JP2001522526A - プラスチック・パッケージを成形する方法および装置 - Google Patents
プラスチック・パッケージを成形する方法および装置Info
- Publication number
- JP2001522526A JP2001522526A JP53235398A JP53235398A JP2001522526A JP 2001522526 A JP2001522526 A JP 2001522526A JP 53235398 A JP53235398 A JP 53235398A JP 53235398 A JP53235398 A JP 53235398A JP 2001522526 A JP2001522526 A JP 2001522526A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cavity
- bga
- package
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004033 plastic Substances 0.000 title claims description 15
- 238000000034 method Methods 0.000 title abstract description 23
- 238000000465 moulding Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 241000218657 Picea Species 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000001721 transfer moulding Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000003925 fat Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012120 mounting media Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. プラスチック・パッケージをカプセル化するシステムであって、 少なくとも1つのスプルース、および、少なくとも1つのプランジャ・ポット組 立体から樹脂を移送するための少なくとも1つのランナー・システムを包含する トップ・モールドと、 少なくとも1つのプラスチック・パッケージを作ることになっている基板を支え るためのボトム・モールドと、 前記トップ・モールドと、前記ランナー・システムから樹脂を受け入れる前記 ボトム・モールドとの間に挿設したキャビティ・プレートであり、前記トップ・ モールドに面しているその表面に、少なくとも1つの円錐形流路を有し、前記流 路が、前記基板をカプセル化するために少なくとも1つのキャビティと連通する キャビティ・プレートと を包含し、 それによって、前記プラスチック・パッケージ内のワイヤ・スウィープ問題を 最小限に抑えながら前記システムが信頼性をもって前記基板をカプセル化する ことを特徴とするカプセル化システム。 2. 請求の範囲第1項記載のカプセル化システムにおいて、前記キ ャビティ・プレートが、さらに、その先端に、サブマリン・ゲートを有すること を特徴とするカプセル化システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG1997001389A SG64985A1 (en) | 1997-05-06 | 1997-05-06 | Method and apparatus for moulding plastic packages |
SG9701389-0 | 1997-05-06 | ||
PCT/SG1998/000032 WO1998050216A1 (en) | 1997-05-06 | 1998-05-02 | Method and apparatus for molding plastic packages |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001522526A true JP2001522526A (ja) | 2001-11-13 |
JP4162720B2 JP4162720B2 (ja) | 2008-10-08 |
Family
ID=20429640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53235398A Expired - Lifetime JP4162720B2 (ja) | 1997-05-06 | 1998-05-02 | 半導体装置をカプセル化するシステムおよび方法 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0980305B1 (ja) |
JP (1) | JP4162720B2 (ja) |
CN (1) | CN1255082A (ja) |
DE (1) | DE69828163T2 (ja) |
MY (1) | MY132795A (ja) |
SG (1) | SG64985A1 (ja) |
TW (1) | TW407097B (ja) |
WO (1) | WO1998050216A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6869556B2 (en) | 2002-07-16 | 2005-03-22 | Asm Technology Singapore Pte Ltd. | Molding system for semiconductor packages |
TWI384597B (zh) | 2009-04-09 | 2013-02-01 | Advanced Semiconductor Eng | 封裝結構及封裝其之封膠模組與封膠模具 |
CN101859690B (zh) * | 2009-04-10 | 2012-09-05 | 日月光半导体制造股份有限公司 | 封装结构及封装其的封胶模块与封胶模具 |
CN102294781A (zh) * | 2010-06-22 | 2011-12-28 | 禾晶能源科技股份有限公司 | 太阳能镜片多穴射出成型的方法 |
CN102285058B (zh) * | 2011-05-24 | 2014-01-15 | 四川钟顺太阳能开发有限公司 | 玻璃基硅胶复眼聚光器生产工艺及其专用模具 |
CN103587033A (zh) * | 2012-08-16 | 2014-02-19 | 汉达精密电子(昆山)有限公司 | 外观装饰效果处理方法及其产品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650648A (en) * | 1970-02-25 | 1972-03-21 | Union Carbide Corp | System for molding electronic components |
US4332537A (en) * | 1978-07-17 | 1982-06-01 | Dusan Slepcevic | Encapsulation mold with removable cavity plates |
US4442056A (en) * | 1980-12-06 | 1984-04-10 | Dusan Slepcevic | Encapsulation mold with gate plate and method of using same |
FR2598258B1 (fr) * | 1986-04-30 | 1988-10-07 | Aix Les Bains Composants | Procede d'encapsulation de circuits integres. |
US5155578A (en) * | 1991-04-26 | 1992-10-13 | Texas Instruments Incorporated | Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages |
US5783134A (en) * | 1994-01-13 | 1998-07-21 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor device |
-
1997
- 1997-05-06 SG SG1997001389A patent/SG64985A1/en unknown
-
1998
- 1998-04-22 TW TW087106204A patent/TW407097B/zh not_active IP Right Cessation
- 1998-04-29 MY MYPI98001933A patent/MY132795A/en unknown
- 1998-05-02 JP JP53235398A patent/JP4162720B2/ja not_active Expired - Lifetime
- 1998-05-02 DE DE69828163T patent/DE69828163T2/de not_active Expired - Lifetime
- 1998-05-02 CN CN98804825A patent/CN1255082A/zh active Pending
- 1998-05-02 WO PCT/SG1998/000032 patent/WO1998050216A1/en active IP Right Grant
- 1998-05-02 EP EP98920815A patent/EP0980305B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW407097B (en) | 2000-10-01 |
EP0980305B1 (en) | 2004-12-15 |
JP4162720B2 (ja) | 2008-10-08 |
DE69828163T2 (de) | 2005-12-29 |
EP0980305A1 (en) | 2000-02-23 |
WO1998050216A1 (en) | 1998-11-12 |
SG64985A1 (en) | 1999-05-25 |
DE69828163D1 (de) | 2005-01-20 |
MY132795A (en) | 2007-10-31 |
CN1255082A (zh) | 2000-05-31 |
EP0980305A4 (en) | 2001-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8012799B1 (en) | Method of assembling semiconductor device with heat spreader | |
US6287503B1 (en) | Method for encasing array packages | |
CN101409266B (zh) | 封装结构 | |
US6338813B1 (en) | Molding method for BGA semiconductor chip package | |
US6498055B2 (en) | Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system | |
US6918178B2 (en) | Method of attaching a heat sink to an IC package | |
EP2565913B1 (en) | Method for encapsulating of a semiconductor | |
KR19990021975A (ko) | 전자 패키지들의 트랜스퍼 몰딩방법 및 이를 이용하여 제조된패키지들 | |
US9147600B2 (en) | Packages for multiple semiconductor chips | |
JP2000208540A (ja) | 薄型半導体チップスケ―ル・パッケ―ジを密封する方法 | |
JPH06252316A (ja) | リードフレーム上へのプラスチック部材の形成方法 | |
US9177941B2 (en) | Semiconductor device with stacked semiconductor chips | |
US8039951B2 (en) | Thermally enhanced semiconductor package and method of producing the same | |
JP2008545254A (ja) | モールド・フラッシュを低減させるための磁気支援製造、及びヒートスラグ・アッセンブリを用いる支援 | |
JP2001522526A (ja) | プラスチック・パッケージを成形する方法および装置 | |
US20050093181A1 (en) | Heat sinkable package | |
US7863094B2 (en) | Method for removing bubbles from adhesive layer of semiconductor chip package | |
TW559960B (en) | Fabrication method for ball grid array semiconductor package | |
JPH04124846A (ja) | テープキャリヤ | |
JP2003258158A (ja) | 半導体装置の製造方法 | |
TW200412659A (en) | Semiconductor package with heat dissipating structure | |
US7042078B2 (en) | Semiconductor package | |
EP4383317A1 (en) | A method for fabricating a semiconductor package with improved thermal performance | |
US20240178007A1 (en) | Method of manufacturing semiconductor devices and corresponding semiconductor device | |
KR19980086768A (ko) | 플라스틱 패키지를 성형하기 위한 장치 및 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050428 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20070926 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080115 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20080414 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080508 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20080602 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080624 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080723 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110801 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140801 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |