CN1242927A - Method and arrangement for heating component - Google Patents
Method and arrangement for heating component Download PDFInfo
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- CN1242927A CN1242927A CN 97181186 CN97181186A CN1242927A CN 1242927 A CN1242927 A CN 1242927A CN 97181186 CN97181186 CN 97181186 CN 97181186 A CN97181186 A CN 97181186A CN 1242927 A CN1242927 A CN 1242927A
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- thermal resistance
- circuit board
- heated
- heating
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Abstract
The invention relates to a method and arrangement for heating at least one component (14) of a circuit board comprising one or plural layers (10 and 11). At least one component (14) to be heated is then heated with at least one heat resistor (15) associated with the circuit board.
Description
Invention field
The present invention relates to the method at least one element (component) heating on the circuit board, described circuit board comprises one or more layer.
The invention still further relates to the device to the heating of the element on the circuit board, this circuit board comprises at least one layer and comprises the element that one or more is to be heated.
Background of invention
The circuit board common plan of predetermined use in wide temperature range will be dispelled the heat fully.Heat is from the element conduction or be delivered to cooling-part (element), supporting structure and/or surrounding environment.This solution function is suitable under warm and hot condition, but under cold condition even usually undue cooling and make the temperature of element reduce to the scope that can hinder relevant devices work.
The running of the equipment of working under cool condition can be made military element by using to specify, and described element specifies in the wide temperature range and works, and perhaps is guaranteed by the equipment that comprises standard component is added heat energy.Make military element cost height owing to specify, and every kind of element has only a manufacturer usually, the solution of prior art depends on whole relevant device is heated, and also typically comprises space and fin thereof in heating frame, the equipment outside the dividing circuit plate.This just requires big heating power.Such a heater usually also will increase the size of relevant device, when at be small size and high integration the time this shortcoming especially.In addition, even some element does not wherein need heating, whole elements thereby all will stand the heating power of equivalent.
The heating of element is at United States Patent (USP) 5,539, also is described in 186, and it is appended hereto this as a reference.According to United States Patent (USP) 5,539,186 solution relates to multi-layer sheet, and wherein one deck includes the resistance heating membrane structure that is used for the heater circuit plate.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of method and apparatus of heating element, the framework, space and the fin that do not heat entire equipment in described method and apparatus by only heating the element that needs heating reduce heating power.
This purpose realizes with the method described in the preamble, described method is characterised in that, one or more element to be heated heats with thermal resistance that this circuit board combines with at least one, and the electric conducting material of this circuit board self is used as the material of this thermal resistance.
Apparatus of the present invention are characterised in that circuit board comprises the thermal resistance of at least one configuration that combines with it, and described thermal resistance is configured at least one the element heating on this circuit board, and the material of thermal resistance is the electric conducting material of this circuit board.
Method of the present invention shows very important advantage.Compared with prior art, the total amount of required heating power is much smaller, concentrates on more subtly on the desired element because add heat energy, and this can be avoided the element that does not need to heat is heated.The integrated level of heater also can improve.
The accompanying drawing summary
Example illustrated is for a more detailed description to the present invention with reference to the accompanying drawings, wherein:
Fig. 1 represents a multilayer circuit board;
Fig. 2 represents to include a layer of the circuit board of a thermal resistance, and
Fig. 3 represents to include a layer of the circuit board of a plurality of thermal resistances.
The description of preferred embodiment
Solution of the present invention can be applied in various circuit boards, especially includes in the solution of multilayer circuit board of discrete component.
Let us is analyzed method of the present invention more closely now.The one or more heatable element of single or multiple lift circuit board (described element is responsible for the actual motion of this circuit) uses at least one thermal resistance that combines with this circuit board to be carried out heating.And thermal resistance abuts against near the of element to be heated or contacts with element to be heated.Heating is preferably finished with the thermal resistance that is integrated in the board layer in solution of the present invention.Element to be heated is carried out the operation of this circuit board actual needs, for example the signal processing in the digital radio system transmitter-receiver.In the present invention, no matter any heatable element itself can be in any element, for example machinery, electronics or optical element.It is very important generally using the stable of processor working temperature in signal processing.Realize heating by feed-in direct current or AC power in resistor, so the resistor heating.Any prior art meritorious resistance material commonly used all can be used as resistor and uses.The resistance material of use in circuit board, as copper, preferably the material as this resistor uses.Yet the thermal resistance material also can be any material that other is well suited for conducting electricity, and metal is its representative example.When feed-in alternating current in thermal resistance, also can play resistor to small part capacitive or emotional resistance.
