JP2002022841A - Radiation photographing apparatus and system equipped with it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the S/N ratio of an electric signal from being worsened by a vibration generated at the inside or the outside of an apparatus. SOLUTION: The radiation photographing apparatus is provided with a conversion means which converts a radiation into the electric signal, an amplification means which amplifies the signal converted by the conversion means, a processing means which processes the signal amplified by the amplification means, a transmission means which comprises a first signal wire used to transmit the signal to the amplification means from the conversion means and which comprises a second signal wire used to transmit the signal to the processing means from the amplification means and a heat conduction means which conducts heat generated by the amplification means to a cooling means. At least in a region which influences the electric charge of the signal passing through the first signal wire, the heat conduction means is constituted so as to correspond to the amplification means in a state that the heat conduction means does not face the transmission means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray imaging apparatus for medical diagnosis, and more particularly to a radiation imaging apparatus having an area sensor in which a plurality of photoelectric conversion elements are arranged on the same surface as an X-ray receiving medium, and It is related to a system provided.

[0002]

2. Description of the Related Art In various fields such as medical X-ray photography for medical diagnosis and nondestructive inspection of substances, a so-called radiographic method combining an intensifying screen and a radiographic film has been used. I have. According to this method, a radiographic image can be obtained directly as an image visualized on a radiographic film. In recent years, in the medical field, instead of the above radiographic film, Japanese Patent Application Laid-Open No. 08-116
An X-ray imaging apparatus having an area sensor surface on which a plurality of photoelectric conversion elements and a thin film transistor TFT are arranged as an X-ray receiving medium as disclosed in Japanese Patent No. 044 is proposed.

FIGS. 1A and 1B are a top view and a plan view, respectively, of a conventional X-ray imaging apparatus. FIG. 1 shows an a-Si sensor substrate (hereinafter, referred to as a “sensor substrate”) 1 made of glass on which a plurality of pixels including a photoelectric conversion element and a TFT are formed, and a shift from the sensor substrate 1. 2 shows a flexible circuit board 2 for connecting to a register SR1.

FIG. 1 shows a flexible substrate 3 on which a detection integrated circuit IC (hereinafter referred to as “IC”) is mounted and connects a sensor substrate 1 and a shift register SR2.
And a scintillator such as a phosphor 4 for converting X-rays into visible light, circuit boards PCB1 and PCB2 connected to the flexible circuit boards 2 and 3, and circuit boards PCB1 and PCB2.
And a signal processing circuit board 5 mounted with a memory connected thereto.

FIG. 1 shows a damper 6 made of an elastic material such as Si rubber, a frame 7 holding the sensor board 1 together with the damper 6, and a memory 8 mounted on the signal processing circuit board 5. A lead plate 9 attached to the back side of the frame 7 for protection from X-ray irradiation is shown. Note that points A and B in FIG. 1A conceptually show each pixel including a photoelectric conversion element and a TFT on the sensor surface.

In an X-ray imaging apparatus as shown in FIG. 1, before irradiation with X-rays, all pixels are refreshed by shift registers SR1 and SR2 and a control signal from a refresh control circuit (not shown). You are in the mode state. At this time, a TFT (not shown) in the pixel is in an on state. Next, when the control signal from the refresh control circuit is switched, the photoelectric conversion elements (not shown) in the pixels enter the photoelectric conversion mode, and the storage units (not shown) such as capacitors in the photoelectric conversion elements are initialized. Is done.

In this state, shift registers SR1 and SR2
When the control signal is switched, the TFT is turned off, and the drain electrodes (not shown) of the photoelectric conversion elements of all the pixels are opened, but the charge is held by the accumulation unit. In this state, when X-rays are irradiated, light emitted by the phosphor 4 is incident on the photoelectric conversion element, and an amount of signal charge corresponding to the intensity of the incident light is generated in the photoelectric conversion element, and is generated in the storage unit. Each is accumulated. The accumulated charges are sequentially amplified by the IC and transferred to the signal processing circuit board 5 via the circuit board PCB2.

[0008]

However, in the conventional X-ray imaging apparatus, the influence of vibration from the inside or the outside of the apparatus is not enough.
/ N ratio fluctuated and there was a problem that a good image could not be obtained. That is, an IC serving as an output-side amplifier
A resistor is built in, but when amplifying the electric charge from the sensor, a current flows through the resistor, and at that time, most of the electric energy is converted into thermal energy.

Then, the IC itself becomes a heat source, and a temperature gradient is generated on the sensor surface of FIG. 1A according to the distance from the IC through a signal line in the flexible substrate 3. Also, the ambient temperature around the IC rises due to heat transfer, and the ambient temperature of the sensor varies depending on the location.

Since a dark current remains in the photoelectric conversion element even after initialization, the amount of accumulation corrected by subtracting the amount is usually used as information detected by the photoelectric conversion element. When the temperature of the element changes, the amount of dark current changes accordingly. If there is a difference between the temperature at the time of correction and the temperature at the time of X-ray irradiation, a value different from the actual storage amount is output.

FIG. 10 is a graph showing the relationship between the dark current value and the temperature. The vertical axis shows the dark current value and the horizontal axis shows the temperature. The points A and B shown in FIG. 1A have a temperature gradient on the sensor surface due to the heat generated by the IC.
Assuming that ₁ ° C. and point B is t ₂ ° C., the ambient temperature is t
After all the pixels on the sensor surface are corrected at ° C, A becomes t ₁ ° C and B becomes t ₂ ° C due to the heat generated by the IC.

Point A is closer to the center than point B on the sensor surface.
And the distance from the IC ₁<T_TwoBecomes
t and t₁Since there is almost no difference, the value of the dark current at point A is supplemented.
It can be considered equivalent to the value at the time of correction, but t and t_TwoThen the difference
Even if it is corrected and the dark current at point B is subtracted,
Is output as a noise component. The IC itself
If the amount of heat of the IC increases too much, the internal resistance of the IC will melt and become necessary.
Unnecessary current flows to the circuit inside the IC, which may cause destruction.
There is. Such noise component increase and IC destruction
To prevent this, for example, the methods described below are adopted.
Have been.

FIG. 11 shows a state in which cooling fins 10 made of a metal having a high heat transfer coefficient, such as aluminum, which dissipates the heat generated by the IC itself are provided on the surface of the IC via the heat transfer member 11. FIG. The cooling fins 10 and the heat transfer member 11 have an elastic body 12 and a fixing plate 13 provided on the surface of the flexible substrate 3 opposite to the surface on which the IC is mounted, attached by sleeves 14a and 14b. Note that 11
Reference numerals a to 11c denote regions between the sleeves 14a and 14b, the upper side of the sleeve 14a with respect to the paper surface, and the lower side of the sleeve 14b, respectively. By the way, FIG.
, The same parts as in FIG. 1 are denoted by the same reference numerals.

The amount of heat transmitted to the cooling fins 10 is radiated from the surface of the cooling fins 10 into the air in the device, and is naturally cooled or forced by using a cooling fan (not shown) provided in the device. Heat is dissipated by cooling. As a material of the heat transfer member 11, a substance having a high heat transfer rate such as silicone rubber or boron nitride is used. Silicone rubber has a low hardness and plays a role of absorbing an error or the like at the time of mounting the flexible substrate 3 on which the IC is mounted and the cooling fin 10 as an elastic body.

In order to effectively transfer the heat from the IC, it is necessary to increase the surface area of each of the contact surfaces of the IC, the heat transfer member 11, and the cooling fin 10 for transferring heat, and to enhance the adhesion of each of the contact surfaces. is necessary. Therefore, as shown in FIG. 11, by fixing the fixing plate 13 and the cooling fins 10 with the sleeves 14a and 14b, the adhesion of the IC to the cooling fins 10 is enhanced.

In this state, the fixed plate 13 and the cooling fin 10
The distance between IC and flexible board 3 and heat transfer member 1
1. The dimensions are set smaller than the sum of the thicknesses of the elastic members 12, so that the heat transfer member 11 and the elastic members 12
Has been compressed moderately to increase the adhesion.

However, as shown in FIG. 11, the provision of the cooling fan 10 and the like causes the following problems in the configuration. FIGS. 12A and 12B are diagrams schematically illustrating the configuration of the IC, the flexible substrate 3, and the heat transfer member 11 for explaining the state of the problem.

