gap between 103 and the backplane 14 , the third installation board 103 and the second installation board 102 are arranged side by side, and the first weak current device is arranged on the third installation board 103 .

如此,柜体10中第三安装板103的设置便于安装第三安装板103上的第一弱电器件,第三安装板103与背板14之间存在间隙,可以减少电器元件之间的干扰,便于散热。In this way, the arrangement of the third mounting plate 103 in the cabinet body 10 facilitates the installation of the first weak current device on the third mounting plate 103, and there is a gap between the third mounting plate 103 and the back plate 14, which can reduce the interference between electrical components. It is easy to dissipate heat.

具体地,设于柜体10内的第三安装板103上设置有第一弱电器件,参阅上述,第一安装板101上的第一弱电器件可以包括智能电表和接线插排。在一些实施方式中,接线插排横向设置在第三安装板103上,智能电表安装于接线插排的左侧。第三安装板103与第二安装板102并排设置,使得变频柜100结构紧凑。Specifically, the first weak current device is provided on the third installation board 103 in the cabinet body 10 . Referring to the above, the first weak current device on the first installation board 101 may include a smart meter and a power strip. In some implementations, the wiring socket is arranged horizontally on the third installation board 103 , and the smart meter is installed on the left side of the wiring socket. The third installation board 103 and the second installation board 102 are arranged side by side, so that the frequency conversion cabinet 100 has a compact structure.

在某些实施方式中,第三安装板103上设有接线插排、走线槽、智能电表中的至少一种。In some embodiments, the third installation board 103 is provided with at least one of a wiring socket, a wiring trough, and a smart meter.

如此,可以实现对应电子器件30的功能。In this way, the functions of the corresponding electronic device 30 can be realized.

具体地,参阅上述,第三安装板103上安装有第一弱电器件,第一弱电器件可以包括接线插排、走线槽、智能电表中的至少一种,可以实现对应电子器件3030的功能。Specifically, referring to the above, the third mounting board 103 is installed with the first weak current device, and the first weak current device may include at least one of a wiring strip, a wiring trough, and a smart meter, and may realize the function of the corresponding electronic device 3030 .

在某些实施方式中,参阅图3,变频柜100还包括:第四安装板104,第四安装板104设于柜体10内,并层叠于背板14的前侧,且第四安装板104与背板14之间具有间隙,第四安装板104与第一安装板101并排设置,第四安装板104上设有第一弱电器件。In some embodiments, referring to FIG. 3 , the frequency conversion cabinet 100 further includes: a fourth mounting plate 104, the fourth mounting plate 104 is arranged in the cabinet body 10, and stacked on the front side of the back plate 14, and the fourth mounting plate 104 There is a gap between 104 and the back plate 14 , the fourth mounting plate 104 is arranged side by side with the first mounting plate 101 , and the first weak current device is disposed on the fourth mounting plate 104 .

如此,柜体10中第三安装板103的设置便于安装第三安装板103上的第一弱电器件,第三安装板103与背板14之间存在间隙,可以减少电器元件之间的干扰,便于散热。In this way, the arrangement of the third mounting plate 103 in the cabinet body 10 facilitates the installation of the first weak current device on the third mounting plate 103, and there is a gap between the third mounting plate 103 and the back plate 14, which can reduce the interference between electrical components. It is easy to dissipate heat.

具体地,设于柜体10内的第四安装板104上设置有第一弱电器件,参阅上述,第一安装板101上的第一弱电器件可以包括电源板。第四安装板104与第一安装板101并排设置,使得变频柜100结构紧凑。Specifically, the first weak current device is disposed on the fourth installation board 104 provided in the cabinet body 10 . Referring to the above, the first weak current device on the first installation board 101 may include a power board. The fourth installation board 104 is arranged side by side with the first installation board 101 , so that the frequency conversion cabinet 100 has a compact structure.

在某些实施方式中,参阅图3,第四安装板104的一部分层叠于第三安装板103的后侧,且另一部分层叠于第二安装板102的后侧。In some embodiments, referring to FIG. 3 , a part of the fourth mounting board 104 is stacked on the rear side of the third mounting board 103 , and another part is stacked on the rear side of the second mounting board 102 .

如此,第四安装板104可以安装更大的第一弱电器件。In this way, the fourth mounting board 104 can mount larger first weak current components.

具体地,参阅上述,在一些实施方式中,第一安装板101和第四安装板104并排设置,第二安装板102和第三安装板103并排设置,第二安装板102和第三安装板103位于第一安装板101和第四安装板104的前侧。第四安装板104的一部分层叠于第三安装板103的后侧,另一部分层叠于第二安装板102的后侧,如此,第四安装板104的面积大于第三安装板103,便于第四安装板104安装第一弱电器件。Specifically, referring to the above, in some embodiments, the first installation board 101 and the fourth installation board 104 are arranged side by side, the second installation board 102 and the third installation board 103 are arranged side by side, and the second installation board 102 and the third installation board 103 is located on the front side of the first installation board 101 and the fourth installation board 104 . A part of the fourth mounting plate 104 is stacked on the rear side of the third mounting plate 103, and another part is stacked on the rear side of the second mounting plate 102. In this way, the area of the fourth mounting plate 104 is larger than that of the third mounting plate 103, which is convenient for the fourth mounting plate 104. The mounting board 104 is mounted with the first weak current device.

在某些实施方式中,参阅图3,第三安装板103可翻转地与第四安装板104铰接,以遮盖和显露第三安装板103后侧的结构。In some embodiments, referring to FIG. 3 , the third mounting plate 103 is reversibly hinged to the fourth mounting plate 104 to cover and reveal the rear structure of the third mounting plate 103 .

如此,可以遮盖和显露第三安装板103后侧的结构。In this way, the structure on the rear side of the third mounting board 103 can be covered and revealed.

具体地,第三安装板103和第四安装板104位于容置腔20的同一侧,第三安装板103可翻转地与第四安装板104铰接,以遮盖和显露第三安装板103后侧的结构。Specifically, the third mounting plate 103 and the fourth mounting plate 104 are located on the same side of the accommodating cavity 20, and the third mounting plate 103 is reversibly hinged with the fourth mounting plate 104 to cover and expose the rear side of the third mounting plate 103. Structure.

在某些实施方式中,参阅图4,容置腔20包括第一腔201和第二腔202,且第一腔201配置成风道结构,以对第一腔201内的电子器件30散热,第二腔202与第一腔201隔开。In some embodiments, referring to FIG. 4, the accommodating chamber 20 includes a first chamber 201 and a second chamber 202, and the first chamber 201 is configured as an air duct structure to dissipate heat from the electronic device 30 in the first chamber 201. The second cavity 202 is separated from the first cavity 201 .

如此,利用第一腔201和第二腔202放置电子器件30,并将第一腔201配置成散热风道结构,可以提高变频柜100的散热效果,并降低变频柜100的噪音。In this way, the first cavity 201 and the second cavity 202 are used to place the electronic device 30 , and the first cavity 201 is configured as a cooling air duct structure, which can improve the cooling effect of the frequency conversion cabinet 100 and reduce the noise of the frequency conversion cabinet 100 .

具体地,容置腔20包括第一腔201,第一腔201配置成散热风道结构以进行散热,换言之可以通过气流在第一腔201内的流通,带走第一腔201内电子器件30上的热量,达到电子器件30的散热目的。第二腔202内设置第一强电器件、第一弱电器件、第二强电器件。在一些实施方式中,第一腔201为封闭的腔室,其在柜内构造出一个封闭的流道,可以利用气流驱动件22与下面将提及的第一散热器2011的组合来实现对第一腔201内电子器件30的散热。而第二腔202可以设置成敞开的形式,例如,将柜体10内第一腔201之外的空间设置成第二腔202,此时由于第二腔202是一个敞开的空间,可以方便第二腔202内电子器件30的安装和维护。Specifically, the accommodating cavity 20 includes a first cavity 201, and the first cavity 201 is configured as a heat dissipation air duct structure for heat dissipation, in other words, the electronic device 30 in the first cavity 201 can be taken away by the circulation of the airflow in the first cavity 201. heat on the surface to achieve the purpose of heat dissipation of the electronic device 30. The second cavity 202 is provided with a first strong electric device, a first weak electric device and a second strong electric device. In some embodiments, the first chamber 201 is a closed chamber, which forms a closed flow passage in the cabinet, and the combination of the airflow driver 22 and the first heat sink 2011 mentioned below can be used to realize the control. Heat dissipation of the electronic device 30 in the first cavity 201 . And the second cavity 202 can be set to the form of opening, for example, the space outside the first cavity 201 in the cabinet body 10 is set to the second cavity 202, this moment because the second cavity 202 is an open space, can facilitate the second cavity Installation and maintenance of the electronic device 30 in the second chamber 202.

在某些实施方式中,参阅图3和图4,还包括:气流驱动件22,气流驱动件22设于第一腔201,并配置成驱动散热气流在第一腔201内流通,多个电路板32中的至少一个与气流驱动件22电连接。In some embodiments, referring to FIG. 3 and FIG. 4 , it also includes: an airflow driver 22, the airflow driver 22 is disposed in the first chamber 201, and is configured to drive the heat dissipation airflow to circulate in the first chamber 201, and a plurality of circuits At least one of the plates 32 is electrically connected to the airflow driver 22 .

如此,可以保证第一腔201的气流流通。In this way, the flow of air in the first chamber 201 can be ensured.

具体地,为了促使第一腔201内的气流流通,柜体10还可以包括气流驱动件22,该气流驱动件22可以设置成驱动第一腔201内的气流形成散热气流,散热气流可以设置成流经第一腔201内的电子器件30以及第一散热器2011。在气流流经第一散热器2011时,能够将气流中的热量交换至第一散热器2011,以降低气流的温度,并可以吸取第一散热器2011的冷量,用于对第一腔201进行散热;在气流流经第一腔201内的电子器件30时,能够将气流中的冷量交换至第一腔201内的电子器件30,并将第一腔201内电子器件30的热量带走,从而实现对第一腔201内电子器件30的散热。也就是说,将第一腔201内电子器件30的热量送往第一散热器2011,实现对第一腔201内电子器件30的散热。Specifically, in order to promote the flow of air in the first chamber 201, the cabinet 10 may further include an airflow driver 22, which may be configured to drive the airflow in the first chamber 201 to form a heat dissipation airflow, and the heat dissipation airflow may be set to The flow passes through the electronic device 30 in the first cavity 201 and the first radiator 2011 . When the airflow passes through the first radiator 2011, the heat in the airflow can be exchanged to the first radiator 2011 to lower the temperature of the airflow, and the cooling capacity of the first radiator 2011 can be absorbed for cooling the first cavity 201 Carry out heat dissipation; when the airflow flows through the electronic device 30 in the first chamber 201, the cold energy in the airflow can be exchanged to the electronic device 30 in the first chamber 201, and the heat of the electronic device 30 in the first chamber 201 can be brought to dissipate heat from the electronic device 30 in the first cavity 201. That is to say, the heat of the electronic device 30 in the first cavity 201 is sent to the first heat sink 2011 to realize the heat dissipation of the electronic device 30 in the first cavity 201 .

在某些实施方式中,参阅图4,还包括:第一散热器2011,第一散热器2011设于第一腔201内,配置为通过风冷的方式降低第一腔201内的温度,且气流驱动件22配置成驱动散热气流流经第一腔201内的电子器件30和第一散热器2011。In some embodiments, referring to FIG. 4 , further comprising: a first heat sink 2011, the first heat sink 2011 is disposed in the first cavity 201, configured to reduce the temperature in the first cavity 201 by air cooling, and The airflow driver 22 is configured to drive the heat dissipation airflow to flow through the electronic device 30 and the first heat sink 2011 in the first cavity 201 .

如此,第一散热器2011可以对第一腔201内电子器件30进行散热。In this way, the first radiator 2011 can dissipate heat from the electronic device 30 in the first cavity 201 .

具体地,第一腔201内可以设置第一散热器2011,第一散热器2011可以提供冷量,在通过风冷的方式来降低第一腔201内的热量时,第一散热器2011可以带走风中的热量,及时对气流进行散热,以便于气流更好地与第一腔201内的电子器件30散热,有效地提高第一腔201内的风冷效果。通过气流实现第一散热器2011与第一腔201内电子器件30的换热,实现通过风冷的降低第一腔201内的温度。Specifically, a first heat sink 2011 can be provided in the first cavity 201, and the first heat sink 2011 can provide cooling capacity. When the heat in the first cavity 201 is reduced by air cooling, the first heat sink 2011 can bring The heat in the wind is dissipated, and the airflow is dissipated in time, so that the airflow can better dissipate heat with the electronic device 30 in the first cavity 201 , and effectively improve the air cooling effect in the first cavity 201 . The heat exchange between the first heat sink 2011 and the electronic device 30 in the first cavity 201 is realized through the airflow, and the temperature in the first cavity 201 is lowered by air cooling.

在某些实施方式中,参阅图1,还包括:第二散热器2021,配置为通过热传导的方式为第二腔202内的电子器件30散热。In some embodiments, referring to FIG. 1 , it further includes: a second radiator 2021 configured to dissipate heat from the electronic device 30 in the second cavity 202 through heat conduction.

如此,第二散热器2021可以对第二腔202内的电子器件30进行散热。In this way, the second radiator 2021 can dissipate heat from the electronic device 30 in the second cavity 202 .

具体地,可以设置与第二腔202相对应的第二散热器2021,并将第二散热器2021设置成通过热传导的方式为第二腔202内的电子器件30散热。从而实现对第二腔202内电子器件30的散热。通过热传导,能够提高散热效率和效果,能够实现对工作温度较高的电子器件30快速散热。Specifically, a second heat sink 2021 corresponding to the second cavity 202 may be provided, and the second heat sink 2021 may be configured to dissipate heat for the electronic device 30 in the second cavity 202 through heat conduction. In this way, the heat dissipation of the electronic device 30 in the second cavity 202 is realized. Through heat conduction, the heat dissipation efficiency and effect can be improved, and rapid heat dissipation can be realized for the electronic device 30 with a relatively high operating temperature.

在某些实施方式中,参阅图2,还包括:门体18,门体18与柜体10相连,并配置成打开和关闭容置腔20,其中,门体18上设有电子器件30。In some embodiments, referring to FIG. 2 , it further includes: a door body 18 connected to the cabinet body 10 and configured to open and close the accommodating chamber 20 , wherein the door body 18 is provided with an electronic device 30 .

如此,参阅上述,门体18的设置便于打开和关闭容置腔20。In this way, referring to the above, the setting of the door body 18 is convenient for opening and closing the accommodating cavity 20 .

具体地,另外,柜体10上可以安装门体18,通过门体18打开和关闭柜体10。具体而言,在一些实施例方式中,门体18可以用于打开和关闭第二腔202,在门体18打开时,第二腔202打开,可以方便对第二腔202内电子器件30的安装和围护,并可以方便通过第二腔202内的电子器件30检查变频柜100的运行状态,而此时,第一腔201处于封闭的状态,不会影响第二腔202内的空间,第二腔202内将可以维持在一个湿度较低、灰尘较少的环境下,其散热效果、运行稳定性等都会相对较高;在门体18关闭时,第二腔202关闭,此时,第二腔202内将会形成一个相对封闭的环境,此时在自然对流或其他方式的作用下,第二腔202内各处的温度也可以较为均匀,也可以在一定程度上实现第二腔202内电子器件30的散热。Specifically, in addition, a door body 18 can be installed on the cabinet body 10 , and the cabinet body 10 can be opened and closed through the door body 18 . Specifically, in some embodiments, the door body 18 can be used to open and close the second chamber 202. When the door body 18 is opened, the second chamber 202 is opened, which can facilitate the access to the electronic device 30 in the second chamber 202. Installation and enclosure, and it is convenient to check the operating status of the frequency conversion cabinet 100 through the electronic device 30 in the second cavity 202, and at this time, the first cavity 201 is in a closed state, which will not affect the space in the second cavity 202, In the second chamber 202, it can be maintained in an environment with low humidity and less dust, and its heat dissipation effect and operation stability are relatively high; when the door body 18 is closed, the second chamber 202 is closed, and at this time, A relatively closed environment will be formed in the second chamber 202. At this time, under the action of natural convection or other methods, the temperature in the second chamber 202 can be relatively uniform everywhere, and the second chamber can also be realized to a certain extent. Heat dissipation of electronic device 30 in 202 .

在某些实施方式中,门体18上设有通讯模块、显示模块、低压控制模块和急停按钮中的至少一种。In some embodiments, the door body 18 is provided with at least one of a communication module, a display module, a low voltage control module and an emergency stop button.

如此,通讯模块、显示模块、低压控制模块和急停按钮中的至少一种的设置可以实现对应的功能。In this way, the setting of at least one of the communication module, the display module, the low-voltage control module and the emergency stop button can realize the corresponding function.

