JP2001358450A - Solder ball mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the operation efficiency of a solder ball mounting device, which mounts solder balls on electrodes formed on a chip, by greatly decreasing the frequency of supply of solder balls onto a ball array mask, and eliminating the need for operation for discharging excessive solder balls from a discharge opening and ball arraying operation using a brush. SOLUTION: The solder ball mounting device 1 is provided with a tray mount table 9 where the chip 2 is positioned and held with an electrode 3 facing up, a ball array mask 14 which holds the solder balls fallen through holes 14a on the electrodes, a ball joint 6 which allows the solder ball array mask 14, etc., to swing so that the solder balls 4 are fallen in the respective through holes 14a when arrayed, and a stopper member 17 which holds the solder ball array mask 14, etc., at a slanting attitude so that the solder balls 4 are stored at one end of the solder ball array mask 14 when the chip is set and taken out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention belongs to the technical field of a solder ball mounting apparatus for mounting a solder ball on an electrode formed on a chip.

[0002]

2. Description of the Related Art In general, a BGA (ball grid array) type chip has at least a printing step of printing solder paste or flux on a plurality of electrodes formed on the chip, and an electrode on which solder paste or flux is printed. After passing through a solder ball mounting step of mounting solder balls on the substrate, the semiconductor device is mounted on a substrate using a reflow soldering apparatus. The solder ball mounting step is performed using a solder ball mounting device. The existing solder ball mounting device has a type in which a solder ball is suctioned by a suction head and transferred onto an electrode, and a plurality of through holes. The type is roughly divided into a type in which a solder ball is dropped on an electrode using a ball alignment mask in which is formed.

[0003]

However, in the former type, there is no possibility that the solder ball may be deformed by the suction force of the suction head, and the separation property between the suction head and the solder ball is inferior. There was a problem that the yield was lowered due to the occurrence of a defect. On the other hand, the latter type has an advantage that deformation or mounting failure of the solder ball is unlikely to occur because no excessive force is applied to the solder ball, but a work step of supplying a large number of solder balls on the ball alignment mask,
Since many work steps such as a work step of dropping solder balls into all through holes of the ball alignment mask using a brush and a work step of discharging surplus solder balls from the discharge port of the ball alignment mask are required, It was difficult to carry out efficient mounting work.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in order to solve these problems in view of the above-mentioned circumstances, and comprises a plurality of electrodes formed on a chip.
A solder ball mounting device for mounting a solder ball, wherein the solder ball mounting device has a chip set portion for positioning and holding a chip with an electrode facing upward, and a plurality of through holes corresponding to the electrode positions of the chip. And a solder ball aligning portion for holding the solder ball dropped on the through hole on the electrode, and an integrated swing of the chip set portion and the solder ball aligning portion for dropping the solder ball into each through hole when aligning the solder ball. Swing support means for allowing movement, and inclined holding means for holding the solder ball alignment section in an inclined position in order to store solder balls at one end of the solder ball alignment section during chip setting and chip removal. It is characterized by the following. In other words, it is not possible to significantly reduce the number of times solder balls are supplied on the ball alignment mask, and it becomes unnecessary to discharge surplus solder balls from the discharge port and to align balls using a brush, As a result, an efficient solder ball mounting operation can be performed. The chip setting section includes a chip tray capable of positioning and holding one or a plurality of chips, a tray mounting table capable of setting the chip tray in a sliding manner from front and rear or right and left, and a table for raising and lowering the tray mounting table. And an elevating mechanism. That is, it is not necessary to touch the chip at the time of chip setting or chip removal, so that inconveniences such as displacement of the mounted solder balls can be avoided, and the chip tray can be taken in and out without moving the solder ball alignment portion. Therefore, it is possible to keep the solder balls stored at one end of the solder ball alignment portion in a stationary state and prevent the solder balls from falling out of the through holes. The chip tray is also used as a chip tray of a printing apparatus for printing solder paste or flux on chip electrodes. In other words, since the chip on which the solder paste or the flux is printed by the printing apparatus can be set in the solder ball mounting apparatus while being placed on the chip tray, the chip can be easily and quickly transferred between the two apparatuses. be able to. Further, the table elevating mechanism connects the tray mounting table supported so as to be able to move up and down to a lifting operation lever via a cam, and raises and lowers the tray mounting table according to the left and right rotation operation of the lifting operation lever. It is a feature. That is, since the cam is used for the table lifting mechanism, the structure can be simplified and the cost can be reduced. In addition, since the tray mounting table is raised and lowered by the right and left rotation operation of the lifting and lowering operation lever, the lever operation stroke is increased. This makes it easy to finely adjust the elevation position and control the elevation speed. Further, the solder ball alignment portion includes a ball alignment mask having a plurality of through holes formed therein, and a ball guide frame capable of restricting the drop of the solder ball at a peripheral portion of the ball alignment mask and storing the solder ball at one end. Are provided. That is, it is possible to avoid a disadvantage that the solder ball drops from the peripheral portion of the mask when the mask swings or tilts. Further, a ball storage portion for storing solder balls is formed in the ball guide frame. In other words, it is possible to easily check the ball storage amount and to optimize the timing of supplying the solder balls. Also, on the underside of the ball alignment mask,
An interval maintaining mask for securing a predetermined interval between the ball alignment mask and the chip is provided. In other words, the necessary spacing is ensured only by bringing the chip into close contact with the spacing holding mask, so that the spacing adjustment is not required and the working efficiency can be improved. Further, the swing supporting means is characterized in that the device main body in which the chip set portion and the solder ball aligning portion are incorporated is swingably supported by using a ball joint as a fulcrum. That is, since the swing support means is constituted by a ball joint, the structure can be simplified and the cost can be reduced. Further, the tilt holding means is characterized in that the tilt holding means is constituted by a stopper member which restricts the swing of the apparatus main body in which the chip set portion and the solder ball alignment portion are incorporated at a predetermined tilt angle. That is, since the inclination holding means is constituted by the stopper member, the structure can be simplified and the cost can be reduced.