As shown in FIG. 12, since the end surface of the heat transfer member 11 is not fixed, the regions 11b and 11c are caused by the cooling fan inside the apparatus or the vibration outside the apparatus.
Shaking occurs in the direction of the arrow in FIG. In addition, the flexible substrate 3 also swings in the direction of the arrow in FIG. As shown in FIG. 12A, the regions 11b and 11c are portions where the distance between the signal line passing through the inside of the flexible substrate 3 and the heat transfer member 11 changes, and these may approach each other.
In addition, each of the flexible substrate 3 and the heat transfer member 11 shown in the regions 11b and 11c in FIG.
The three holes are holes through which the sleeves 14a and 14b pass.

The charge accumulated on the sensor substrate 1 is referred to as an IC,
When transferring to the signal processing circuit board 5 via the PCB 2,
When the swinging occurs in the direction of the arrow in FIG. 12A, the distance between the heat transfer member 11 and the flexible substrate 3 changes, and the capacitance remaining on the heat transfer member 11 is
Destabilizes the capacity of the charge passing through the signal lines inside. In particular,
The electric charge passing through the signal lines in the flexible substrate 3 from the sensor substrate 1 to the IC is greatly affected by the change in the capacitance because the electric charge to which the noise component is added is amplified by the IC as it is. .

An image having such a problem is displayed on a CRT.
Also, when output is performed by a printer or the like, there is a portion where a difference occurs with the irradiation density actually distributed by X-rays. If a lesion of a patient who has taken an image is present in that portion, the lesion may not be found.

Therefore, an object of the present invention is to prevent the S / N ratio of an electric signal from being deteriorated by vibration generated outside or inside the apparatus.

[0022]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a converting means for converting radiation into an electric signal, an amplifying means for amplifying a signal converted by the converting means, and an amplifying means. Processing means for processing the signal amplified in step (a), and a second signal line for transmitting a signal from the conversion means to the amplification means, and a second signal line for transmitting a signal from the amplification means to the processing means. In a radiation imaging apparatus including a flexible transmission member having a signal line and a heat transfer unit that transfers heat generated by the amplification unit to a cooling unit, at least the charge of a signal passing through the first signal line is affected. In a region where the heat transfer means does not face the transfer member, the heat transfer means is configured to correspond to the amplification means.

Further, the present invention provides a conversion means for converting radiation into an electric signal, an amplification means for amplifying the signal converted by the conversion means, a processing means for processing the signal amplified by the amplification means, A flexible transmission member having a first signal line for transmitting a signal from the conversion means to the amplification means and having a second signal line for transmitting a signal from the amplification means to the processing means; In a radiation imaging apparatus comprising: a heat transfer unit that transfers heat generated by the amplifying unit to a cooling unit, an insulator is provided between the amplifying unit and the heat transfer unit, and the cooling unit is dropped to ground. It is characterized by.

Further, the present invention provides a converting means for converting radiation into an electric signal, an amplifying means for amplifying the signal converted by the converting means, a processing means for processing the signal amplified by the amplifying means, A flexible transmission member having a first signal line for transmitting a signal from the conversion means to the amplification means and having a second signal line for transmitting a signal from the amplification means to the processing means; In a radiation imaging apparatus provided with a heat transfer unit that transfers heat generated by the amplification unit to a cooling unit, the heat transfer unit and the cooling unit are fixed by a fixing member on the first signal line side, and the fixing is performed. It is characterized in that the member is dropped to ground.

Still further, according to the present invention, there is provided a radiation image pickup system, the radiation image pickup apparatus according to any one of the above, a signal processing means for processing a signal from the radiation image pickup apparatus, and a signal from the signal processing means. Recording means for performing, a display means for displaying a signal from the signal processing means, a transmission processing means for transmitting a signal from the signal processing means, and a radiation source for generating the radiation It is characterized by having.

[0026]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1A is a plan view showing a configuration of an X-ray imaging apparatus according to Embodiment 1 of the present invention. FIG. 1B is a cross-sectional view of FIG. In FIG. 1, an a-Si sensor substrate (hereinafter, referred to as a “sensor substrate”) 1 made of glass and formed with a plurality of pixels as a conversion unit including a photoelectric conversion element and a TFT, and an amplification unit. (Hereinafter referred to as “I
C ". ), A flexible substrate 3 which is a transmission member for connecting the sensor substrate 1 and the shift register SR2, a scintillator such as a phosphor 4 for converting X-rays into visible light, and a circuit connected to the flexible substrate 3. FIG. 3 shows a substrate PCB2 and a signal processing circuit substrate 5 which is a processing unit mounted with a memory connected to the circuit substrate PCB2.

FIG. 1 shows a damper 6 made of an elastic material such as Si rubber, and a sensor board 1 together with the damper 6.
And a lead plate 9 attached to the back side of the frame 7 for the purpose of protecting the memory 8 mounted on the signal processing circuit board 5 from X-ray irradiation.

FIG. 2A is a peripheral view of the flexible substrate 3 of FIG. 1A. FIG. 2B is a peripheral view of the heat transfer member 15 serving as the heat transfer unit viewed from the cooling fin 10 serving as the cooling unit. FIG. 2 shows a cooling fin 10 made of a metal having a high heat transfer coefficient, such as aluminum, which radiates the heat generated by the IC itself, and a cooling fin 1.
0, a heat transfer member 15 for transferring heat to the flexible substrate 3, an elastic body 12 and a fixing plate 13 provided on a surface of the flexible substrate 3 opposite to the surface on which the IC is mounted, an elastic body 12 and the fixing plate 13, a cooling fin 10, and a heat sink. A sleeve 14a for connecting with the transmission member 11,
14b. In addition, among the signal lines passing through the flexible substrate 3, the signal line on the sleeve 14a side is a first signal line, and the signal line on the sleeve 14b side is a second signal line.

As shown in FIG. 2, in this embodiment, the IC
A heat transfer member 15 having an area equal to or smaller than the area of the mounting surface of the flexible substrate 3 and the flexible substrate 3. Thereby, the heat transfer member 1
The distance between the signal line 5 and the signal line of the flexible substrate 3 is not changed by vibration or the like. The heat transfer member 15
Is provided so as to be pressed between the IC and the cooling fin 10.

(Embodiment 2) FIG. 3 is a peripheral view of a heat transfer member 16 according to an X-ray imaging apparatus of Embodiment 2 of the present invention. In FIG. 3, reference numeral 16a denotes a region of the heat transfer member 16 that is not in contact with the IC. FIG.
In FIG. 1, the same parts as those in FIG. 1B are denoted by the same reference numerals.

As shown in FIG. 3, in the present embodiment, the second
A heat transfer member 16 having a shape that can be fixed by a sleeve 14b as a holding member is used. When the heat transfer member 16 is used, the heat transfer member 1
6 and the IC can be easily aligned.

When such a heat transfer member 16 is used, the distance between the region 16a and the signal line in the flexible substrate 3 may fluctuate due to vibrations generated by driving a cooling fan or the like. The signal passing through the signal line has already been amplified by the IC. Therefore, when the amplified signal is less affected by the charge in the region 16a, the heat transfer member 16 may be used as shown in FIG.

(Embodiment 3) FIG. 4 is a peripheral view of a heat transfer member 17 according to an X-ray imaging apparatus of Embodiment 3 of the present invention. In FIG. 4, reference numerals 17a to 17c denote regions of the heat transfer member 17 that are in contact with the IC and regions that are not in contact with the IC, that is, regions on the sleeve 14a side and 14b side that are the first holding members. Is shown. Also,
In FIG. 4, the same parts as those in FIG. 1 (b) are denoted by the same reference numerals.

In this embodiment, the sleeves 14a, 14b
The heat transfer member 17 is positioned so that it does not come into contact with the signal lines in the flexible substrate 3.
Specifically, the shape of the regions 17a and 17b has a U-shaped groove on the end face that comes into contact with the sleeves 14a and 14b, respectively, and the U-shaped groove is formed in the sleeves 14a and 14b.
, The positioning of the heat transfer member 17 is facilitated similarly to the second embodiment.

It is necessary that the distances x1 and x2 between the regions 17b and 17c in the lateral direction of the drawing are set so as not to deteriorate the S / N ratio. This corresponds to the areas 17b, 17
Since the distance between the flexible substrate 3 and the flexible substrate 3 may be short due to vibration, if the distance is too long, the region 17 may be vibrated.
This is because the electric charges passing through the signal lines in the flexible substrate 3 become unstable when the flexible substrate 3 approaches the flexible substrate 3.

(Embodiment 4) FIG. 5A is a peripheral view of a heat transfer member 11 of an X-ray imaging apparatus according to Embodiment 4 of the present invention. FIG. 5B is a cross-sectional view taken along a line AB in FIG. 5A as viewed from the direction of the arrow in the drawing. In the present embodiment, the heat transfer member 11 and the cooling fin 10 are fixed by the fixing members 18 and 19. Specifically, the cooling fin 10 and the region 11b are sandwiched by the fixing member 18, and the cooling fin 10 and the region 11c are sandwiched by the fixing member 19.

Here, the flexible substrate 3 is vibrated by vibration.
In some cases, the distance between the first and second regions 11b and 11c is short. Therefore, the material of the fixing members 18 and 19 is made of a conductive material, and the cooling fin 10 is dropped to the ground of 0 potential, as shown in FIG. 19 and the cooling fin 10 are connected via a ground wire 20.

If the cooling fins 10 cannot be dropped to the ground of potential 0, the ground is dropped to another casing of potential 0 (not shown) in the apparatus, so that the space between the areas 11b and 11c and the flexible substrate 3 can be reduced. Thus, even if the flexible substrate 3 is shaken by vibration, the conductor is not easily affected by the capacitance contained in the heat transfer member 11.

On the side of the region 11c of the heat transfer member 11, as described in the second embodiment, the signal after being amplified by the IC changes due to the fluctuation of the distance between the region 11c and the flexible substrate 3 due to vibration. In the case where there is no influence from the capacitance, the fixing member 19 may not be used.

(Embodiment 5) FIG. 6 is a peripheral view of a heat transfer member 22 according to an X-ray imaging apparatus of Embodiment 5 of the present invention. In the present embodiment, the insulator 24 is provided between the heat transfer member 22 and the IC. The heat transfer member 22 is made of a conductive fiber obtained by weaving a material having a high heat transfer rate, such as silicone rubber or boron nitride, and polyamide and silver. The cooling fin 10 is made of a metal having a high heat transfer coefficient, such as aluminum or copper, and the surface of the cooling fin 10 in contact with the heat transfer member 22 is not subjected to film treatment to prevent oxidation. The potential difference between the fin 10 and the heat transfer member 22 becomes zero.

Since the cooling fins 10 are grounded to another casing (not shown) having a potential of 0 in the apparatus, the heat transfer member 22 also has the potential of 0. Therefore, even if the heat transfer member 22 and the flexible substrate 3 oscillate due to vibration, there is no capacitance in the heat transfer member 22 that affects the electric charge passing through the signal line in the flexible substrate 3, so that S / N The ratio does not deteriorate.

By the way, an IC usually has a housing for protecting a circuit inside the IC. However, in order to make the IC thinner and to efficiently release the heat of the resistance inside the IC to the outside of the IC, the housing is generally used. Some of them have no body, and others have a case in which a housing gives a potential as part of a circuit. In this case, the insulator 24
Also plays a role of preventing the heat transfer member 22, which is a conductor, from coming into direct contact with the IC. Therefore, the advantage of the heat transfer member can be effectively used even for an IC having a potential on its surface.

(Embodiment 6) FIG. 7A is a peripheral view of a heat transfer member 11 according to an X-ray imaging apparatus of Embodiment 6 of the present invention. FIG. 7B is a cross-sectional view taken along a line AB in FIG. In this embodiment, the flexible substrate 3 and the cooling fins 10 are fixed by the fixing member 25, and the flexible substrate 3 and the regions 11b and 11b are further fixed.
A spacer 26 is provided between the first and second members c and c so that these distances do not change.

The fixing member 25 is shown in FIGS. 7 (a) and 7 (b).
As shown in FIG. 5, the cooling fin 10, the heat transfer member 11, the spacer 26, and the flexible substrate 3 are sandwiched therebetween. The spacer 26 is a resin-based insulator such as polycarbonate, and has a thickness equal to the thickness of the IC on the flexible substrate 3.

