JP2001358463A - Method for manufacturing printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed-wiring board using a metal foil-clad resin com pound ceramics plate where at least two metal foil-clad resin compound ceram ics plates are mutually bonded at the side. SOLUTION: In this method of manufacturing a printed-wiring board using a metal foil-clad resin compound ceramics plate (II), an impregnation sintering substrate (IR) where an inorganic continuation pore sintering substrate (I) is impregnated with curing resin (R) and metal foil are laminated for forming. An assembly plate (MII) where at least two impregnation sintering substrate (IR) are mutually bonded by the contact side is arranged and manufactured as the compound ceramics plate (II) without separating to each compound ceramics plate (II). Printed-wiring net is formed collectively. Also, a method for manufacturing multilayered boards uses the printed-wiring board, thus manufacturing the printed-wiring net in a large size and forming it in multiplayer, drastically relaxing lamination in terms of manufacturing operation due to a small work size, effectively utilizing existing production facilities, and further using a small printed-wiring board that has not been used due to problems for securing a work region.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the use of two or more metal foil-clad resin composite ceramic plates bonded together at their sides (assembled plate) without separating them into individual metal foil-clad resin composite ceramic plates. It is a method of manufacturing a printed wiring board, especially 12 cm square or more, thickness 0.5 ~ 0.64 mm 20 cm
It can be used in processes such as formation of a printed wiring network with a large size larger than a corner, and can greatly improve productivity and the like.

[0002]

2. Description of the Related Art A method for manufacturing a ceramic wiring board includes:
Various methods have been developed and put into practical use. These include a ceramic wiring board using a thick film method, a ceramic wiring board using a thin film method, a ceramic wiring board using a green sheet method, a ceramic wiring board using a plating method, and a ceramic wiring board using an etching method. Etching method Except for the method of manufacturing ceramic wiring boards, none of these ceramic wiring boards use a copper foil-covered board in advance, such as a method of conducting conductors simultaneously with sintering of ceramics, a method of printing and sintering, sputtering, etc. Formed by a vapor deposition method, a plating method, or the like.

[0003] The etching ceramic wiring board is typically manufactured by eutectic press bonding of a copper foil having a thickness of about 150 µm to an aluminum nitride substrate via an oxide layer, and a thin copper foil attached thereto. However, the workability was the same as that of ordinary ceramics, and was extremely expensive. In addition, a cordierant was selected as an inorganic continuous pore sintered body, a thin glass cloth was placed on the surface, a resin was impregnated with the cloth, and copper foil was stretched on both sides of the sintered body. In this case as well, drilling is possible, but it is difficult to use a normal steel drill or the like, and since the surface of the ceramic has the same layer as the conventional glass-epoxy laminate, its physical properties Had significant restrictions.

Further, as a ceramic-resin composite copper-clad substrate, a substrate obtained by kneading a fine powder of alumina, silica or the like in a fluororesin or the like, forming a plate shape and attaching copper foil to both surfaces thereof is commercially available. However, this substrate is a resin substrate in which ceramic powder is dispersed, and is basically a resin substrate containing a large amount of ceramics.
Its physical properties greatly depend on the resin component, and it has not been possible to attain the low thermal expansion coefficient and high thermal conductivity of ceramics.

[0005]

Therefore, the present inventors have made use of the excellent properties of ceramics such as low coefficient of thermal expansion, high heat dissipation, heat resistance, etc. to obtain a printed wiring board with high dimensional accuracy. A method in which a thermosetting resin is impregnated into an inorganic continuous pore sintered body and cured to form a resin composite ceramic, and then sliced into a thin plate shape (Japanese Patent Laid-Open No. 5-29)
1706, 6-152086 and others). Furthermore, they discovered a metal foil-clad composite ceramics plate (Japanese Patent Laid-Open No. 8-244163, etc.) in which a metal foil was firmly adhered to the resin composite ceramics layer via a minimum adhesive layer that could not be substantially identified. Used as a wiring board.

[0006] The metal foil-clad composite ceramic plate has the largest size that can be mass-produced industrially stably according to its thickness.
The limit is about 15 cm square, and if it is thinner, it must be much smaller. In addition, the size of each product was about 2.5 × 5 cm or less in most cases, and even this size was sufficiently usable. On the other hand, a metal foil-clad composite ceramics board can be used to manufacture a printed wiring board by using a conventional apparatus for manufacturing a printed wiring board using a glass epoxy laminate. Therefore, there is an extremely strong demand for manufacturing a printed wiring board using this process.

However, since the size of the metal foil-clad composite ceramics plate is small, it has been necessary to use it while holding it in a frame for process application. However, during the course of the process, troubles such as the metal foil-clad composite ceramics plate falling out of the frame occur, or in order to hold it in the frame,
The parts that can be effectively used as printed wiring boards are limited,
In particular, in the case of a thin and small one, there is a problem that it may not be practically used considering frame holding. Further, there is no problem in the case of trial production, but there is a problem that it is difficult to increase productivity when mass production is desired as a product. The present invention provides a method for solving this problem.

[0008]

That is, the present invention firstly provides an impregnated sintered substrate (IR) obtained by impregnating an inorganic continuous porous sintered substrate (I) with a curable resin (R) and a metal foil. In a method for manufacturing a printed wiring board using a metal foil-clad resin composite ceramics board (II) obtained by laminating and forming the composite ceramics board (I
As I), a laminated plate (MII) in which two or more of the impregnated sintered substrates (IR) are arranged so that their sides are in contact with each other and bonded together at the sides is used. Ceramics plate (II)
This is a method of manufacturing a printed wiring board in which a printed wiring network is collectively formed without separating the printed wiring board.