具体地,门体18上设有通讯模块、显示模块、低压控制模块和急停按钮中的至少一种,一方面使得变频柜100结构紧凑,另一方面,安装在门体18上的模块可以实现对应的功能。Specifically, the door body 18 is provided with at least one of a communication module, a display module, a low-voltage control module, and an emergency stop button. On the one hand, the structure of the frequency conversion cabinet 100 is made compact; Realize the corresponding function.

本实用新型实施方式通过的暖通设备包括:上述任一实施方式中的变频柜100和空调机组,空调机组与变频柜100相连。The HVAC equipment adopted in the embodiments of the present utility model includes: the frequency conversion cabinet 100 and the air conditioning unit in any of the above embodiments, and the air conditioning unit is connected to the frequency conversion cabinet 100 .

上述暖通设备,多个电路板32层叠安装于第一安装板101上,电路板32集成度高,减少了单板数量,提高功率密度。In the above HVAC equipment, a plurality of circuit boards 32 are stacked and mounted on the first installation board 101 , the circuit boards 32 are highly integrated, the number of single boards is reduced, and the power density is improved.

具体地,包括上述任一实施方式中的变频柜100的暖通设备,变频柜100中的电路板32层叠于容置腔20的内侧面,结构紧凑,便于散热,提高了电器元件功率密度。Specifically, for the HVAC equipment including the frequency conversion cabinet 100 in any of the above-mentioned embodiments, the circuit board 32 in the frequency conversion cabinet 100 is stacked on the inner surface of the accommodating cavity 20, which has a compact structure, facilitates heat dissipation, and improves the power density of electrical components.

在某些实施方式中,空调机组的机组控制板集成于变频柜100上,且机组控制板与空调机组信号传输。In some embodiments, the unit control board of the air-conditioning unit is integrated on the frequency conversion cabinet 100, and the unit control board and the air-conditioning unit transmit signals.

如此,机组控制板集成于变频柜100暖通设备,结构紧凑,提高了功率密度。In this way, the control board of the unit is integrated into the HVAC equipment of the frequency conversion cabinet 100, which has a compact structure and improves the power density.

具体地,空调机组的机组控制板集成于变频柜100上,且机组控制板与空调机组信号传输。机组控制板集成于变频柜100暖通设备,结构紧凑,提高了功率密度。Specifically, the unit control board of the air-conditioning unit is integrated on the frequency conversion cabinet 100, and the unit control board and the air-conditioning unit transmit signals. The control board of the unit is integrated in the frequency conversion cabinet 100 HVAC equipment, which has a compact structure and improves the power density.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本实用新型的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structures, materials or features are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

尽管上面已经示出和描述了本实用新型的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本实用新型的限制,本领域的普通技术人员在本实用新型的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limitations of the present invention, and those skilled in the art are within the scope of the present invention. Variations, modifications, substitutions and variations can be made to the above-described embodiments.

Claims (21)

1.一种变频柜,其特征在于,包括:1. A frequency conversion cabinet, characterized in that, comprising: 柜体,所述柜体设有容置腔,所述容置腔的前侧具有开口,且后侧具有背板,所述容置腔配置为容置电子器件;A cabinet body, the cabinet body is provided with an accommodating cavity, the front side of the accommodating cavity has an opening, and the rear side has a backboard, and the accommodating cavity is configured to accommodate electronic devices; 第一安装板,所述第一安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第一安装板与所述背板之间具有间隙;a first mounting plate, the first mounting plate is arranged in the cabinet and stacked on the front side of the back plate, and there is a gap between the first mounting plate and the back plate; 其中,所述第一安装板上层叠安装有多个电路板。Wherein, a plurality of circuit boards are stacked and mounted on the first mounting board. 2.根据权利要求1所述的变频柜,其特征在于,所述多个电路板并排设置,并层叠于所述第一安装板的同一侧。2. The frequency conversion cabinet according to claim 1, wherein the plurality of circuit boards are arranged side by side and stacked on the same side of the first installation board. 3.根据权利要求2所述的变频柜,其特征在于,所述多个电路板层叠于所述第一安装板的背离所述背板的一侧;3. The frequency conversion cabinet according to claim 2, wherein the plurality of circuit boards are stacked on a side of the first mounting board away from the backboard; 或,所述多个电路板层叠于所述第一安装板的朝向所述背板的一侧。Or, the plurality of circuit boards are stacked on a side of the first mounting board facing the backplane. 4.根据权利要求1所述的变频柜,其特征在于,所述多个电路板分别层叠于所述第一安装板上沿前后方向的相对两侧,所述多个电路板中的至少一个层叠于所述第一安装板上面向所述背板的一侧,且至少一个层叠于所述第一安装板上背离所述背板的一侧。4. The frequency conversion cabinet according to claim 1, wherein the plurality of circuit boards are respectively stacked on opposite sides of the first mounting plate along the front and rear directions, at least one of the plurality of circuit boards stacked on the side of the first mounting board facing the backboard, and at least one stacked on the side of the first mounting board facing away from the backboard. 5.根据权利要求1-4中任一项所述的变频柜,其特征在于,所述多个电路板在所述第一安装板的一侧表面上的覆盖率不低于90%;5. The frequency conversion cabinet according to any one of claims 1-4, wherein the coverage of the plurality of circuit boards on one side surface of the first mounting board is not less than 90%; 或,所述多个电路板的总面积,不小于所述第一安装板一侧表面的90%。Or, the total area of the plurality of circuit boards is not less than 90% of one side surface of the first mounting board. 6.根据权利要求1-4中任一项所述的变频柜,其特征在于,所述变频柜还包括:6. The frequency conversion cabinet according to any one of claims 1-4, characterized in that, the frequency conversion cabinet further comprises: 第二安装板,所述第二安装板设于所述柜体内,并层叠于所述第一安装板的前侧,且所述第二安装板与所述第一安装板之间具有间隙。A second mounting plate, the second mounting plate is arranged in the cabinet and stacked on the front side of the first mounting plate, and there is a gap between the second mounting plate and the first mounting plate. 7.根据权利要求6所述的变频柜,其特征在于,所述变频柜包括空调机组阀控制板和主控板,所述空调机组阀控制板用于连接空调机组的控制阀,所述主控板与所述空调机组阀控制板相连,并设于所述第一安装板上,所述主控板与所述空调机组阀控制板沿前后方向相对。7. The frequency conversion cabinet according to claim 6, characterized in that, the frequency conversion cabinet comprises an air conditioning unit valve control board and a main control board, the air conditioning unit valve control board is used to connect the control valve of the air conditioning unit, the main The control board is connected with the valve control board of the air conditioner unit and is arranged on the first installation board, and the main control board is opposite to the valve control board of the air conditioner unit along the front and rear direction. 8.根据权利要求6所述的变频柜,其特征在于,所述第二安装板在打开位置和关闭位置之间可翻转地设于所述柜体内,所述第二安装板打开时露出所述第一安装板,且关闭时遮盖所述第一安装板。8. The frequency conversion cabinet according to claim 6, characterized in that, the second mounting plate is reversibly arranged in the cabinet between the open position and the closed position, and when the second mounting plate is opened, the the first mounting plate, and cover the first mounting plate when closed. 9.根据权利要求6所述的变频柜,其特征在于,所述变频柜还包括:9. The frequency conversion cabinet according to claim 6, characterized in that, the frequency conversion cabinet further comprises: 第三安装板,所述第三安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第三安装板与所述背板之间具有间隙,所述第三安装板与所述第二安装板并排设置,所述第三安装板上设有第一弱电器件。The third installation board, the third installation board is arranged in the cabinet, and stacked on the front side of the back board, and there is a gap between the third installation board and the back board, the third installation board The installation board is arranged side by side with the second installation board, and the first weak current device is arranged on the third installation board. 10.根据权利要求9所述的变频柜,其特征在于,所述第三安装板上设有接线插排、走线槽、智能电表中的至少一种。10 . The frequency conversion cabinet according to claim 9 , wherein at least one of a wiring socket, a wiring trough, and a smart meter is provided on the third mounting plate. 11 . 11.根据权利要求9所述的变频柜,其特征在于,所述变频柜还包括:11. The frequency conversion cabinet according to claim 9, characterized in that, the frequency conversion cabinet further comprises: 第四安装板,所述第四安装板设于所述柜体内,并层叠于所述背板的前侧,且所述第四安装板与所述背板之间具有间隙,所述第四安装板与所述第一安装板并排设置,所述第四安装板上设有第一弱电器件。A fourth installation plate, the fourth installation plate is arranged in the cabinet and stacked on the front side of the back plate, and there is a gap between the fourth installation plate and the back plate, the fourth The installation board is arranged side by side with the first installation board, and the first weak current device is arranged on the fourth installation board. 12.根据权利要求11所述的变频柜,其特征在于,所述第四安装板的一部分层叠于所述第三安装板的后侧,且另一部分层叠于第二安装板的后侧。12 . The frequency conversion cabinet according to claim 11 , wherein a part of the fourth installation board is stacked on the rear side of the third installation board, and another part is stacked on the rear side of the second installation board. 13 . 13.根据权利要求11所述的变频柜,其特征在于,所述第三安装板可翻转地与所述第四安装板铰接,以遮盖和显露所述第三安装板后侧的结构。13 . The frequency conversion cabinet according to claim 11 , wherein the third mounting plate is reversibly hinged to the fourth mounting plate to cover and reveal the rear structure of the third mounting plate. 14 . 14.根据权利要求1所述的变频柜,其特征在于,所述容置腔包括第一腔和第二腔,且所述第一腔配置成风道结构,以对所述第一腔内的电子器件散热,所述第二腔与所述第一腔隔开。14. The frequency conversion cabinet according to claim 1, wherein the accommodating cavity includes a first cavity and a second cavity, and the first cavity is configured as an air duct structure to The electronic device dissipates heat, and the second cavity is separated from the first cavity. 15.根据权利要求14所述的变频柜,其特征在于,还包括:15. The frequency conversion cabinet according to claim 14, further comprising: 气流驱动件,所述气流驱动件设于所述第一腔,并配置成驱动散热气流在第一腔内流通,所述多个电路板中的至少一个与所述气流驱动件电连接。An airflow driving part, the airflow driving part is arranged in the first chamber and configured to drive the cooling airflow to circulate in the first chamber, at least one of the plurality of circuit boards is electrically connected to the airflow driving part. 16.根据权利要求15所述的变频柜,其特征在于,还包括:16. The frequency conversion cabinet according to claim 15, further comprising: 第一散热器,所述第一散热器设于所述第一腔内,配置为通过风冷的方式降低所述第一腔内的温度,且所述气流驱动件配置成驱动散热气流流经所述第一腔内的电子器件和所述第一散热器。The first radiator, the first radiator is arranged in the first cavity, configured to reduce the temperature in the first cavity by air cooling, and the airflow driver is configured to drive the cooling airflow to flow through The electronic device in the first cavity and the first heat sink. 17.根据权利要求14所述的变频柜,其特征在于,还包括:17. The frequency conversion cabinet according to claim 14, further comprising: 第二散热器,配置为通过热传导的方式为所述第二腔内的电子器件散热。The second heat sink is configured to dissipate heat for the electronic devices in the second cavity through heat conduction. 18.根据权利要求1-4中任一项所述的变频柜,其特征在于,还包括:18. The frequency conversion cabinet according to any one of claims 1-4, further comprising: 门体,所述门体与所述柜体相连,并配置成打开和关闭所述容置腔,a door body, the door body is connected with the cabinet body and configured to open and close the accommodating cavity, 其中,所述门体上设有电子器件。Wherein, electronic devices are arranged on the door body. 19.根据权利要求18所述的变频柜,其特征在于,所述门体上设有通讯模块、显示模块、低压控制模块和急停按钮中的至少一种。19. The frequency conversion cabinet according to claim 18, wherein at least one of a communication module, a display module, a low-voltage control module and an emergency stop button is provided on the door body. 20.一种暖通设备,其特征在于,包括:20. A heating and ventilation equipment, characterized in that it comprises: 根据权利要求1-19中任一项所述的变频柜;The frequency conversion cabinet according to any one of claims 1-19; 空调机组,所述空调机组与所述变频柜相连。An air-conditioning unit, the air-conditioning unit is connected with the frequency conversion cabinet. 21.根据权利要求20所述的暖通设备,其特征在于,所述空调机组的机组控制板集成于所述变频柜上,且所述机组控制板与所述空调机组信号传输。21. The HVAC equipment according to claim 20, wherein the unit control board of the air conditioning unit is integrated on the frequency conversion cabinet, and the unit control board and the air conditioning unit transmit signals.
CN202320163533.6U 2023-01-17 2023-01-17 Variable frequency cabinet and heating and ventilation equipment Active CN219068072U (en)

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CN202320163533.6U CN219068072U (en) 2023-01-17 2023-01-17 Variable frequency cabinet and heating and ventilation equipment

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