[0005]

Next, one embodiment of the present invention will be described with reference to the drawings. In the drawing, reference numeral 1 denotes a solder ball mounting device for mounting solder balls 4 on a plurality of electrodes 3 formed on the lower surface of a chip 2. The solder ball mounting device 1 has elastic leg members 5a mounted at four corners. A base 5, a ball joint 6 erected at the center of the rear end of the base 5, a swing table 7 slidably supported by the ball joint 6 as a fulcrum, A plurality of guide posts 8 to be provided, a tray mounting table 9 guided by the guide posts 8 so as to be movable up and down, and a lever shaft for receiving and supporting the tray mounting table 9 and standing on the swing table 7. A lifting / lowering operation lever 11 rotatable in the left-right direction around a fulcrum 10; a chip tray 13 slidably set from the near side along a tray guide 12 arranged side by side on the tray mounting table 9; Strike 8
Alignment mask 1 held at the upper end of the ball
4, a ball guide frame 15 superposed from above on a peripheral portion of the ball alignment mask 14, a fixing frame 16 for fixing the ball guide frame 15 and the ball alignment mask 14, and the like.

Reference numeral 17 denotes a pair of left and right stopper members which are erected at the front left and right positions of the base 5. The stopper members 17 move the swingable swing table 7 to a forward inclined posture (initial posture). It is provided to abut and hold.

Reference numeral 18 denotes a cam fixed to the bottom surface of the tray mounting table 9. The cam 18 is in contact with a bearing 19 mounted on the base end of the lifting operation lever 11. The contact surface portion 18a is formed on a downwardly inclined surface, so that the tray mounting table 9 rises with the rightward operation of the up / down operation lever 11, while the left / right operation of the up / down operation lever 11 is performed. Accordingly, the tray mounting table 9 is lowered.

The chip tray 13 has a concave portion 13 which can hold the chip 2 in a positioning manner with the electrode 3 facing upward.
The chip tray 13 of the present embodiment has an opening 13b for chip suction fixing below the concave portion 13a so as to also serve as a chip tray of the printing device 20 described later. I have.

On the other hand, the ball alignment mask 14 has a plurality of through holes 14a corresponding to the electrode positions of the chips 2 held on the chip tray 13. In a state where the tray mounting table 9 is raised to bring the chip 2 close to the lower surface of the ball alignment mask 14, the solder balls 4 supplied on the ball alignment mask 14 are passed through the respective through holes 14a.
And the dropped solder balls 4 are held on the electrodes. On the lower surface of the ball alignment mask 14, an interval holding mask 21 for securing a predetermined interval K between the ball alignment mask 14 and the chip 2 is provided. Are mounted in a polymerized manner, so that the solder paste 22 pre-printed on the electrode 3
The solder balls 4 can be mounted on the electrodes while avoiding contact between the (or flux) and the ball alignment mask 14.

The ball guide frame 15 regulates the falling of the solder balls 4 at the peripheral edge of the ball alignment mask 14 and the ball alignment mask 14
In the initial posture in which the solder balls 4 are stored in front of the ball alignment mask 14 in the initial posture integrally inclined forward, the frame is formed in a frame shape having a predetermined rising dimension so as to allow the solder balls 4 to accumulate.

Further, reference numeral 15a denotes the ball guide frame 15;
The ball storage groove 15a is for storing the solder ball 4 stored on the front side of the ball alignment mask 14 in the initial position. If it is known in advance, it is easy to check the remaining amount of the balls, so that the replenishment timing of the solder balls 4 can be accurately determined.

Next, operation procedures (1) to (6) of a ball mounting operation using the solder ball mounting apparatus 1 will be described.
However, the electrode 3 of the chip 2 placed on the chip tray 13
Has solder paste 22 printed thereon in advance, and
It is assumed that a predetermined amount of the solder ball 4 is stored in the ball storage groove 15a of the ball guide frame 15.

(1) In a state in which the apparatus main body 1a (the part that swings integrally with the swing table 7) is tilted forward and the tray loading table 9 is lowered, the chip tray is placed on the tray loading table 9. 13 is slid from the near side. (2) The tray operation table 9 is raised by rotating the lifting operation lever 11 to the right, and the peripheral edge of the chip 2 is brought into contact with the spacing mask 21. (3) The apparatus main body 1a is swung by hand to drop the solder balls 4 into the respective through holes 14a of the ball alignment mask 14. (4) After confirming that the solder balls 4 have fallen into all the through holes 14a, the apparatus main body 1a is inclined forward to accommodate the extra solder balls 4 in the ball storage grooves 15a of the ball guide frame 15. (5) After confirming that no extra solder ball 4 remains on the ball alignment mask 14, the solder ball 4 is pressed against the chip 2 by the stamper 23. (6) After lowering the tray mounting table 9 by rotating the lifting operation lever 11 to the left, the chip tray 13 is pulled out to the near side.

The printing apparatus 20 includes a base 25 having elastic leg members 25a attached to four corners, a plurality of guide posts 26 erected on the base 25, and a vertically movable guide post 26. A tray mounting table 27 to be guided; an elevating operation lever 29 which receives and supports the tray mounting table 27 and is rotatable in the left-right direction with a lever shaft 28 erected on the base 25 as a fulcrum; The chip tray 13 slidably set from the near side on a tray temporary holding stand 30 erected on the left and right sides of the table 25, a paste print mask 31 held in a positioning manner on the upper end of the guide post 26, and the paste printing A fixing frame 32 for fixing the mask 31 is provided. Reference numeral 33 denotes a cam fixed to the bottom of the tray mounting table 27, reference numeral 34 denotes a bearing mounted on the base end of the elevating operation lever 29,
These parts 33, 34, 35
Are formed in substantially the same manner as the corresponding parts.

Reference numeral 36 denotes a tray guide which is provided upright on the left and right sides of the tray mounting table 27.
6 receives the chip tray 13 on the tray temporary holding stand 30 in the course of raising the tray mounting table 27 and causes the chip tray 13 to approach the lower surface side of the paste print mask 31, and moves the tray temporary holding stand in the course of lowering the tray mounting table 27. 3
The chip tray 13 is transferred to the first tray.

Reference numeral 37 denotes a suction nozzle which stands on the tray mounting table 27. The suction nozzle 37 enters each of the openings 13b of the chip tray 13 from below while the tray mounting table 27 is being lifted. At the same time, the tray guide 36 is provided so as to come into contact with the surface of the chip 2 at the timing of receiving the chip tray 13.

The paste print mask 31 has a plurality of through holes (not shown) corresponding to the electrode positions of the chips 2 held on the chip tray 13. When the chip 2 is brought into close contact with the lower surface of the paste print mask 31 by raising the tray mounting table 27, the solder paste 22 supplied on the paste print mask 31 is used.
Is pressed into each through hole using a squeegee (not shown), so that an appropriate amount of solder paste 2
2 can be printed.

