JP2001508942A - Method and component for heating parts - Google Patents

Method and component for heating parts

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Publication number
JP2001508942A
JP2001508942A JP52965898A JP52965898A JP2001508942A JP 2001508942 A JP2001508942 A JP 2001508942A JP 52965898 A JP52965898 A JP 52965898A JP 52965898 A JP52965898 A JP 52965898A JP 2001508942 A JP2001508942 A JP 2001508942A
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Prior art keywords
heating
circuit board
heated
resistor
component
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JP52965898A
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Japanese (ja)
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アリ イステーリ
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ノキア テレコミュニカシオンス オサケ ユキチュア
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Publication of JP2001508942A publication Critical patent/JP2001508942A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Control Of Resistance Heating (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】 本発明は、１つ又は複数の層(10，11)より成る回路板の少なくとも１つの部品(14)を加熱する方法及び構成体に係る。加熱されるべき少なくとも１つの部品(14)は、回路板に関連した少なくとも１つの加熱抵抗器(15)で加熱される。 (57) SUMMARY The present invention relates to a method and an arrangement for heating at least one component (14) of a circuit board comprising one or more layers (10, 11). At least one component to be heated (14) is heated by at least one heating resistor (15) associated with the circuit board.

Description

【発明の詳細な説明】 部品を加熱する方法及び構成体発明の分野 本発明は、１つ又は複数の層を含む回路板上の少なくとも１つの部品を加熱す る方法に係る。 又、本発明は、少なくとも１つの層を含みそして１つ又は複数の加熱されるべ き部品を備えた回路板上の部品を加熱する構成体にも係る。先行技術の説明 広い温度範囲で使用される回路板は、通常、熱を充分発散するように設計され る。熱は、部品から冷却素子、支持構造体及び／又は環境へ伝導又は伝達される 。この解決策は、温暖及び高温状態では充分に機能するが、低温状態では、冷却 がしばしば効き過ぎ、部品の温度が、関連装置の動作を妨げるほど低下する。 低温状態で機能する装置の動作は、広い温度範囲内で機能するように設計され た軍用部品を使用するか、又は標準部品より成る装置を加熱することにより確保 できる。軍用部品は高価でありそして各部品は通常１つの製造者しかないので、 公知の解決策は、関連装置全体を加熱することに依存し、これは、一般に、回路 板に加えて、フレーム、装置内の空間及びその冷却フィンを加熱することを含む 。これは高い加熱電力を必要とする。このような加熱構成体は、関連装置のサイ ズもしばしば増加させ、これは、サイズが小さいときに特に不都合であり、従っ て、高度な一体化が目的とされる。加えて、全ての部品は、たとえその幾つかが 加熱を必要としなくても、同じ量の熱電力を受けることになる。 部品の加熱は、参考としてここに取り上げる米国特許第５，５３９，１８６号 にも開示されている。この米国特許第５，５３９，１８６号の解決策は、回路板 を加熱する抵抗性加熱膜を層が備えた多層基板に関するものである。発明の要旨 従って、本発明の目的は、全装置のフレーム、空間及び冷却フィンではなく、 加熱する必要のある部品のみを加熱することにより加熱電力を減少する部品加熱 方法及び構成体を提供することである。 これは、冒頭で述べた方法において、加熱されるべき１つ又は複数の部品を、 回路板に関連した少なくとも１つの加熱抵抗器で加熱し、そして回路板自身の導 通材料を加熱抵抗器の材料として使用することを特徴とする方法によって達成さ れる。 本発明の構成体は、回路板がそれに関連して配置された少なくとも１つの加熱 抵抗器を備え、この加熱抵抗器は、回路板上の少なくとも１つの部品を加熱する ように構成され、そして加熱抵抗器の材料が回路板の導通材料であることを特徴 とする。 本発明の方法は、顕著な効果を発揮する。公知技術に比して、必要な加熱電力 の量は相当に少なくなる。というのは、加熱を所望部品に入念に集中させること ができ、必ずしも加熱する必要のない素子の加熱を回避できるからである。又、 この加熱構成体は、一体化の程度を高めることができる。図面の簡単な説明 以下、添付図面を参照して、本発明を詳細に説明する。 図１は、多層回路板を示す図である。 図２は、加熱抵抗器を含む回路板の層を示す図である。 図３は、複数の加熱抵抗器を含む回路板の層を示す図である。好ましい実施形態の詳細な説明 本発明の解決策は、種々の回路板解決策に使用することができ、特に、個別部 品を含む多層回路板に使用することができる。 本発明の方法を詳細に説明する。１つ以上の複数の層をもつ回路板上にあって 回路を実際に動作する役割を果たす１つ又は複数の加熱可能な部品は、回路板に 関連した少なくとも１つの加熱抵抗器を用いて加熱される。加熱抵抗器は、加熱 されるべき部品の至近にあるか又はそれと接触される。本発明の解決策では、回 路板の層に一体化された加熱抵抗器で加熱が行なわれるのが好ましい。加熱され るべき部品は、回路板の実際の所望の動作、例えば、デジタル無線システムのト ランシーバにおける信号処理を遂行する。本発明において、加熱可能な部品は、 いかなる部品でもよく、例えば、機械的、電子的又は光学的部品でよい。一般に 、信号処理に使用されるプロセッサの動作温度を安定化することが重要である。 加熱は、抵抗器に直流又は交流電力を供給して抵抗器をウオームアップすること に より行なわれる。いかなる通常の抵抗性の従来の抵抗材料も、抵抗器として使用 できる。回路板に使用される抵抗材料、例えば、銅は、抵抗器の材料として好ま しく使用される。しかしながら、加熱抵抗器の材料は、電気を適度に良く導通す る他の材料であってもよく、その典型的な例が金属である。加熱抵抗器に交流が 供給されるときには、少なくとも部分的に容量性又は誘導性の負荷インピーダン スも抵抗器として働き得る。 特に、単一層の回路板では、回路板を実際に動作する役目を果たす充分に大き な部品の真下に加熱抵抗器を配置することができ、このとき、加熱抵抗器は、そ の上の部品を、好ましくは上記回路板を実際に動作する役目を果たす部品と同じ 動作電圧から加熱電力を得ることにより加熱する。 図１、２及び３を参照して本発明の構成体及び方法を説明する。図１は、回路 板を示す分解図である。回路板は、通常、偶数個の層を含むが、簡単化のために 、図１の回路板の構造体は、３つの層１０及び１１を備え、最も下及び最も上の 層１０は、所望の動作を遂行する部品１４のスイッチング回路板１０であり、こ れら層１０間には、加熱抵抗器１５をもつ加熱抵抗器層１１がある。従って、関 連装置全体ではなく、回路板及びその部品に加熱を集中させることができる。本 発明の解決策では、加熱抵抗器の電源は、回路板を実際に動作するのに必要な部 品１４に使用される電力即ち動作電圧であるのが好ましい。しかし、加熱抵抗器 １５は、個別の電源１２によって加熱することもできる。 加熱抵抗器１５の加熱電力は、必要に応じて調整できるのが好ましく、このた め、電源１２は、部品１４の温度を監視する制御手段１３で制御される。制御手 段１３は、部品の周りの温度、例えば、空気の温度、回路板１０の温度又は加熱 可能な部品１４の温度を監視することができ、温度が低過ぎる場合には、加熱が 開始される。回路板を実際に動作する役割を果たす部品１４に対して所定の温度 変化が許される場合には、制御手段１３は、その最も簡単なものとしては、低温 状態で加熱をオンにしそして温暖状態でオフにするスイッチである。しかしなが ら、制御手段１３は、電源１２により抵抗器１５へ供給される電力を制御できる ことも好ましい。この場合には、環境、回路板１０、或いは１つ又は複数の部品 １４が低温であるほど、より多くの加熱電力が供給されるのが好ましい。制御手 段１３は、公知技術に適合する電子式サーモメータであって、環境、回路板１０ 又は部品１４の温度を測定する少なくとも１つの測定ヘッド１３１、１３２、１ ３３が設けられる。 図２は、回路板の層１１を詳細に示す。この層１１は、この例では、層１０の 全ての部品を加熱するのに使用する１つの加熱抵抗器１５を含む。加熱抵抗器の 形状は、本発明にとって重要でないから、図２に示すものとはかなり異なっても よい。加熱抵抗器１５は、層１０の部品１４に接近しているので、効率的に加熱 を行う。加熱抵抗器１５は、図２に示すように回路板の全層１１を実質的にカバ ーしてもよいし、又は層１１の表面の一部分のみに配置されてもよい。 図３は、上記より効率的に実施される本発明の解決策を示す。この例の加熱抵 抗器層１１は、複数の加熱抵抗器１５を備えている。従って、本発明の解決策は 、回路板を実際に動作する役目を果たす異なる部品１４を異なるやり方で加熱す ることができる。多量の熱をそれ自身の動作中に発生する部品は、あまり熱を発 生しない部品より加熱の程度が少なくてよい。例えば、異なる大きさのインピー ダンスをもつ加熱抵抗器１５を使用することにより加熱電力を変えることができ る。これは、回路板の異なる層１０で実際に所望の動作を行う役目を果たす部品 １４を、互いに関わりなく、独立して加熱できるようにする。更に、図１に示す ものと同様の解決策が使用されるときには、制御手段１３は、測定ヘッド１３１ 、１３２、１３３で各部品１４の温度を別々に測定し、そして各部品へ別々に電 源１２の加熱電力を誘導できるのが好ましい。回路板を実際に動作する役目を果 たす各部品１４は、それ自身の加熱抵抗器１５を有するので、抵抗器１５の抵抗 値は小さくてよく、従って、それらに対して低い動作電圧で充分である。これは 、例えば、ロジックに意図された動作電圧を加熱抵抗器１５の電源として使用す ることもできる。しかし、手段１２、１３、１３１、１３２及び１３３は、本発 明にとって本質的なものではない。 添付図面の例を参照して本発明を詳細に説明したが、本発明はこれに限定され るものではなく、請求の範囲に記載した本発明の範囲内で種々の変更がなされ得 ることが明らかである。BACKGROUND OF THE INVENTION Field of the Invention The methods and constructs invention for heating the parts, according to the method of heating at least one component on the circuit board comprising one or more layers. The invention also relates to an arrangement for heating a component on a circuit board comprising at least one layer and comprising one or more components to be heated. DESCRIPTION OF THE PRIOR ART Circuit boards used over a wide temperature range are usually designed to dissipate heat well. Heat is conducted or transferred from the component to the cooling element, support structure, and / or environment. This solution works well in warm and hot conditions, but in cold conditions cooling is often too effective and the temperature of the components is so low as to hinder the operation of the associated equipment. Operation of a device operating at low temperatures can be assured by using military components designed to function within a wide temperature range or by heating a device consisting of standard components. Since military components are expensive and each component usually has only one manufacturer, known solutions rely on heating the entire associated equipment, which generally involves adding frames, equipment in addition to circuit boards. Heating the interior space and its cooling fins. This requires high heating power. Such a heating arrangement often also increases the size of the associated device, which is particularly disadvantageous when the size is small and is therefore aimed at a high degree of integration. In addition, all parts will receive the same amount of thermal power, even if some of them do not require heating. Part heating is also disclosed in US Pat. No. 5,539,186, incorporated herein by reference. The solution of U.S. Pat. No. 5,539,186 relates to a multi-layer substrate having a layer provided with a resistive heating film for heating the circuit board. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component heating method and structure that reduces heating power by heating only the components that need to be heated, rather than the frame, space and cooling fins of the entire device. It is. This means that in the method described at the outset, the component or components to be heated are heated by at least one heating resistor associated with the circuit board and the conducting material of the circuit board itself is replaced by the material of the heating resistor. This is achieved by a method characterized in that it is used as The arrangement of the present invention comprises at least one heating resistor having a circuit board associated therewith, the heating resistor configured to heat at least one component on the circuit board, and The material of the resistor is a conductive material of a circuit board. The method of the present invention has a remarkable effect. The amount of heating power required is considerably smaller than in the prior art. This is because the heating can be carefully concentrated on the desired parts, and the heating of the element that does not necessarily need to be heated can be avoided. Also, the heating arrangement can increase the degree of integration. BRIEF DESCRIPTION OF THE DRAWINGS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing a multilayer circuit board. FIG. 2 is a diagram illustrating the layers of a circuit board including a heating resistor. FIG. 3 is a diagram illustrating layers of a circuit board including a plurality of heating resistors. Solution DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be used for various circuit board solutions, particularly, can be used in a multilayer circuit board including a discrete component. The method of the present invention will be described in detail. One or more heatable components on the circuit board having one or more layers and serving to actually operate the circuit are heated using at least one heating resistor associated with the circuit board. Is done. The heating resistor is in close proximity to or in contact with the component to be heated. In the solution according to the invention, the heating is preferably performed with a heating resistor integrated in the layer of the circuit board. The component to be heated performs the actual desired operation of the circuit board, for example, signal processing in a transceiver in a digital radio system. In the present invention, the heatable component may be any component, for example, a mechanical, electronic or optical component. Generally, it is important to stabilize the operating temperature of a processor used for signal processing. The heating is performed by supplying DC or AC power to the resistor to warm up the resistor. Any conventional resistive conventional resistive material can be used as the resistor. Resistive materials used for circuit boards, such as copper, are preferably used as the material for the resistors. However, the material of the heating resistor may be any other material that conducts electricity reasonably well, a typical example being metal. When an alternating current is supplied to the heating resistor, an at least partially capacitive or inductive load impedance may also act as the resistor. In particular, in a single-layer circuit board, the heating resistor can be placed directly below a sufficiently large component that serves to actually operate the circuit board, where the heating resistor replaces the components above it. Preferably, the circuit board is heated by obtaining heating power from the same operating voltage as the parts that serve to actually operate. The structure and method of the present invention will be described with reference to FIGS. FIG. 1 is an exploded view showing a circuit board. Although the circuit board typically includes an even number of layers, for simplicity, the circuit board structure of FIG. 1 comprises three layers 10 and 11, with the bottom and top layers 10 being the desired layers. The switching circuit board 10 of the component 14 that performs the above operation is provided. Between these layers 10 is a heating resistor layer 11 having a heating resistor 15. Therefore, the heating can be concentrated on the circuit board and its components instead of the entire related device. In the solution of the invention, the power supply of the heating resistor is preferably the power or operating voltage used for the components 14 necessary to actually operate the circuit board. However, the heating resistor 15 can also be heated by a separate power supply 12. Preferably, the heating power of the heating resistor 15 can be adjusted as needed, so that the power supply 12 is controlled by a control means 13 that monitors the temperature of the component 14. The control means 13 can monitor the temperature around the component, for example the temperature of the air, the temperature of the circuit board 10 or the temperature of the heatable component 14, and if the temperature is too low, the heating is started. . If a certain temperature change is allowed for the component 14 which plays the role of actually operating the circuit board, the control means 13 will, in its simplest case, turn on the heating in the cold state and in the warm state A switch to turn off. However, it is also preferred that the control means 13 can control the power supplied to the resistor 15 by the power supply 12. In this case, it is preferable that the lower the temperature of the environment, the circuit board 10, or the one or more components 14, the more heating power is supplied. The control means 13 is an electronic thermometer compatible with the known art, and is provided with at least one measuring head 131, 132, 133 for measuring the temperature of the environment, the circuit board 10 or the component 14. FIG. 2 shows the circuit board layer 11 in detail. This layer 11 comprises in this example one heating resistor 15 which is used to heat all the components of the layer 10. The shape of the heating resistor may be significantly different from that shown in FIG. 2 because it is not critical to the invention. Since the heating resistor 15 is close to the component 14 of the layer 10, it effectively heats. The heating resistor 15 may cover substantially all of the layers 11 of the circuit board, as shown in FIG. 2, or may be disposed on only a portion of the surface of the layers 11. FIG. 3 shows a solution of the invention that is implemented more efficiently than described above. The heating resistor layer 11 of this example includes a plurality of heating resistors 15. Thus, the solution of the present invention can heat different components 14 that serve to actually operate the circuit board in different ways. Components that generate large amounts of heat during their own operation may require less heating than components that generate less heat. For example, the heating power can be changed by using heating resistors 15 having different magnitudes of impedance. This allows the components 14 that actually serve the desired operation in the different layers 10 of the circuit board to be heated independently of each other. Furthermore, when a solution similar to that shown in FIG. 1 is used, the control means 13 measures the temperature of each part 14 separately with the measuring heads 131, 132, 133 and separately supplies the power supply 12 to each part. It is preferable that the heating power can be induced. Since each component 14 which serves to actually operate the circuit board has its own heating resistor 15, the resistance of the resistor 15 can be small, so that a low operating voltage for them is sufficient. . This can also use, for example, the operating voltage intended for the logic as the power supply for the heating resistor 15. However, the means 12, 13, 131, 132 and 133 are not essential to the present invention. Although the present invention has been described in detail with reference to examples of the accompanying drawings, it is apparent that the present invention is not limited thereto, and that various changes can be made within the scope of the present invention described in the claims. It is.

───────────────────────────────────────────────────── フロントページの続き (81)指定国 ＥＰ(ＡＴ，ＢＥ，ＣＨ，ＤＥ， ＤＫ，ＥＳ，ＦＩ，ＦＲ，ＧＢ，ＧＲ，ＩＥ，ＩＴ，Ｌ Ｕ，ＭＣ，ＮＬ，ＰＴ，ＳＥ)，ＯＡ(ＢＦ，ＢＪ，ＣＦ ，ＣＧ，ＣＩ，ＣＭ，ＧＡ，ＧＮ，ＭＬ，ＭＲ，ＮＥ， ＳＮ，ＴＤ，ＴＧ)，ＡＰ(ＧＨ，ＧＭ，ＫＥ，ＬＳ，Ｍ Ｗ，ＳＤ，ＳＺ，ＵＧ，ＺＷ)，ＥＡ(ＡＭ，ＡＺ，ＢＹ ，ＫＧ，ＫＺ，ＭＤ，ＲＵ，ＴＪ，ＴＭ)，ＡＬ，ＡＭ ，ＡＴ，ＡＵ，ＡＺ，ＢＡ，ＢＢ，ＢＧ，ＢＲ，ＢＹ， ＣＡ，ＣＨ，ＣＮ，ＣＵ，ＣＺ，ＤＥ，ＤＫ，ＥＥ，Ｅ Ｓ，ＦＩ，ＧＢ，ＧＥ，ＧＨ，ＧＭ，ＧＷ，ＨＵ，ＩＤ ，ＩＬ，ＩＳ，ＪＰ，ＫＥ，ＫＧ，ＫＰ，ＫＲ，ＫＺ， ＬＣ，ＬＫ，ＬＲ，ＬＳ，ＬＴ，ＬＵ，ＬＶ，ＭＤ，Ｍ Ｇ，ＭＫ，ＭＮ，ＭＷ，ＭＸ，ＮＯ，ＮＺ，ＰＬ，ＰＴ ，ＲＯ，ＲＵ，ＳＤ，ＳＥ，ＳＧ，ＳＩ，ＳＫ，ＳＬ， ＴＪ，ＴＭ，ＴＲ，ＴＴ，ＵＡ，ＵＧ，ＵＳ，ＵＺ，Ｖ Ｎ，ＹＵ，ＺＷ────────────────────────────────────────────────── ─── Continuation of front page    (81) Designated countries EP (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, L U, MC, NL, PT, SE), OA (BF, BJ, CF) , CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG), AP (GH, GM, KE, LS, M W, SD, SZ, UG, ZW), EA (AM, AZ, BY) , KG, KZ, MD, RU, TJ, TM), AL, AM , AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, E S, FI, GB, GE, GH, GM, GW, HU, ID , IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, M G, MK, MN, MW, MX, NO, NZ, PL, PT , RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, V N, YU, ZW

Claims (1)

【特許請求の範囲】 １．１つ又は複数の層(10，11)を含む回路板上の少なくとも１つの部品(14)を加 熱する方法において、加熱されるべき１つ又は複数の部品(14)を、回路板に関 連した少なくとも１つの加熱抵抗器(15)で加熱し、そして回路板自身の導通材 料を加熱抵抗器(15)の材料として使用することを特徴とする方法。 ２．多層回路板のときには、回路板の１つ又は複数の層(11)を、加熱抵抗器(15) を含む回路として使用する請求項１に記載の方法。 ３．複数の異なる部品(14)を加熱するときには、各部品(14)を独立して加熱する 請求項１に記載の方法。 ４．１つ又は複数の加熱抵抗器(15)は、加熱されるべき部品(14)とは異なる加熱 電力発生電源(12)を使用する請求項１に記載の方法。 ５．加熱する必要のある部品(14)が互いに異なる場合には、それら部品(14)を異 なる加熱電力で加熱する請求項１に記載の方法。 ６．１つ又は複数の加熱抵抗器(15)の加熱電力を必要に応じて調整する請求項１ に記載の方法。 ７．加熱されるべき１つ又は複数の部品(14)の温度を測定し、そして１つ又は複 数の加熱抵抗器(15)の加熱電力を、加熱されるべき部品(14)の温度に基づいて 自動的に調整する請求項１又は６に記載の方法。 ８．多層回路板の１つ又は複数の最も内側の層(11)、又はその層の一部分を、１ つ又は複数の加熱抵抗器(15)が配置される回路として使用する請求項２に記載 の方法。 ９．加熱されるべき部品(14)を、その部品(14)と同じ層にある部品(14)の下の加 熱抵抗器(15)で加熱する請求項１に記載の方法。 10．少なくとも１つの層(10，11)を含みそして１つ又は複数の加熱されるべき部 品(14)を含む回路板上の部品を加熱する構成体において、上記回路板はそれに 関連して配置された少なくとも１つの加熱抵抗器(15)を備え、この加熱抵抗器 は、回路板上の少なくとも１つの部品(14)を加熱するように構成され、そして 加熱抵抗器(15)の材料が回路板の導通材料であることを特徴とする構成体。 11．複数の異なる部品(14)が加熱されるときには、２つ以上の加熱抵抗器(15)が 、 各々の部品(14)に別々に熱を集中するように構成される請求項１０に記載の構 成体。 12．１つ又は複数の加熱抵抗器(15)を含む層(11)が、加熱されるべき部品(14)と は異なる電源(12)に作動的に接続される請求項１０に記載の構成体。 13．加熱されるべき部品(14)が互いに異なるときには、部品(14)を加熱する役目 を果たす加熱抵抗器(15)の加熱電力が変えられる請求項１０に記載の構成体。 14．上記構成体は、加熱されるべき部品(14)の温度を実質的に測定しそして１つ 又は複数の加熱抵抗器(15)の加熱電力を自動的に調整する手段(13)を含む請求 項１０に記載の構成体。 15．上記加熱抵抗器(15)は、加熱されるべき上記部品(14)と同じ層にある加熱さ れるべき部品(14)の下にある請求項１０に記載の構成体。 16．多層回路板の１つ又は複数の最も内側の層(11)又はその層の一部分は、１つ 又は複数の加熱抵抗器(15)を含む回路である請求項１０に記載の構成体。[Claims] 1. Add at least one component (14) on a circuit board containing one or more layers (10, 11).   In the heating method, one or more components (14) to be heated are attached to a circuit board.   Heating with at least one connected heating resistor (15) and conducting material of the circuit board itself   Using the material as a material for the heating resistor (15). 2. In the case of a multilayer circuit board, one or more layers (11) of the circuit board may be connected to a heating resistor (15).   The method according to claim 1, wherein the method is used as a circuit including: 3. When heating a plurality of different parts (14), heat each part (14) independently   The method of claim 1. 4. One or more heating resistors (15) have a different heating than the part (14) to be heated.   The method according to claim 1, wherein a power generating power supply (12) is used. 5. If the parts (14) that need to be heated are different from each other,   2. The method according to claim 1, wherein the heating is performed with a heating power. 6. The heating power of one or more heating resistors (15) is adjusted as required.   The method described in. 7. Measure the temperature of one or more parts (14) to be heated, and   The heating power of the number of heating resistors (15) is based on the temperature of the part (14) to be heated.   The method according to claim 1, wherein the adjustment is performed automatically. 8. One or more innermost layers (11) of the multilayer circuit board, or a portion of the layers,   3. The method according to claim 2, wherein the heating resistor is used as a circuit.   the method of. 9. Place the part to be heated (14) below the part (14) in the same layer as the part (14).   The method according to claim 1, wherein the heating is carried out with a thermal resistor (15). Ten. Part comprising at least one layer (10,11) and one or more to be heated   In a structure for heating a component on a circuit board containing an article (14), the circuit board may   At least one heating resistor (15) arranged in association therewith;   Is configured to heat at least one component (14) on the circuit board, and   A structure wherein the material of the heating resistor (15) is a conductive material of a circuit board. 11． When several different parts (14) are heated, two or more heating resistors (15) ,   A structure as claimed in claim 10, configured to concentrate heat separately on each component (14).   Adult. 12. The layer (11) containing one or more heating resistors (15) is connected to the part (14) to be heated.   An arrangement according to claim 10, wherein the is operatively connected to a different power supply (12). 13. When the parts (14) to be heated are different from each other, the role of heating the parts (14) is   11. The arrangement according to claim 10, wherein the heating power of the heating resistor (15) is varied. 14. The arrangement substantially measures the temperature of the part (14) to be heated and   Or means (13) for automatically adjusting the heating power of the plurality of heating resistors (15).   Item 11. The structure according to Item 10. 15． The heating resistor (15) is located on the same layer as the part (14) to be heated.   An arrangement according to claim 10, which is below the part (14) to be removed. 16． One or more innermost layers (11) of the multilayer circuit board or a part of the layers may be one   An arrangement according to claim 10, or a circuit comprising a plurality of heating resistors (15).
JP52965898A 1996-12-31 1997-12-30 Method and component for heating parts Pending JP2001508942A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI965301A FI965301A (en) 1996-12-31 1996-12-31 Procedure and arrangement for heating a component
FI965301 1996-12-31
PCT/FI1997/000834 WO1998030075A2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component

Publications (1)

Publication Number Publication Date
JP2001508942A true JP2001508942A (en) 2001-07-03

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ID=8547390

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JP52965898A Pending JP2001508942A (en) 1996-12-31 1997-12-30 Method and component for heating parts

Country Status (6)

Country Link
EP (1) EP0983714A2 (en)
JP (1) JP2001508942A (en)
AU (1) AU728378B2 (en)
FI (1) FI965301A (en)
NO (1) NO993236D0 (en)
WO (1) WO1998030075A2 (en)

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JP2008529262A (en) * 2005-01-24 2008-07-31 ユマテック ゲーエムベーハー Printed circuit board or card with heating wire

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FI981032A (en) 1998-05-08 1999-11-09 Nokia Networks Oy Heating method and circuit board
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GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method

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US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2668876B1 (en) * 1990-11-07 1992-12-24 Alcatel Espace ELECTRONIC TEMPERATURE CONTROL CIRCUIT.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008529262A (en) * 2005-01-24 2008-07-31 ユマテック ゲーエムベーハー Printed circuit board or card with heating wire
US8481897B2 (en) 2005-01-24 2013-07-09 Jumatech, Gmbh Printed circuit board or card comprising a heating wire

Also Published As

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EP0983714A2 (en) 2000-03-08
NO993236L (en) 1999-06-29
AU728378B2 (en) 2001-01-11
WO1998030075A3 (en) 1998-08-27
NO993236D0 (en) 1999-06-29
FI965301A0 (en) 1996-12-31
WO1998030075A2 (en) 1998-07-09
FI965301A (en) 1998-07-01
AU5323998A (en) 1998-07-31

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