Especially in single layer board, thermal resistance can directly be configured in enough belows of big element of being responsible for this circuit board actual motion, preferably by obtaining its heating power from the operating voltage identical with the element of being responsible for this circuit board actual motion, thereby thermal resistance heats the element of its top.
Let us analysis now is based on Fig. 1,2 and 3 apparatus and method of the present invention.Fig. 1 is the extended view of this circuit board of expression.Circuit board generally includes even level, but the structure of circuit board comprises three layer 10 and 11 among Fig. 1 for the sake of simplicity, its bottom and top layer 10 are the switching circuit board 10 of the element 14 of finishing desired operation, and between described layer 10 for having the thermoelectric resistance layer 11 of thermal resistance 15.Thereby heating can concentrate on circuit board and the element thereof rather than relevant entire equipment.The power supply that the necessary element 14 of the most handy actual motion by this circuit board of the power supply of thermal resistance uses in solution of the present invention, i.e. operating voltage.Yet the also available independent power supply 12 of thermal resistance 15 heats.
The heating power of thermal resistance 15 preferably can be regulated as required, and power supply 12 is for example controlled with monitoring element 14 temperature controlling devices 13 for this purpose.But the temperature around control device 13 monitoring elements, as the temperature of the temperature of the temperature of air, circuit 10 or heatable element 14 and, the starting heating if temperature is crossed low.If predetermined variations in temperature allows that for the element 14 of being responsible for the circuit board actual motion control device 13 is a switch under the simplest situation so, under the condition in heat it is closed in its connection heating under the cold condition.Yet control device 13 preferably also can be controlled by the feed power of resistor 15 of power supply 12.In the case, surrounding environment is cold more, and the heating power that circuit board 10 or one or more element 14 are presented is preferably big more.Control device 13 is a kind of electronic thermometers that are consistent with prior art and is equipped with at least a gage outfit 131,132 and 133 that they measure the temperature of surrounding environment, circuit board 10 or element 14.
Fig. 2 is indication circuit flaggy 11 in more detail.Layer 11 comprises that is used for the thermal resistance 15 that the whole elements in the layer 10 are heated in this example.The form of this thermal resistance can be different among Fig. 2 represented a kind of fully, because be unessential to its form of the present invention.Because thermal resistance 15 is near the element 14 in the layer 10, so they are effectively heated.Thermal resistance 15 can cover the whole layer 11 of circuit board basically, and as shown in Figure 2, perhaps thermal resistance 15 can only be configured on the part on layer 11 surface.
Fig. 3 represents a kind of than above-mentioned more effective embodiment of solution of the present invention.Thermoelectric in this example resistance layer 11 comprises a plurality of thermal resistances 15.Therefore, solution of the present invention allows the different elements 14 of being responsible for the circuit board actual motion is heated in a different manner.Element in the big calorimetric of himself generation in service lacks than the heating that the element that produces little calorimetric is subjected to.The thermal resistance 15 that heating power can be for example has different big or small impedances by use changes.This element 14 that just allows to be responsible for actual required operation in the different layer 10 of circuit board has nothing to do each other, is heated independently of one another.In addition, when the solution that adopts when being showed in similar among Fig. 1, control device 13 preferably can be measured respectively and the heat energy of power supply 12 is guided to each element respectively the temperature of each element 14 with gage outfit 131,132 and 133.Because each element 14 of being responsible for the circuit board actual motion has the thermal resistance 15 of himself, so this resistance 15 can have little value, thereby low-work voltage is enough for them.This just makes and for example adopts the operating voltage identical with the power supply of thermal resistance 15 also to become rational selection.Yet install 12,13,131,132 and 133 couples of the present invention still is not substantial.
Though above by invention being described, obvious with reference to example shown in the drawings, the invention is not restricted to this, in claims, can make change in many aspects in the disclosed scope of the inventive concept.
Claims (16)
1. the method for at least one element (14) usefulness on the heater circuit plate, described circuit board comprises one or more layer (10 and 11), it is characterized in that, one or more element (14) to be heated heats with the thermal resistance (15) that at least one combines with this circuit board, and the electric conducting material of this circuit board self is used as the material of this thermal resistance (15).
2. according to the method for claim 1, it is characterized in that when relating to multilayer circuit board, one or more layers of this circuit board (11) is used as the circuit that contains thermal resistance (15).
3. according to the method for claim 1, it is characterized in that when a plurality of different elements (14) when being heated, each element (14) is carried out heating independently.
4. according to the method for claim 1, it is characterized in that one or more thermal resistance (15) uses the power supply (12) different with element (14) to be heated to produce heating power.
5. according to the method for claim 1, it is characterized in that when the element (14) of needs heating when differing from one another, described element (14) heats with different heating powers.
6. according to the method for claim 1, it is characterized in that the heating power of one or more thermal resistance (15) is regulated as required.
7. according to the method for claim 1 or 6, it is characterized in that, the temperature of one or more element to be heated (14) is measured, and the heating power of one or more thermal resistance (15) is automatically regulated according to the temperature of element to be heated (14).
8. according to the method for claim 2, it is characterized in that the part of one or more innermost layer (11) of multilayer circuit board or layer is used as the circuit that wherein disposes one or more thermal resistance (15).
9. according to the method for claim 1, it is characterized in that element to be heated (14) heats with being arranged in the thermal resistance (15) of described element (14) with this element of one deck (14) below.
10. device that is used for element on the heater circuit plate, this circuit board comprises at least one layer (10 and 11) and comprises one or more element to be heated (14), it is characterized in that, this circuit board comprises the thermal resistance (15) of at least one configuration that combines with it, described thermal resistance is configured to the heating of at least one element (14) on this circuit board, and the material of thermal resistance (15) is the electric conducting material of this circuit board.
11. the device according to claim 10 is characterized in that, when a plurality of different elements (14) when being heated, configuration concentrates on respectively on each described element (14) so that will heat more than a thermal resistance (15).
12. the device according to claim 10 is characterized in that, the layer (11) that includes one or more thermal resistance (15) is connected with the power supply that is different from element to be heated (14) (12) in operation.
13. the device according to claim 10 is characterized in that, when element to be heated (14) when differing from one another, the heating power of thermal resistance (15) of being responsible for the described element of heating (14) is different.
14. the device according to claim 10 is characterized in that, this device comprises the temperature that is used in fact measuring element to be heated (14), and the device (13) that is used for regulating automatically the heating power of one or more thermal resistance (15).
15. the device according to claim 10 is characterized in that, thermal resistance (15) is positioned at and the below of described element to be heated (14) with one deck element to be heated (14).
16. the device according to claim 10 is characterized in that, the part of one or more innermost layer (11) of multilayer circuit board or layer is the circuit that comprises one or more thermal resistance (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97181186 CN1242927A (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating component |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI965301 | 1996-12-31 | ||
| CN 97181186 CN1242927A (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1242927A true CN1242927A (en) | 2000-01-26 |
Family
ID=5178141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97181186 Pending CN1242927A (en) | 1996-12-31 | 1997-12-30 | Method and arrangement for heating component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1242927A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382666C (en) * | 2003-12-24 | 2008-04-16 | 华为技术有限公司 | A heating system |
| CN101227808B (en) * | 2007-01-15 | 2011-05-18 | 研华股份有限公司 | Heating module of circuit board |
| CN107820377A (en) * | 2017-10-24 | 2018-03-20 | 上海新储集成电路有限公司 | Board-level circuit pinpoints heater and method |
-
1997
- 1997-12-30 CN CN 97181186 patent/CN1242927A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382666C (en) * | 2003-12-24 | 2008-04-16 | 华为技术有限公司 | A heating system |
| CN101227808B (en) * | 2007-01-15 | 2011-05-18 | 研华股份有限公司 | Heating module of circuit board |
| CN107820377A (en) * | 2017-10-24 | 2018-03-20 | 上海新储集成电路有限公司 | Board-level circuit pinpoints heater and method |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |