JP2002009267A - Solid-state image pickup device, its manufacturing method, image reading unit, and image scanning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small, thin, and lightweight solid-state image pickup device by face-down mounting a solid-state image pickup chip onto a glass substrate and fixing the solid-state image pickup chip and the glass substrate, with sealing of only the periphery of the solid-state image pickup chip in order to prevent water arrival at the surface of the solid-state image pickup chip. SOLUTION: This solid-state image pickup device comprises a projection 71a in a glass substrate 71 to closely attach an effective pixel area 75a of a CCD bare chip 75, bumps 74 conducting current between the CCD bare chip 75 and the wiring patterns 73 on the glass substrate 81, and a sealing mold S2 which adheres the periphery of bare chip 75 with the glass substrate 71.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device such as an image reading device for reading an optical image using a solid-state image pickup device, for example, a copying machine, an image scanner, a facsimile, a digital camera, a video camera, a stomach camera and the like. The present invention relates to a semiconductor mounting technology that can be applied.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a solid-state imaging device, a method of mounting a solid-state imaging device represented by a CCD in a package using ceramic as an insulating substrate (hereinafter referred to as a ceramic package) has been mainly used.

Hereinafter, a conventional solid-state imaging device will be described with reference to the drawings. FIG. 8 is a sectional view showing a conventional solid-state imaging device.

The conventional solid-state imaging device shown in FIG. 8 has a solid-state imaging device 8 in a recess 802a on the upper surface of a ceramic package 802 having a terminal group 801 for outputting an electric signal to the outside.
03 is mounted with the light receiving portion facing up, and the electrodes 8 on the inner periphery of the concave portion 802a on the upper surface of the ceramic package 802 are mounted.
04 and an electrode formed around the surface of the solid-state imaging device 803 are made of aluminum (Al) by a wire bonding method.
Alternatively, they are electrically connected by a thin metal wire 805 such as gold (Au), and the upper opening of the ceramic package 802 is sealed in a lid shape with quartz glass 806 for sealing in order to protect the solid-state imaging device 803. Configuration.

The operation of the conventional solid-state imaging device configured as described above will be described below.

As shown in FIG. 8, incident light 807 when a subject or the like is photographed passes through a quartz glass 806 for sealing provided on the upper surface of a ceramic package 802 and is incident on a solid-state imaging device 803. The light receiving area on the surface of the solid-state image sensor 803 varies from 200,000 to 4
Light receiving portions (not shown) called 100,000 photodiodes are formed. Recently, the light receiving sensitivity has been reduced due to the miniaturization of the light receiving section itself, and a microlens made of resin has been formed on the light receiving section to increase the light receiving sensitivity. That is, the incident light 807 passes through the quartz glass 806 and is condensed by the microlens on the surface of the light receiving area of the solid-state imaging device 802 before being incident on the light receiving unit, converted into an electric signal, and processed as image data.

Next, a conventional method for manufacturing a solid-state imaging device will be described with reference to the drawings. 9 (A) to 9
(C) is a cross-sectional view illustrating a method for manufacturing a conventional solid-state imaging device.

In the conventional method for manufacturing a solid-state imaging device shown in FIGS. 9A to 9C, the solid-state image pickup device A first step of mounting the image sensor 803 with the light receiving image facing up, and a ceramic package 8
A second step of electrically connecting the electrode 804 on the inner periphery of the concave portion 802a on the upper surface of the substrate 02 and the electrode formed on the periphery of the surface of the solid-state imaging device 803 by a thin metal wire 805 by a wire bonding method; The third step is to seal the upper opening of the ceramic package 802 in a lid shape with quartz glass 806 for sealing for the purpose of protecting the element 3.

The operation of the conventional method of manufacturing the solid-state imaging device having the above-described configuration will be described below.

First, the first die bonding step will be described with reference to FIG. The solid-state imaging device 80 is provided in the concave portion 802a on the upper surface of the ceramic package 802.
3 is mounted by a device called a die bonder with its light receiving portion facing upward. The solid-state imaging device 803 and the ceramic package 802 are fixed using a conductive adhesive such as a thermosetting silver paste. The conductive adhesive is cured by heating at a temperature of about 150 ° C.

