AU728378B2 - Method and arrangement for heating a component - Google Patents
Method and arrangement for heating a component Download PDFInfo
- Publication number
- AU728378B2 AU728378B2 AU53239/98A AU5323998A AU728378B2 AU 728378 B2 AU728378 B2 AU 728378B2 AU 53239/98 A AU53239/98 A AU 53239/98A AU 5323998 A AU5323998 A AU 5323998A AU 728378 B2 AU728378 B2 AU 728378B2
- Authority
- AU
- Australia
- Prior art keywords
- heated
- components
- circuit board
- heat
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Description
WO 98/30075 PCT/FI97/00834 1 METHOD AND ARRANGEMENT FOR HEATING A COMPONENT FIELD OF THE INVENTION The invention relates to a method for heating at least one component on a circuit board, said circuit board comprising one or plural layers.
The invention also relates to an arrangement for heating a component on a circuit board, which comprises at least one layer and which comprises one or plural components to be heated.
BACKGROUND OF THE INVENTION Circuit boards that are meant to be used within a broad temperature range, are usually designed to dissipate heat well. Heat is conducted or conveyed from components to cooling elements, to support structures and/or to the environment. This solution functions well in warm and hot conditions, but in cold conditions the cooling is often even too efficient and the temperature of the components falls to the extent that it can disturb the operation of the apparatus concerned.
The operation of an apparatus functioning in cold conditions can be secured by using components intended for military use, said components being designed to function within a broad temperature range, or by heating an apparatus comprising standard components. Since components intended for military use are expensive and each component usually has only one manufacturer, a prior art solution relies on heating the whole apparatus concerned, which typically involves heating the frame, the air space in the apparatus and its cooling fins, in addition to the circuit boards. This requires high heating power. Often a heating arrangement such as this also increases the size of the apparatus concerned, which is particularly disadvantageous when small size and high degree of integration are aimed at. In addition, all components are then subject to an equal amount of heating power, even if some of them would not need to be heated.
The heating of components is also described in the US Patent 5,539,186, which is enclosed herein as a reference. A solution according to the US Patent 5,539,186 concerns a multi-layer board, in which a layer comprises a resistive heating film structure for heating a circuit board.
SUMMARY OF THE INVENTION WO 98/30075 PCT/FI97/00834 2 An object of the present invention is thus to provide a method and arrangement for heating components, in said method and arrangement heating power being reduced by heating only components that need to be heated, instead of the frame, air space and cooling fins of a whole apparatus.
This is achieved with a method described in the preamble, said method being characterized in that one or plural components to be heated are heated with at least one heat resistor associated with a circuit board and that the circuit board's own conduction material is used as the material of the heat resistor.
An arrangement of the invention is characterized in that a circuit board comprises at least one heat resistor arranged in connection with it, said heat resistor being arranged to heat at least one component on the circuit board and that the material of a heat resistor is the conduction material of the circuit board.
The method of the invention offers considerable advantages.
Compared with prior art, the amount of heating power needed is much smaller, because heating can be focused more carefully on the desired components, which enables avoiding the heating of elements that need not necessarily to be heated. The degree of integration of the heating arrangement can also be increased.
BRIEF DESCRIPTION OF THE DRAWINGS In the following the invention is described in greater detail with reference to examples shown in the attached drawings, in which Figure 1 illustrates a multi-layer circuit board and Figure 2 illustrates a layer of a circuit board comprising a heat resistor and Figure 3 illustrates a layer of a circuit board comprising plural heat resistors.
DESCRIPTION OF PREFERRED
EMBODIMENTS
A solution of the invention can be utilized in different circuit board solutions, particularly in multi-layer circuit boards comprising discrete components.
Let us now examine more closely a method of the invention. One or plural heatable components of a circuit board of one or plural layers, said components being responsible for the actual operation of the circuit, are WO 98/30075 PCT/FI97/00834 3 heated using at least one heat resistor associated with the circuit board. The heat resistor is then in the immediate vicinity of or in contact with the component to be heated. In the solution of the invention heating is preferably performed with a heat resistor integrated into a circuit board layer. The components to be heated perform the actual desired operation of the circuit board, for instance signal processing in a transceiver of a digital radio system.
