CN219068797U - Frequency conversion equipment, compressor and heating ventilation equipment - Google Patents

Frequency conversion equipment, compressor and heating ventilation equipment Download PDF

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Publication number
CN219068797U
CN219068797U CN202223426590.3U CN202223426590U CN219068797U CN 219068797 U CN219068797 U CN 219068797U CN 202223426590 U CN202223426590 U CN 202223426590U CN 219068797 U CN219068797 U CN 219068797U
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China
Prior art keywords
cavity
frequency conversion
housing
heat
flow
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CN202223426590.3U
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Chinese (zh)
Inventor
李思源
李逸信
岳宝
刘树清
贺伟衡
林琳
王坤杰
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Midea Group Co Ltd
GD Midea Heating and Ventilating Equipment Co Ltd
Chongqing Midea General Refrigeration Equipment Co Ltd
Original Assignee
Midea Group Co Ltd
GD Midea Heating and Ventilating Equipment Co Ltd
Chongqing Midea General Refrigeration Equipment Co Ltd
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Priority to CN202223426590.3U priority Critical patent/CN219068797U/en
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Abstract

The utility model discloses a frequency conversion device, a compressor and a heating and ventilation device, wherein the frequency conversion device comprises: a housing provided with a receiving cavity configured to receive an electronic device, the receiving cavity including a first cavity and a second cavity; a first heat sink disposed within the first chamber and configured to reduce a temperature within the first chamber by way of gas flow; and the second radiator is configured to radiate heat for the electronic device in the second cavity and the electronic device in the first cavity in a heat conduction mode. According to the frequency conversion equipment provided by the embodiment of the utility model, the first radiator and the second radiator can be utilized to radiate the electronic device in the first cavity, so that the radiating effect and efficiency of the electronic device in the first cavity can be effectively improved.

Description

Frequency conversion equipment, compressor and heating ventilation equipment
Technical Field
The utility model relates to the technical field of frequency conversion devices, in particular to frequency conversion equipment, a compressor comprising the frequency conversion equipment and heating ventilation equipment comprising the frequency conversion equipment.
Background
The variable frequency cabinet control cabinet, which is called variable frequency cabinet for short, can be widely applied to various medium-voltage motor equipment such as pumps, fans, compressors, rolling mills, injection molding machines, belt conveyors and the like in metallurgy, chemical industry, petroleum, water supply, mines, building materials, motor industry and the like.
The frequency conversion cabinet comprises a frequency conversion cabinet power element, a frequency conversion cabinet control element and a frequency conversion cabinet control element, when the frequency conversion cabinet works, the elements can generate heat, and if the heat cannot be effectively discharged, the working environment of the elements can be directly influenced, and the service life of the elements is further influenced.
In addition, in the related art, the air outlet of the variable frequency cabinet is usually disposed at the top or the upper part of the front wall of the variable frequency cabinet, when the variable frequency cabinet is placed in the air compressor, if the air outlet is located at the top of the variable frequency cabinet, since the air outlet of the variable frequency cabinet is very close to the air inlet of the air compressor, hot air from the air outlet of the variable frequency cabinet is still sucked by the air compressor, which will cause the internal temperature of the air compressor to be too high, and affect the performance and stability thereof. If the air outlet is positioned on the upper part of the front wall of the frequency conversion cabinet, the air outlet of the frequency conversion cabinet is required to use a filter grid with a certain protection level, so that hot air at the air outlet of the frequency conversion cabinet is discharged downwards obliquely, and hot air from the air outlet of the frequency conversion cabinet is still sucked by the air inlet of the frequency conversion cabinet positioned on the lower part of the front wall, so that the temperature inside the frequency conversion cabinet is overhigh, and the performance and the stability of the frequency conversion cabinet are affected.
Disclosure of Invention
An object of the present utility model is to provide a frequency conversion device, which can utilize a first radiator and a second radiator to radiate heat of an electronic device in a first cavity, so as to effectively improve the radiating effect and efficiency of the electronic device in the first cavity.
Another object of the present utility model is to propose a compressor comprising a frequency conversion device as described above.
It is a further object of the present utility model to provide a heating and ventilation device comprising the compressor or the variable frequency device as described above.
According to an embodiment of the utility model, a frequency conversion device includes: a housing provided with a receiving cavity configured to receive an electronic device, the receiving cavity including a first cavity and a second cavity; a first heat sink disposed within the first chamber and configured to reduce a temperature within the first chamber by way of gas flow; and the second radiator is configured to radiate heat for the electronic device in the second cavity and the electronic device in the first cavity in a heat conduction mode.
According to the frequency conversion equipment provided by the embodiment of the utility model, the first radiator and the second radiator can be utilized to radiate the electronic device in the first cavity, so that the radiating effect and efficiency of the electronic device in the first cavity can be effectively improved.
In addition, the frequency conversion device according to the above embodiment of the present utility model may further have the following additional technical features:
optionally, the electronic device includes a first electronic device and a second electronic device, the first electronic device is disposed in the first cavity, the second electronic device is disposed in the second cavity, and the second heat sink is in heat transfer fit with the first electronic device and the second electronic device, so as to dissipate heat of the first electronic device and the second electronic device by using the second heat sink.
Optionally, the first electronic device and the second electronic device are respectively stacked with the second heat sink to exchange heat.
Optionally, at least part of the second heat sink is disposed within the receiving cavity.
Optionally, the second heat sink is disposed within the first cavity; or, the second radiator is arranged in the second cavity; or, a part of the second radiator is arranged in the first cavity, and the other part of the second radiator is arranged in the second cavity; or, a part of the second radiator is arranged in at least one of the first cavity and the second cavity, and the other part of the second radiator is arranged outside the accommodating cavity.
Optionally, the second heat sink is disposed on a back side of the housing and corresponds to a location of at least a portion of the electronics within the first cavity and at least a portion of the electronics within the second cavity.
Optionally, the first radiator is an evaporator; and/or, the second radiator is a parallel flow radiator.
Optionally, the first cavity is configured as an annular cavity, and the air flow in the first cavity is suitable for circulating to dissipate heat under the driving action of the air flow driving piece.
Optionally, the first cavity includes a first flow channel located at a bottom of the housing and configured to direct a flow of heat dissipating air from a first side of the housing to a second side, and the first heat sink is disposed in the first flow channel.
Optionally, the first chamber further comprises a second flow passage located on a second side of the housing, the second flow passage directing the flow of heat dissipating air from the bottom of the housing to the upper portion of the housing.
Optionally, the first chamber further comprises a third flow passage disposed in an upper portion of the housing, the third flow passage directing the flow of heat dissipating air from the second side to the first side of the housing.
Optionally, the first chamber further includes a fourth flow channel disposed on the first side, the fourth flow channel guiding the flow of the heat dissipating air from above the housing to the bottom of the housing.
Optionally, the first cavity is configured as an annulus within the housing extending along a peripheral wall of the housing.
Optionally, the first cavity is configured as a closed annular cavity and the second cavity is spaced from the first cavity.
Optionally, the first cavity is disposed within the housing proximate to a back plate of the housing.
Optionally, the frequency conversion device further includes: the door body is connected with the shell and is configured to open and close the accommodating cavity, and the second cavity is closed when the accommodating cavity is closed by the door body.
The compressor according to the embodiment of the utility model comprises the frequency conversion equipment.
The heating and ventilation equipment comprises the frequency conversion equipment; or a compressor according to the foregoing.
Drawings
Fig. 1 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 2 is a schematic diagram of a frequency conversion device according to an embodiment of the utility model.
Fig. 3 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 4 is a schematic diagram of a frequency conversion device according to an embodiment of the utility model.
Fig. 5 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 6 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 7 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 8 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Fig. 9 is a schematic diagram of a frequency conversion device according to an embodiment of the present utility model.
Reference numerals: 100. a frequency conversion device; 10. a housing; 101. a receiving chamber; 102. a first chamber; 1021. a first flow passage; 1022. a second flow passage; 1023. a third flow passage; 1024. a fourth flow passage; 103. a second chamber; 11. a first heat sink; 12. a second heat sink; 121. a first deflector; 122. a second deflector; 13. a junction box; 14. an air flow driving member; 141. a first fan; 142. a second fan; 20. a door body; 31. a circuit breaker; 32. a reactor; 33. a capacitor; 34. an IGBT; 35. a diode; 36. a transformer; 37. a contactor; A. a first electronic device; B. and a second electronic device.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
As shown in fig. 1, a frequency conversion apparatus 100 according to an embodiment of the present utility model includes: the shell 10, the shell 10 is provided with the accommodating cavity 101, the accommodating cavity 101 is configured to accommodate the electronic device, the accommodating cavity 101 comprises the first cavity 102, the first cavity 102 can be set to dissipate heat in a gas circulation mode, in other words, heat on the electronic device in the first cavity 102 can be taken away through circulation of air flow in the first cavity 102, and the purpose of dissipating heat of the electronic device is achieved.
The first radiator 11 may be disposed in the first cavity 102, the first radiator 11 may provide cold energy, when the heat in the first cavity 102 is reduced by the air circulation mode, the first radiator 11 may take away the heat in the wind and timely radiate the air flow, so that the air flow better radiates heat with the electronic devices in the first cavity 102, and the air flow heat exchange effect in the first cavity 102 is effectively improved. The heat exchange between the first radiator 11 and the electronic device in the first cavity 102 is realized through the air flow, and the temperature in the first cavity 102 is reduced through the air circulation mode.
In addition, the accommodating cavity 101 may further include a second cavity 103, and a heat dissipation manner of the electronic device in the second cavity 103 may be different from a heat dissipation manner of the electronic device in the first cavity 102. For example, a second heat sink 12 corresponding to the second cavity 103 may be provided, and the second heat sink 12 may be arranged to dissipate heat by heat conduction from the electronic device within the second cavity 103. Thereby effecting heat dissipation from the electronic device within the second cavity 103.
In addition, the second heat sink 12 is configured to dissipate heat by heat conduction from the electronic components in the second cavity 103 and the electronic components in the first cavity 102. That is, at least a portion of the electronic devices within the first cavity 102 can dissipate heat using the combination of the first heat sink 11 and the second heat sink 12, and the heat dissipation efficiency and effect of the electronic devices within the first cavity 102 can be effectively improved.