In the first invention, the thickness of the impregnated sintered substrate (IR) is 1.0 mm or less, and the long side of the laminated plate (MII) is 12 cm.
Further, it is preferable that the printed wiring board has a printed wiring network formed by leaving a copper foil having a width of 2 mm or more at the mutually bonded portion of the composite ceramics board (II).

[0010] Second, the present invention relates to a method for manufacturing a printed wiring board, comprising the steps of:
This is a method for producing a multilayer printed wiring board, which comprises repeating a step of laminating (IR) and a metal foil to form a printed wiring network at least once. In the production method, the laminated plate
The printed wiring network formed on (MII) is formed over a plurality of composite ceramics plates (II), and the impregnated sintered substrate (IR) is formed on the mutual bonding portion of the composite ceramics plates (II). A multilayer printed wiring board can be produced by forming a printed wiring network by stacking over the top and further stacking and forming a metal foil.

Third, the present invention provides an adhesive sheet on at least one surface of a printed wiring board manufactured by the manufacturing method of the first invention.
This is a method for producing a multilayer printed wiring board, which comprises repeating a step of laminating (PP) and a metal foil to form a printed wiring network at least once. The difference in the coefficient of linear expansion between the composite ceramics plate (II) constituting the printed wiring board and the cured adhesive sheet (PP) in the XY direction (board surface direction) is 5 × 10 ⁻⁶ /
K, particularly preferably 3 × 10 ⁻⁶ / K or less. Further, as the adhesive sheet (PP), a fiber-reinforced resin-impregnated base material using a thermosetting resin composition prepared by mixing an inorganic filler as an essential component, a polyimide sheet or film having an adhesive layer formed on both surfaces, or A polyimide sheet or film in which at least both surfaces are thermoplastic polyimides is mentioned as a preferable one.

Fourth, the present invention provides a method for connecting between printed wiring layers in at least one side of a printed wiring board manufactured by the manufacturing method of the first invention by the steps of (1) resist pattern formation, electroplating, and resist peeling. (2) a step of forming the conductive metal pillars (SM) in the curable resin composition layer obtained by curing the conductive metal pillars (SM), polishing and smoothing the surface, and forming the conductive metal pillars (SM). (3) A method for manufacturing a multilayer printed wiring board, comprising repeating at least once a step of exposing (SM), and (3) forming a printed wiring network on the smooth surface. The electroplating in the step (1) is pulse plating, and the curable resin composition used for the cured curable resin composition layer in the step (2) is obtained by blending an inorganic filler as an essential component. Is preferable.

Fifthly, the present invention provides (1) forming a resist pattern using a thermosetting photoresist on at least one surface of the printed wiring board manufactured according to the first invention, and connecting the printed wiring layers by electroplating. Forming a conductive metal pillar (SM) for use; (2) a step of thermally curing the photoresist, followed by polishing to smooth the surface; and (3) forming a printed wiring network on the smooth surface. This is a method for manufacturing a multilayer printed wiring board, which comprises repeating three of the steps one or more times.

Hereinafter, the present invention will be described. The present invention makes it possible to divert existing manufacturing equipment such as glass epoxy laminates by using large-sized laminated boards (MII) in the manufacturing process of printed wiring boards and the like. Thus, it is possible to significantly improve productivity and reduce investment in equipment. That is, the inorganic continuous pore sintered substrate
For (I), the maximum size that can be handled (the size that enables stable production of thin plates by slicing, impregnation, lamination molding, etc.) is determined according to their thickness. It is to solve the point that it is practically impossible to handle.

Next, the inorganic continuous pore sintered substrate of the present invention (I)
Can be used as an inorganic continuous-porous sintered body, which is produced by directly producing a thin plate and polishing the surface thereof, but is usually produced by slicing into a thin plate. Here, the inorganic continuously porous sintered body of aluminum nitride - boron nitride (AlN-h-BN), alumina - boron nitride _{(Al 2 O 3 -h-BN} ), zirconium oxide - aluminum nitride - boron nitride (ZrO ₂ -AlN-h-BN), silicon nitride-boron nitride (Si ₃ N ₄ -h-BN), alumina-titanium oxide-boron nitride (A
l ₂ O ₃ -TiO ₂ -h-BN) and other boron nitride (h-BN) of 8 to 40%, β-wollastonite (β-CaSiO ₃ ), cordierite (2MgO / 2Al ₂ O ₃ / 5SiO ₂ ), magnesium titanate (MgTiO ₃ ), barium titanate (BaTiO ₃ ), mica and the like.

In slicing, preferably, an organic compound or resin which is solid at room temperature is directly heated and melted and impregnated, or is impregnated as a solution of an organic solvent and dried. Inorganic continuous pore sintered substrate (I)
Is preferably a thin plate having a thickness of about 0.2 to 2 mm,
Thickness accuracy per 2mm-50mm is within ± 30μm, especially ± 20
μm, and the 10-point average surface roughness Rz is also 30 μm or less, preferably 20 μm or less, particularly 10 μm or less.

The curable resin (R) of the present invention is preferably a thermosetting resin such as an addition polymerization type resin which cures without generating by-products, and can be used. It is liquid at normal temperature or melted by heating from impregnation, and has a low viscosity and a small change in viscosity at the impregnation temperature, for example, a gel time at the impregnation temperature of 1 hour or more, preferably 2 hours or more. . Furthermore, after the impregnation, when cooled to about room temperature, even when the pre-reaction etc. does not occur due to the impregnation operation conditions, those that become solids have excellent storage stability, especially handling in the process of manufacturing a copper clad board. It is preferable because it is easy.

A heat-resistant thermosetting resin is preferable, and an epoxy resin and a cyanato resin are preferable. Examples of the cyanate resin include a cyanate resin, a cyanate ester-epoxy resin, a cyanate ester-maleimide resin, a cyanate ester-maleimide-epoxy resin, and the like. Further, as an epoxy resin to be further combined, an aromatic hydrocarbon-formaldehyde resin Modified novolak epoxy resins and 4,4'-diglycidyl biphenyl are particularly preferred.

The impregnated sintered substrate (IR) of the present invention is obtained by applying a curable resin (R) to an inorganic continuous pore sintered substrate (I) at an atmospheric pressure of 7 kPa.
Below, preferably 4 kPa or less, particularly 0.7 kPa or less, preferably using a pre-melted and vacuum degassed curable resin (R), impregnation treatment for 10 minutes to 10 hours, preferably 15 minutes to 2 hours The resin is taken out and, preferably, is produced by removing excess resin and cooling to solidify the impregnated resin. The inorganic continuous pore sintered substrate (I) used for impregnation is sufficiently dried,
Used for impregnation. The resin adhered to the surface of the manufactured impregnated sintered substrate (IR) should be the minimum necessary since most of the resin is discharged around the impregnated sintered substrate (IR) when manufacturing the composite ceramics plate (II) Is preferred. In addition, the impregnated sintered substrate (I
The impregnated resin of R) does not require, but rather does not require, the B-stage treatment of the impregnated resin, which is indispensable in the method of manufacturing a glass epoxy laminate.

The metal foil of the present invention is a copper foil, an aluminum foil, a nickel foil, a nickel-plated copper foil, a nickel-plated copper foil with an adhesive layer, a thin copper foil with an aluminum foil, a metal sheet core copper foil (0.07 to 0.7 mm thick). Of aluminum, iron, stainless steel, etc., in which copper foil is temporarily bonded to one or both sides of the sheet), or any other suitable one depending on the purpose. In particular, in the present invention, the surface treatment for bonding metal foil It is preferable that the surface roughness is small, for example, Rz is about 5 μm or less.

Specifically, a rolled copper foil or a rolled electrolytic copper foil having a thickness of 18 μm or less or a rolled electrolytic copper foil having a thickness of about 0.1 to 0.6 mm, which is low-profile treated for bonding on one or both sides of an aluminum alloy plate having a thickness of about 0.1 to 0.6 mm, is bonded by heat-peeling. Preferably, a thin foil is put on an aluminum core copper foil or an aluminum alloy plate temporarily bonded with an agent, and the periphery thereof is fixed with a cellophane tape. In addition, the rolled copper foil of the low profile treatment or the electrolytic copper foil of the rolled specification, particularly the ultra-thin copper foil of 9 μm is extremely soft, so that even at a molding pressure of about 0.5 to 1 MPa, the surface unevenness of the aluminum alloy plate is reduced. Since it is transferred to the surface of the copper foil,
An aluminum alloy plate or the like whose surface irregularities are as small as possible is selected. As described above, the metal foil-clad resin composite ceramics plate of the present invention (II), as the material of the laminated plate (MII), JP-A-8-244163, those described in detail in the same 9-314732 can be used .

The adhesive sheet of the present invention used in the third invention
As (PP), those used in the production of electrical laminates and multilayer boards can be used. Since it is bonded to the composite ceramics plate (II), it is preferable that the thermal expansion coefficient be as small as possible or as small as possible, and further, the elastic modulus as small as possible. The difference in linear expansion coefficient between the composite ceramics plate (II) and the cured adhesive sheet (PP) is 5 × 10 ^-6 / K, especially
It is preferable to select a material so as to be 3 × 10 ⁻⁶ / K or less. In addition, those that can form a smooth surface from the surface that makes use of the excellent surface smoothness of the composite ceramics plate, and those that have higher heat resistance from the viewpoint of minimizing the heat resistance of the composite ceramics plate as much as possible Is preferred.

Specifically, a thermosetting resin such as an epoxy resin or a cyanate resin is blended with an inorganic filler as an essential component, and further, a heat-resistant low-elastic modulus resin for appropriately lowering the elastic modulus of the resin component. (Silicone resin, silicon rubber particles, etc.), prepreg for a smooth surface plate, impregnated into glass woven fabric, wholly aromatic polyamide woven fabric, etc. Can be It is preferable that the thickness is thinner, too.
Usually selected from the range of 03-0.2mm.

The curable resin composition used in the cured curable resin composition layer of the fourth invention includes a thermosetting resin composition which is liquid at room temperature or becomes liquid by heating. It has fluidity that does not cause displacement or the like of the metal column for conduction (SM) when filling the composition. Specifically, as appropriate, an inorganic filler, a thermosetting resin composition that can be used for the production of the above-described impregnated sintered substrate (IR) blended with a short fiber reinforcing material, for casting, for semiconductor encapsulation, or Epoxy resin molding materials, cyanato resin molding materials, silicon imide resins, and the like for heat-resistant adhesives are included.

The thermosetting photoresist used in the fifth invention is a polyimide-based thermosetting photoresist used in the field of semiconductors, for example,
BUR-100 from Asahi Denka Co., Ltd., UR-3140 from Toray Co., Ltd., a heat-resisting photoresist such as epoxy or acrylate used in the field of printed wiring boards, such as PSR from Taiyo Ink. -4000 is a typical example. If required long-term heat resistance is satisfied, it is also possible to use a photoresist for surface protection such as a glass epoxy printed wiring board.

Production of the laminated plate (MII) The inorganic continuous pore sintered substrate (I) has a constant thickness and size, and there is substantially no change other than a dimensional change due to thermal expansion under lamination molding conditions. From this point, it can be said that, in order to manufacture industrially with high reliability, it is essential to use a secondary material for lamination molding in consideration of the above, particularly, use of an inverted cushion. Other auxiliary materials include heat-resistant cushions and laminated molding frames.
(A mold), a plate heater, and the like.

The inverted cushion is described in Japanese Patent Application Laid-Open No. Hei 8-2441.
No. 63, which is described in JP-A-9-314732 as “frame having continuous pores (CF)” can be used. As a material of the frame (CF) having continuous pores, paper is particularly preferable because of ease of waste treatment.
Select a material whose thickness is thicker than the sintered substrate (I) and about 1.5 times or less, arrange two or more impregnated sintered substrates (IR) on the inner side, It has a frame shape with a space of (IF). Most preferably, the width of the frame portion is set to a width sufficient to absorb excess resin and to uniformly apply the laminating pressure, usually 10 mm or more, preferably about 20 to 70 mm.

The inner frame (IF) is the same as or slightly thinner than the sintered substrate (I) at the lamination molding temperature.
It has a strip shape and its surface is processed to be releasable, or a cellophane tape or the like is stuck so that it can be released. Examples of the material include a resin composite ceramics plate, a low thermal expansion metal plate, and a fiber-reinforced heat-resistant resin laminate.
In particular, those having substantially the same thermal expansion coefficient as the sintered substrate (I) are most preferable. In the case of using a fiber-reinforced heat-resistant resin laminate having a large coefficient of thermal expansion, a strip having a length of 10 cm or less, preferably 6 cm or less is used. , Which are processed so as to be arranged as a length.

As the laminating machine, there can be used a conventional reduced pressure (multistage) hot plate press, an autoclave, a vacuum backpacking press and the like which are heated and pressurized under vacuum. Here, be careful not to apply the molding load at too high a speed, and use these with great care to avoid uneven loading due to misalignment of the parallelism of the hot platen. I do.

Two or more impregnated sintered substrates (IR) described above are arranged with their sides in contact with each other, and a frame (CF) having continuous pores around it, an impregnated sintered substrate (IR) and a frame (CF) Arrange the inner frame (IF) between, and put the metal foil on both sides via aluminum, iron or other smooth metal plate, appropriately stack multiple sets, sandwich the cushion on both sides, Placed between hot plates, heated and pressurized (laminated molding), and after the impregnated resin has cured,
Depressurize, forcibly cool or naturally cool, and temperature 1 as appropriate
Remove from the laminating machine at 50 ° C or less,
(CF, IF) is cut off to obtain a laminated plate (MII) of the present invention.

In a preferred lamination molding, first, the temperature is raised and the atmosphere is degassed under reduced pressure, and is kept at 20 kPa or less, preferably 7 kPa or less for 5 minutes or more.
Preferably, a pressure of 0.4 to 4 MPa, particularly 0.5 to 1.5 MPa is applied, excess resin on the impregnated sintered substrate (IR) is discharged to the surroundings, and the impregnated resin (R) is gelled and cured. The vacuum degassing of the atmosphere is preferably performed so that the impregnated resin of the impregnated sintered substrate (IR) reaches the maximum degree of decompression before melting, and when manufacturing the impregnated sintered substrate (IR). It is preferable to perform the process to a degree of vacuum equivalent to that used for the vacuum impregnation used and to a temperature of about the temperature range or less.

After the impregnating resin (R) is melted and the laminating pressure is applied, the decompression is stopped or the degree of decompression is reduced to suppress the vaporization of the impregnating resin (R). If vaporization of the impregnated resin (R) is observed, the depressurization is stopped. It is preferable that the depressurization of the atmosphere is stopped by a temperature at which the curing reaction of the impregnated resin (R) substantially starts. The curing temperature is appropriately selected according to the type of the impregnated thermosetting resin (R), but in the present invention, usually, a thermosetting resin that can be melted and vacuum impregnated is selected, and therefore, a catalyst is usually used. Is used or only a small amount is used, and the final curing temperature is preferably selected to be higher than the temperature usually used.

Formation of Printed Wiring Network Next, a desired printed wiring network is formed on the laminated plate (MII) manufactured above. For the production of the printed wiring network, a known subtraction method can be used. However, when forming a precise printed wiring network with high absolute position accuracy, drilling with a drill machine with a repeat position accuracy of 5 μm or less, replacing the usual polyester-based photomask with glass or quartz glass as the photomask It is necessary to appropriately employ a liquid resist composition or the like instead of a mask or a photoresist film based on the above.

Further, from the viewpoint of precision etching, the laminated plate (M
II), a plating-resistant and non-plating protective film is formed on the surface of the protective film, a hole is formed, a hole is formed, only a through-hole portion without the protective film is plated, and the protective film is peeled and surface-treated. Excessive through-hole plating protruding from the metal foil surface is removed in advance, and through-hole plating is performed by a process of forming a printed wiring network-that is, a process of forming a resist film, exposing, developing, etching, and removing the resist film. Adopt a method for making a printed wiring board (Japanese Patent Application No. Hei 10-187422).