In the invention, the heatable components can, in turn, be any components whatsoever, e.g. mechanical, electronic or optical components. Typically the stabilizing of the operating temperature of a processor used in signal processing is important. Heating is performed by feeding direct current or alternating current power into the resistor, whereby the resistor warms up. Any typically resistive prior art resistor material can be used as a resistor. The resistor material used in the circuit board, such as copper, is preferably used as the material of the resistor. The material of a heat resistor can, however, also be any other material conducting electricity reasonably well, of which metals are a typical example. When alternating current is being fed into a heat resistor, at least a partly capacitive or inductive load impedance can also function as a resistor.
In a single-layer circuit board in particular the heat resistor can be arranged directly below a sufficiently large component responsible for the actual operation of the circuit board, the heat resistor then heating the component above it by obtaining its heating power preferably from the same operating voltage as the component responsible for the actual operation of the circuit board.
Let us now examine the inventive arrangement and method on the basis of Figures 1, 2 and 3. Figure 1 is an explosion view illustrating the circuit board. A circuit board usually comprises an even number of layers, but for the sake of simplicity the structure of the circuit board in Figure 1 comprises three layers 10 and 11, of which the bottommost and the topmost layers 10 are the switching circuit boards 10 of the components 14 performing the desired operation and between said layers 10 is a heat resistor layer 11 with a heat resistor 15. Heating can thus be focused on the circuit board and its components, instead of the whole apparatus concerned. In the inventive solution the power source of the heat resistor is preferably the power, i.e. the operating voltage, used by the components 14 needed for the actual operation of the circuit board. The heat resistor 15 can, however, also be heated by a WO 98/30075 PCT/FI97/00834 4 separate power source 12.
The heating power of the heat resistor 15 can preferably be adjusted according to need, for which purpose the power source 12 is for instance controlled with a control means 13 monitoring the temperature of the components 14. The control means 13 can monitor the temperature around the components, such as the temperature of the air, the temperature of the circuit 10 or the temperature of the heatable component 14 and, if the temperature is too low, heating is activated. If a predetermined variation in temperature is allowed for the components 14 responsible for the actual operation of the circuit board, then the control means 13 is, at its simplest, a switch which in cold conditions switches the heating on and in warm conditions turns it off. The control means 13 can, however, preferably also control the power fed by the power source 12 to the resistor 15. In this case, the colder the environment, the circuit board 10 or one or plural components 14 are, the more heating power is preferably fed. The control means 13 is an electronic thermometer conforming to prior art and furnished with at least one measuring head 131, 132 and 133, which measure the temperature of the environment, the circuit board 10 or the component 14.
Figure 2 shows the circuit board layer 11 in greater detail. The layer 11 in this example comprises one heat resistor 15, which is used for heating all components in the layers 10. The form of the heat resistor can differ quite considerably from the one shown in Figure 2, because the form is not essential to the invention. Since the heat resistor 15 is close to the components 14 of the layer 10, they heat effectively. The heat resistor 15 can substantially cover the whole layer 11 of the circuit board, as shown in Figure 2, or the heat resistor 15 can be arranged on only a part of the surface of the layer 11.
Figure 3 illustrates a more efficient embodiment of the inventive solution than the above. The heat resistor layer 11 in this example comprises plural heat resistors 15. The inventive solution thus allows heating different components 14 responsible for the actual operation of the circuit board in a different way. Components generating a lot of heat in their own operation are heated less than components generating little heat. Heating power can be varied for instance by using heat resistors 15 with impedances of a different magnitude. This allows the components 14 responsible for the actual desired operation in the different layers 10 of the circuit board to be heated WO 98/30075 PCTFI97/00834 independently, irrespective of each other. In addition, when a solution similar to the one shown in Figure 1 is used, the control means 13 can preferably measure the temperature of each component 14 separately with measuring heads 131, 132 and 133 and guide the heating power of the power source 12 to each component separately. Since each component 14 responsible for the actual operation of the circuit board has its own heat resistor 15, the resistors can have small values, whereby a low operating voltage is sufficient for them. This enables using for instance the operating voltage meant for logic also as the power source for heat resistors 15. The means 12, 13, 131, 132 and 133 are not, however, essential to the invention.
Even though the invention is described above with reference to an example shown in the attached drawings, it is apparent that the invention is not restricted to it, but can vary in many ways within the inventive idea disclosed in the attached claims.
Claims (9)
1. A method for heating at least one component on a circuit board, said circuit board comprising one or more layers whereby one or more components to be heated are heated with at least one heat resistor associated with the circuit board and whereby the circuit board's own conduction material is used as the material of the heat resistor.
2. A method according to claim 1, whereby when a multi-layer circuit io board is 'connected, one or more layers of the circuit board are used as the circuit S° containing the heat resistors. o• 00
3. A. method according to claim 1, whereby when a plurality of different o components are heated, each component is heated independently. *O 0• IS
4. A method according to claim 1, whereby one or more heat resistors use a different power source for generating heating power than the components to be heated. .00 5. A method according to claim 1, whereby when the components that o. 20 need to be heated differ from one another, said components are heated with different heating power. 0@ o••
6. A method according to claim 1, whereby the heating power of one or more heat resistors are adjusted according to need. 0505
7. A method according to claim 1 or 6, whereby the temperature of one or more components to be heated is measured and the heating power of one or more heat resistors is automatically adjusted according to the temperature of the components to be heated.
8. A method according to claim 2, whereby one or more innermost layers of a multi-layer circuit board or a part of a layer are used as a circuit in which one or more heat resistors are arranged. [R:\LIBK]01523doc:nxl -7-
9. A method according to claim 1, whereby the component to be heated is heated with the heat resistor, which is below the component in the same layer as said component.
510. An arrangement for heating a component on a circuit board, which comprises at least one layer and which comprises one or more components to be heated, wherein the circuit board comprises at least one heat resistor arranged in connection with it, said heat resistor being arranged to heat at least one component on the circuit board and the material of the heat resistor is the conduction material of the circuit board. °11. An arrangement according to claim 10, whereby when a plurality of different components are heated, more than one heat resistor is arranged to focus heating 0 o on each said component separately. S 15 12. An arrangement according to claim 10, whereby the layer comprising one or more heat resistors is operationally connected to a different power source than the components to be heated. S13. An arrangement according to claim 10, wherein when the components 20 to be heated differ from one another, the heating power of the heat resistors responsible 00 S for heating said components varies. 0 0 14. An arrangement according to claim 10, whereby the arrangement 00o0 comprises means for substantially measuring the temperature of the components to be heated and for automatically adjusting the heating power of one or more heat resistors. 0 0 0 a An arrangement according to claim 10, whereby the heat resistor is below the component to be heated, in the same layer as said component to be heated. 16. An arrangement according to claim 10, whereby one or more innermost layers of a multi-layer circuit board, or a part of a layer, is a circuit comprising one or more heat resistors. [R:\LIBK]OI 523.doc:mxl -8- 17. A method for heating at least one component substantially as described herein with reference to any one of the embodiments, as that embodiment is shown in the accompanying drawings. 18. An arrangement for heating a component substantially as described herein with reference to any one of the embodiments, as that embodiment is shown in the accompanying drawings. 0o DATED this Twenty-ninth Day of July, 1999 Nokia Telecommunications OY Patent Attorneys for the Applicant SPRUSON FERGUSON 0 0 00 00 0 0 00 0* 0 [R:\LIBK]O1523.doc:mxl
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI965301 | 1996-12-31 | ||
| FI965301A FI965301A (en) | 1996-12-31 | 1996-12-31 | Procedure and arrangement for heating a component |
| PCT/FI1997/000834 WO1998030075A2 (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating a component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU5323998A AU5323998A (en) | 1998-07-31 |
| AU728378B2 true AU728378B2 (en) | 2001-01-11 |
Family
ID=8547390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU53239/98A Withdrawn - After Issue AU728378B2 (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating a component |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0983714A2 (en) |
| JP (1) | JP2001508942A (en) |
| AU (1) | AU728378B2 (en) |
| FI (1) | FI965301A (en) |
| NO (1) | NO993236L (en) |
| WO (1) | WO1998030075A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006077165A1 (en) * | 2005-01-24 | 2006-07-27 | Juma Pcb Gmbh | Printed circuit board or card comprising a heating wire |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI981032A (en) * | 1998-05-08 | 1999-11-09 | Nokia Networks Oy | Heating method and circuit board |
| DE19851172A1 (en) * | 1998-11-06 | 2000-05-11 | Alcatel Sa | Arrangement for heating an assembled printed circuit |
| GB2345453B (en) * | 1999-09-14 | 2000-12-27 | Lee John Robinson | Laminated reflow soldering |
| US11350490B2 (en) * | 2017-03-08 | 2022-05-31 | Raytheon Company | Integrated temperature control for multi-layer ceramics and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5268558A (en) * | 1990-11-07 | 1993-12-07 | France Telecom | Temperature-controlled electronic circuit |
| US5539186A (en) * | 1992-12-09 | 1996-07-23 | International Business Machines Corporation | Temperature controlled multi-layer module |
| GB2300340A (en) * | 1995-04-28 | 1996-10-30 | Smiths Industries Plc | Heating electrical components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3440407A (en) * | 1966-12-29 | 1969-04-22 | Rca Corp | Temperature controlled circuit boards |
| US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
| US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
-
1996
- 1996-12-31 FI FI965301A patent/FI965301A/en unknown
-
1997
- 1997-12-30 JP JP52965898A patent/JP2001508942A/en active Pending
- 1997-12-30 AU AU53239/98A patent/AU728378B2/en not_active Withdrawn - After Issue
- 1997-12-30 EP EP97950212A patent/EP0983714A2/en not_active Withdrawn
- 1997-12-30 WO PCT/FI1997/000834 patent/WO1998030075A2/en not_active Application Discontinuation
-
1999
- 1999-06-29 NO NO993236A patent/NO993236L/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5268558A (en) * | 1990-11-07 | 1993-12-07 | France Telecom | Temperature-controlled electronic circuit |
| US5539186A (en) * | 1992-12-09 | 1996-07-23 | International Business Machines Corporation | Temperature controlled multi-layer module |
| GB2300340A (en) * | 1995-04-28 | 1996-10-30 | Smiths Industries Plc | Heating electrical components |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006077165A1 (en) * | 2005-01-24 | 2006-07-27 | Juma Pcb Gmbh | Printed circuit board or card comprising a heating wire |
| US8481897B2 (en) | 2005-01-24 | 2013-07-09 | Jumatech, Gmbh | Printed circuit board or card comprising a heating wire |
Also Published As
| Publication number | Publication date |
|---|---|
| NO993236D0 (en) | 1999-06-29 |
| FI965301A (en) | 1998-07-01 |
| NO993236L (en) | 1999-06-29 |
| WO1998030075A2 (en) | 1998-07-09 |
| FI965301A0 (en) | 1996-12-31 |
| JP2001508942A (en) | 2001-07-03 |
| AU5323998A (en) | 1998-07-31 |
| WO1998030075A3 (en) | 1998-08-27 |
| EP0983714A2 (en) | 2000-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4964238B2 (en) | Smart laminated heater surface | |
| JP4989894B2 (en) | Integrated motor device | |
| US4394564A (en) | Solid plate heating unit | |
| US20050115956A1 (en) | Flexible heating elements with patterned heating zones for heating of contoured objects powered by dual AC and DC voltage sources without transformer | |
| EP0821468A3 (en) | Temperature control of electronic components | |
| AU728378B2 (en) | Method and arrangement for heating a component | |
| JP2003303932A (en) | Cooling device and electrical device provided with the same | |
| US20090139972A1 (en) | Docking connector | |
| CN100411260C (en) | Optical amplifiers | |
| KR20040102025A (en) | Electrical heating assembly | |
| JP3855128B2 (en) | Hot plate using metal foil heater, manufacturing method thereof, and heat treatment method of liquid crystal panel using hot plate | |
| US20040245239A1 (en) | Electric heating assembly | |
| US6285005B1 (en) | Device for housing communication and electronic equipment using positive temperature coefficient material | |
| EP1008278B1 (en) | Electrical liquid heating apparatus | |
| US6301436B1 (en) | Photothermic desoldering unit | |
| JP2007123541A (en) | Device with built-in functional part | |
| US20030178405A1 (en) | Electrical heating assembly | |
| GB2047487A (en) | Heating circuits | |
| EP1086772A2 (en) | Electric soldering iron | |
| US20020066723A1 (en) | Heater unit for tray | |
| JP2004226575A (en) | Wiring board, electronic equipment, and led display | |
| CN1242927A (en) | Method and arrangement for heating component | |
| US20020038797A1 (en) | Arrangement for heating an assembled printed circuit board | |
| JPH09113374A (en) | Terminal block for thermocouple | |
| JP2001237284A (en) | Temperature controller and prober device for inspecting semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK12 | Application lapsed section 141(1)/reg 8.3(2) - applicant filed a written notice of withdrawal |