JP2002002867A - Container for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a container for electronic components, such as ICs, sensitive to static electricity. SOLUTION: The container for electronic components has a low absolute value of a voltage of electrostatic charge on their surfaces, which is caused by friction with the electronic components. The absolute value of the voltage of electrostatic charge caused by friction between the electronic component such as an IC and the container for the electronic components or a resin composition forming the surface of the container is controlled to 2,000 V or below, preferably 1,000 V or below, whereby fault and damage of the ICs due to static electricity can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container for electronic components sensitive to static electricity such as an IC.

[0002]

2. Description of the Related Art Conventionally, an electronic component container housing electronic components which are easily destroyed by static electricity, such as ICs, has conventionally been easy to remove static electricity generated due to contact and friction between the electronic component and the container, and the generated electric charge has been reduced. It is common practice to impart conductivity in order to disperse uniformly in the inside and make it difficult to generate a potential difference. For example, it is possible to use a conductive metal material, a resin molded with carbon fiber or carbon black, or to apply a conductive paint such as carbon black to the molded container surface. Is used.

[0003] These electronic component containers have a feature that when static electricity is generated, electricity is easily released by grounding, and thus the electronic component has been prevented from being destroyed by static electricity. However, even in such a case, it may not be possible to completely prevent electrostatic destruction. In particular, as the wiring inside the electronic component is miniaturized with the high integration of the electronic component, even when the conductive resin is used as a container for the electronic component, the failure and destruction of the electronic component surface due to the static electricity occur. Has become a problem.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a container for preventing electrostatic damage of electronic components.

[0005]

SUMMARY OF THE INVENTION A conventional electronic component container is provided with conductivity so as to remove generated static electricity and protect the electronic component from electrostatic destruction.
No consideration was given to the "easiness of generation" of static electricity generated by friction with electronic components such as C. Even if the electronic component container is conductive, the IC is charged by friction between the electronic component container and the IC, the sealant on the IC surface is easily charged, and the sealant on the IC exterior surface is nonconductive. For this reason, no consideration has been given to the fact that the charge generated on the IC exterior surface cannot be completely removed even if the electronic component container is grounded. According to the measurement by the inventors, even if the electronic component container has conductivity, when the container containing the IC is vibrated in an insulated state, the charging voltage on the surface of the IC is 10,000 V,
It was confirmed that the voltage sometimes exceeded 20,000 V. Static electricity charged on the surface of the IC is sufficient to destroy the IC.

According to the present invention, static electricity itself is not generated even if the electronic component and the container rub, or even if it is generated, the electronic component is not charged until it is destroyed. That is, the present invention is an electronic component container having a low absolute value of a charging voltage on the surface of the electronic component caused by friction with the electronic component. The absolute value of the charging voltage due to friction between an electronic component such as an IC and the electronic component container or the resin composition forming the surface of the electronic component container is defined as 2
By setting the voltage to 000 V or lower, preferably 1000 V or lower, electrostatic damage and destruction of the IC can be suppressed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The electronic component container used in the present invention is made of a resin. As the resin, the lower the absolute value of the triboelectric charging voltage with the electronic component stored in the electronic component container, the better, and the value differs depending on the electronic component. However, it is preferable that the rubbing force be 2000 V or less, and more preferably 1000 V or less, when the number of times of friction is 20000. 1000V at 500 times of friction
The following are also preferred. Here, the resin may be a thermoplastic resin or a thermosetting resin as long as the resin satisfies the performance described above, but a thermoplastic resin is preferable.

As the thermoplastic resin to be used, a resin whose charging sequence is close to that of a resin used as a sealant for an electronic component to be housed can lower the frictional charging voltage. In addition, when both positive and negative charging columns are used in combination with the resin used as the encapsulant for the electronic components to be housed, the frictional charging voltage can be reduced. Electronic components, especially I
Epoxy resins are widely used as the sealant for C. As a container for such an electronic component, a blend of both polystyrene on the positive electrode side and polyethylene on the negative electrode side of the epoxy series resin and a resin having these structures at the same time can be suitably used. . For example, there is a resin having an ethylene structure as a main chain and grafted with a styrene structure, or a resin having a styrene structure as a main chain and grafted with an ethylene structure. These can use a commercial thing as it is. Further, these resins can be used in combination with the above-mentioned blend.

If the absolute value of the charging voltage is large, electronic components such as an IC chip are liable to be damaged and destroyed, which is a problem. In addition, even for components that are unlikely to cause electrostatic damage and destruction, electrostatic attraction of the components to the container may occur, which may cause a reduction in workability, which is not preferable.

In order to provide heat resistance that can withstand the aging step at 120 ° C. or higher, which is performed for removing water from ICs to electronic component containers, a heat-resistant resin can be used.

The resin used in the electronic component container of the present invention includes talc, mica, silica, alumina, titanium, and the like as long as the characteristic that the charging voltage with the electronic component is small due to friction with the target electronic component is not impaired. Potassium oxide whiskers, metal oxides such as calcium oxide, calcium carbonate,
It is also possible to add fillers such as magnesium carbonate, calcium silicate, glass fibers, glass flakes and glass beads. Similarly, conductive fibers such as non-carbon fibers, steel fibers, aluminum fibers, brass fibers, copper fibers, metal fibers such as stainless steel fibers, carbon fibers, metal-coated carbon fibers, carbon black, graphite powder, and metal-coated glass fibers. It is also possible to add conductive substances, and it is also possible to make the resin conductive by adding these substances. In the present invention, it is not a problem that the electronic component container has conductivity, and it is one of preferred embodiments. In this case, the layer that directly contacts the electronic component can be made conductive, or the layer that does not directly contact the electronic component can be made conductive by forming the electronic component container into two or more layers.

Further, the electronic component container and the resin of the present invention contain a reinforcing material, a foaming agent, and the like within a range not to impair the object of the present invention.
Lubricants, antioxidants, UV inhibitors, coupling agents, flame retardants, flame retardant aids such as antimony trioxide, heat stabilizers, and coloring agents can also be blended.

The method for producing the resin used in the electronic component container of the present invention is not particularly limited, but a known method may be used.
For example, it can be carried out by melt-kneading and extruding a raw material mixed with a tumbler or a mazeler using a single-screw extruder or a twin-screw extruder. Alternatively, it can be directly molded using a raw material mixed with a tumbler or mazeler.

The electronic component container of the present invention is a container for storing an electronic component that is particularly susceptible to static electricity damage.
There are trays for C chips and carrier tapes for IC chips. In addition, by using a container that does not easily generate static electricity, electrostatic adsorption of electronic components to the container can be suppressed, so it can be used as a carrier tape for various parts such as a tray for bare chips, a capacitor, a connector, etc. is there. As described above, tray-shaped electronic component containers can be obtained by molding after heating and melting using a common hydraulic or toggle injection molding machine. It can be obtained by molding a sheet prepared by a known method, such as vacuum forming or pressure forming. In addition, it is also possible to use a multi-layer flat die method and to make only the surface layer a resin composition having a small frictional voltage with the IC.

[0015]

The present invention will be further described with reference to the following examples.

Example 1 75 parts by weight of polystyrene (Toyostyrol HI-U2-301U manufactured by Toyo Styrene, abbreviated as "HIPS" in Table 1), high-density polyethylene (HF-310 manufactured by Nippon Polychem, "HDPE" in Table 1) 25% by weight, as a compatibilizer between polystyrene and polyethylene, a graft copolymer having polystyrene as a main chain and polyethylene as a side chain (VMXAN-5 manufactured by Mitsubishi Chemical Corporation).
0F, 30 parts by weight (abbreviated as “PS-g-PE” in Table 1) were used, and the plate-like piece shown in FIG. 1 was molded by injection molding.
Using this plate-like piece, measurement of a triboelectric charging voltage with an electronic component (QFP32 × 32 IC) using an epoxy resin as a sealant was performed. The method of measuring the triboelectric charging voltage was such that the plate-like piece of FIG. 1 was placed on a friction machine, and the plate-like piece was neutralized using static elimination. On the other hand, for an IC to be a friction object, the terminal was cut off and the same portion was closed with an insulating tape in order to prevent the transfer of electric charge from the IC metal terminal for the purpose of accurately measuring the charging voltage. The IC was placed on a plate-shaped piece and subjected to friction after static elimination by static elimination. The friction conditions are as follows in the vibration direction shown in FIG.
Swing width: 22 mm, friction speed: 300 reciprocations / minute. After the end of the friction, the charging voltage at the frictional portion of the IC was measured, and the number of times of friction: 50 times, 200 times, 500 times, 2000 times
The charging voltage at 0 times was measured. The results are shown in Table 1. In this composition, almost no increase in charging voltage was observed.
The charging voltage was measured using Keyence charging voltage measuring devices SK-030 and SK-200.

Examples 2 to 7 The same procedures as in Example 1 were carried out except that the compositions were changed as shown in Table 1. In Table 1, PE
-G-PS indicates a graft copolymer having polyethylene as a main chain and polystyrene as a side chain (trade name: Modipa-A1100, manufactured by NOF Corporation), and AB indicates acetylene black (manufactured by Denki Kagaku Kogyo Co., Ltd.).

Comparative Example 1 As a resin, polystyrene (Toyostyrene HI-U2-30 manufactured by Toyo Styrene) was used.
1U) A friction charging test was performed on 100 parts by weight of the resin composition in the same manner as in Example 1, and the relationship between the number of times of friction and the charging voltage was measured. The results are shown in Table 1. The charging voltage was greatly increased due to friction.

(Comparative Example 2) Polystyrene (Toyostyrol HI-U2-30 manufactured by Toyo Styrene) was used as a resin.
1U) A conductive resin composition having a volume resistivity of 10 ² Ω · cm added to 100 parts by weight of carbon black (Tokai Carbon Seast 116) as a conductive agent in an amount of 25 parts by weight was frictionally charged in the same manner as in Example 1. A test was performed to measure the relationship between the number of times of friction and the charging voltage. The results are shown in Table 1. The charging voltage was greatly increased due to friction despite having conductivity.

(Comparative Examples 3 to 5) The same procedure as in Example 1 was carried out except that the composition of the resin was changed as shown in Table 1. In Table 1, PVC indicates a vinyl chloride resin, A-PET indicates a polyethylene terephthalate resin, and PC indicates a polycarbonate resin.

[0021]

[Table 1]

[0022]

According to the present invention, the absolute value of the charging voltage of static electricity generated on the surface of an electronic component in friction with the electronic component is 2000V.
By using the following electronic component container, it is possible to protect the electronic components such as the IC chip from the electrostatic damage and destruction by suppressing the generation of static electricity which is a fundamental problem of the electrostatic damage and destruction of the electronic components.

[Brief description of the drawings]

FIG. 1 is a resin container used for a friction charging test with an IC chip.

Claims (8)

[Claims] An absolute value of a charging voltage on the surface of an electronic component caused by 20,000 frictions with the electronic component is 2000 V.
An electronic component container that is: 2. An electronic component container, wherein the absolute value of the charged voltage on the surface of the electronic component caused by friction with the electronic component 500 times is 1000 V or less. 3. The electronic component container according to claim 1, wherein the surface in contact with the electronic component contains a resin which is close to the resin of the sealant of the electronic component in the charging line. 4. The electronic component according to claim 1, wherein the surface in contact with the electronic component contains a resin having a positive polarity and a resin having a negative polarity in a charging sequence with respect to the resin of the sealant of the electronic component. container. 5. An electronic component container whose surface in contact with an electronic component contains a resin having a polystyrene structure and a polyethylene structure. 6. The electronic component container according to claim 5, further comprising polystyrene and polyethylene. 7. An absolute value of a charging voltage on the surface of an electronic component caused by 20,000 times of friction with the electronic component is 2000V.
The electronic component container according to claim 5, wherein: 8. The electronic component container according to claim 5, wherein an absolute value of the charging voltage on the surface of the electronic component caused by friction with the electronic component 500 times is 1000 V or less.