JP2001357779A - Manufacturing method of substrate for plasma display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a plasma display in order that a fluorescent substance layer is simply formed at a high precision between barrier ribs with a high yield and in order that a plasma display of a high luminance is manufactured. SOLUTION: This is the manufacturing method of the substrate for the plasma display, which has the barrier ribs on the substrate, and which has the fluorescent substance layer, and a forming process of the fluorescent layer has a process to fill fluorescent substance pastes between the barrier ribs, and the filling amount is within a range of 50% to 120% of the volume of grooves consisting of the ribs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a substrate for a plasma display. More specifically, the present invention relates to a method for easily manufacturing a plasma display substrate with a high yield.

[0002]

2. Description of the Related Art In a plasma display, a plasma discharge is generated between electrodes facing each other in a discharge space provided between a front substrate and a rear substrate, and ultraviolet rays generated from a gas sealed in the discharge space. Is applied to a phosphor provided in the discharge space, and display is performed by causing the phosphor to emit light. In this case, a partition is provided to suppress the spread of the discharge to a certain area, to perform display in a specified cell, and to secure a uniform discharge space. The partition is usually formed on the back substrate, and an RGB phosphor layer is formed between cells formed by the partition in the case of a color display.

As a method of forming a phosphor layer of a plasma display, a screen printing method is often used. As a method for forming a high-definition phosphor pattern on a large-sized substrate, a method using screen blasting and then using sandblasting as disclosed in JP-A-6-5205, and a method disclosed in JP-A-5-144375. A method of screen printing after applying such a crosslinking agent has been proposed.

A method using photolithography is also used as a method for obtaining a high-precision pattern. In this case, however, it is necessary to repeat steps such as coating, exposure, development, and drying. Unnecessary portions are removed by development after the exposure, and wasteful consumption of the phosphor powder, and recovery and regeneration of the phosphor powder increase costs.

A method has been proposed in which a phosphor paste is sprayed from the tip of an ink jet nozzle to form a phosphor layer. However, in the case of ink jet, the viscosity needs to be about 0.2 poise or less due to a mechanism for injecting a phosphor paste by a piezoelectric element or the like, and the amount of phosphor powder in the paste cannot be increased. The overall thickness is reduced.

Further, the phosphor layer formed by the method such as the screen printing described above tends to have a small thickness near the top of the partition wall, so that the luminous luminance and the luminous efficiency of the plasma display are low. Was something.

[0007]

SUMMARY OF THE INVENTION The present invention provides a method for manufacturing a plasma display substrate for manufacturing a high-luminance plasma display by easily forming a phosphor layer between partition walls with high yield and high yield. Aim.

[0008]

That is, a first invention of the present invention is a method of manufacturing a plasma display substrate in which a phosphor layer is formed between partition walls. A method for manufacturing a substrate for a plasma display, wherein a filling amount of a phosphor paste is in a range of 50 to 120% of a volume of a groove formed by a partition. Further, the second invention of the present invention is a method for manufacturing a plasma display substrate having a phosphor layer formed between partitions, wherein the filling of the phosphor paste between the partitions is performed by image processing. A method for manufacturing a substrate for a plasma display, comprising detecting an amount and controlling a filling amount.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate used in the manufacturing method of the present invention is not particularly limited, but it is possible to use a general soda lime glass, a glass obtained by annealing a soda lime glass or a glass having a high strain point. it can.
The size of the glass substrate is not particularly limited, and is 1 to 5 m.
Glass with a thickness of m can be used. Further, an electrode and a dielectric layer may be formed on a glass substrate.
Here, the electrodes can be formed on the substrate by a screen printing method, a method using a photosensitive conductive paste, or the like of silver, aluminum, copper, gold, nickel, tin oxide, ITO, or the like.

A back substrate constituting a plasma display usually has a pitch of 100 to 430 μm and a line width of 15 to 6 μm.
A partition layer having a shape of 0 μm and a height of about 60 to 150 μm is formed. In addition, since the partition walls are usually formed in a stripe shape, the phosphor layer is also formed in a stripe shape in a range of 10 to 50.
It is formed with a thickness of μm. The partition is formed so that its cross section is substantially rectangular, and the phosphor paste is filled between the grooves partitioned by the partition. In the case of a color display, since one pixel line is formed with three stripes of RGB, it is necessary to repeatedly form a phosphor layer.

The method of filling the phosphor paste is an important technique which affects the quality of the plasma display, and specific examples include a screen printing method and a photolithography method.

As the phosphor paste in the present invention, a mixture of a phosphor powder and an organic component can be used.

[0013] The phosphor powder is not particularly limited. An example
For example, in red, Y_TwoO_Three: Eu, YVO_Four: Eu,
(Y, Gd) BO_Three: Eu, Y_TwoO_ThreeS: Eu, γ-Zn_Three
(PO_Four) _Two: Mn, (ZnCd) S: Ag + In_TwoO_Three,
Y_TwoSiO_Five: Eu, Y_TwoAl_FiveO₁₂: Eu, Zn_Three(P
O_Four)_Two: Mn, YBO_Three: Eu, (Y, Gd) BO_Three: E
u, GdBO_Three: Eu, ScBO_ThreeP: Eu, LuB
O_Three: Eu and the like. In green, Zn_TwoGeO_Two: M
n, BaAl₁₂O₁₉: Mn, Zn_TwoSO_Four: Mn, LaP
O_Four: Tb, ZnS: Cu, Al, ZnS: Au, C
u, Al, (ZnCd) S: Cu, Al, Zn_TwoSiO
_Four: Mn, As, AsY_ThreeAl_FiveO₁₂: Ce, CeMgA
l₁₁O₁₉: Tb, Gd_TwoO_TwoS: Tb, Y_ThreeAl_FiveO₁₂: T
b, ZnO: Zn and the like. In blue, Y_TwoSi
O_Five: Ce, CaWO_Four: Pb, BaMgAl₁₄O_{twenty three}: E
u, Sr_Five(PO_Four)_ThreeCl: Eu, BaMgAl
₁₆O₂₇: Eu, BaMg_TwoAl₁₄O_{twenty four}: Eu, ZnS:
Ag + pigment (red), Y_TwoSiO_Three: Ce
What is it?

As the organic component, general organic binders, solvents and the like can be used. Specific examples of the organic binder include polyvinyl alcohol, polyvinyl butyral, polyvinyl acetate, methylcellulose, ethylcellulose, hydroxyethylcellulose, cellulosic polymers such as methylhydroxyethylcellulose, polymethylsiloxane, silicon polymers such as polymethylphenylsiloxane, polyethylene, Polyvinylpyrrolidone, polystyrene, polyamide, high molecular weight polyether, methacrylate polymer, acrylate polymer, acrylate-
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins. In addition, as a solvent used for purposes such as adjusting the viscosity of the paste, methyl cellosolve, ethyl cellosolve,
Butyl cellosolve, methyl ethyl ketone, dioxane,
Acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, benzyl alcohol, terpineol, tetrahydrofuran, butyl carbitol acetate, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, Examples thereof include chlorobenzoic acid and the like and an organic solvent mixture containing at least one of these.

A plasticizer can be added to the organic component. Specific examples include dibutyl phthalate,
Dioctyl phthalate, polyethylene glycol, glycerin and the like can be mentioned.

In the case where the photolithography method is applied, the paste contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer and a photosensitive polymer. Photosensitivity is imparted by adding additive components such as a polymerization initiator, an ultraviolet absorber, a sensitizer, a sensitization aid, and a polymerization inhibitor. In such a case, after filling the paste, after drying,
Unnecessary portions can be developed and removed by pattern exposure to form a desired pattern.

The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group in the molecule. (B) those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds. (C) So-called diazo resins such as condensates of diazo amines and formaldehyde. And others.

Examples of the photo-soluble type include (D) a complex of a diazo compound with an inorganic salt or an organic acid, and a compound containing a quinone diazo compound. (E) a quinone diazo compound combined with an appropriate polymer binder. For example, phenol, naphthoquinone-1,2-diazide-5-sulfonic acid ester of a novolak resin, and the like.

Of these, in particular, when laminating and patterning, the photoinsolubilizing type is particularly preferable because it can be easily mixed with inorganic fine particles as a photosensitive paste and used as (A). Are preferably used.

The sensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, isobutyl acrylate, tert-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, Glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate Rate, isobornyl acrylate,
2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafluoropentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, Allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, Dipentaerythrit Rumonohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, triglycerol diacrylate, trimethylolpropane triacrylate, acrylamide, Aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-
Acrylates such as naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct, diacrylate of bisphenol A-propylene oxide adduct, thiophenol acrylate and benzyl mercaptan acrylate, and hydrogen atoms of these aromatic rings Among them, monomers in which 1 to 5 are substituted with chlorine or bromine atoms, or
Styrene, p-methylstyrene, o-methylstyrene,
m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α-methylstyrene,
Brominated α-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxymethylstyrene,
Vinyl naphthalene, vinyl anthracene, vinyl carbazole, and those obtained by changing some or all of the acrylate in the molecule of the above compound to methacrylate, γ
-Methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone and the like.

In addition, by adding an unsaturated acid such as an unsaturated carboxylic acid, developability after pattern exposure can be imparted. Specific examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid,
Examples thereof include crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

As a monomer to be copolymerized, an unsaturated acid such as an unsaturated carboxylic acid may be copolymerized to improve the developability in forming a pattern. Specific examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid,
Examples thereof include fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

By adding a photoreactive group to the side chain or molecular terminal of the polymer or oligomer described above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are
It has an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acryl group, and a methacryl group.

A method for adding such a side chain to an oligomer or a polymer is to use an ethylenically unsaturated compound having a glycidyl group or an isocyanate group, or an acrylic acid, for a mercapto group, an amino group, a hydroxyl group or a carboxyl group in the polymer. There is a method in which chloride, methacrylic chloride or allyl chloride is added to make an addition reaction.

Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate, and glycidyl ether isocrotonic acid. .

Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate.

The ethylenically unsaturated compound having a glycidyl group or isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is used in an amount of from 0.05 to 0.05 to the mercapto group, amino group, hydroxyl group and carboxyl group in the polymer. It is preferable to add one molar equivalent.

Specific examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, and 4,4-dichlorobenzophenone. , 4-benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-
Diethoxyacetophenone, 2,2-dimethoxy-2-
Phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketanol , Benzylmethoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone, 2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone, 4-azidoben Zalacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene)- - methylcyclohexanone, 2-phenyl-1,2-butadione-2-(o-methoxycarbonyl) oxime, 1-phenyl - propane dione -2
-(O-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, N-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, Photoreducing dyes such as benzothiazole disulfide, triphenylphorphine, camphorquinone, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide and eosin, and methylene blue, and reduction of ascorbic acid, triethanolamine, etc. Such as the combination, and the like.

It is also effective to add an ultraviolet absorber to the paste, since high aspect ratio, high definition and high resolution can be obtained. As an ultraviolet absorber, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinone dyes,
Benzophenone-based, diphenylcyanoacrylate-based,
Triazine-based, p-aminobenzoic acid-based dyes and the like can be used.

Further, the addition of a sensitizer is effective for improving the sensitivity. As the sensitizer, for example, 2,4
-Diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal ) -4-Methylcyclohexanone, Michler's ketone, 4,4-bis (diethylamino) -benzophenone, 4,4-bis (dimethylamino) chalcone,
4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene) -isonaphthothiazole, 1,3-
Bis (4-dimethylaminobenzal) acetone, 1,3
-Carbonyl-bis (4-diethylaminobenzal) acetone, 3,3-carbonyl-bis (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-tolyldiethanolamine, N- Examples include phenylethanolamine, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazole, 1-phenyl-5-ethoxycarbonylthiotetrazole and the like.

The addition of a polymerization inhibitor is effective for improving the thermal stability during storage. Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone, N-nitrosodiphenylamine, phenothiazine, pt-butylcatechol, N-phenylnaphthylamine, 2,6-di-t-butyl-p- Methyl phenol, chloranil, pyrogallol and the like can be mentioned.

After the above components are mixed, the mixture is kneaded with a planetary mixer, a three-roller or the like to prepare the phosphor paste of the present invention.

The screen printing method will be described as an example. As described above, when the partition pitch is 100 to 430 μm, the filling pitch of the phosphor paste when divided into three colors is 300 to 1290 μm, and the partition line width is 50 μm.
Then, the size of the pattern portion filled with the paste is 50 to 380 μm. The phosphor paste extruded between the partition walls from the screen printing plate on which such a pattern is formed is transferred to the side surfaces of the partition walls, then descends on the partition wall side surfaces by the own weight of the paste, and is uniform by the paste's own weight and surface tension. It is considered that the phosphor paste layer is formed on the side surface and the bottom portion of the partition wall. Here, when the filling amount of the phosphor paste is small, the paste concentrates on the bottom portion and the thickness of the side wall of the paste layer becomes thin, so that a loss of luminance and a decrease in luminance at a high viewing angle are caused. Further, when the filling amount is large, it is effective to some extent for securing the luminance, but it may be disadvantageous that the paste adheres to the top of the partition wall.

According to the first aspect of the present invention, the filling amount of the phosphor paste must be in the range of 50 to 120% of the volume of the groove formed by the partition. If the filling amount of the phosphor paste is less than 50%, the thickness near the top becomes thin, and
If the thickness exceeds the above range, problems such as adhesion of the phosphor paste to the top of the partition wall may occur. In order to stably form a phosphor layer having a uniform thickness, the filling amount of the phosphor paste is preferably set to 60% to 110%. The filling amount can be easily calculated from the supply amount of the phosphor paste and the volume of the groove between the used partition walls. Specifically, (supply amount of phosphor paste) × 100 / (volume of groove between partition walls)
In, you can ask.

According to a second aspect of the present invention, in the step of filling the phosphor paste, the filling amount of the phosphor paste is detected by image processing to control the filling amount. According to this method, it is not necessary to set conditions for controlling the filling amount every time the setup is changed, so that elementary mistakes such as setting mistakes can be eliminated, and the yield can be improved.