As the through-hole plating method, any method can be used as long as the conditions are selected, using a method used for a conventional glass epoxy copper clad laminate, but in the present invention, in particular, palladium colloid or palladium-tin is used. Direct plating copper plating using a colloid is preferred. The through-hole plated laminated plate (M
II) A photoresist is attached to both sides, exposed, developed, and etched to produce a printed wiring pattern. Here, as a printed wiring network, usually, a printed wiring network is not formed over two or more metal foil-clad resin composite ceramics plates, and a width of 1 mm or more, preferably
Perform so that copper foil of 2 mm or more remains.

Production of Multilayer Printed Wiring Board (1) In the second invention, an impregnated sintered substrate (I) is stacked on at least one surface of the printed wiring board, and a metal foil is further stacked to form a multilayered laminate. Thereby, the multilayer board of the second invention is obtained. Multi-layer laminate molding is performed using the laminated plate (MII) described above.
Apply a manufacturing method according to. Here, in the case of the second invention, a printed wiring network is formed over a plurality of composite ceramic plates (II) constituting the laminated plate (MII), and the impregnated sintered substrate (IR) is It is possible to form a printed wiring network by stacking the ceramic plates (II) so as to cover the mutually bonded portions, and further stacking and forming a metal foil.
In this method, due to the relationship between thickness and size, the size of the composite ceramic plate (II) is small, so it is essential to manufacture individual components and combine them to make interconnected and integrated components This is particularly effective in the case of parts.

(2) Production of multilayer printed wiring board (2) The third and fourth and fifth inventions described below are directed to a multilayer ceramic board having a composite ceramic board (II) as a core and a printed wiring board made of a different material stacked thereon. The method of manufacturing a printed wiring board is performed using a laminated board (MII). Book 3
The conditions of the multilayer lamination molding in the invention usually depend on the conditions of the adhesive sheet (PP) used, but as the adhesive sheet (PP),
It is more preferable to use a composite ceramics plate (II) prepared so as to exhibit good physical properties even under the conditions of lamination molding. In addition, it is preferable that the thickness of the cured adhesive sheet (PP) be smaller in order to reduce the stress generated due to the difference in thermal expansion coefficient.

Production of Multilayer Printed Wiring Board (3) According to the fourth and fifth inventions, in the production of printed wiring boards to be stacked, conductive metal columns (SM) for connecting between printed wiring layers are first formed or Simultaneously with the formation of the insulating layer
It is characterized in that conductive metal columns (SM) are formed in parallel.

According to the fourth aspect of the present invention, on at least one side of the printed wiring board, (1) a conductive metal column (SM) for connecting between printed wiring layers is formed in the steps of resist pattern formation, electroplating and resist peeling. I do. The resist pattern is formed by exposing and developing a photoresist layer using a normal photoresist film, liquid resist, or the like, to form a resist pattern having holes corresponding to conductive metal columns (SM) connecting between printed wiring layers. The depth of the holes is controlled by the thickness of the photoresist formed by the resist layer. Fill the hole with metal by electroplating. As the electroplating, a method based on pulse plating is preferable. Then, by removing the photoresist, it is assumed that conductive metal columns (SM) for connecting between printed wiring layers are formed on at least one surface of the printed wiring board.

Next, (2) the conductive metal pillars (SM) are embedded with a cured curable resin composition layer, preferably polished to smooth the surface, and the conductive metal pillars (SM) are polished. To expose. The embedding of the conductive metal columns (SM) is performed by casting or press molding. In order to suppress the generation of voids, it is preferable to perform the treatment under a vacuum or to perform a vacuum treatment, and to appropriately apply pressure when curing. The pressing is preferably performed via a release film, and the release film serves to absorb variations in height of the conductive metal pillars (SM), in addition to the release after curing. It is.

Next, preferably, the surface is polished to a smooth surface and the conductive metal columns (SM) are uniformly exposed to the surface. As the surface polishing, for example, using a desktop lapping machine (Kunimoto Machine Tool Works, Ltd., GRIND-X, SPL-15T), SiC powder # 320 (Fujimi Incorporated, GC
# 320), and further, polishing with Al ₂ O ₃ powder # 2000 (Fujimi Incorporated, A # 2000) and soft etching.

Finally, (3) a printed wiring network is formed on the smooth surface. As the method, usually, a thin metal layer is formed on the entire surface using electroless plating, metal deposition, or other means, and then a predetermined negative pattern is formed with a resist,
After the desired pattern portion is thickened by electroplating, flash etching is performed. Then, after forming a resist layer for surface protection, gold plating, and appropriately mounting components, the outer shape is cut to obtain a desired multilayer printed wiring board. In the present invention, the printed wiring layers can be appropriately stacked by a method such as appropriately repeating the steps (1) to (3). In this case, finishing is performed at the end. In addition,
Depending on the use, instead of this step (3), the surface of the conductive metal pillar (SM) obtained in step (2) may be used by plating it with gold or the like.

In the fifth aspect of the present invention, (1) a resist pattern is formed on at least one surface of the printed wiring board with a thermosetting photoresist, and a conductive metal column (SM) for connecting printed wiring layers by electroplating. ) Is formed. next,
(2) The photoresist is thermally cured and its surface is polished and smoothed. (3) A printed wiring network is formed on the smooth surface. The
In the steps (2) and (3), a method according to the above-described fourth invention can be appropriately used.

[0044]

As described above, according to the manufacturing method of the present invention, a large-sized printed wiring network can be manufactured and multilayered, and the limitation on the manufacturing operation due to the small work size can be greatly eased. This makes possible the effective use of existing production equipment, and also allows the use of small-sized equipment that could not be used due to the problem of securing a work area. As a result, high-frequency antennas, high-frequency part modules, etc. that make the most of the high heat dissipation, low coefficient of thermal expansion, and heat resistance of the metal-foil-clad resin composite ceramic plate and the excellent electrical properties of the copper foil used. It can be suitably used as a through-hole shield as a through-hole for conduction such as a substrate or a substrate for directly mounting a semiconductor chip.

[0045]

The present invention will be specifically described below with reference to examples. Example 1 Alumina-silica-boron nitride-based porous sintered body (Al ₂ O ₃ 79 wt
%, H-BN 13wt%, balance SiO ₂ other, an apparent density of 2.323g / cm
³ , a plate having a thickness of 0.5 mm and a size of 90 mm × 120 mm (hereinafter referred to as AL-1) having an open porosity of 24.4% was prepared. This is placed in a muffle furnace and kept at 250 ° C for 30 minutes.
The temperature was raised over a period of time, maintained at that temperature for 10 minutes, and then naturally cooled in a furnace.

The cooled AL-1 is placed in an impregnation vessel of a vacuum impregnating machine, and at room temperature (25 ° C.), aluminum tris (ethyl acetylacetonate) (product name: ALCH-TR, manufactured by Kawaken Fine Chemical Co., Ltd.) 5.0 A solution prepared by dissolving wt% in a mixed solution of 30 wt% of xylene and 65 wt% of isopropyl alcohol is added, pressure reduction is started, and an ultrasonic wave is applied as appropriate while maintaining a state immediately before boiling of IPA for 30 minutes. Infiltration was performed. After completion of the impregnation, remove the
Sun-dried. Next, the air-dried AL-1 was placed in a muffle furnace and kept at 120 ° C. for 30 minutes and at 250 ° C. for 30 minutes. Then, the temperature was raised to a maximum temperature of 600 ° C. in 1 hour and kept at that temperature for 10 minutes. After that, it is cooled naturally in a furnace and surface-treated by AL-1 (hereinafter, AL-T
).

As a thermosetting resin composition, 2,2-bis (4-cyanatophenyl) propane (72 parts), a xylene-formaldehyde resin-modified novolak epoxy resin (epoxy equivalent: 259, softening point: 83 ° C., number average molecular weight: 1163, Trade name: Dinacol T, manufactured by Nagase Kasei Co., Ltd.) 15 parts, biphenyl epoxy resin (trade name: YX-4000HK, manufactured by Yuka Shell Epoxy Co., Ltd.) 10 parts, γ-glycidoxypropyltrimethoxysilane 3.0 parts and imidazole catalyst (product name; C11Z-
A thermosetting resin composition (hereinafter, referred to as resin R1) was prepared by mixing 0.05 parts of CN, manufactured by Shikoku Chemicals Co., Ltd.).

The impregnation vessel of the vacuum impregnator was charged with AL-T, and the atmosphere pressure was adjusted to 0.66 kPa, then heated to 110 ° C. and maintained for 1 hour. Separately, the resin R1 prepared above was placed in a resin container of a vacuum impregnating machine, melted at 110 ° C., and subjected to vacuum degassing for 10 minutes. While maintaining the degree of pressure reduction, the resin R1 subjected to the above-described vacuum degassing treatment was gradually poured into the impregnation vessel at 110 ° C. from the lower part of the vessel, and the impregnation was performed for 1 hour. From the vacuum impregnation machine,
The AL-T impregnated with R1 was taken out, the resin on the surface was dropped and removed, and the resin R1 was cooled and solidified to obtain a resin-impregnated sintered substrate (hereinafter referred to as R-ALT).

As a reverse cushion, the thickness is 0.2 mm, 500 mm ×
A 270 mm × 210 mm rectangular hole was cut out of three 400 mm pieces of paper and prepared. In addition, a 241 mm x 181 mm rectangular hole was cut out into a 0.3 mm, 270 mm x 210 mm Kovar plate (manufactured by Sumitomo Special Metals Co., Ltd., product name KV-2) as an inner frame to form a frame, and the surface was made of Teflon. Was prepared. Further, an aluminum alloy plate having a thickness of 0.4 mm and having a 9 μm-thick adhesive surface low-profile treated rolled electrolytic copper foil having a profile-treated surface fixed as an outer surface (hereinafter referred to as a CA foil) was prepared.

A 0.5 mm thick stainless steel plate and a CA foil are stacked on a 1.0 mm thick, 500 mm × 400 mm iron plate.
On this, the above-mentioned inverted cushion, an inner frame made of a Teflon-coated Kovar plate was arranged in a cut-out portion inside the above-mentioned inverted cushion, and the four R-ALTs produced above were arranged inside the inner frame.
On top of this, a CA foil, a stainless steel plate, and an iron plate were stacked with the profile-treated surface as the lower surface to form a set for lamination molding. A thermocouple for temperature measurement of R-ALT was also set.

A heat-resistant glass cloth / silicon sheet (thickness: 1.6 mm, manufactured by Rogers Co., Ltd.) was placed on both outer surfaces of the above set for lamination molding. This was set between hot press hot plates, heating of the hot plate and depressurization of the atmosphere were started, and the set R-ALT applied a pressing pressure of 0.6 MPa at a temperature of 80 ° C, and depressurized at a temperature of 110 ° C. Stop and 1MPa
The press pressure was applied, the temperature was raised to 190 ° C. as it was, press-molded for 3 hours, and then taken out to obtain a four-sided double-sided copper-clad composite ceramic plate (hereinafter referred to as CR-ALT). The time from the start of depressurization to the application of the press pressure of 0.6 MPa was 20 minutes, and the time from depressurization to stop was 15 minutes.

The obtained four-plated copper-clad ceramic plate is
No warping or twisting was observed, and the release from the inner frame was good. Further, the joints between the resin composite ceramics forming the inner layer were adhered to each other so close that they could be confirmed visually, and no step was confirmed at the joints.

A substrate I-ALT was manufactured by providing a model printed wiring network for the inner layer and two reference holes on both sides of the CR-ALT. As a model printed wiring network for this inner layer,
The joint part of CR-ALT was made to leave a copper foil part with a width of 3 mm, and contained a plurality of unit printed wiring networks formed in each composite ceramics plate. The obtained printed wiring board could be easily handled as one board.

Example 2 In Example 1, a resin-impregnated sintered substrate (R) having a size and thickness of 0.35 mm and a size of 60 mm × 90 mm (hereinafter referred to as AL-2) was used.
-ALT-1), except that six of them are arranged in a square shape so that they are in contact with each other on the sides, except that 180 mm ×
180mm double-sided copper-clad composite ceramics plate (hereinafter referred to as CR-ALT-
1). On both sides of this CR-ALT-1, two model printed wiring networks for the inner layer over multiple resin composite ceramics and the reference holes are formed to form an inner layer plate (hereinafter referred to as substrate I-ALT-1) I got

As an inverted cushion, thickness 1.5 mm, 500 mm ×
A 210 mm × 210 mm square hole was cut out of 400 mm paper and prepared. In addition, as the inner frame, thickness 1.0mm, 2
A 181 mm x 181 mm square hole was cut out into a 10 mm x 210 mm Kovar plate (manufactured by Sumitomo Special Metals Co., Ltd.) to form a frame, and a Teflon-coated surface was prepared.

A stainless steel plate having a thickness of 0.5 mm was placed on a steel plate having a thickness of 1.0 mm and 500 mm × 400 mm, and then a CA foil similar to that used in Example 1 was placed thereon. An inner frame of Teflon coated Kovar was arranged. Furthermore, the six sheets of R-ALT-1 manufactured above are arranged on the inner side, and the substrate I-ALT-1 obtained above is placed on the R-ALT-1 at the joint of the composite ceramics plate. Place it so that it does not overlap the contact part of the side of ALT-1.Furthermore, place six R-ALT-1 on it in the same way as the first step. Then, an iron plate was stacked to form a set for lamination molding. This was laminated and molded in the same manner as in Example 1 to obtain a four-layer multilayer board having double-sided copper foil and an inner printed wiring network. Table 1 shows the results of the physical properties test.

Example 3 A substrate I-ALT was manufactured by providing a model printed wiring network for an inner layer and two reference holes on both sides of the CR-ALT of Example 1. Next, thermoplastic polyimide resin film and copper foil (GTS foil 9μm, manufactured by Furukawa Circuit Foil Co., Ltd.)
Is cut into 190mm × 250mm, placed on both sides of the board I-ALT, and a 0.5mm thick stainless steel plate and a 0.4mm thick aluminum alloy sheet are stacked on a 1.0mm, 500mm × 400mm iron plate. Was. This was set between hot press hot plates, heating of the hot plate and depressurization of the atmosphere were started, and the set R-ALT applied a pressing pressure of 0.6 MPa at a temperature of 120 ° C., and was directly heated to a temperature of 320 ° C. The mixture was heated for 20 minutes, cooled to 130 ° C. by natural cooling, and taken out.
A four-sided copper-clad multilayer board having a thickness of 0.7 mm and a good appearance was produced. Table 1 shows the results of the physical property test of the obtained multilayer board.
It was shown to.

Example 4 A substrate I-ALT was manufactured by providing a model printed wiring network for an inner layer and two reference holes on both sides of the CR-ALT of Example 1. Next, photoresist (Nichigo Morton, Drift Film photoresist, product number: 601Y25, 25 μm thickness)
Was applied, holes were formed on the lands at the required locations, hermetic plating was performed by electroplating, the photoresist was removed, and conductive copper pillars (SM) for connecting printed wiring were formed.

Next, 25 wt parts of the resin R1 of Example 1 and 75 wt parts of the spherical fused silica powder were heated to 110 ° C. and sufficiently kneaded, and the substrate surface was thinly coated to form a release film (Tedlar film). ) And cured by vacuum hot pressing. Then, both surfaces were polished with a # 800 lap polisher to adjust the resin thickness to 25 μm and to expose the conductive copper pillars (SM). Further, a printed wiring network was formed. A four-sided copper-clad multilayer board having a thickness of 0.7 mm and a good appearance was produced. Table 1 shows the results of a physical property test performed on the obtained multilayer board.

Example 5 A substrate I-ALT was manufactured by providing a model printed wiring network for an inner layer and two reference holes on both sides of the CR-ALT of Example 1. Next, a thermosetting photoresist (Taiyo Ink Co., Ltd.)
Mixture of 70% of the main agent PSR-4000 and 30% of the hardener CA-403), and form a hole on the required land, 130 ℃
After post-curing with, electroplating, performing hermetic plating, heating and curing the resist, # 8
Polish both sides with a No. 00 lapping machine and reduce the resin thickness to 25.
The thickness was adjusted to μm, and the conductive copper pillar (SM) was exposed.
Further, a printed wiring network was formed. Good thickness 0.7
A double-sided copper-clad 4-layer multilayer board of mm was produced. Table 1 shows the results of a physical property test performed on the obtained multilayer board.

Table 1 Item Example 1 Example 2 Example 3 Example 4 Example 5 Substrate material Core material Alumina Same as left Same as left Same as left Same as left Multilayer material None Alumina PI film Si-R1 Heat-photo Copper foil peel strength Initial 0.6-0.8 0.6-0.8 0.8-0.9 0.8-1.0 0.6-0.8 (kg / cm) After test 0.7-0.8 0.7-0.8 0.8-0.9 0.9-1.0 0.5-0.7 Appearance after heat cycle test No abnormality Same as left Same as left Same as left Same as left inner layer Force-not measurable 0.7-0.8 0.7-0.8 0.7-0.8

The measurement of physical properties and the like in Table 1 were as follows. 1: Copper foil is made by Furukawa Circuit Foil; VLP foil elongation (at 180 ° C) Vertical 12.8%, horizontal 7.7%, Rz = 5.1 μm, Ra = 0.8 μm on profile-treated surface. 2: Thermal cycle test conditions: 150 ° C / 30 minutes → Leave at room temperature for 15 minutes → -60 ° C / 30 minutes → Leave at room temperature for 15 minutes → As one cycle
After 100 cycles. 3: Inner layer adhesive strength: When measurement was not possible, delamination was attempted,
This indicates that it could not be peeled and was broken.

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Claims (12)

[Claims] 1. A curable resin is applied to an inorganic continuous pore sintered substrate (I).
(R) impregnated sintered substrate (IR) and a metal foil laminated and formed by laminating a metal foil-clad resin composite ceramics board (II) in a printed wiring board manufacturing method, the composite ceramics board (IR II) A laminated plate manufactured by arranging two or more impregnated sintered substrates (IR) with their sides in contact with each other and bonding them together
A method for producing a printed wiring board, wherein a printed wiring network is formed collectively without separating the composite board (MII) into individual composite ceramic boards (II) by using (MII). 2. The thickness of said inorganic continuous pore sintered substrate (I) is
2. The method for producing a printed wiring board according to claim 1, wherein the length of the laminated board (MII) is at least 12 cm. 3. The printed wiring board according to claim 1, wherein said printed wiring board has a printed wiring network formed by leaving a copper foil having a width of 2 mm or more at a mutual bonding portion of said composite ceramics board (II). Manufacturing method. 4. A step of laminating and laminating the impregnated sintered substrate (IR) and a metal foil on at least one side of the printed wiring board according to claim 1, and then forming a printed wiring network on both sides at least once. A method for manufacturing a multilayer printed wiring board, which consists of repeating. 5. The printed wiring network of the printed wiring board,
The composite ceramic plate (II) is formed over a plurality of composite ceramic plates (II), the impregnated sintered substrate (IR) is overlapped so as to cover the mutual bonding portion of the composite ceramic plate (II), and a metal foil is further laminated. 5. The method for producing a multilayer printed wiring board according to claim 4, wherein the printed wiring network is formed by stacking and laminating. 6. A step of forming a printed wiring network after laminating an adhesive sheet (PP) and a metal foil on at least one surface of the printed wiring board (CPWB) according to claim 1 and repeating the forming at least once. And a method for manufacturing a multilayer printed wiring board. 7. The difference in linear expansion coefficient between the composite ceramics plate (II) constituting the printed wiring board (CPWB) and the laminate formed by laminating the adhesive sheet (PP) alone is 5 × 10 ^{− The} method for producing a multilayer printed wiring board according to claim ^{6, wherein the} temperature is ⁶ / C or lower. 8. An adhesive sheet (PP) comprising a fiber-reinforced resin-impregnated base material using a thermosetting resin composition containing an inorganic filler as an essential component, a polyimide sheet having an adhesive layer formed on both sides, The method for producing a multilayer printed wiring board according to claim 6, wherein the film is a polyimide sheet or a film in which at least both surfaces are thermoplastic polyimide. 9. A conductive metal column (SM) for connecting between printed wiring layers in at least one surface of the printed wiring board (CPWB) according to claim 1 in the steps of (1) forming a resist pattern, electroplating, and removing the resist. (2) forming the conductive metal column (S
(M) embedding in a cured curable resin composition layer, polishing and smoothing the surface and exposing the conductive metal columns (SM); (3) forming a printed wiring network on the smooth surface A method for manufacturing a multilayer printed wiring board, comprising repeating at least one of the three steps of: 10. The method for manufacturing a multilayer printed wiring board according to claim 9, wherein the electroplating in the step (1) is pulse plating. 11. The multilayer print according to claim 9, wherein the curable resin composition used in the cured curable resin composition layer in the step (2) comprises an inorganic filler as an essential component. Manufacturing method of wiring board. 12. A printed circuit board according to claim 1, wherein (1) a resist pattern is formed from a thermosetting photoresist, and a conductive metal column (SM) for connecting between printed wiring layers by electroplating. (2) a step of thermally curing the photoresist, and polishing and smoothing the surface;
(3) A method for producing a multilayer printed wiring board, comprising repeating at least once three steps of forming a printed wiring network on the smooth surface.