JP2002001320A - Method of treating waste ozone water - Google Patents

Method of treating waste ozone water

Info

Publication number
JP2002001320A
JP2002001320A JP2000186414A JP2000186414A JP2002001320A JP 2002001320 A JP2002001320 A JP 2002001320A JP 2000186414 A JP2000186414 A JP 2000186414A JP 2000186414 A JP2000186414 A JP 2000186414A JP 2002001320 A JP2002001320 A JP 2002001320A
Authority
JP
Japan
Prior art keywords
ozone
ozone water
treatment
waste
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000186414A
Other languages
Japanese (ja)
Inventor
Takeshi Nakatsuka
豪 中塚
Kuniko Yamano
邦子 山野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Priority to JP2000186414A priority Critical patent/JP2002001320A/en
Priority to PCT/JP2001/011065 priority patent/WO2003051777A1/en
Publication of JP2002001320A publication Critical patent/JP2002001320A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/78Treatment of water, waste water, or sewage by oxidation with ozone
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/30Treatment of water, waste water, or sewage by irradiation
    • C02F1/32Treatment of water, waste water, or sewage by irradiation with ultraviolet light
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2303/00Specific treatment goals
    • C02F2303/18Removal of treatment agents after treatment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Water Treatments (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent corrosion of a piping system and pollution of the environment caused by discharge of waste ozone water, when a high concentration of ozone water is used for a liquid phase ozone. SOLUTION: The waste ozone water 41 discharged from a substrate treating part 20 is introduced in to a reaction container 31, and is discharged to the outside of the system after it is irradiated with UV rays by an UV ray lamp 34. The waste ozone water 41 contains high concentration of dissolved ozone, substance for suppressing decomposition of ozone and a lot of organic matters produced in treatment of the substrate at the substrate treating part 20, but UV rays are efficiently utilized to obtain dissolved ozone without decomposing the organic matters.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、オゾン水による液
相オゾン処理に使用した後の排オゾン水の処理方法に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating waste ozone water after use in liquid ozone treatment with ozone water.

【0002】[0002]

【従来の技術】半導体基板や液晶表示装置用ガラス基板
の製造プロセスにおいては、基板の表面に対してレジス
ト塗布−エッチング−レジスト剥離の工程が繰り返され
る。ここにおけるレジスト剥離は、剥離液や硫酸・過水
混合液を使用するウエット処理と、プラズマによるドラ
イ処理(アッシング)とに大別され、それぞれ用途によ
って使い分けられている。両者を比較した場合、ウエッ
ト処理の方が経済的である。これは、プラズマによるド
ライアッシングが真空等を必要とするためである。
2. Description of the Related Art In a process of manufacturing a semiconductor substrate or a glass substrate for a liquid crystal display device, a process of applying a resist, etching and removing the resist is repeated on the surface of the substrate. The resist stripping here is roughly classified into a wet process using a stripping solution or a mixed solution of sulfuric acid and hydrogen peroxide, and a dry process (ashing) using plasma, and each is used properly according to the purpose. When comparing the two, the wet treatment is more economical. This is because dry ashing by plasma requires a vacuum or the like.

【0003】しかしながら、剥離液や硫酸・過水混合液
を使用するウエット処理は、その剥離液や硫酸・過水混
合液が総じて環境汚染物質であることから、環境上の問
題が大きい。このため、環境面で問題がないクリーンで
経済的な代替方法の開発が進められており、その一つと
してオゾンによる剥離処理が考えられている。
However, wet processing using a stripping solution or a mixture of sulfuric acid and hydrogen peroxide has a great environmental problem since the stripping solution and the mixture of sulfuric acid and hydrogen peroxide are generally environmental pollutants. For this reason, the development of clean and economical alternative methods that have no environmental problems is being promoted, and one of these methods is considered as a peeling treatment using ozone.

【0004】オゾンは、周知のとおり、強力な酸化力を
有しており、しかも、分解して酸素になるため、環境汚
染の懸念がなく、排ガス、排液処理の問題もないことか
ら、クリーンな酸化分解剤として注目を集めている。
As is well known, ozone has a strong oxidizing power and is decomposed into oxygen, so there is no concern about environmental pollution, and there is no problem with exhaust gas and wastewater treatment. It is attracting attention as an oxidative decomposition agent.

【0005】オゾンを用いた基板処理は、気相処理と液
相処理とに大別される。気相処理は、オゾンを含むオゾ
ンガスにより基板表面を処理するものである。一方、液
相処理は、オゾンが溶解したオゾン水により基板表面を
処理するものであり、処理枚数によってバッチ式と枚葉
式とに分けられる。また、基板とオゾン水の接触状態に
よってディップ処理と流水処理とに分けることができ、
ディップ処理はバッチ式と、また流水処理は枚葉式とそ
れぞれ組み合わされることが多い。
[0005] The substrate processing using ozone is roughly classified into a gas phase processing and a liquid phase processing. In the gas phase treatment, the substrate surface is treated with ozone gas containing ozone. On the other hand, the liquid phase treatment is a treatment of the substrate surface with ozone water in which ozone is dissolved, and is classified into a batch type and a single-wafer type according to the number of processed substrates. In addition, it can be divided into dip treatment and running water treatment according to the contact state of the substrate and ozone water,
Dip processing is often combined with batch processing, and running water processing is often combined with single wafer processing.

【0006】気相オゾン処理と液相オゾン処理を比較す
ると、アッシングと呼ばれる気相処理の場合は、反応レ
ート上げるために基板を200〜300℃の高温に加熱
する必要があり、加熱コストが嵩むだけでなく、その加
熱によって基板がダメージを受けるおそれもある。ま
た、酸素プラズマアッシングに比べてレートが低いため
に紫外線が併用される場合もあり、その場合は紫外線の
照射による損傷が懸念される。
Comparing the gas phase ozone treatment and the liquid phase ozone treatment, in the case of the gas phase treatment called ashing, it is necessary to heat the substrate to a high temperature of 200 to 300 ° C. in order to increase the reaction rate, which increases the heating cost. In addition, the substrate may be damaged by the heating. In addition, since the rate is lower than that of oxygen plasma ashing, ultraviolet rays may be used in some cases. In such a case, there is a concern about damage due to irradiation with ultraviolet rays.

【0007】これに対し、液相オゾン処理の場合は、オ
ゾン水の高温加熱が不可能なこともあって、加熱による
問題は生じないが、その一方で反応レートが著しく低い
という本質的な問題がある。このため、オゾン水による
液相処理は、レジスト剥離では実用化には至っておら
ず、せいぜい基板の洗浄程度でしか実用化されていない
のが現状である。
On the other hand, in the case of the liquid phase ozone treatment, the high temperature heating of the ozone water is impossible, so that the problem caused by the heating does not occur, but the essential problem is that the reaction rate is extremely low. There is. For this reason, the liquid phase treatment using ozone water has not yet been put to practical use in resist stripping, and is currently put to practical use only at the level of cleaning the substrate.

【0008】[0008]

【発明が解決しようとする課題】ところで、基板洗浄等
の液相オゾン処理に使用されるオゾン水の溶解オゾン濃
度は、これまでは最高でも10mg/L程度であった。
この場合、液相オゾン処理に使用された後の排オゾン水
の溶解オゾン濃度も低く、また、使用後も引き続いてオ
ゾンの分解が進むため、その排オゾン水を処理装置から
そのまま排出しても何ら問題はなかった。むしろ、排オ
ゾン水の後処理の必要がないのが、液相オゾン処理の利
点の一つと考えられていたため、後処理を行わないこと
が当然とされていた。
By the way, the dissolved ozone concentration of ozone water used for liquid phase ozone treatment such as substrate washing has hitherto been at most about 10 mg / L.
In this case, the dissolved ozone concentration of the waste ozone water after use in the liquid phase ozone treatment is low, and the decomposition of ozone continues after use, so that the waste ozone water can be directly discharged from the processing apparatus. There was no problem. Rather, it was considered that there was no need for post-treatment of the waste ozone water as one of the advantages of the liquid-phase ozone treatment, and it was natural that no post-treatment was performed.

【0009】ところが、液相オゾン処理をレジスト剥離
に適用するに当たって障害となる反応レートの低さを改
善するためには、オゾン水の溶解オゾン濃度を高めるこ
とが必要であり、その結果として以下のような問題が明
らかになってきた。
However, in order to improve the low reaction rate which is an obstacle in applying the liquid phase ozone treatment to resist stripping, it is necessary to increase the concentration of dissolved ozone in ozone water. Such problems have become apparent.

【0010】本出願人は、先に、200gO3 /Nm3
以上、更には300gO3 /Nm3以上の高濃度オゾン
ガスを安定的に発生させることができる高性能オゾナイ
ザを開発した。この高性能オゾナイザで発生させた高濃
度オゾンガスを加圧と組み合わせることにより、50m
g/L以上、更には100mg/L以上の高濃度オゾン
水を生成できる。また、液中のオゾンは、ガス中のオゾ
ンほどではないが、経時的に分解するので、使用時まで
その高い濃度を維持することが重要になる。この維持の
ためには、液中のオゾンの分解を抑制する酢酸等の物質
を添加するのが有効である。
[0010] The present applicant has previously reported that 200 gO 3 / Nm 3
As described above, a high-performance ozonizer capable of stably generating a high-concentration ozone gas of 300 gO 3 / Nm 3 or more has been developed. By combining high-concentration ozone gas generated by this high-performance ozonizer with pressurization, 50 m
High-concentration ozone water of not less than g / L, and more preferably not less than 100 mg / L can be generated. Also, ozone in a liquid is not as good as ozone in a gas, but decomposes over time, so it is important to maintain its high concentration until use. To maintain this, it is effective to add a substance such as acetic acid that suppresses the decomposition of ozone in the liquid.

【0011】酢酸等のオゾン分解抑制物質を添加された
高濃度オゾン水は、レジスト剥離等の液相オゾン処理に
適用して高い反応レートを示す。しかし、その一方で、
液相オゾン処理に使用された後の排オゾン水は、オゾン
濃度が非常に高くなり、その後の経時的なオゾン分解も
期待できないため、その排オゾン水を処理装置からその
まま排出すると、配管系を早期に腐食させるとか、環境
汚染を招くといった、従来のクリーンなイメージをもつ
液相オゾン処理では予想もされなかった問題を生じるこ
とが判明した。
High-concentration ozone water to which an ozone decomposition inhibitor such as acetic acid has been added exhibits a high reaction rate when applied to liquid phase ozone treatment such as resist stripping. But on the other hand,
The waste ozone water used for the liquid phase ozone treatment has an extremely high ozone concentration and cannot be expected to decompose ozone over time. It has been found that conventional liquid-phase ozone treatment with a clean image causes unexpected problems such as early corrosion and environmental pollution.

【0012】本発明の目的は、液相オゾン処理に高濃度
オゾン水を使用したときに、排オゾン水の排出に起因し
て問題となる配管系の腐食や環境汚染を防止できる排オ
ゾン水の処理方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide an ozone water discharge system capable of preventing corrosion of piping systems and environmental pollution caused by discharge of ozone water when high-concentration ozone water is used for liquid phase ozone treatment. It is to provide a processing method.

【0013】[0013]

【課題を解決するための手段】液相オゾン処理に高濃度
オゾン水を使用したときに生じる排オゾン水の処理、即
ち排オゾン水中の溶存オゾンの除去処理は意外に厄介で
ある。なぜなら、溶存オゾン濃度が高いだけでなく、酢
酸等により溶存オゾンの分解が抑制されており、しか
も、液相オゾン処理で生じたレジスト分解物質等の有機
物が多量に存在し、溶存オゾンを分解するための対策が
この有機物の分解に優先的に使われる危険性が高いから
である。
SUMMARY OF THE INVENTION The treatment of waste ozone water, which occurs when high-concentration ozone water is used for liquid-phase ozone treatment, that is, the treatment of removing dissolved ozone in waste ozone water, is unexpectedly troublesome. This is because not only the dissolved ozone concentration is high, but also the decomposition of dissolved ozone is suppressed by acetic acid and the like, and a large amount of organic substances such as resist decomposed substances generated in the liquid phase ozone treatment are present to decompose dissolved ozone. This is because there is a high risk that measures for the above will be used preferentially for the decomposition of this organic matter.

【0014】このような状況下で、本発明者らは、排オ
ゾン水中の溶存オゾンを効率的に分解する方法について
種々検討した。その結果、紫外線の照射が有効なことを
知見した。
[0014] Under such circumstances, the present inventors have studied various methods for efficiently decomposing dissolved ozone in waste ozone water. As a result, they found that irradiation with ultraviolet rays was effective.

【0015】本発明の排オゾン水の処理方法は、かかる
知見に基づいて開発されたものであり、オゾンが溶解し
たオゾン水による液相オゾン処理に使用した後の排オゾ
ン水に紫外線を照射する点に特徴がある。
The method of treating waste ozone water of the present invention has been developed based on such knowledge, and irradiates ultraviolet light to waste ozone water after use in liquid-phase ozone treatment with ozone water in which ozone is dissolved. There is a feature in the point.

【0016】液相オゾン処理は、代表的にはオゾン水に
より基板上から有機物を除去する処理であるが、これ以
外に基盤上への酸化膜形成等を挙げることができる。
The liquid phase ozone treatment is typically a treatment for removing organic substances from the substrate with ozone water, but may also include the formation of an oxide film on a substrate.

【0017】オゾン水により基板上から有機物を除去す
る処理は、代表的には微粒子除去処理であるが、これ以
外にレジスト剥離処理等を挙げることができる。
The process of removing organic substances from the substrate with ozone water is typically a process of removing fine particles, but a resist stripping process and the like can also be used.

【0018】本発明の排オゾン水の処理方法は、溶存オ
ゾンを20mg/L以上、更には100mg/L以上含
む高濃度の排オゾン水についても、その溶存オゾン濃度
を、通常の排水設備に排水を行っても配管等への劣化の
影響のない10mg/L以下に低減することができる。
また、その排オゾン水がオゾン分解抑制物質を5mg/
L以上含む場合にも、その溶存オゾン濃度を上記10m
g/L以下に低減することができる。更に、その排オゾ
ン水が有機物をTOC値として100mg/L以上含む
場合にも、その溶存オゾン濃度を上記10mg/L以下
に低減することができる。
The method for treating waste ozone water according to the present invention is characterized in that even for high-concentration waste ozone water containing dissolved ozone of 20 mg / L or more, or even 100 mg / L or more, the dissolved ozone concentration is discharged to a normal drainage facility. Can be reduced to 10 mg / L or less, which does not adversely affect the piping and the like.
In addition, the waste ozone water contains 5 mg / m of an ozone decomposition inhibitor.
L or more, the dissolved ozone concentration should be 10 m
g / L or less. Furthermore, even when the waste ozone water contains an organic substance as a TOC value of 100 mg / L or more, the dissolved ozone concentration can be reduced to 10 mg / L or less.

【0019】オゾン分解抑制物質は、代表的には酢酸で
あるが、これ以外に炭酸、リン酸、カルボン酸等を挙げ
ることができる。
The ozone decomposition inhibitor is typically acetic acid, but may also include carbonic acid, phosphoric acid, carboxylic acid and the like.

【0020】排オゾン水に照射する紫外線は紫外線ラン
プによって照射され、その波長はオゾン分解に有効な2
54nmを含むもの、特に254nmを多く含むものが
好ましく、具体的には低圧水銀ランプ、エキシマランプ
等から照射されるものが好ましい。紫外線は又、溶存オ
ゾンの分解効率の点から高出力が好ましく、具体的には
低圧水銀ランプの場合、ランプ1本当たりの電力100
W以上でUV─C変換効率30%以上、UV─C発光密
度0.5W/cm以上が好ましい。
The ultraviolet light for irradiating the waste ozone water is radiated by an ultraviolet lamp, and its wavelength is effective for ozone decomposition.
Those containing 54 nm, particularly those containing a large amount of 254 nm, are preferred. Specifically, those irradiated from a low-pressure mercury lamp, excimer lamp or the like are preferred. Ultraviolet light also preferably has a high output from the viewpoint of the decomposition efficiency of dissolved ozone. Specifically, in the case of a low-pressure mercury lamp, the power per lamp is 100%.
It is preferable that the UV30C conversion efficiency is 30% or more at W or more and the UV─C emission density is 0.5 W / cm or more.

【0021】なお、排オゾン水にはpHを7未満に調整
するために、塩酸、硫酸、フッ酸等の酸が5mg/L以
上添加されてもよい。また、pHを7以上に調整するた
めに、水酸化ナトリウム、水酸化カリウム、アンモニア
等のアルカリが5mg/L以上添加されてもよい。
In order to adjust the pH to less than 7, the waste ozone water may be added with an acid such as hydrochloric acid, sulfuric acid or hydrofluoric acid in an amount of 5 mg / L or more. In order to adjust the pH to 7 or more, an alkali such as sodium hydroxide, potassium hydroxide, or ammonia may be added at 5 mg / L or more.

【0022】[0022]

【発明の実施の形態】以下に本発明の実施形態を図面に
基づいて説明する。図1は本発明の排オゾン水の処理方
法を用いた基板処理装置の一例を示す装置構成図であ
る。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an apparatus configuration diagram showing an example of a substrate processing apparatus using the method for treating waste ozone water of the present invention.

【0023】基板処理装置は、ウエーハと呼ばれる半導
体基板10のレジスト剥離を行うものである。この基板
処理装置は基板処理部20と排オゾン水処理部30とを
備えている。
The substrate processing apparatus removes a resist from a semiconductor substrate 10 called a wafer. The substrate processing apparatus includes a substrate processing unit 20 and a waste ozone water processing unit 30.

【0024】基板処理部20は、ロータ21で基板10
を回転させながら、上方のノズル22より基板10の回
転中心部上にオゾン水40を供給する。基板10の回転
中心部上に供給されたオゾン水40は、基板10の表面
上で遠心力により外周側へ広がり、その表面上に塗布さ
れたレジストを分解除去する。
The substrate processing unit 20 uses the rotor 21 to
Is supplied to the center of rotation of the substrate 10 from the nozzle 22 above. The ozone water 40 supplied on the center of rotation of the substrate 10 spreads on the surface of the substrate 10 to the outer peripheral side by centrifugal force, and decomposes and removes the resist applied on the surface.

【0025】オゾン水40は、反応レートを上げるため
に、例えば100mg/L以上の溶存オゾンを含み、且
つ、そのオゾンの分解を抑制するための酢酸等を例えば
100mg/L以上含んでいる。
The ozone water 40 contains, for example, 100 mg / L or more of dissolved ozone to increase the reaction rate, and contains, for example, 100 mg / L or more of acetic acid for suppressing the decomposition of the ozone.

【0026】レジスト剥離に使用された後の排オゾン水
41は、基板10上から下方の受け部23に流下して回
収され、排オゾン水処理部30へ送られる。
The drained ozone water 41 used after stripping the resist flows down from the substrate 10 to the lower receiving portion 23, is collected, and is sent to the drained ozone water processing unit 30.

【0027】排オゾン水処理部30は、排オゾン水41
を処理するための反応容器31と、反応容器31内の処
理水に紫外線を照射する紫外線ランプ34と、紫外線ラ
ンプ34に電力を供給する電源ユニット35とを備えて
いる。紫外線ランプ34は、反応容器31内に挿入され
た石英管33内に収容された例えば低圧水銀ランプであ
る。電源ユニット35は、コネクタ36,37を通して
紫外線ランプ34に電力を供給する。反応容器31内に
は、処理水に乱流を生じさせて攪拌を行うために整流板
32が設けられている。
The waste ozone water treatment section 30 is provided with a waste ozone water 41.
, A UV lamp 34 for irradiating the treated water in the reaction vessel 31 with ultraviolet light, and a power supply unit 35 for supplying electric power to the ultraviolet lamp 34. The ultraviolet lamp 34 is, for example, a low-pressure mercury lamp housed in a quartz tube 33 inserted into the reaction vessel 31. The power supply unit 35 supplies power to the ultraviolet lamp 34 through the connectors 36 and 37. A rectifying plate 32 is provided in the reaction vessel 31 to generate turbulence in the treated water and perform stirring.

【0028】基板処理部20から送られてきた排オゾン
水41は、オゾン分解抑制物質を含んでおり、基板処理
時と同等の高い溶存オゾン濃度を維持している。加え
て、レジスト剥離に伴うレジスト分解物質を多量に含ん
でいる。しかるに、この排オゾン水41も、反応容器3
1内で254nmの波長を多く含む紫外線が照射される
ことにより、高濃度の溶解オゾンが効率よく選択的に分
解され、溶解オゾンを実質含まない、単なる有機物含有
排水となって反応容器31外へ排出される。
The waste ozone water 41 sent from the substrate processing section 20 contains an ozone decomposition suppressing substance, and maintains a high dissolved ozone concentration equivalent to that during substrate processing. In addition, it contains a large amount of resist decomposing substances accompanying the resist stripping. However, this waste ozone water 41 is also used in the reaction vessel 3
By irradiating with ultraviolet light having a wavelength of 254 nm in the inside 1, high-concentration dissolved ozone is efficiently and selectively decomposed, and becomes a mere organic matter-containing wastewater containing substantially no dissolved ozone and out of the reaction vessel 31. Is discharged.

【0029】このため、基板処理装置の排水系を腐食さ
せる懸念がない。また、環境汚染の危険もない。なお、
排水中に含まれる有機物が問題になる場合は、周知の方
法により適宜除去して排水を行えばよい。
Therefore, there is no concern that the drainage system of the substrate processing apparatus will be corroded. There is no danger of environmental pollution. In addition,
When the organic matter contained in the wastewater becomes a problem, the wastewater may be removed appropriately by a known method.

【0030】[0030]

【実施例】次に、本発明の実施例を説明する。Next, an embodiment of the present invention will be described.

【0031】溶存オゾン濃度が約100ppmの排オゾ
ン水を想定した実験用オゾン水に反応容器内で紫外線を
照射した。紫外線の照射には、消費電力160W・紫外
線出力59WのUVランプ(低圧水銀ランプ)を1〜4
本使用した。オゾン水の流量は4.5L/分、反応容器
におけるオゾン水滞留時間は3.3分である。
Ultraviolet light was irradiated in the reaction vessel to experimental ozone water, which assumed waste ozone water having a dissolved ozone concentration of about 100 ppm. For UV irradiation, use a UV lamp (low-pressure mercury lamp) with a power consumption of 160 W and a UV output of 59 W for 1-4.
Used this book. The flow rate of the ozone water is 4.5 L / min, and the residence time of the ozone water in the reaction vessel is 3.3 minutes.

【0032】反応容器の入口及び出口で溶存オゾン濃度
を測定した結果を表1に示す。表2から分かるように、
2本のUVランプ使用(320W)により、100pp
mの溶存オゾンのほぼ完全な分解除去が可能である。
Table 1 shows the results of measuring the dissolved ozone concentration at the inlet and outlet of the reaction vessel. As can be seen from Table 2,
100pp by using two UV lamps (320W)
m can be almost completely decomposed and removed.

【0033】[0033]

【表1】 [Table 1]

【0034】上記のオゾン水に酢酸を100mg/L添
加したときの結果を表2に示す。オゾン分解抑制物質で
ある酢酸が添加されても、3本のUVランプ使用(48
0W)により、100mg/Lの溶存オゾンのほぼ完全
な分解除去が可能である。
Table 2 shows the results when 100 mg / L of acetic acid was added to the above ozone water. Even if acetic acid which is an ozone decomposition inhibitor is added, three UV lamps are used (48
0W), it is possible to almost completely decompose and remove 100 mg / L of dissolved ozone.

【0035】[0035]

【表2】 [Table 2]

【0036】オゾン分解抑制物質を含む多量の有機物が
存在する条件を想定して、上記のオゾン水に酢酸を10
00mg/L添加した。このときの水質は有機物の量の
指標となるTOC値で480mg/Lである。処理結果
を表3に示す。TOC値が480mg/Lであっても、
4本のUVランプ使用(640W)により、100mg
/Lの溶存オゾンのほぼ完全な分解除去が可能である。
また、4本のUVランプ使用(640W)の場合で、紫
外線照射処理後のTOC値は約430mg/Lであっ
た。これは、紫外線が有機物の分解に余り使用されず、
オゾン分解のほうに有効活用されていることの証左と考
えられる。
Assuming a condition where a large amount of organic substances including an ozone decomposition inhibiting substance is present, acetic acid is added to the above ozone water in an amount of 10%.
00 mg / L was added. The water quality at this time is 480 mg / L as a TOC value which is an index of the amount of organic matter. Table 3 shows the processing results. Even if the TOC value is 480 mg / L,
100mg by using 4 UV lamps (640W)
/ L of dissolved ozone can be almost completely decomposed and removed.
In the case of using four UV lamps (640 W), the TOC value after the ultraviolet irradiation treatment was about 430 mg / L. This is because ultraviolet light is not used much for the decomposition of organic matter,
This is considered to be evidence that it is more effectively used for ozonolysis.

【0037】[0037]

【表3】 [Table 3]

【0038】pHが7未満の条件を想定してオゾン水へ
の酢酸の添加によりpHを3.8としたとき、及びpH
が7以上を条件を想定してオゾン水への炭酸水素アンモ
ニウムの添加によりpHを8.2としたときの結果を表
4に示す。処理水が酸性、アルカリ性のどちらであって
も、オゾンの分解除去が可能である。
Assuming that the pH is less than 7, the pH is adjusted to 3.8 by adding acetic acid to ozone water;
Table 4 shows the results when the pH was adjusted to 8.2 by adding ammonium bicarbonate to ozone water on the assumption that the pH was 7 or more. The ozone can be decomposed and removed regardless of whether the treated water is acidic or alkaline.

【0039】[0039]

【表4】 [Table 4]

【0040】オゾン分解抑制物質を含む多量の有機物存
在下でも、紫外線の照射により高濃度の溶存オゾンが効
果的に分解される理由は以下のように考えられる。
The reason why high-concentration dissolved ozone is effectively decomposed by ultraviolet irradiation even in the presence of a large amount of an organic substance containing an ozone decomposition inhibitor is considered as follows.

【0041】オゾンは紫外線のなかでも254nmの波
長の光によって分解される。一方、有機物の光の吸収は
254nm付近にない。このため、オゾンの分解は有機
物の存在に影響されない。図2(a)はオゾン水(11
mg/L)の250nm付近の実際の光の吸収を示し、
図2(b)は有機物の1例としての酢酸(60000m
g/L)の250nm付近の実際の光の吸収を示す。図
2から分かるように、有機物の光の吸収は254nm付
近にないので、多量の有機物存在下でも紫外線の照射に
より高濃度の溶存オゾンが効率よく選択的に分解され
る。この観点から、紫外線としては、254nmの波長
の光を多く含むものが好ましい。
Ozone is decomposed by light having a wavelength of 254 nm among ultraviolet rays. On the other hand, the light absorption of the organic substance is not around 254 nm. Thus, ozone decomposition is not affected by the presence of organic matter. FIG. 2A shows ozone water (11).
(mg / L) around 250 nm.
FIG. 2B shows acetic acid (60000 m) as an example of an organic substance.
(g / L) around 250 nm. As can be seen from FIG. 2, since the absorption of light by the organic substance is not near 254 nm, even in the presence of a large amount of organic substance, high-concentration dissolved ozone is efficiently and selectively decomposed by ultraviolet irradiation. From this viewpoint, it is preferable that the ultraviolet ray contains a large amount of light having a wavelength of 254 nm.

【0042】[0042]

【発明の効果】以上に説明したとおり、本発明の排オゾ
ン水の処理方法は、オゾン分解抑制物質を含む多量の有
機物が存在する条件下でも、排オゾン水中に多量に溶解
するオゾンを効率的に分解除去することができる。従っ
て、液相オゾン処理に高濃度オゾン水を使用したとき
に、排オゾン水の排出に起因して問題となる配管系の腐
食や環境汚染を防止でき、高濃度オゾン水による効率的
な液相オゾン処理を可能にする効果がある。
As described above, the method of treating waste ozone water according to the present invention efficiently removes ozone that is dissolved in a large amount in waste ozone water even under the condition that a large amount of organic matter containing an ozone decomposition inhibitor is present. Can be decomposed and removed. Therefore, when high-concentration ozone water is used for the liquid-phase ozone treatment, it is possible to prevent the corrosion of the piping system and environmental pollution caused by the discharge of the waste ozone water, and the efficient liquid phase This has the effect of enabling ozone treatment.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の排オゾン水の処理方法を用いた基板処
理装置の一例を示す装置構成図である。
FIG. 1 is an apparatus configuration diagram showing an example of a substrate processing apparatus using a method of treating waste ozone water of the present invention.

【図2】オゾン及び有機物の光の吸収を示すグラフであ
る。
FIG. 2 is a graph showing light absorption of ozone and organic substances.

【符号の説明】[Explanation of symbols]

10 基板 20 基板処理部 30 排オゾン水処理部 31 反応容器 34 紫外線ランプ 40 オゾン水 41 排オゾン水 DESCRIPTION OF SYMBOLS 10 Substrate 20 Substrate processing part 30 Waste ozone water processing part 31 Reaction container 34 Ultraviolet lamp 40 Ozone water 41 Exhausted ozone water

フロントページの続き Fターム(参考) 2H096 AA25 AA27 LA02 4D037 AA11 AB11 BA18 BB01 BB09 CA14 5F046 MA02 MA05 Continued on the front page F term (reference) 2H096 AA25 AA27 LA02 4D037 AA11 AB11 BA18 BB01 BB09 CA14 5F046 MA02 MA05

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 オゾンが溶解したオゾン水による液相オ
ゾン処理に使用した後の排オゾン水に紫外線を照射する
ことを特徴とする排オゾン水の処理方法。
1. A method for treating waste ozone water, comprising irradiating ultraviolet light to waste ozone water after use in liquid-phase ozone treatment with ozone water in which ozone is dissolved.
【請求項2】 液相オゾン処理は、オゾン水により基板
上から有機物を除去する処理である請求項1に記載の排
オゾン水の処理方法。
2. The method for treating waste ozone water according to claim 1, wherein the liquid phase ozone treatment is a treatment for removing organic substances from the substrate with ozone water.
【請求項3】 オゾン水により基板上から有機物を除去
する処理は、レジスト剥離処理である請求項2に記載の
排オゾン水の処理方法。
3. The method for treating waste ozone water according to claim 2, wherein the treatment for removing organic substances from the substrate with ozone water is a resist stripping treatment.
【請求項4】 排オゾン水は、紫外線が照射される段階
で、溶存オゾンを20mg/L以上含む請求項1に記載
の排オゾン水の処理方法。
4. The method according to claim 1, wherein the discharged ozone water contains at least 20 mg / L of dissolved ozone at the stage of irradiation with ultraviolet rays.
【請求項5】 紫外線の照射により、排オゾン水中の溶
存オゾン濃度を10mg/L以下に低減する請求項4に
記載の排オゾン水の処理方法。
5. The method for treating waste ozone water according to claim 4, wherein the concentration of dissolved ozone in the waste ozone water is reduced to 10 mg / L or less by ultraviolet irradiation.
【請求項6】 排オゾン水は、オゾンの分解を抑制する
物質を5mg/L以上含む請求項1に記載の排オゾン水
の処理方法。
6. The method according to claim 1, wherein the waste ozone water contains at least 5 mg / L of a substance that suppresses the decomposition of ozone.
【請求項7】 排オゾン水は、有機物をTOC値として
100mg/L以上含む請求項1に記載の排オゾン水の
処理方法。
7. The method for treating waste ozone water according to claim 1, wherein the waste ozone water contains an organic substance at a TOC value of 100 mg / L or more.
JP2000186414A 2000-06-21 2000-06-21 Method of treating waste ozone water Pending JP2002001320A (en)

Priority Applications (2)

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JP2000186414A JP2002001320A (en) 2000-06-21 2000-06-21 Method of treating waste ozone water
PCT/JP2001/011065 WO2003051777A1 (en) 2000-06-21 2001-12-17 Method and apparatus for treating waste ozone water and apparatus for treatment with ozone

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000186414A JP2002001320A (en) 2000-06-21 2000-06-21 Method of treating waste ozone water
PCT/JP2001/011065 WO2003051777A1 (en) 2000-06-21 2001-12-17 Method and apparatus for treating waste ozone water and apparatus for treatment with ozone

Publications (1)

Publication Number Publication Date
JP2002001320A true JP2002001320A (en) 2002-01-08

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Cited By (4)

* Cited by examiner, † Cited by third party
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WO2003051777A1 (en) * 2000-06-21 2003-06-26 Sumitomo Precision Products Co., Ltd Method and apparatus for treating waste ozone water and apparatus for treatment with ozone
JP2005294377A (en) * 2004-03-31 2005-10-20 Kurita Water Ind Ltd Method and apparatus for supplying ozone water
KR101161904B1 (en) * 2004-03-31 2012-07-03 쿠리타 고교 가부시키가이샤 Method of ozone water supply and ozone water supply apparatus
JP2017074553A (en) * 2015-10-14 2017-04-20 栗田工業株式会社 Treatment method and treatment apparatus for ozone-containing waste water

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JPS5933401Y2 (en) * 1980-04-30 1984-09-18 日立木材地所株式会社 liquid sterilizer
JPH09131588A (en) * 1995-11-10 1997-05-20 Toray Ind Inc Waste water treatment for kitchen sink and device therefor
JP2000147793A (en) * 1998-11-12 2000-05-26 Mitsubishi Electric Corp Method for removing photoresist film and apparatus therefor
JP2000262992A (en) * 1999-03-18 2000-09-26 Toshiba Corp Substrate washing method
TW466558B (en) * 1999-09-30 2001-12-01 Purex Co Ltd Method of removing contamination adhered to surfaces and apparatus used therefor
JP3068405U (en) * 1999-10-21 2000-05-12 株式会社東京フローメータ研究所 Dissolved ozone decomposer
JP2002001320A (en) * 2000-06-21 2002-01-08 Sumitomo Precision Prod Co Ltd Method of treating waste ozone water

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003051777A1 (en) * 2000-06-21 2003-06-26 Sumitomo Precision Products Co., Ltd Method and apparatus for treating waste ozone water and apparatus for treatment with ozone
JP2005294377A (en) * 2004-03-31 2005-10-20 Kurita Water Ind Ltd Method and apparatus for supplying ozone water
JP4513122B2 (en) * 2004-03-31 2010-07-28 栗田工業株式会社 Ozone water supply method and ozone water supply device
KR101161904B1 (en) * 2004-03-31 2012-07-03 쿠리타 고교 가부시키가이샤 Method of ozone water supply and ozone water supply apparatus
JP2017074553A (en) * 2015-10-14 2017-04-20 栗田工業株式会社 Treatment method and treatment apparatus for ozone-containing waste water

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