Next, the operation procedures (1) to (6) of the solder paste printing operation using the printing apparatus 20 will be described.
However, it is assumed that a plurality of chips 2 are set in the chip tray 13 in a positioning manner in advance.

(1) With the tray mounting table 27 being lowered, the chip tray 13 is set on the temporary tray holding stand 30 in a sliding manner from the near side. (2) The tray operation table 27 is raised by rotating the lifting operation lever 29 to the right, and the chip 2 is brought into close contact with the lower surface of the paste print mask 31. (3) The suction switch (not shown) is turned ON, and the chip 2 is suction-fixed by the suction nozzle 37. (4) The solder paste 22 is pressed into each through hole of the paste print mask 31 using a squeegee. (5) After the tip 2 is separated from the paste print mask 31 by slightly rotating the elevating operation lever 29 to the left,
Turn off the suction switch. (6) After lowering the tray mounting table 27 by rotating the elevating operation lever 29 further leftward, the chip tray 13 is pulled out to the near side.

In the apparatus configured as described above, the solder ball mounting apparatus 1 for mounting the solder balls 4 on the electrodes 3 formed on the chip 2 positions and holds the chip 2 with the electrodes 3 facing upward. A plurality of through-holes 14a corresponding to the electrode positions of the chip 2 and the chip setting section (the tray mounting table 9, the chip tray 13, and the like) are formed, and the solder balls 4 dropped into the through-holes 14a are held on the electrodes. In order to drop the solder balls 4 into the through holes 14a at the time of solder ball alignment, the chip set portion and the solder ball alignment portion are integrally rocked. Allowable rocking support means (such as a ball joint 6) and a solder ball for storing the solder ball 4 at one end of the solder ball alignment portion at the time of chip setting and chip removal. Due to the provision of an inclined holding means for holding the Le alignment portion to the inclined position (the stopper member 17, etc.),
The number of times that the solder balls 4 are supplied onto the ball alignment mask 14 cannot be greatly reduced, and the operation of discharging the surplus solder balls 4 from the discharge port and the ball alignment operation using a brush become unnecessary. As a result, an efficient solder ball mounting operation can be performed.

The chip set section includes a chip tray 13 capable of positioning and holding one or a plurality of chips 2.
A tray mounting table 9 on which the chip tray 13 can be slid from the near side, and a table elevating mechanism (elevating operation lever 1) for elevating the tray mounting table 9
1, the cam 18 and the like), it is possible to avoid inconvenience such as displacing the mounted solder ball 4 by touching the chip 2 at the time of chip setting or chip removal, and furthermore, the solder ball alignment mask 14 is moved. Since the chip tray 13 can be taken in and out without any need, the solder balls 4 stored at one end of the solder ball alignment mask 14 can be kept stationary and can be prevented from falling out of the through holes 14a.

The chip tray 13 is also used as a chip tray of the printing apparatus 20 for printing the solder paste 22 (or flux) on the electrodes 3 of the chips 2.
Chip 2 on which solder paste 22 is printed by printing device 20
Can be set in the solder ball mounting device 1 while being placed on the chip tray 13, and as a result, the chip 2 can be easily and quickly transferred between the two devices 1 and 20.

The table elevating mechanism connects the tray mounting table 9 supported so as to be movable up and down to a lifting operation lever 11 via a cam 18, and the tray mounting table 9 is moved in accordance with the left and right rotation operation of the lifting operation lever 11. Since the table 9 is configured to be moved up and down, the structure can be simplified and the cost can be reduced. In addition, the tray operation table 11 can be moved up and down by rotating the elevation operation lever 11 left and right. By increasing the stroke, fine adjustment of the elevating position and control of the elevating speed can be facilitated.

Further, the solder ball aligning portion includes a ball aligning mask 14 having a plurality of through holes 14a formed therein, and a peripheral portion of the ball aligning mask 14 for restricting the drop of the solder ball 4 and having one end having a solder ball. Since the ball guide frame 15 capable of storing the solder balls 4 is provided, it is possible to avoid a disadvantage that the solder balls 4 drop from the peripheral portion of the mask when the mask swings or the mask is tilted.

Further, since the ball storage groove 15a for storing the solder balls 4 is formed in the ball guide frame 15, it is possible to easily check the amount of stored balls and to optimize the timing of supplying the solder balls 4.

On the lower surface of the ball alignment mask 14,
Since the gap holding mask 21 for securing a predetermined gap between the ball alignment mask 14 and the chip 2 is provided, a necessary gap can be secured only by bringing the chip 2 into close contact with the gap holding mask 21, and as a result, the gap adjustment can be performed. It is unnecessary and the work efficiency can be improved.

Further, since the swinging support means swingably supports the apparatus main body 1a with the ball joint 6 as a fulcrum, the structure can be simplified and the cost can be reduced.

Further, since the inclination holding means is constituted by the stopper member 17 for restricting the swing of the apparatus main body 1a at a predetermined inclination angle, the structure can be simplified and the cost can be reduced.

The present invention is, of course, not limited to the above-described embodiment. For example, the solder ball mounting apparatus of the above-described embodiment includes a ball supply operation, a tray setting operation, a table raising operation, a main body swinging operation, Although the main body initial posture returning work, the table lowering work, the tray removing work, etc. are configured to be performed manually, any one or all of the works may be configured to be performed automatically using an actuator. Good.

[Brief description of the drawings]

FIG. 1 is a partially omitted front sectional view of a solder ball mounting device showing a swing operation state.

FIG. 2A is a sectional side view of the same, showing a swing operation state;
(B) is an upper side sectional view showing the tilt holding state (initial posture).

FIG. 3 is a plan view of the same.

FIG. 4 is an operation explanatory view of the solder ball mounting device.

FIG. 5 is a partially omitted front sectional view of the printing apparatus.

FIG. 6 is a sectional side view of the same.

FIG. 7 is an enlarged view of a main part of the above.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball mounting device 2 Chip 3 Electrode 4 Solder ball 5 Base 6 Ball joint 7 Swing table 9 Tray placing table 11 Lifting operation lever 13 Chip tray 14 Ball alignment mask 14a Through hole 15 Ball guide frame 15a Ball storage groove 17 Stopper member 18 Cam 20 Printing device 21 Spacing mask 22 Solder paste

Claims (9)

[Claims] 1. A solder ball mounting device for mounting a solder ball on a plurality of electrodes formed on a chip, comprising: a chip set portion for positioning and holding the chip in a posture in which the electrode faces upward; A plurality of through-holes corresponding to the positions of the electrodes of the chip are formed, and a solder ball aligning portion for holding the solder balls dropped in the through-holes on the electrodes; Swing support means for allowing the chip set portion and the solder ball alignment portion to swing integrally, and a solder ball alignment portion for storing the solder ball at one end of the solder ball alignment portion at the time of chip setting and chip removal. And a tilt holding means for holding the device in an inclined posture. 2. The chip set unit according to claim 1,
A chip tray capable of positioning and holding one or a plurality of chips, a tray mounting table capable of setting the chip tray in a sliding manner from front to back or right and left, and a table lifting mechanism for raising and lowering the tray mounting table are provided. A solder ball mounting device, characterized in that: 3. The solder ball mounting device according to claim 2, wherein the chip tray is used also as a chip tray of a printing device for printing solder paste or flux on chip electrodes. 4. A table lifting mechanism according to claim 2, wherein the tray mounting table supported to be movable up and down is connected to a lifting operation lever via a cam, and the tray is moved in accordance with a left-right rotation operation of the lifting operation lever. A solder ball mounting device characterized by raising and lowering a mounting table. 5. The solder ball alignment portion according to claim 1, wherein the solder ball alignment portion includes a ball alignment mask having a plurality of through-holes formed therein, and a peripheral portion of the ball alignment mask for restricting the drop of the solder ball, and having one end provided with a solder ball. A solder ball mounting device comprising: a ball guide frame capable of storing balls. 6. The ball guide frame according to claim 5,
A solder ball mounting device, wherein a ball storage portion for storing solder balls is formed. 7. The solder ball mounting apparatus according to claim 5, wherein an interval maintaining mask for securing a predetermined interval between the ball aligning mask and the chip is provided on a lower surface of the ball aligning mask. 8. The solder ball mounting device according to claim 1, wherein the swing support means swingably supports the device main body in which the chip set portion and the solder ball alignment portion are incorporated with a ball joint as a fulcrum. . 9. The apparatus according to claim 1, wherein the inclination holding means is constituted by a stopper member for restricting the swing of the apparatus main body into which the chip setting section and the solder ball alignment section are incorporated at a predetermined inclination angle. Features solder ball mounting device.