JP2001513452A - 連続的に変化し得る平坦化及び研磨パッドシステム - Google Patents

連続的に変化し得る平坦化及び研磨パッドシステム

Info

Publication number
JP2001513452A
JP2001513452A JP2000507089A JP2000507089A JP2001513452A JP 2001513452 A JP2001513452 A JP 2001513452A JP 2000507089 A JP2000507089 A JP 2000507089A JP 2000507089 A JP2000507089 A JP 2000507089A JP 2001513452 A JP2001513452 A JP 2001513452A
Authority
JP
Japan
Prior art keywords
pad
layers
polishing
changing
pad system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000507089A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001513452A5 (https=
Inventor
レイモンド ピー． スホーキ
ハインツ ラインハート
デイヴィット ジェイ．ヴィー． ローデリック
Original Assignee
ローデル ホールディングス インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローデル ホールディングス インコーポレイテッド filed Critical ローデル ホールディングス インコーポレイテッド
Publication of JP2001513452A publication Critical patent/JP2001513452A/ja
Publication of JP2001513452A5 publication Critical patent/JP2001513452A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000507089A 1997-08-06 1998-08-05 連続的に変化し得る平坦化及び研磨パッドシステム Pending JP2001513452A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5490797P 1997-08-06 1997-08-06
US60/054,907 1997-08-06
PCT/US1998/016266 WO1999007518A1 (en) 1997-08-06 1998-08-05 Continuously variable planarization and polishing pad system

Publications (2)

Publication Number Publication Date
JP2001513452A true JP2001513452A (ja) 2001-09-04
JP2001513452A5 JP2001513452A5 (https=) 2006-01-05

Family

ID=21994296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000507089A Pending JP2001513452A (ja) 1997-08-06 1998-08-05 連続的に変化し得る平坦化及び研磨パッドシステム

Country Status (2)

Country Link
JP (1) JP2001513452A (https=)
WO (1) WO1999007518A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004511083A (ja) * 2000-06-30 2004-04-08 ロデール　ホールディングス　インコーポレイテッド 研磨パッド用ベースパッド

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6746311B1 (en) * 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
US6962521B2 (en) 2000-07-10 2005-11-08 Shin-Etsu Handotai Co., Ltd. Edge polished wafer, polishing cloth for edge polishing, and apparatus and method for edge polishing
US20220048156A1 (en) * 2020-08-14 2022-02-17 Steven Anneker Polishing pad assembly
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04201181A (ja) * 1990-11-30 1992-07-22 Ichikawa Woolen Textile Co Ltd 研磨用フェルト
JPH0963995A (ja) * 1995-08-28 1997-03-07 Hitachi Ltd 研磨装置およびそれを用いた研磨方法
JPH09115862A (ja) * 1995-10-20 1997-05-02 Hitachi Ltd 研磨工具と、それを用いた研磨方法および研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4220491A (en) * 1978-10-19 1980-09-02 Ppg Industries, Inc. Method for forming an accurately assembled laminate utilizing a vacuum holding press
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5310455A (en) * 1992-07-10 1994-05-10 Lsi Logic Corporation Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
US5665656A (en) * 1995-05-17 1997-09-09 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04201181A (ja) * 1990-11-30 1992-07-22 Ichikawa Woolen Textile Co Ltd 研磨用フェルト
JPH0963995A (ja) * 1995-08-28 1997-03-07 Hitachi Ltd 研磨装置およびそれを用いた研磨方法
JPH09115862A (ja) * 1995-10-20 1997-05-02 Hitachi Ltd 研磨工具と、それを用いた研磨方法および研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004511083A (ja) * 2000-06-30 2004-04-08 ロデール　ホールディングス　インコーポレイテッド 研磨パッド用ベースパッド
JP4916638B2 (ja) * 2000-06-30 2012-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド用ベースパッド

Also Published As

Publication number Publication date
WO1999007518A1 (en) 1999-02-18

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