JP2001500188A - チタニウム含有複合物を研磨するための合成物およびその方法 - Google Patents

チタニウム含有複合物を研磨するための合成物およびその方法

Info

Publication number
JP2001500188A
JP2001500188A JP11508826A JP50882699A JP2001500188A JP 2001500188 A JP2001500188 A JP 2001500188A JP 11508826 A JP11508826 A JP 11508826A JP 50882699 A JP50882699 A JP 50882699A JP 2001500188 A JP2001500188 A JP 2001500188A
Authority
JP
Japan
Prior art keywords
compound
substrate
polishing
item
oxidizing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11508826A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001500188A5 (https=
Inventor
ホイ ミン ワン
グアングウエイ ウ
リー メルボルン クック
Original Assignee
ローデル ホールディングス インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローデル ホールディングス インコーポレイテッド filed Critical ローデル ホールディングス インコーポレイテッド
Publication of JP2001500188A publication Critical patent/JP2001500188A/ja
Publication of JP2001500188A5 publication Critical patent/JP2001500188A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11508826A 1997-07-08 1998-07-07 チタニウム含有複合物を研磨するための合成物およびその方法 Withdrawn JP2001500188A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/889,338 US5770103A (en) 1997-07-08 1997-07-08 Composition and method for polishing a composite comprising titanium
US08/889,338 1997-07-08
PCT/US1998/013991 WO1999002623A1 (en) 1997-07-08 1998-07-07 Composition and method for polishing a composite comprising titanium

Publications (2)

Publication Number Publication Date
JP2001500188A true JP2001500188A (ja) 2001-01-09
JP2001500188A5 JP2001500188A5 (https=) 2006-01-05

Family

ID=25394929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11508826A Withdrawn JP2001500188A (ja) 1997-07-08 1998-07-07 チタニウム含有複合物を研磨するための合成物およびその方法

Country Status (5)

Country Link
US (1) US5770103A (https=)
EP (1) EP0931118A4 (https=)
JP (1) JP2001500188A (https=)
KR (1) KR20000068476A (https=)
WO (1) WO1999002623A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297782A (ja) * 2002-02-22 2003-10-17 Agere Systems Inc デュアル配向多結晶材料の化学機械研磨
JP2021153129A (ja) * 2020-03-24 2021-09-30 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法、および研磨方法

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US5993686A (en) * 1996-06-06 1999-11-30 Cabot Corporation Fluoride additive containing chemical mechanical polishing slurry and method for use of same
US6132637A (en) 1996-09-27 2000-10-17 Rodel Holdings, Inc. Composition and method for polishing a composite of silica and silicon nitride
US5738800A (en) * 1996-09-27 1998-04-14 Rodel, Inc. Composition and method for polishing a composite of silica and silicon nitride
US6001269A (en) * 1997-05-20 1999-12-14 Rodel, Inc. Method for polishing a composite comprising an insulator, a metal, and titanium
US6001730A (en) * 1997-10-20 1999-12-14 Motorola, Inc. Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers
US6284151B1 (en) * 1997-12-23 2001-09-04 International Business Machines Corporation Chemical mechanical polishing slurry for tungsten
US6294105B1 (en) 1997-12-23 2001-09-25 International Business Machines Corporation Chemical mechanical polishing slurry and method for polishing metal/oxide layers
KR100581649B1 (ko) * 1998-06-10 2006-05-23 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 금속 ｃｍｐ에서 광택화를 위한 조성물 및 방법
TW512170B (en) * 1998-07-24 2002-12-01 Ibm Aqueous slurry composition and method for polishing a surface using the same
EP1137056B1 (en) * 1998-08-31 2013-07-31 Hitachi Chemical Company, Ltd. Abrasive liquid for metal and method for polishing
US6572449B2 (en) 1998-10-06 2003-06-03 Rodel Holdings, Inc. Dewatered CMP polishing compositions and methods for using same
US6241586B1 (en) * 1998-10-06 2001-06-05 Rodel Holdings Inc. CMP polishing slurry dewatering and reconstitution
US6855266B1 (en) * 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
WO2001019935A1 (en) * 1999-09-15 2001-03-22 Rodel Holdings, Inc. Slurry for forming insoluble silicate during chemical-mechanical polishing
US6447375B2 (en) 2000-04-19 2002-09-10 Rodel Holdings Inc. Polishing method using a reconstituted dry particulate polishing composition
TW471057B (en) * 2000-06-09 2002-01-01 Macronix Int Co Ltd Method for reducing dishing effect during chemical mechanical polishing
US6646348B1 (en) 2000-07-05 2003-11-11 Cabot Microelectronics Corporation Silane containing polishing composition for CMP
US6458013B1 (en) 2000-07-31 2002-10-01 Asml Us, Inc. Method of chemical mechanical polishing
US7029381B2 (en) * 2000-07-31 2006-04-18 Aviza Technology, Inc. Apparatus and method for chemical mechanical polishing of substrates
MY128145A (en) * 2000-07-31 2007-01-31 Silicon Valley Group Thermal In-situ method and apparatus for end point detection in chemical mechanical polishing
US6468137B1 (en) 2000-09-07 2002-10-22 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system
KR100458756B1 (ko) * 2001-06-27 2004-12-03 제일모직주식회사 반도체 소자의 금속배선 연마용 ｃｍｐ 슬러리
US6705926B2 (en) * 2001-10-24 2004-03-16 Cabot Microelectronics Corporation Boron-containing polishing system and method
KR100421928B1 (ko) * 2001-11-21 2004-03-11 제일모직주식회사 반도체 웨이퍼의 금속배선 연마용 슬러리 조성물
US6682575B2 (en) 2002-03-05 2004-01-27 Cabot Microelectronics Corporation Methanol-containing silica-based CMP compositions
US6616514B1 (en) * 2002-06-03 2003-09-09 Ferro Corporation High selectivity CMP slurry
US20060042502A1 (en) * 2002-10-31 2006-03-02 Showa Denko K.K. Composition for polishing metal, polishing metod for metal layer, and production method for wafer
JP2004153086A (ja) * 2002-10-31 2004-05-27 Showa Denko Kk 金属研磨組成物、金属膜の研磨方法および基板の製造方法
WO2004073926A1 (en) * 2003-02-18 2004-09-02 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US7148147B2 (en) * 2003-03-06 2006-12-12 J.G. Systems, Inc. CMP composition containing organic nitro compounds
KR100960687B1 (ko) * 2003-06-24 2010-06-01 엘지디스플레이 주식회사 구리(또는 구리합금층)를 포함하는 이중금속층을 일괄식각하기위한 식각액
US20050022456A1 (en) * 2003-07-30 2005-02-03 Babu S. V. Polishing slurry and method for chemical-mechanical polishing of copper
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
US6964600B2 (en) * 2003-11-21 2005-11-15 Praxair Technology, Inc. High selectivity colloidal silica slurry
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
KR100497413B1 (ko) * 2004-11-26 2005-06-23 에이스하이텍 주식회사 텅스텐-화학적 기계적 연마에 유용한 슬러리 및 그 제조방법
EP2197972B1 (en) * 2007-09-21 2020-04-01 Cabot Microelectronics Corporation Polishing composition and method utilizing abrasive particles treated with an aminosilane
JP5646996B2 (ja) * 2007-09-21 2014-12-24 キャボット マイクロエレクトロニクス コーポレイション 研磨組成物およびアミノシランを用いて処理された研削剤粒子の使用方法
KR20140034231A (ko) * 2011-05-24 2014-03-19 가부시키가이샤 구라레 화학 기계 연마용 부식 방지제, 화학 기계 연마용 슬러리, 및 화학 기계 연마 방법

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DE3815111C1 (en) * 1988-05-04 1989-02-23 Carl Kurt Walther Gmbh & Co Kg, 5600 Wuppertal, De Treatment agent for vibratory grinding, and vibratory grinding process using this treatment agent
US4954142A (en) * 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
US5244534A (en) * 1992-01-24 1993-09-14 Micron Technology, Inc. Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5382272A (en) * 1993-09-03 1995-01-17 Rodel, Inc. Activated polishing compositions
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing
WO1995024054A1 (en) * 1994-03-01 1995-09-08 Rodel, Inc. Improved compositions and methods for polishing
WO1996016436A1 (en) * 1994-11-18 1996-05-30 Advanced Micro Devices, Inc. Method of making a chemical-mechanical polishing slurry and the polishing slurry

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297782A (ja) * 2002-02-22 2003-10-17 Agere Systems Inc デュアル配向多結晶材料の化学機械研磨
JP2021153129A (ja) * 2020-03-24 2021-09-30 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法、および研磨方法
JP7575878B2 (ja) 2020-03-24 2024-10-30 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法、および研磨方法

Also Published As

Publication number Publication date
WO1999002623A1 (en) 1999-01-21
US5770103A (en) 1998-06-23
EP0931118A1 (en) 1999-07-28
KR20000068476A (ko) 2000-11-25
EP0931118A4 (en) 2001-05-09

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