Next, the second wire bonding step will be described with reference to FIG. After the die bonding step, the concave portion 80 on the upper surface of the ceramic package 802 is formed.
The electrode 804 on the inner periphery of 2a and the electrode formed on the periphery of the surface of the solid-state imaging device 803 are connected by a wire bonder.
Gold (Au) or aluminum (Al) metal wire 80
5 is electrically connected. In addition, an electrode 804 on the inner periphery of the concave portion 802a on the upper surface of the ceramic package 802,
It corresponds to a terminal group 801 that outputs an electric signal to the outside of the ceramic package 802.

Finally, the third sealing step will be described with reference to FIG. After the wire bonding, the upper opening portion of the ceramic package 802 is sealed in a lid shape with quartz glass 806 for sealing for the purpose of protecting the solid-state imaging device 803 from the outside, and a solid-state imaging device is realized. When sealing in a lid shape with quartz glass 806,
Since the space between the solid-state imaging device 803 and the quartz glass 806 after sealing needs to be kept in a vacuum in order to maintain high reliability, the sealing is performed in a vacuum state. A thermosetting adhesive is used for sealing, and thereby the quartz glass 806 and the ceramic package 802 are bonded.

[0013]

In the configuration of the conventional solid-state imaging device as described above, as an electric connection method of the solid-state imaging device, an electrode of the ceramic package and an electrode of the solid-state imaging device are connected by a thin metal wire. However, an area for forming an electrode for wiring a wire around the solid-state imaging device is required, and a gap required for forming a loop of a thin metal wire between the solid-state imaging device and the quartz glass for sealing is required. Must also be provided. For this reason, it is difficult to reduce the size, thickness, and weight.

In the manufacture thereof, as a method of solving these problems, a so-called flip-chip method in which a projection is provided on an electrode terminal of a semiconductor element to directly join the circuit board face-down, that is, a so-called flip-chip method is applied. A method is considered in which a projection is provided on an electrode, a circuit is formed on a glass substrate, and the solid-state imaging device is joined face-down.

Accordingly, the present invention provides a method for mounting a solid-state imaging device face down on a glass substrate, and further fixing the solid-state imaging device and the glass substrate to prevent moisture from reaching the surface of the solid-state imaging device. It is another object of the present invention to provide a small, thin, and lightweight solid-state imaging device in which only a peripheral portion of a solid-state imaging device is sealed, a manufacturing method thereof, a reading unit, and an image scanning device.

[0016]

In order to achieve the above object, a first aspect of the present invention is a solid-state imaging device in which an imaging device faces a wiring pattern provided on a transparent member such as glass in a face-down state. A projection for adhering a pixel effective area of the image sensor to the transparent member, a bump for conducting between the image sensor and a wiring pattern of the transparent member, and an outer periphery of the image sensor and the transparent member A solid-state imaging device, comprising: a sealing resin for bonding the side.

According to a second aspect of the present invention, in the solid-state imaging device according to the first aspect, a height of the bump provided on the imaging element or the wiring pattern and at least one of the imaging element and the transparent member. Is characterized in that the height of the projections formed on the surface is substantially equal.

[0018] The invention of claim 3 is the invention of claim 1 or 2.
Wherein the sealing resin is opaque.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a solid-state imaging device in which an image pickup device faces a wiring pattern provided on a transparent member such as glass in a face-down state. The area and the transparent member are brought into close contact with each other via the projection, and the bump is connected between the image pickup device and the wiring pattern of the transparent member, and then these are brought near the outer periphery of the image pickup device and the transparent member. A method for manufacturing a solid-state imaging device, comprising applying a sealing resin to be bonded, and thereafter curing the sealing resin.

According to a fifth aspect of the present invention, in the method for manufacturing a solid-state imaging device according to the fourth aspect, the sealing resin is opaque.

According to a sixth aspect of the present invention, there is provided an image reading unit using the solid-state imaging device according to any one of the first to third aspects.

According to a seventh aspect of the present invention, there is provided an image scanning apparatus using the image reading unit according to the sixth aspect.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a method for manufacturing the solid-state imaging device according to the first embodiment of the present invention. As shown in FIG. 1C, this solid-state imaging device includes an integrated circuit for converting optical information such as a line CCD and an area CCD into an electric signal.
A wiring board 73 for electrical connection is disposed facing the circuit forming surface of the D bare chip 75, that is, a glass substrate 71 which is a transparent member disposed in a face-down state;
Pixel effective area 75a of D bare chip 75 and glass substrate 7
1 and a projection 71a of a glass substrate
Wiring pattern 7 between CD bear chip 75 and glass substrate 71
3 is provided. In addition,
In this embodiment, the bumps 74 are used for the CCD bare chip 7.
Although it is provided on the side of the glass substrate 71, it is needless to say that it may be provided on the side of the glass substrate 71.

The CCD bare chip 75 is formed by forming a circuit on a silicon wafer and cutting it to a required size. When mounted, the flatness of the pixel portion is required. Is formed. Further, since the CCD bare chip 75 is adversely affected by dust, dew, and the like due to the external atmosphere, it is necessary to be shielded from the external atmosphere.

The glass substrate 71 is, as described above,
A protrusion 71 a having a height C is formed on the side facing the CCD bare chip 75, that is, on the wiring pattern 73 side for electrical connection. The projection 71a is formed to include a pixel effective area on the glass substrate 71 side corresponding to the pixel effective area 75a of the CCD bare chip 75. That is, it is formed in a size that does not hinder the light beam incident on the pixel effective area 75a of the CCD bare chip 75.

The glass substrate 71 is made of a member having a high light transmittance, and the flatness of a portion of the CCD bare chip 75 which is in contact with and fixed to a pixel is formed to a required flatness. The glass substrate 71 has a wiring pattern 73 as an electric circuit formed on the surface on which the CCD bare chip 75 is mounted. In this embodiment, the glass substrate 71 is used as a transparent member.
Is used, but a member having high light transmittance such as plastic for a lens may be used instead of the glass substrate.

The bump 74 has a projection shape for establishing conduction between the CCD bare chip 75 and the wiring pattern 73 of the glass substrate 71, and its height A is the height C of the projection 71a.
Are formed almost equally. Thus, conduction between the CCD bare chip 75 and the electric circuit of the glass substrate 71 can be ensured, and the flatness of the CCD bare chip 75 can be maintained.

The periphery of the bump 74 is covered with a sealing resin S2.
Is sealed. Therefore, the bump 74 is also in a sealed state. At this time, a space S is formed inside the bump 74.

The sealing resin S2 may be transparent, but need not be transparent, and in this embodiment, an opaque resin is used. By using such an opaque resin, it is possible to prevent unnecessary light from entering the pixel effective area 75a of the CCD bare chip 75, so that the image quality is improved. Further, since it is not necessary to use expensive transparent resin, it is advantageous in cost as compared with the case where transparent resin is used. The sealing resin S2 preferably has a low coefficient of thermal expansion.

Although the sealing resin S2 is an opaque resin in the present embodiment, it may be an ultraviolet-curable adhesive, another light-curable adhesive, or another transparent adhesive. May be. For example, an adhesive having high optical properties, for example, balsam, epoxy resin, fluorine resin, silicon, or the like can be used. The pixel effective area 75a
Is an area on the image sensor where the photocell array (the part of the circuit for reading an image of the image sensor) is provided.

In order to manufacture the solid-state imaging device as described above, first, as shown in FIG. 1A, the CCD bare chip 75 is placed face down on the surface of the glass substrate 71 on the wiring pattern 73 side. To face.

Next, as shown in FIG. 1B, the CCD bare chip 75 and the projection 71a of the glass substrate 71 are in close contact with each other, and the CCD bare chip 75 and the glass substrate 71
The CCD bare chip 75 and the glass substrate 71 are brought close to a predetermined distance so that the wiring pattern 73 is electrically connected to the wiring pattern 73 by the bumps 74 to cover the pixel effective area 75a.

