NO993236D0 - Method and apparatus for heating a component - Google Patents
Method and apparatus for heating a componentInfo
- Publication number
- NO993236D0 NO993236D0 NO993236A NO993236A NO993236D0 NO 993236 D0 NO993236 D0 NO 993236D0 NO 993236 A NO993236 A NO 993236A NO 993236 A NO993236 A NO 993236A NO 993236 D0 NO993236 D0 NO 993236D0
- Authority
- NO
- Norway
- Prior art keywords
- heating
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- General Induction Heating (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Control Of Resistance Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI965301A FI965301A (en) | 1996-12-31 | 1996-12-31 | Procedure and arrangement for heating a component |
PCT/FI1997/000834 WO1998030075A2 (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating a component |
Publications (2)
Publication Number | Publication Date |
---|---|
NO993236L NO993236L (en) | 1999-06-29 |
NO993236D0 true NO993236D0 (en) | 1999-06-29 |
Family
ID=8547390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO993236A NO993236D0 (en) | 1996-12-31 | 1999-06-29 | Method and apparatus for heating a component |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0983714A2 (en) |
JP (1) | JP2001508942A (en) |
AU (1) | AU728378B2 (en) |
FI (1) | FI965301A (en) |
NO (1) | NO993236D0 (en) |
WO (1) | WO1998030075A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI981032A (en) * | 1998-05-08 | 1999-11-09 | Nokia Networks Oy | Heating method and circuit board |
DE19851172A1 (en) * | 1998-11-06 | 2000-05-11 | Alcatel Sa | Arrangement for heating an assembled printed circuit |
GB2345453B (en) * | 1999-09-14 | 2000-12-27 | Lee John Robinson | Laminated reflow soldering |
DE202005001163U1 (en) * | 2005-01-24 | 2005-03-31 | Juma Leiterplattentechologie M | Circuit board for circuitry subject to temperature fluctuations, has heating wire arranged on or in circuit board and connected to power supply |
US11350490B2 (en) * | 2017-03-08 | 2022-05-31 | Raytheon Company | Integrated temperature control for multi-layer ceramics and method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440407A (en) * | 1966-12-29 | 1969-04-22 | Rca Corp | Temperature controlled circuit boards |
US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
FR2668876B1 (en) * | 1990-11-07 | 1992-12-24 | Alcatel Espace | ELECTRONIC TEMPERATURE CONTROL CIRCUIT. |
US5539186A (en) * | 1992-12-09 | 1996-07-23 | International Business Machines Corporation | Temperature controlled multi-layer module |
GB9508631D0 (en) * | 1995-04-28 | 1995-06-14 | Smiths Industries Ltd | Electrical circuits |
-
1996
- 1996-12-31 FI FI965301A patent/FI965301A/en unknown
-
1997
- 1997-12-30 WO PCT/FI1997/000834 patent/WO1998030075A2/en not_active Application Discontinuation
- 1997-12-30 EP EP97950212A patent/EP0983714A2/en not_active Withdrawn
- 1997-12-30 AU AU53239/98A patent/AU728378B2/en not_active Withdrawn - After Issue
- 1997-12-30 JP JP52965898A patent/JP2001508942A/en active Pending
-
1999
- 1999-06-29 NO NO993236A patent/NO993236D0/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU5323998A (en) | 1998-07-31 |
NO993236L (en) | 1999-06-29 |
JP2001508942A (en) | 2001-07-03 |
WO1998030075A3 (en) | 1998-08-27 |
FI965301A0 (en) | 1996-12-31 |
FI965301A (en) | 1998-07-01 |
EP0983714A2 (en) | 2000-03-08 |
WO1998030075A2 (en) | 1998-07-09 |
AU728378B2 (en) | 2001-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |