JP2001509634A - 周波数選択型可変出力誘導ヒータシステムおよび方法 - Google Patents
周波数選択型可変出力誘導ヒータシステムおよび方法Info
- Publication number
- JP2001509634A JP2001509634A JP2000501636A JP2000501636A JP2001509634A JP 2001509634 A JP2001509634 A JP 2001509634A JP 2000501636 A JP2000501636 A JP 2000501636A JP 2000501636 A JP2000501636 A JP 2000501636A JP 2001509634 A JP2001509634 A JP 2001509634A
- Authority
- JP
- Japan
- Prior art keywords
- induction heating
- zones
- frequency
- circuit
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000006698 induction Effects 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims description 76
- 238000010438 heat treatment Methods 0.000 claims abstract description 149
- 230000001939 inductive effect Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 5
- 239000010409 thin film Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 23
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 102100022749 Aminopeptidase N Human genes 0.000 description 1
- 102100024222 B-lymphocyte antigen CD19 Human genes 0.000 description 1
- 101000757160 Homo sapiens Aminopeptidase N Proteins 0.000 description 1
- 101000980825 Homo sapiens B-lymphocyte antigen CD19 Proteins 0.000 description 1
- 101000935040 Homo sapiens Integrin beta-2 Proteins 0.000 description 1
- 101000946889 Homo sapiens Monocyte differentiation antigen CD14 Proteins 0.000 description 1
- 102100025390 Integrin beta-2 Human genes 0.000 description 1
- 102100035877 Monocyte differentiation antigen CD14 Human genes 0.000 description 1
- 235000019013 Viburnum opulus Nutrition 0.000 description 1
- 244000071378 Viburnum opulus Species 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
- H05B6/44—Coil arrangements having more than one coil or coil segment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Induction Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5202997P | 1997-07-09 | 1997-07-09 | |
| US60/052,029 | 1997-07-09 | ||
| PCT/US1998/014125 WO1999003308A1 (en) | 1997-07-09 | 1998-07-08 | Frequency selected, variable output inductor heater system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001509634A true JP2001509634A (ja) | 2001-07-24 |
| JP2001509634A5 JP2001509634A5 (enExample) | 2006-01-05 |
Family
ID=21974964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000501636A Pending JP2001509634A (ja) | 1997-07-09 | 1998-07-08 | 周波数選択型可変出力誘導ヒータシステムおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6316754B1 (enExample) |
| EP (1) | EP0995340A1 (enExample) |
| JP (1) | JP2001509634A (enExample) |
| KR (1) | KR100574414B1 (enExample) |
| WO (1) | WO1999003308A1 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010047155A1 (ja) * | 2008-10-23 | 2010-04-29 | 東京エレクトロン株式会社 | 熱処理装置 |
| KR20150013637A (ko) * | 2012-04-27 | 2015-02-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 다-구역 가열을 갖는 기판 지지부를 위한 방법 및 장치 |
| JP2018524983A (ja) * | 2015-06-29 | 2018-09-06 | ニコベンチャーズ ホールディングス リミテッド | 電子エアロゾル供給システム |
| US11185110B2 (en) | 2015-06-29 | 2021-11-30 | Nicoventures Trading Limited | Electronic vapor provision system |
| US11896055B2 (en) | 2015-06-29 | 2024-02-13 | Nicoventures Trading Limited | Electronic aerosol provision systems |
| US12070070B2 (en) | 2015-06-29 | 2024-08-27 | Nicoventures Trading Limited | Electronic vapor provision system |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2340681B (en) * | 1998-08-14 | 2003-07-30 | Mars Inc | Oscillators |
| US7212414B2 (en) | 1999-06-21 | 2007-05-01 | Access Business Group International, Llc | Adaptive inductive power supply |
| AU1467501A (en) | 1999-11-03 | 2001-05-14 | Nexicor Llc | Hand held induction tool |
| JP3839228B2 (ja) | 2000-07-31 | 2006-11-01 | 株式会社神戸製鋼所 | 生タイヤ予熱方法およびその装置 |
| EP1194011B1 (de) * | 2000-09-29 | 2008-09-10 | BSH Bosch und Siemens Hausgeräte GmbH | Umrichterschaltung und Verfahren zum Betrieb einer solchen |
| JP2004531042A (ja) * | 2001-06-27 | 2004-10-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 真空管のゲッタ材料を蒸発させるための方法及びその装置 |
| JP2003017237A (ja) * | 2001-06-28 | 2003-01-17 | Harison Toshiba Lighting Corp | 誘導加熱ローラ装置、定着装置および画像形成装置 |
| JP2004013016A (ja) * | 2002-06-10 | 2004-01-15 | Toshiba Tec Corp | 定着装置および画像形成装置 |
| JP3834540B2 (ja) | 2002-10-10 | 2006-10-18 | 株式会社神戸製鋼所 | 生タイヤ予熱方法およびその装置 |
| JP4422422B2 (ja) * | 2003-03-25 | 2010-02-24 | 東芝テック株式会社 | 定着装置 |
| US20050065901A1 (en) * | 2003-07-09 | 2005-03-24 | Board Of Regents, The University Of Texas System | Methods and systems for simultaneous multiple frequency voltage generation |
| GB0324831D0 (en) * | 2003-10-24 | 2003-11-26 | British Nuclear Fuels Plc | Induction heating |
| US6875966B1 (en) | 2004-03-15 | 2005-04-05 | Nexicor Llc | Portable induction heating tool for soldering pipes |
| JP5117400B2 (ja) * | 2006-01-09 | 2013-01-16 | インダクトサーム・コーポレイション | 可変パラメーターを有するストリップ材料のための誘導加熱装置 |
| JP5202839B2 (ja) | 2006-12-25 | 2013-06-05 | 東京エレクトロン株式会社 | 成膜装置および成膜方法 |
| US8884201B2 (en) * | 2008-09-15 | 2014-11-11 | The Boeing Company | Systems and methods for fabrication of thermoplastic components |
| DE102009048490A1 (de) * | 2009-09-24 | 2011-04-07 | E.G.O. Elektro-Gerätebau GmbH | Verfahren zum Einstellen einer Heizleistungsabgabe einer Induktionsheizeinrichtung sowie zugehörige Induktionsheizeinrichtung |
| CN104372309B (zh) * | 2013-08-12 | 2018-09-14 | 北京北方华创微电子装备有限公司 | 加热装置、反应腔室及等离子体加工设备 |
| US9789421B2 (en) | 2014-06-11 | 2017-10-17 | Corner Star Limited | Induction heater system for a fluidized bed reactor |
| KR102368372B1 (ko) | 2015-08-04 | 2022-02-28 | 삼성전자주식회사 | 유도 가열 장치 및 그 제어 방법 |
| DE102016119328A1 (de) * | 2016-10-11 | 2018-04-12 | Osram Opto Semiconductors Gmbh | Heizvorrichtung, Verfahren und System zur Herstellung von Halbleiterchips im Waferverbund |
| CN106947954B (zh) * | 2017-04-27 | 2019-06-18 | 京东方科技集团股份有限公司 | 一种气相沉积设备及薄膜的制备方法 |
| CN117224017B (zh) * | 2022-06-08 | 2025-10-10 | 上海爱餐机器人(集团)有限公司 | 智能炒菜机中为炒锅提供热能的加热装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2669647A (en) | 1952-06-13 | 1954-02-16 | Gen Engineering Company Canada | Dual frequency induction heating apparatus |
| US4093839A (en) * | 1976-04-02 | 1978-06-06 | Ajax Magnethermic Corporation | Apparatus and method for inductively heating metallic tubing having an upset portion |
| US4506131A (en) | 1983-08-29 | 1985-03-19 | Inductotherm Industries Inc. | Multiple zone induction coil power control apparatus and method |
| GB8505811D0 (en) * | 1985-03-06 | 1985-04-11 | Bekaert Sa Nv | Induction heating |
| JP2530812B2 (ja) | 1985-12-12 | 1996-09-04 | 富士電機株式会社 | 高周波誘導加熱装置 |
-
1998
- 1998-07-08 JP JP2000501636A patent/JP2001509634A/ja active Pending
- 1998-07-08 US US09/462,402 patent/US6316754B1/en not_active Expired - Fee Related
- 1998-07-08 KR KR1020007000258A patent/KR100574414B1/ko not_active Expired - Fee Related
- 1998-07-08 WO PCT/US1998/014125 patent/WO1999003308A1/en not_active Ceased
- 1998-07-08 EP EP98933258A patent/EP0995340A1/en not_active Withdrawn
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103280A (ja) * | 2008-10-23 | 2010-05-06 | Tokyo Electron Ltd | 熱処理装置 |
| KR101102740B1 (ko) | 2008-10-23 | 2012-01-05 | 도쿄엘렉트론가부시키가이샤 | 열 처리 장치 |
| US8658951B2 (en) | 2008-10-23 | 2014-02-25 | Tokyo Electron Limited | Heat treatment apparatus |
| WO2010047155A1 (ja) * | 2008-10-23 | 2010-04-29 | 東京エレクトロン株式会社 | 熱処理装置 |
| KR102113454B1 (ko) * | 2012-04-27 | 2020-05-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 다-구역 가열을 갖는 기판 지지부를 위한 방법 및 장치 |
| KR20150013637A (ko) * | 2012-04-27 | 2015-02-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 다-구역 가열을 갖는 기판 지지부를 위한 방법 및 장치 |
| JP2015521371A (ja) * | 2012-04-27 | 2015-07-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | マルチゾーン加熱を有する基板支持体のための方法および装置 |
| JP2018524983A (ja) * | 2015-06-29 | 2018-09-06 | ニコベンチャーズ ホールディングス リミテッド | 電子エアロゾル供給システム |
| US11033055B2 (en) | 2015-06-29 | 2021-06-15 | Nicoventures Trading Limited | Electronic aerosol provision systems, inductive heating assemblies and cartridges for use therewith, and related methods |
| US11185110B2 (en) | 2015-06-29 | 2021-11-30 | Nicoventures Trading Limited | Electronic vapor provision system |
| US11882877B2 (en) | 2015-06-29 | 2024-01-30 | Nicoventures Trading Limited | Electronic vapor provision system |
| US11896055B2 (en) | 2015-06-29 | 2024-02-13 | Nicoventures Trading Limited | Electronic aerosol provision systems |
| US12070070B2 (en) | 2015-06-29 | 2024-08-27 | Nicoventures Trading Limited | Electronic vapor provision system |
| US12232533B2 (en) | 2015-06-29 | 2025-02-25 | Nicoventures Trading Limited | Inductive heating assemblies for generating an aerosol |
| US12402657B2 (en) | 2015-06-29 | 2025-09-02 | Nicoventures Trading Limited | Electrical vapor provision system without wired electrical connection between a control unit and a cartridge |
Also Published As
| Publication number | Publication date |
|---|---|
| US6316754B1 (en) | 2001-11-13 |
| KR100574414B1 (ko) | 2006-04-27 |
| EP0995340A1 (en) | 2000-04-26 |
| WO1999003308A1 (en) | 1999-01-21 |
| KR20010021699A (ko) | 2001-03-15 |
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