According to the frequency conversion equipment 100 provided by the embodiment of the utility model, the first cavity 102 and the second cavity 103 are arranged, the first cavity 102 can exchange heat in a gas circulation mode, and the temperature in the first cavity 102 is set by using the first radiator 11, so that the temperature of an electronic device in the first cavity 102 is set; and the temperature of the electronic devices in the second cavity 103 can be reduced by using the second radiator 12, different modes are adopted for radiating, different types of electronic devices can be radiated in a targeted manner, the heat conduction between different electronic devices can be reduced, the running stability of each electronic device is improved, meanwhile, the interference between different electronic devices can be reduced through the isolation of the first cavity 102 and the second cavity 103, the stability of the frequency conversion equipment 100 is improved, and the fault rate is reduced. In addition, the first radiator 11 and the second radiator 12 can be utilized to radiate the electronic device in the first cavity 102, so that the radiating effect and efficiency of the electronic device in the first cavity 102 can be effectively improved.
In addition, to facilitate airflow within the first chamber 102, the housing 10 may further include an airflow driver 14, and the airflow driver 14 may be configured to drive airflow within the first chamber 102 to form a heat dissipating airflow, which may be configured to flow through the electronics within the first chamber 102 and the first heat sink 11. When the air flow passes through the first radiator 11, heat in the air flow can be exchanged to the first radiator 11 so as to reduce the temperature of the air flow, and cold energy of the first heat exchanger can be absorbed for radiating the first cavity 102; when the air flow passes through the electronic devices in the first cavity 102, the cold energy in the air flow can be exchanged to the electronic devices in the first cavity 102, and the heat of the electronic devices in the first cavity 102 is taken away, so that the heat dissipation of the electronic devices in the first cavity 102 is realized. That is, heat of the electronic device in the first cavity 102 is sent to the first heat sink 11, and heat dissipation of the electronic device in the first cavity 102 is achieved.
In some embodiments of the utility model, as shown in fig. 1, the electronic device comprises a first electronic device a and a second electronic device B, the first electronic device a being provided in the first cavity 102 and the second electronic device B being provided in the second cavity 103. It is possible to radiate heat from the first electronic device a by the first heat sink 11 and to radiate heat from the second electronic device B by the second heat sink 12.
In addition, a second heat sink 12 may be provided in heat transfer engagement with the first electronic device a and the second electronic device B to dissipate heat from the first electronic device a and the second electronic device B using the second heat sink 12. The first electronic device a can be cooled by the combination of the first heat sink 11 and the second heat sink 12, so that the cooling efficiency and effect of the first electronic device a can be improved, and the humidity environment in the first chamber 102 can be maintained by the condensation of the first heat sink 11. Meanwhile, the second radiator 12 can be used for radiating the second electronic device B, and the operating temperature environment of the second electronic device B is maintained, so that the purpose of optimizing the performance of the frequency conversion equipment 100 is achieved.
Wherein the first and second electronic devices a and B are stacked with the second heat sink 12, respectively, to exchange heat. By the lamination mode, the cooling capacity of the second radiator 12 can be quickly transferred to the second electronic device B, and the cooling effect is better compared with the cooling effect of air flow. Therefore, the electronic device with relatively high heat generating power in the inverter device 100 can generally dissipate heat by the second heat sink 12, and directly dissipate heat by heat conduction.
In addition, at least part of the second heat sink 12 is disposed within the accommodating chamber 101. It is possible to realize stable heat dissipation to the electronic device stacked or adjacent to the second heat sink 12; meanwhile, the temperature in the second cavity 103 can be reduced through the second radiator 12, so that the purpose of radiating other electronic devices in the second cavity 103 is achieved.
The second heat sink 12 may be disposed in the first cavity 102, and when the air flows along the second cavity 103, the air flow in the first cavity 102 may exchange heat with the second heat sink 12, so that the air flow in the first cavity 102 may flow along the first cavity 102 by guiding the heat of the first heat sink 11 and the second heat sink 12, so that the second heat sink 12 may be utilized to dissipate heat from the electronic device in the first cavity 102, effectively maintain the ambient temperature in the first cavity 102, and optimize the operation stability of the components in the first cavity 102.
In addition, the second heat sink 12 may be provided in the second chamber 103. At this time, part of the electronic devices in the second cavity 103 may be stacked on the second heat sink 12, improving the efficiency and effect of heat dissipation.
In addition, the second radiator 12 may be partially disposed in the first cavity 102, and the other portion is disposed in the second cavity 103, so that the portion disposed in the first cavity 102 may dissipate heat due to the ventilation flow, and may also exchange heat with the electronic device in the first cavity 102 by means of heat conduction, and may also dissipate heat with respect to the electronic device in the first cavity 102, thereby effectively improving the utilization rate of the second radiator 12, avoiding the dissipation of cold energy on the second radiator 12, and saving energy and protecting environment.
In addition, a part of the second heat sink 12 is provided in at least one of the first chamber 102 and the second chamber 103, and the other part is provided outside the accommodating chamber 101. The installation of the second radiator 12 can be simplified, the second radiator 12 can be conveniently connected with other pipelines (such as a compressor and the like), the assembly and maintenance efficiency of the frequency conversion equipment 100 can be improved, the failure rate of the frequency conversion equipment 100 can be reduced, and the service life can be prolonged.
Referring to fig. 1-9, in some embodiments of the utility model, a second heat sink 12 is disposed on the back of the housing 10 and corresponds to the location of at least some of the electronics within the first chamber 102 and at least some of the electronics within the second chamber 103. The installation of the second heat sink 12 in the receiving chamber 101 is relatively complicated, so that in the present utility model the second heat sink 12 may also be arranged on the back side of the housing 10, corresponding to the position of at least part of the electronics in the frequency conversion device 100. In this way, not only the installation of the second radiator 12 can be facilitated, but also the condensate water generated in the operation process of the second radiator 12 can be prevented from flowing into the shell 10, and the operation stability of the frequency conversion equipment 100 is improved.
In some embodiments of the present utility model, the first heat sink 11 is an evaporator. The first radiator 11 may be combined with a compressor, a condenser, etc., and heat dissipation is achieved by using refrigerant phase change, so as to optimize heat dissipation efficiency and effect in the first cavity 102. When the frequency conversion device is used, the first radiator 11 is arranged in the first cavity 102, and the air flow in the first cavity 102 can be utilized to convey the cold energy on the first radiator 11 to other positions in the first cavity 102, so that the heat dissipation of electronic devices in the first cavity 102 is realized, the operation environment of the electronic devices in the first cavity 102 is optimized, and the stability and the service life of the frequency conversion device 100 are improved.
In addition, the second radiator 12 may be a parallel flow radiator. The parallel flow radiator may have a higher cooling capacity, so that effective heat dissipation of the electronic devices in the second cavity 103 may be achieved, so as to maintain stable operation of the electronic devices in the second cavity 103, improve operation stability of the frequency conversion apparatus 100, and reduce a failure rate.
In some embodiments of the present utility model, the first chamber 102 is a closed chamber, which forms a closed flow path in the housing 10, and the combination of the airflow driving member 14 and the first heat sink 11 may be used to dissipate heat from the electronic device in the first chamber 102. While the second chamber 103 may be provided in an open form, for example, a space outside the first chamber 102 in the housing 10 is provided as the second chamber 103, and at this time, since the second chamber 103 is an open space, the installation and maintenance of the electronic components in the second chamber 103 can be facilitated. In addition, a door body 20 may be installed on the housing 10, and the housing 10 may be opened and closed by the door body 20. Specifically, in some embodiments, the door body 20 may be used to open and close the second cavity 103, when the door body 20 is opened, the second cavity 103 is opened, so that installation and enclosure of electronic devices in the second cavity 103 can be facilitated, and the operation state of the frequency conversion apparatus 100 can be checked by using the electronic devices in the second cavity 103 conveniently, at this time, the first cavity 102 is in a closed state, so that the space in the second cavity 103 is not affected, the second cavity 103 can be maintained in an environment with low humidity and less dust, and the heat dissipation effect, the operation stability and the like of the second cavity 103 are relatively high; when the door 20 is closed, the second cavity 103 is closed, and at this time, a relatively closed environment is formed in the second cavity 103, and at this time, under the action of natural convection or other modes, the temperature of each place in the second cavity 103 can be relatively uniform, and heat dissipation of electronic devices in the second cavity 103 can be realized to a certain extent.
In addition, in the utility model, the second cavity 103 may not be provided with an air flow driving structure such as a fan, so that the electronic devices in the second cavity 103 will operate under the noise of the intersection, thereby effectively reducing the noise of the frequency conversion device 100, and avoiding introducing external high humidity air, dust-containing air flow and the like into the second cavity 103, so as to prolong the service life of the electronic devices in the second cavity 103; of course, an air flow driving structure such as a fan may be disposed in the second cavity 103, so that sufficient heat exchange of the electronic devices in the second cavity 103 may be achieved, the temperature environment of the electronic devices in the second cavity 103 may be maintained, and the operation stability and service life of the electronic devices in the second cavity 103 may be improved.
The first cavity 102 in the present utility model may be configured as a linear, curved, or folded heat dissipation channel, and the heat is taken away by the first heat sink 11 under the driving action of the airflow driving member 14, for example, the heat dissipation airflow may be introduced from one end of the first cavity 102 and flow out from the second end of the first cavity 102, which may adversely affect the surrounding environment, and may also cause dust-containing airflow in the external environment to enter the first cavity 102, thereby affecting the operation environment in the first cavity 102.
In addition, in the present utility model, the first heat sink 11 is provided to remove heat in the first cavity 102, and when the heat dissipation airflow in the first cavity 102 circulates, the first heat sink 11 may be used to remove heat of the electronic device in the second cavity 103. Therefore, in order to reduce the influence on the surrounding environment during the heat dissipation process, the first cavity 102 may be configured as an annular cavity, and the air flow in the first cavity 102 is adapted to circulate to dissipate heat under the driving action of the air flow driving member 14. Through the circulation of the air flow, the temperature in the first cavity 102 can be effectively reduced, the heat dissipation of the electronic devices in the first cavity 102 is realized, a better temperature environment is provided for the operation of the electronic devices in the first cavity 102, meanwhile, the influence of the heat in the first cavity 102 on the surrounding environment can be reduced, particularly, the influence of the heat in the first cavity 102 on the electronic devices in the second cavity 103 can be reduced, and the stability of the whole frequency conversion equipment 100 is improved. In addition, the first radiator 11 also has a condensation function, so that the humidity in the first cavity 102 can be regulated by the first radiator 11, and the humidity environment of the electronic device in the first cavity 102 can be optimized.
The first chamber 102 of the present utility model may be provided as a circular ring-shaped, elliptical ring-shaped, polygonal ring-shaped, or other irregularly shaped annular chamber, and the first chamber 102 of one embodiment of the present utility model is described below with reference to the accompanying drawings.
In some embodiments of the utility model, as shown in fig. 7, the first chamber 102 may include a first flow passage 1021, the first flow passage 1021 being located at the bottom of the housing 10 and configured to direct the flow of heat dissipating air from the first side to the second side of the housing 10. Referring to the drawings, the first flow passage 1021 is provided at the bottom of the housing 10 and extends in a left-to-right direction to guide the heat dissipation air flow from the left side of the bottom of the housing 10 to the right side of the housing 10, thereby achieving heat dissipation to the bottom of the housing 10. Meanwhile, if condensed water is generated in the first chamber 102, the condensed water will flow to the first flow passage 1021, accumulate at the bottom of the first flow passage 1021, or be guided out through a guiding structure arranged in the first flow passage 1021.
In the circulation process of the air flow in the first cavity 102, the temperature of the position where the first radiator 11 is located is low, so that condensation is easily generated at the position where the first radiator 11 is located, and condensed water is generated, therefore, the first radiator 11 is arranged in the first flow passage 1021, when the condensation is generated on the first radiator 11, the condensation can flow to the bottom of the shell 10 more quickly, the influence of the condensed water and the like on other electronic devices caused by the flow in the first cavity 102 is avoided, and the stability of the frequency conversion equipment 100 is improved.
In the utility model, the drain hole is arranged on the bottom wall of the first flow passage 1021, and after the condensed water is generated in the first cavity 102, the condensed water can be drained through the drain hole, so that the effective drainage of the condensed water in the first cavity 102 can be realized, and the running stability and safety of electronic devices in the first cavity 102 are improved. In addition, the first chamber 102 in the present utility model may be provided in a closed flow channel, and since the inner space of the first chamber 102 is relatively closed, the external dust-containing air flow, high humidity air flow, etc. are difficult to enter into the first chamber 102, and the first radiator 11 provided in the first chamber 102 may have a certain condensation capacity, the humidity in the first chamber 102 may be effectively reduced by the cooperation of the exhaust port and the first radiator 11, and the stable operation of each component in the first chamber 102 may be maintained.
Of course, the bottom of the first cavity 102 of the present utility model may not be provided with a drain, and when the condensed water is generated in the first cavity 102, the condensed water may be stored in the first cavity 102, and due to the arrangement of the first radiator 11, the humidity in the first cavity 102 may be effectively reduced, and the condensed water stored in the bottom of the first cavity 102 may play a role in maintaining the humidity in the first cavity 102, so as to avoid excessively low humidity in the first cavity 102.
In some embodiments of the utility model, as shown in fig. 7, the first chamber 102 further includes a second flow passage 1022, the second flow passage 1022 being located on a second side of the housing 10, for directing the flow of heat dissipating air from the bottom of the housing 10 to the upper portion of the housing 10. Referring to fig. 7, the second flow passage 1022 is provided at the right side of the housing 10 and extends in the up-down direction, and the lower end of the second flow passage 1022 communicates with the right end of the first flow passage 1021. The heat dissipation air flow in the first flow passage 1021 can be sent to the upper part of the shell 10 through the second flow passage 1022 to realize heat dissipation of the electronic device on the upper part of the shell 10, wherein the electronic device can be arranged in the second flow passage 1022, so that the heat dissipation air flow passing through the second flow passage 1022 is utilized to dissipate heat; the second flow passage 1022 may also be used only as a passage for the conveyance of the air flow. The second flow passage 1022 may be adjusted according to actual use situations.
Wherein when no electronic devices are disposed in the second flow passage 1022, a portion of the electronic devices in the second cavity 103 can be disposed near the second flow passage 1022, so that not only can heat dissipation of the electronic devices be achieved by using the cooling capacity in the second flow passage 1022, but also mutual interference between the electronic devices can be further weakened. In addition, when no electronic device is provided in the second flow path 1022, the thickness of the second flow path 1022 in the left-right direction may be set to be relatively small to optimize the space utilization of the inverter apparatus 100, for example, the thickness of the second flow path 1022 in the left-right direction may be set to be smaller than the thickness of the first flow path 1021 in the up-down direction; of course, in combination with the embodiment described below, the thickness of the second flow passage 1022 in the left-right direction may be set smaller than the thickness of the third flow passage 1023 in the up-down direction, and the thickness of the second flow passage 1022 in the left-right direction may also be set smaller than the thickness of the fourth flow passage 1024 in the left-right direction.
In some embodiments of the utility model, as shown in fig. 6, the flow wall of the first flow passage 1021 includes a first baffle 121, the first baffle 121 being disposed adjacent to the second flow passage 1022, and the first baffle 121 being inclined downward with respect to the horizontal in a direction from the first side toward the second side. Through the first deflector 121, the air flow in the first flow passage 1021 can be guided to the first radiator 11, so that the air flow can exchange heat with the first radiator 11 better, and the air flow can bring the cooling capacity of the first radiator 11 to other positions in the first cavity 102, thereby realizing heat dissipation of electronic devices in the first cavity 102.
The flow passage wall of the second flow passage 1022 in the present utility model is provided to include the second flow guide plate 122, the second flow guide plate 122 is adjacent to the first flow passage 1021, the first flow guide plate and the second flow guide plate are connected in a direction from the first side toward the second side, and the second flow guide plate 122 is inclined upward with respect to the horizontal direction in a direction from the first side toward the second side, because of the flow guide effect of the first flow guide plate 121, resulting in a reduction in the cross-sectional area of the first flow passage 1021 and a relatively large air resistance of the air flow. The flow area of the air flow can be increased through the second flow guide piece, so that the air flow can be conveniently circulated, the noise in the air flow circulation process can be effectively reduced, the stability of the frequency conversion equipment 100 is improved, and the noise reduction of the frequency conversion equipment 100 is realized.
In addition, the first chamber 102 further includes a third flow passage 1023 disposed in an upper portion of the housing 10, the third flow passage 1023 directing a flow of heat dissipating air from the second side to the first side of the housing 10. Referring to fig. 6, a third flow path 1023 is provided at an upper portion of the housing 10 and extends in a left-right direction, and a right end of the third flow path 1023 communicates with an upper end of the second flow path 1022. The air flow can be guided conveniently by the guiding action of the third flow passage 1023, wherein the third flow passage 1023 is arranged at the upper part of the housing 10, and the cooled air flow can be guided to the third flow passage 1023 by the guiding action of the first flow passage 1021 and the second flow passage 1022. Electronic devices may be disposed in the third flow path 1023, wherein, because the position of the third flow path 1023 is relatively high, the influence of condensed water and the like may be avoided, and thus, electronic devices may be disposed in the third flow path 1023, and the stability of operation of the electronic devices may be improved.
The diodes 35 may be disposed in the third flow channel 1023, where a plurality of diodes 35 may be disposed in the third flow channel 1023, and the plurality of diodes 35 may be arranged along the airflow direction, for example, a plurality of columns of diodes 35 may be disposed in the third flow channel 1023, and each column includes at least one diode 35, where the plurality of columns of diodes 35 are sequentially arranged at intervals along the airflow direction, and two adjacent columns of diodes 35 may be disposed in a side-by-side manner or in a staggered manner.
Optionally, the first cavity 102 further includes a fourth flow channel 1024 disposed on the first side, the fourth flow channel 1024 guiding the flow of the heat dissipating air from above the housing 10 to the bottom of the housing 10. Referring to fig. 7, the fourth flow passage 1024 may be provided at the left side of the housing 10 and extend in the up-down direction, and an upper end of the fourth flow passage 1024 communicates with a left end of the third flow passage 1023, and a lower end of the fourth flow passage 1024 communicates with a left end of the first flow passage 1021. By the guiding action of the fourth flow passage 1024, the air flow can be guided to the first flow passage 1021, so that the first flow passage 1021, the second flow passage 1022, the third flow passage 1023, and the fourth flow passage 1024 are combined to form an annular heat exchange passage.
The fourth flow channel 1024 is located at the end of the circulating flow channel, and the cooling capacity of the cooling air flow is limited, so that some electronic devices with lower requirements on temperature can be placed in the fourth flow channel 1024, or in other words, electronic devices with higher working temperature can be placed in the fourth flow channel 1024.
Optionally, the first cavity 102 is configured into an annular shape extending along the peripheral wall of the housing 10 in the housing 10, where the first cavity 102 may have a simpler structure and a larger coverage area, and the first cavity 102 does not intercept the second cavity 103, and the second cavity 103 may also have a larger space to place electronic devices, and may facilitate arrangement of the electronic devices in the second cavity 103, thereby facilitating maintenance and use of the frequency conversion device 100, optimizing performance of the frequency conversion device 100, reducing a failure rate of the frequency conversion device 100, and improving stability.
Alternatively, the first cavity 102 is configured as a closed annular cavity and the second cavity 103 is spaced from the first cavity 102. The first cavity 102 is arranged in a closed mode, so that the airflow driving part 14 is convenient for driving the airflow, the airflow can be caused to exchange heat with the first radiator 11 fully, the heat dissipation efficiency and effect on the airflow in the first cavity 102 and the electronic devices in the first cavity 102 are effectively improved, the influence of the heat of the electronic devices in the first cavity 102 on the surrounding environment can be avoided, and the influence of the surrounding environment on the electronic devices in the first cavity 102 can also be avoided. At the same time, dust, water, high humidity air, etc. in the external environment can be reduced to affect the stable operation of the electronic devices in the first chamber 102.
Optionally, the first cavity 102 is disposed within the housing 10 proximate to a back plate of the housing 10. In addition, in combination with the foregoing embodiment, the first cavity 102 is a closed annular cavity, the first cavity 102 is disposed close to the back plate, and the electronic device in the second cavity 103 can be installed after the first cavity 102 is assembled, so that the first cavity 102 does not affect the installation of the electronic device in the second cavity 103, and the installation efficiency of the electronic device in the frequency conversion device 100 can be improved.
Optionally, the frequency conversion device 100 further includes a door body 20, where the door body 20 is connected to the housing 10 and configured to open and close the accommodating cavity 101, and the door body 20 covers the second cavity 103 when closing the accommodating cavity 101. The electronic components in the second chamber 103 may be wired, installed, maintained, commissioned, etc. by opening and closing the door 20. The door body 20 is arranged to facilitate the installation of electronic devices and the use of the frequency conversion equipment 100.
Referring to fig. 1 to 9, in some embodiments of the present utility model, a circuit breaker 31, a reactor 32, a capacitor 33, an IGBT34, and a diode 35 are disposed in a housing cavity 101, where the circuit breaker 31, the reactor 32, the capacitor 33, the IGBT34, and the diode 35 are electrically connected to implement a frequency conversion function, and they may be connected by a metal bar (e.g., a copper bar) or the like, so as to reduce the resistance in the operation process of the frequency conversion device 100, reduce energy consumption, save energy, and protect environment.
At least one of the circuit breaker 31, the reactor 32, the capacitor 33, the IGBT34, and the diode 35 is provided in the first chamber 102, and at least one is provided in the second chamber 103. By disposing these electronic devices in the first cavity 102 or the second cavity 103, effective heat dissipation of each electronic device can be achieved, and the efficiency and effect of heat dissipation can be improved.
Wherein, in combination with the foregoing, the first electronic device may include one or more of a circuit breaker 31, a reactor 32, a capacitor 33, an IGBT34, and a diode 35; the second electronic device may also include one or more of a circuit breaker 31, a reactor 32, a capacitor 33, an IGBT34, and a diode 35.
In addition, different heat dissipation modes may be provided according to different types of electronic devices, for example, the heat generated during the operation of the circuit breaker 31 may be relatively small, and may be disposed in the second cavity 103 and at a relatively remote location from the second heat sink 12; the reactor 32 generates relatively high heat during operation, and can be placed in the first cavity 102 to dissipate heat in a gas circulation manner; the heat quantity of the capacitor 33 in the operation process is lower than that of the reactor 32, the capacitor 33 can be placed in the first cavity 102, heat is dissipated in a gas circulation mode, and the first radiator 11, the capacitor 33 and the reactor 32 are sequentially arranged in the flowing direction of heat dissipation airflow, so that good heat dissipation of all components can be realized; the temperature of the IGBT34 and the diode 35 in the operation process is relatively high, and the placement of the IGBT34 and the diode 35 in the first cavity 102 may affect the heat dissipation effect of other components in the first cavity 102, so in the utility model, the IGBT34 and the diode 35 are preferably placed in the second cavity 103, and the second radiator 12 is used for dissipating heat, which not only can improve the heat dissipation effect of the IGBT34 and the diode 35, but also can avoid the heat in the operation process of the IGBT34 and the diode 35 from affecting the stable operation of other electronic devices.
The utility model provides frequency conversion equipment 100, wherein a first cavity 102 and a second cavity 103 are arranged in the frequency conversion equipment 100, heat dissipation is carried out in different modes, heat dissipation can be carried out according to heating power of different devices in the frequency conversion equipment 100, heat transfer among the devices can be reduced by components, heat dissipation effect is affected, and the purposes of moving isolation effect and anti-interference are achieved.
Referring to fig. 1 to 9, a frequency conversion apparatus 100 of the present utility model includes a housing 10 and a door 20, the housing 10 having a receiving chamber 101 therein and being openable and closable by the door 20, the receiving chamber 101 being divided into a first chamber 102 and a second chamber 103, the first chamber 102 being a closed annular chamber and being disposed along a peripheral wall of the housing 10, and the first chamber 102 being disposed around the second chamber 103, the first chamber 102 including a first flow passage 1021, a second flow passage 1022, a third flow passage 1023, and a fourth flow passage 1024 which are sequentially connected, a first radiator 11 being disposed in the first flow passage 1021, a first fan 141 being disposed between the first flow passage 1021 and the second flow passage 1022, a capacitor 33 being disposed in the third flow passage 1023, a reactor 32 being disposed in the fourth flow passage 1024, and a second fan 142 being disposed between the third flow passage 1023 and the fourth flow passage 1024. The air flow can flow along the first flow passage 1021, the second flow passage 1022, the third flow passage 1023 and the fourth flow passage 1024 to form a circulation loop under the driving of the first fan 141 and the second fan 142, and the air flow sequentially passes through the first radiator 11, the first fan 141, the capacitor 33, the second fan 142 and the reactor 32, so as to dissipate heat of the electronic device.
The second cavity 103 may be provided therein with a circuit breaker 31, a diode 35, an IGBT34, a transformer 36, a contactor 37, an electric control board, etc., and since the operating temperature of IGBT and the diode 35 is high, a second heat sink 12 is provided to dissipate heat of IGBT and the diode 35, wherein the second heat sink 12 may be stacked on the back surface of the case 10. The IGBT34 and the diode 35 are arranged side by side, and are stacked on the back plate of the case 10, and the contactor 37 and the transformer 36 are stacked on the back plate of the case 10, and are positioned below the IGBT 34.
Further, a junction box 13 is provided outside the case 10, and the junction box 13 is provided close to the circuit breaker 31, wherein the junction box 13, the circuit breaker 31, the reactor 32, the diode 35, the igbts 34, the transformer 36, the contactor 37, and the like are electrically connected to form a frequency conversion circuit (e.g., connected as a frequency conversion structure in the related art).
In addition, the utility model also provides a compressor which can comprise the frequency conversion equipment, and the frequency conversion of the compressor can be realized through the frequency conversion equipment, so that the frequency of the compressor can be conveniently adjusted according to different working conditions, and the energy efficiency is improved. In addition, the frequency conversion equipment is adopted in the utility model, so that the stability and effect of frequency conversion can be improved, the compressor can be operated stably, the fault rate of the compressor is reduced, the compressor can be operated stably at a preset frequency conveniently, the energy efficiency is improved, and the energy is saved and the environment is protected.
The utility model also provides heating and ventilation equipment which can comprise the frequency conversion equipment or the compressor. Through setting up foretell inverter, can improve the stability of warm logical equipment operation, in addition, first radiator and the second radiator in this inverter can dispel the heat for utilizing the mode of refrigerant phase transition, for example, this first radiator and second radiator can be connected to the unit or the compressor of warm logical equipment to utilize compressor etc. to realize the heat dissipation to the electronic device in the inverter, improve the stability of warm logical equipment and inverter. And the structure of the heating and ventilation equipment can be simplified, and the space utilization rate and the stability of the heating and ventilation equipment are optimized.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims (16)

1. A frequency conversion device (100), characterized by comprising:
a housing (10), the housing (10) being provided with a receiving cavity (101), the receiving cavity (101) being configured to receive an electronic device, the receiving cavity (101) comprising a first cavity (102) and a second cavity (103);
a first radiator (11) disposed in the first chamber (102) and configured to reduce the temperature in the first chamber (102) by means of gas flow;
and a second heat sink (12) configured to dissipate heat by heat conduction from the electronic component in the second cavity (103) and the electronic component in the first cavity (102).
2. The frequency conversion apparatus (100) according to claim 1, wherein the electronics comprise a first electronics and a second electronics, the first electronics being disposed in the first cavity (102) and the second electronics being disposed in the second cavity (103), the second heat sink (12) being in heat transfer engagement with the first electronics and the second electronics for dissipating heat from the first electronics and the second electronics using the second heat sink (12).
3. The frequency conversion apparatus (100) according to claim 2, wherein the first and second electronic devices are stacked with the second heat sink (12), respectively, to exchange heat.
4. The frequency conversion device (100) according to claim 1, wherein at least part of the second heat sink (12) is arranged within the receiving cavity (101).
5. The frequency conversion device (100) according to claim 4, wherein the second heat sink (12) is provided within the first cavity (102); or, the second radiator (12) is arranged in the second cavity (103); or, a part of the second radiator (12) is arranged in the first cavity (102), and the other part is arranged in the second cavity (103); or, a part of the second radiator (12) is arranged in at least one of the first cavity (102) and the second cavity (103), and the other part is arranged outside the accommodating cavity (101).
6. The frequency conversion device (100) according to claim 1, wherein the second heat sink (12) is arranged at the back of the housing (10) and corresponds to the position of at least part of the electronics within the first cavity (102) and at least part of the electronics within the second cavity (103).
7. The frequency conversion device (100) according to any one of claims 1-6, wherein the first heat sink (11) is an evaporator; and/or the second radiator (12) is a parallel flow radiator.
8. The frequency conversion device (100) according to any one of claims 1-6, wherein the first chamber (102) is configured as an annular chamber, the air flow within the first chamber (102) being adapted to circulate under the driving of the air flow driver (14) for heat dissipation.
9. The frequency conversion device (100) according to claim 8, wherein the first cavity (102) comprises a first flow channel (1021), the first flow channel (1021) being located at a bottom of the housing (10) and configured to direct a flow of heat dissipating air from a first side to a second side of the housing (10), the first heat sink (11) being arranged at the first flow channel (1021).
10. The frequency conversion device (100) according to claim 9, wherein the first cavity (102) further comprises a second flow channel (1022), the second flow channel (1022) being located at a second side of the housing (10) for guiding the heat dissipating air flow from the bottom of the housing (10) to the upper part of the housing (10).
11. The frequency conversion device (100) according to claim 10, wherein the first cavity (102) further comprises a third flow channel (1023) arranged in an upper portion of the housing (10), the third flow channel (1023) guiding the heat dissipating air flow from the second side to the first side of the housing (10).
12. The variable frequency device (100) of claim 11, wherein the first cavity (102) further comprises a fourth flow channel (1024) disposed on the first side, the fourth flow channel (1024) directing the flow of heat sink air from above the housing (10) to a bottom of the housing (10).
13. The frequency conversion device (100) according to any one of claims 1-6, wherein the first cavity (102) is configured as an annulus within the housing (10) extending along a peripheral wall of the housing (10);
and/or the first cavity (102) is configured as a closed annular cavity, and the second cavity (103) is mutually separated from the first cavity (102);
and/or the first cavity (102) is arranged within the housing (10) close to a back plate of the housing (10).
14. The frequency conversion device (100) according to any one of claims 1-6, wherein the frequency conversion device (100) further comprises:
the door body (20), the door body (20) with casing (10) links to each other, and is configured to open and close holding chamber (101), the door body (20) close holding chamber (101) time seal second chamber (103).
15. Compressor, characterized by comprising a frequency conversion device according to any of claims 1-14.
16. A heating ventilation device, characterized by comprising a frequency conversion device according to any one of claims 1-14; or a compressor according to claim 15.
CN202223426590.3U 2022-12-16 2022-12-16 Frequency conversion equipment, compressor and heating ventilation equipment Active CN219068797U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223426590.3U CN219068797U (en) 2022-12-16 2022-12-16 Frequency conversion equipment, compressor and heating ventilation equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223426590.3U CN219068797U (en) 2022-12-16 2022-12-16 Frequency conversion equipment, compressor and heating ventilation equipment

Publications (1)

Publication Number Publication Date
CN219068797U true CN219068797U (en) 2023-05-23

Family

ID=86347652

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223426590.3U Active CN219068797U (en) 2022-12-16 2022-12-16 Frequency conversion equipment, compressor and heating ventilation equipment

Country Status (1)

Country Link
CN (1) CN219068797U (en)

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