Thereafter, as shown in FIG. 1C, the outside of the bump 74, ie, the outer periphery of the glass substrate 71 is covered with a sealing resin S2 to seal the bump 74 and the inside of the bump 74, and the CCD is formed. Bare chip 75 and glass substrate 71
And concatenate. That is, the entirety of the pixel effective area 75a including the conductive bumps 74 is filled with the sealing resin S2 and cured.

FIG. 5 is a perspective view of the solid-state imaging device of FIG. 1, and the solid-state imaging device as shown in FIG. 5 is manufactured as described above. In FIG. 5, reference numeral 77 denotes an FPC (flexible wiring board) connected to the wiring pattern 73;
Symbol L is incident light from the imaging lens.

FIG. 2 is a diagram showing a method for manufacturing a solid-state imaging device according to a second embodiment of the present invention. As shown in FIG. 2C, this solid-state imaging device includes a line CCD, an area CCD,
A CCD bear chip 75 which is a solid-state imaging device, and a wiring pattern 73 for electrical connection on a circuit forming surface of the CCD bear chip 75.
Are disposed facing each other, that is, a glass substrate 71 which is a transparent member disposed in a face-down state, and a pixel effective region 75a of the CCD bare chip 75 which closely adheres the pixel effective region 75a of the CCD bare chip 75 to the glass substrate 71. And a bump 74 for conducting between the CCD bear chip 75 and the wiring pattern 73 of the glass substrate 71.
And Although the bumps 74 are provided on the CCD bare chip 75 side in the present embodiment, the glass substrate 7
Of course, it may be provided on one side.

The CCD bare chip 75 is formed by forming a circuit on a silicon wafer and cutting it to a required size. When mounted, the flatness of the pixel portion is required. Is formed to the required flatness. Further, since the CCD bare chip 75 is adversely affected by dust, dew, and the like due to the external atmosphere, it is necessary to be shielded from the external atmosphere.

As described above, the CCD bare chip 75 has a projection 75b having a height C on the side facing the glass substrate 71, that is, on the pixel effective area 75a side. The projection 75b is formed so as to include the pixel effective area 75a of the CCD bare chip 75.

The glass substrate 71 is made of a member having a high light transmittance, and the flatness of a portion of the CCD bare chip 75 which is in contact with and fixed to the pixel is formed to a required flatness. The glass substrate 71 has a wiring pattern 73 as an electric circuit formed on the surface on which the CCD bare chip 75 is mounted. In this embodiment, the glass substrate 71 is used as a transparent member.
However, other than the glass substrate 71, a member having high light transmittance such as plastic for a lens may be used.

The bump 74 has a projection shape for establishing electrical connection between the CCD bare chip 75 and the wiring pattern 73 of the glass substrate 71, and its height A is the height C of the projection 75b.
Are formed almost equally. Thus, conduction between the CCD bare chip 75 and the electric circuit of the glass substrate 71 can be ensured, and the flatness of the CCD bare chip 75 can be maintained.

The periphery of the bump 74 is covered with a sealing resin S2.
Is sealed. Therefore, the bump 74 is also in a sealed state. The sealing resin S2 may be transparent, but need not be transparent. In the present embodiment, an opaque resin is used. By using such an opaque resin, it is possible to prevent unnecessary light from entering the pixel effective area 75a of the CCD bare chip 75, so that the image quality is improved. Furthermore, since there is no need to use expensive transparent resin,
This is advantageous in cost as compared with the case where a transparent resin is used. The sealing resin S2 preferably has a low coefficient of thermal expansion.

The sealing resin S2 is an opaque resin in this embodiment, but may be an ultraviolet curable adhesive, another light curable adhesive, or another transparent adhesive. Good. For example, an adhesive having high optical properties, for example, balsam, epoxy resin, fluorine resin, silicon, or the like can be used. The pixel effective area 75a
Is an area on the image sensor where the photocell array (the part of the circuit for reading an image of the image sensor) is provided.

In order to manufacture the solid-state imaging device as described above, first, as shown in FIG. 2A, a CCD bare chip 75 is placed face down on a surface on a wiring pattern 73 side provided on a glass substrate 71. To face.

Next, as shown in FIG. 2B, the projection 75b of the CCD bare chip 75 and the glass substrate 71 are in close contact with each other.
The CCD bare chip 75 and the glass substrate 71 are brought close to a predetermined distance so that the wiring pattern 73 is electrically connected to the wiring pattern 73 by the bumps 74 to cover the pixel effective area 75a.

Thereafter, as shown in FIG. 2C, the outside of the bump 74, that is, the outer periphery of the glass substrate 71 is covered with a sealing resin S2 to seal the bump 74 and the inside of the bump 74, and at the same time, the CCD is used. Bare chip 75 and glass substrate 71
And concatenate. That is, the entirety of the pixel effective area 75a including the conductive bumps 74 is filled with the sealing resin S2 and cured.

FIG. 3 is a view showing a method for manufacturing a solid-state image sensor according to a third embodiment of the present invention. In the third embodiment,
1 is different from the first embodiment shown in FIG. 1 only in that the periphery of the projection 71 a of the glass substrate 71 is formed in a groove shape.

FIG. 4 is a view showing a method of manufacturing a solid-state image sensor according to a fourth embodiment of the present invention. In the fourth embodiment,
As compared with the second embodiment shown in FIG. 2, only the point that a concave portion is formed in a portion of the glass substrate 71 corresponding to the projection of the CCD bare chip 75 is the same as the other configuration.

FIG. 6 is a perspective view of an image reading unit using the solid-state imaging device of the present invention. As shown in FIG. 6, the image reading unit 1 includes a lens 3 as an optical element having a side surface 3a as a side surface around a transmission surface through which light rays as image light from the document surface pass, and a surface 3a as an edge. The first mounting surface 5a and the first mounting surface 5a facing each other have a different angle, and in the present embodiment, a second mounting surface 5b formed at 90 degrees with respect to the first mounting surface 5a. And lens 3
An intermediate holding member 5 that joins the housing 2 with the housing 2 and a housing 2 that is a base member having a mounting surface 2c facing the second mounting surface 5b are provided. In the image reading unit 1, the housing 2 and the lens 3 whose position is adjusted with respect to the housing 2 are bonded and fixed via the intermediate holding member 5.

The lens 3 has a flat surface 3b disposed on the edge surface 3a on the same diameter. The flat surface 3b is formed by cutting, grinding, or the like, and is polished as necessary. By forming the flat surface 3b in this manner, the bonding area of the intermediate holding member 5 with the first mounting surface 5a can be increased, and the fixing strength can be increased.

The housing 2 includes a lens 3 and a solid-state imaging device 7.
Are fixed in the adjusted positional relationship after the adjustment. The housing 2 is an imaging lens including an arc-shaped groove 2b, a flat mounting surface 2c adjacent to the arc-shaped groove 2b, a mounting surface 2d for mounting the solid-state imaging device 7, and lenses 3, 6, and the like. A light-shielding cover 2a that shields light between the system and the solid-state imaging device 7 is provided. By providing the light-shielding cover 2a, the influence of disturbance light or the like can be prevented, and a good image can be obtained. The housing 2 is fixed to a predetermined position of an image scanning device such as a copying machine to be described later by fixing means such as screwing, caulking, bonding, welding, or the like.

The material used for the intermediate holding member 5 is a member having a high light (ultraviolet) transmittance, such as ARTON, ZEONEX, or polycarbonate. Due to the surface tension of the adhesive, the intermediate holding member 5 can move so that both adhesive surfaces slide and move following the movement of the lens 3 due to the lens position adjustment by the lens adjustment.

By making the first mounting surface 5a and the second mounting surface 5b of the intermediate holding member 5, that is, the two bonding surfaces orthogonal, the position of the lens 3 can be adjusted in six axes, and each axis can be adjusted independently. Can be.

As shown in FIG. 6, two intermediate holding members 5
By arranging the flat surface 3b of the edge 3a of the lens 3 which is the optical element side bonding surface so as to face the optical element side, the influence of curing shrinkage when the adhesive is cured can be reduced.

As shown in FIG. 6, the provision of the translucent ribs 5c between the two adhering surfaces of the intermediate holding member 5 enables the light curable adhesive to be cured without increasing light loss. The strength of the intermediate holding member 5 can be increased.

Since the first mounting surface 5a, which is the lens-side fixing surface of the intermediate holding member 5, and the second mounting surface 5b, which is the holding member-side fixing surface, are perpendicular to each other, the X, Y, Z,
The movement in the α, β, and γ position adjustment directions can be adjusted independently of each other.

Considering the case where the intermediate holding member 5 is connected to the adjusting lens 3 and the housing 2 by an ultraviolet curing adhesive, first, in the case of adjustment in the X and Z directions, the lens 3 and the intermediate holding member are connected. The member 5 is adjusted by sliding on the housing via the housing mounting surface 2c, which is a holding member-side fixing surface of the housing 2. In the case of adjustment in the Y direction, the adjustment is performed by the moving lens 3 sliding on the first mounting surface 5a, which is the lens-side fixing surface of the intermediate holding member 5.

Hereinafter, α, β, and γ are similarly adjusted.
Furthermore, when the optical element is a lens, it has a spherical shape with the optical axis as the center. Therefore, even if the optical element is rotated around the optical axis (γ axis), it is not possible to correct the optical axis tilt caused by a lens processing error or the like. No (only the optical axis rotates). Therefore, adjustment around the γ-axis is unnecessary.

FIG. 7 is a schematic configuration diagram of a multi-function digital image forming apparatus as an example of an image scanning apparatus provided with an image reading unit using the solid-state imaging device of the present invention. As shown in FIG. 7, the image forming apparatus includes an automatic document feeder 10
1, a reading unit 150, a writing unit 157, a sheet feeding unit 130, and a post-processing unit 140. The automatic document feeder 101 automatically feeds a document onto the contact glass 106 of the reading unit 150 and automatically discharges the document that has been read. The reading unit 150 is a contact glass 106
Illuminates the original set on the top and illuminates the photoelectric conversion device C
The reading unit 157 forms an image on the photoconductor 115 in accordance with the image signal of the read original, and transfers and fixes the image on the transfer paper supplied from the paper supply unit 130. The transfer paper on which the fixing is completed is discharged to the post-processing unit 140, and desired post-processing such as sorting and stapling is performed.

First, the reading unit 150 includes a contact glass 106 on which a document is placed and an optical scanning system. The optical scanning system includes an exposure lamp 151 and a first mirror 15.
2, lens 153, CCD image sensor 154, second
It comprises a mirror 155, a third mirror 156, and the like. The exposure lamp 151 and the first mirror 152 are fixed on a first carriage (not shown), and the second mirror 155 and the third mirror 156 are fixed on a second carriage (not shown). When reading a document, the first carriage and the second carriage are mechanically scanned at a relative speed of 2: 1 so that the optical path length does not change. This optical scanning system is driven by a scanner drive motor (not shown).

The original image is read by the CCD image sensor 154, and is converted from an optical signal to an electric signal and processed. Lens 153 and CCD image sensor 1
The image magnification can be changed by moving 54 in the left-right direction in FIG. That is, the lens 153 and the CCD image sensor 15 correspond to the designated magnification.
4, the position in the left-right direction is set.

The writing unit 157 includes a laser output unit 158, an imaging lens 159, and a mirror 160. Inside the laser output unit 158,
A polygon mirror that rotates at high speed at a constant speed by a laser diode and a motor as a laser light source is provided.

The laser light emitted from the laser output unit 158 is deflected by the polygon mirror rotating at a constant speed, passes through the imaging lens 159, is turned back by the mirror 160, and is condensed on the surface of the photoreceptor to form an image. . The deflected laser light is exposed and scanned in a so-called main scanning direction orthogonal to the direction in which the photoconductor 115 rotates.
The image signal output by the SU 606 is recorded in line units. Then, an image, that is, an electrostatic latent image is formed on the photoconductor surface by repeating main scanning at a predetermined cycle corresponding to the rotation speed and the recording density of the photoconductor 115.

As described above, the laser beam output from the writing unit 157 is irradiated on the photosensitive member 115 of the image forming system, and a main scanning synchronization signal is generated at the irradiation position of the laser beam near one end of the photosensitive member 115. A beam sensor (not shown) is provided. Based on the main scanning synchronization signal output from the beam sensor, control of image recording timing in the main scanning direction and generation of a control signal for input / output of an image signal described later are performed.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the case where the projection is provided only on the glass substrate side and the case where the projection is provided only on the CCD bare chip side have been described, but the projection is provided on both the glass substrate and the CCD bare chip. Is also good. In the above embodiment, the case using the housing and the imaging lens shown in FIG. 6 has been described. However, the imaging lens system incorporated in the lens barrel is installed on a V-block formed in the lens barrel. The solid-state imaging device of the present invention can also be used in a conventionally known image reading unit that adjusts the positional relationship between the entire imaging lens system and the solid-state imaging device. That is, various modifications can be made without departing from the gist of the present invention.

[0064]

As described above, according to the present invention, the solid-state imaging device is mounted face-down on a glass substrate, and the solid-state imaging device and the glass substrate are sealed.
It is possible to prevent moisture from reaching the surface of the solid-state imaging device, and since the pixel effective region of the solid-state imaging device is in close contact with the glass substrate, a good image can be obtained because the pixel effective region is not covered with the resin layer. . Further, the size and thickness of the solid-state imaging device can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for manufacturing a solid-state imaging device according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a method for manufacturing a solid-state imaging device according to a third embodiment of the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view of the solid-state imaging device of FIG. 1;

FIG. 6 is a perspective view of an image reading unit using the solid-state imaging device of the present invention.

FIG. 7 is a schematic diagram of an image forming apparatus provided with an image reading unit using the solid-state imaging device of the present invention.

FIG. 8 is a cross-sectional view illustrating a conventional solid-state imaging device.

FIG. 9 is a cross-sectional view illustrating a method for manufacturing a conventional solid-state imaging device.

[Explanation of symbols]

 7 Solid-state imaging device 71 Glass substrate (transparent member) 71a Projection 73 Wiring pattern 74 Bump 75a Pixel effective area 75b Projection S2 Resin for sealing

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04N 1/028 H01L 23/12 F 5/335 C (72) Inventor Toshio Kobayashi 1 Nakamagome, Ota-ku, Tokyo 3-6, Ricoh Co., Ltd. F-term (reference) 4M109 AA01 BA04 CA10 EA15 EC12 GA01 4M118 AA10 AB01 AB10 BA10 FA06 FA08 GA04 GD02 HA11 HA24 HA26 HA31 5C024 CY47 EX01 EX21 EX24 EX41 GY01 5C051 AA01 BA03 DA06 DB01 DC01 DB01 DD02 EA07 5F044 KK06 LL11 LL15 RR17

Claims (7)

[Claims] 1. A solid-state imaging device in which an imaging element faces a wiring pattern provided on a transparent member such as glass in a face-down state, wherein a projection for bringing a pixel effective area of the imaging element into close contact with the transparent member is provided. And a sealing resin for adhering the image sensor and the transparent member near the outer periphery thereof, and a bump for conducting between the image sensor and the wiring pattern of the transparent member. Solid-state imaging device. 2. The method according to claim 1, wherein a height of the bump provided on the image sensor or the wiring pattern is substantially equal to a height of a protrusion formed on at least one of the image sensor and the transparent member. Item 2. The solid-state imaging device according to Item 1. 3. The solid-state imaging device according to claim 1, wherein the sealing resin is opaque. 4. A method for manufacturing a solid-state imaging device in which an imaging element faces a wiring pattern provided on a transparent member such as glass in a face-down state, wherein a pixel effective area of the imaging element and the transparent member are formed. Along with the protruding portion, a conductive resin is provided between the image pickup device and the wiring pattern of the transparent member by a bump, and then a sealing resin for adhering the image pickup device and the transparent member near the outer periphery thereof is provided. A method for manufacturing a solid-state imaging device, comprising applying and then curing a sealing resin. 5. The method according to claim 4, wherein the sealing resin is opaque. 6. An image reading unit using the solid-state imaging device according to claim 1. 7. An image scanning apparatus using the image reading unit according to claim 6.