Further, the fixing member 25 allows the regions 11b,
11c and the flexible substrate 3 are fixed, so that their distance does not change due to vibration. Therefore, the capacitance affecting the charge passing through the signal line in the flexible substrate 3 does not change, and the S / N ratio does not deteriorate.

On the side of the region 11c of the heat transfer member 11, as described in the second embodiment, the signal after being amplified by the IC causes the distance between the region 11c and the flexible substrate 3 to fluctuate due to vibration. In the case where there is no influence from the capacitance, the fixing member 25 may not be used.

(Embodiment 7) FIGS. 8A and 8B are a schematic configuration diagram and a schematic cross-sectional view of a mounting example of an X-ray detector according to Embodiment 7 of the present invention. Photoelectric conversion element and TFT
A plurality of (transistors) are formed in the a-Si sensor substrate 6011, and the shift register SR1 is connected to the flexible circuit board 6010 on which the integrated circuit IC for detection is mounted.

The opposite side of the flexible circuit board 6010 is connected to the circuit boards PCB1 and PCB2. A-
A lead plate 6013 for protecting the memory 6014 in the processing circuit 6018 from X-rays is provided below the base 6012 that forms a large-sized photoelectric conversion device by bonding a plurality of Si sensor bases 6011 on the base 6012. Has been implemented.

On the a-Si sensor substrate 6011, a scintillator 6030 for converting X-rays into visible light, for example, CsI is deposited. As shown in FIG. 8B, the whole is housed in a case 6020 made of carbon fiber.

FIG. 9 shows an example of application of the X-ray detector of FIG. 8 to an X-ray diagnostic system. X-ray tube 6
X-ray 6060 generated at 050 is the patient or subject 6
061 through the chest 6062, and enters the photoelectric conversion device 6040 on which the scintillator is mounted. The incident X-ray includes information on the inside of the body of the patient 6061.

The scintillator emits light in response to the incidence of X-rays, and photoelectrically converts the light to obtain electrical information. This information is converted into digital data, image-processed by an image processor 6070, and can be observed on a display 6080 in the control room.

Further, this information can be transferred to a remote place by a transmission means such as a telephone line 6090, displayed on a display 6081 such as a doctor's room at another place, or stored in a storage means such as an optical disk. It is also possible to make a diagnosis. Also film processor 6
100 can also be recorded on the film 6110.

In each of the embodiments of the present invention described above, the case where the X-ray imaging apparatus is used has been described as an example.
Radiation such as β and γ rays can be used. Light is electromagnetic waves in a wavelength region that can be detected by the photoelectric conversion element, and includes visible light. Further, the present invention can be applied to, for example, an electromagnetic wave electric signal converter that converts electromagnetic waves including radiation into electric signals.

[0055]

As described above, according to the present invention, in a region where the electric charge of the signal passing through the first signal line is affected, the heat transfer means is configured to correspond to the amplification means without being opposed to the transfer member. Therefore, it is possible to prevent the S / N ratio of the electric signal from being deteriorated by vibration generated outside or inside the device.

[Brief description of the drawings]

FIG. 1 is a plan view and a cross-sectional view illustrating a configuration of an X-ray imaging apparatus according to a first embodiment of the present invention.

FIG. 2 is a peripheral view of the flexible substrate of FIG. 1;

FIG. 3 is a peripheral view of a heat transfer member according to the X-ray imaging apparatus of Embodiment 2 of the present invention.

FIG. 4 is a peripheral view of a heat transfer member according to an X-ray imaging apparatus according to Embodiment 3 of the present invention.

FIG. 5 is a peripheral view of a heat transfer member according to an X-ray imaging apparatus of Embodiment 4 of the present invention.

FIG. 6 is a peripheral view of a heat transfer member according to an X-ray imaging apparatus of Embodiment 5 of the present invention.

FIG. 7 is a peripheral view of a heat transfer member according to an X-ray imaging apparatus according to Embodiment 6 of the present invention.

FIG. 8 is a schematic configuration diagram and a schematic cross-sectional view of a mounting example of an X-ray detection device according to a seventh embodiment of the present invention.

9 shows an application example of the X-ray detection device of FIG. 8 to an X-ray diagnostic system.

FIG. 10 is a graph showing a relationship between a dark current value and a temperature;
The vertical axis shows the value of dark current, and the horizontal axis shows temperature.

FIG. 11 is a diagram showing a state in which cooling fins are provided on the surface of an IC via a heat transfer member.

FIG. 12 is a diagram schematically illustrating configurations of a flexible circuit board and a heat transfer member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sensor board 3 Flexible board 10 Cooling fins 11, 15, 16, 17, 22 Heat transfer member 18, 19, 25 Fixing member 24 Insulator 26 Spacer PCB2 Circuit board IC Detection integrated circuit

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification FI theme coat テ ー マ (reference) H01L 31/09 H01L 31/00 A F term (reference) 2G088 EE03 EE29 FF02 GG19 GG20 GG21 JJ05 JJ09 JJ37 LL21 LL23 4C093 AA03 CA06 EB12 EB13 EB17 EB20 5F088 AB05 BA03 BA10 BB07 EA04 EA07 GA02 HA15 JA16 LA07 LA08

Claims (10)

[Claims] A converting means for converting radiation into an electric signal; an amplifying means for amplifying the signal converted by the converting means; a processing means for processing the signal amplified by the amplifying means; A flexible transmission member having a first signal line for transmitting a signal to the amplifying means and having a second signal line for transmitting a signal from the amplifying means to the processing means; A radiation imaging apparatus comprising: a heat transfer unit configured to transfer generated heat to a cooling unit, wherein the heat transfer unit does not face the transfer member at least in a region that affects a charge of a signal passing through the first signal line. And a radiation imaging apparatus configured to correspond to the amplification means. 2. The heat transfer means is brought into contact with the amplification means, and the total area of the surface of the heat transfer means in contact with the amplification means is brought into contact with the heat transfer means of the amplification means. The radiation imaging apparatus according to claim 1, wherein the total area of the surfaces is smaller than the total area. 3. The heat transfer means is held by first and second holding members for keeping a distance between the cooling means and the amplification means on both the first and second signal lines. The radiation imaging apparatus according to claim 1 or 2, wherein 4. The heat transfer means is provided with a hole through which the second holding member passes, and the position of the heat radiating means main body is held by passing the second holding member through the hole. The radiation imaging apparatus according to claim 3. 5. The radiation imaging apparatus according to claim 3, wherein the heat transfer means is shaped so as to be positioned by the first and second holding means. 6. A converting means for converting radiation into an electric signal, an amplifying means for amplifying the signal converted by the converting means, a processing means for processing the signal amplified by the amplifying means, and: A flexible transmission member having a first signal line for transmitting a signal to the amplifying means and having a second signal line for transmitting a signal from the amplifying means to the processing means; A radiation imaging apparatus comprising: a heat transfer unit that transfers generated heat to a cooling unit; wherein an insulator is provided between the amplification unit and the heat transfer unit, and the cooling unit is dropped to ground. Radiation imaging device. 7. Conversion means for converting radiation into an electric signal, amplification means for amplifying the signal converted by the conversion means, processing means for processing the signal amplified by the amplification means, A flexible transmission member having a first signal line for transmitting a signal to the amplifying means and having a second signal line for transmitting a signal from the amplifying means to the processing means; A radiation imaging apparatus comprising: a heat transfer unit that transfers generated heat to a cooling unit; wherein the heat transfer unit and the cooling unit are fixed by a fixing member on the first signal line side, and the fixing member is grounded. A radiation imaging apparatus characterized by being dropped. 8. The fixing member according to claim 7, wherein the fixing member further fixes the cooling means side and the transmission member via an insulator between the heat transmission member and the transmission member. The radiation imaging apparatus according to claim 1. 9. The radiation imaging apparatus according to claim 7, wherein the heat transfer means and the cooling means are fixed by a fixing member on the second signal line side, and the fixing member is dropped to the ground. apparatus. 10. A radiation imaging apparatus according to claim 1, a signal processing means for processing a signal from said radiation imaging apparatus, and a recording means for recording a signal from said signal processing means. Display means for displaying a signal from the signal processing means, transmission processing means for transmitting a signal from the signal processing means, and a radiation source for generating the radiation. Characteristic radiation imaging system.