More specifically, for example, an image pickup device such as a CCD camera is used to capture an image of the state in which the phosphor paste is filled between the partition walls, and the result is stored as an image. A method of controlling the filling amount of the phosphor paste by comparing the image in a state where the image is displayed, and the like can be given.
The filling amount depends on the shape of the groove between the partition walls and the characteristics of the phosphor paste to be used, and thus needs to be controlled. However, it can be controlled mainly by changing the filling condition of the phosphor paste. The filling conditions include, for example, the size of the opening of the screen plate to be used, the angle of the squeegee for pushing the paste, the pushing pressure, the traveling speed, and the clearance between the screen plate and the substrate, in the case of screen printing. The filling amount can be controlled by appropriately adjusting these.

For example, as a method of controlling a filling amount when using a back substrate having different shapes of grooves between the partition walls or a phosphor paste having different characteristics, a plurality of filling conditions such as an indentation pressure are adjusted to adjust the filling amount. There is a method of comparing an image in a state where the body paste is filled with a stored image of a desired filling amount, and selecting a filling condition in which an error is within a certain range.

The present method can also be applied to the case where the actual filling amount is inspected under the set filling conditions.
In addition, when using the method of filling between the partition from the base having the discharge hole, an image detection device is provided in the back of the base in the traveling direction, the filling amount is checked at the same time as the filling, and the feedback is performed. Operations can also be performed.

Further, the method of discharging and filling the phosphor paste between the partition walls from a die having discharge holes can be preferably used as a method of filling the phosphor paste for manufacturing a high-definition back substrate. When the phosphor paste is filled using a screen printing method or the like, there is a problem that the paste wraps around the back surface of the screen plate material, and that each color paste adheres to the top of the partition wall due to a problem of alignment accuracy. This is because the above problem can be solved by using the method.

In order to discharge the phosphor paste from the die, the paste is continuously pressurized at a certain range of pressure using a dispenser or the like, and the paste is discharged at a constant pressure. It is preferable to use a method such as constant-volume ejection in which a predetermined volume of the paste is continuously extruded. Thereby, the discharge amount of the paste can be kept constant, and a stable filling amount can be obtained. The base used at this time is preferably a base having a nozzle at the tip of the discharge hole or a base having a needle, since the base is less likely to be stained.

The inner diameter of the discharge port is determined by the distance 1 between the partition walls to be coated.
The distance between the partition walls is preferably equal to or less than 00 to 400 μm, and is preferably larger than the particle diameter of the phosphor powder.

Further, at the time of filling, the distance between the tip of the discharge portion of the base and the top of the partition wall is maintained in the range of 0.01 to 2 mm, and the fluorescent light is run while moving the base and / or the glass substrate at a constant speed. It is preferable to discharge the body paste at a constant flow rate and fill the space between the partition walls. More preferably 0.0
It is in the range of 3 to 1 mm. By filling at this interval, the phosphor paste can be poured between the partition walls while avoiding contact with the tops of the partition walls.

After the phosphor paste is filled between the partition walls as described above, the phosphor layer can be formed by a drying step such as heating at preferably 40 to 300 ° C.

[0044]

EXAMPLES The present invention will be described below in more detail with reference to Examples, but it should not be construed that the invention is limited thereto. The concentration (%) is% by weight unless otherwise specified. Examples 1 to 6 and Comparative Examples 1 to 6 (1) Preparation of phosphor paste 95 g of inorganic phosphor powder was mixed with a solution of ethyl cellulose in a 16% terpineol / benzyl alcohol (3/1) solution 100.
g was dispersed and mixed to prepare a phosphor paste. The phosphor powder used was (Y, Gd) BO ₃ : E for red emission.
u, ZnSiO ₄ : Mn for green light emission, B for blue light emission
aMgAl ₁₀ O ₁₇ : Eu. The cumulative average particle size and the maximum particle size of each of the phosphor powders were as follows. R phosphor: 2.7 μm, 27 μm B phosphor: 3.7 μm, 27 μm G phosphor: 3.6 μm, 25 μm (2) Formation of phosphor layer The phosphor paste of each color prepared in (1) is placed on a glass substrate. The space was filled between the partition walls having a pitch of 330 μm, a height of 120 μm, and a width of 50 μm. The filling was performed by a die having a discharge hole having a hole diameter of 150 μm. The distance between the discharge hole of the base and the top of the partition was set to 150 μm. Then, the discharge pressure is adjusted to 200 to 700 kPa by a dispenser, and the traveling speed of the die is changed within a range of 20 to 100 mm / s. Under various filling conditions, a predetermined amount of the phosphor paste is fed while the die is advanced at a constant speed. It was discharged and filled between the partition walls. Thereafter, the resultant was dried by heating at 150 ° C. to form a phosphor layer. (3) Evaluation The results of observing the substrate on which the phosphor layer was formed in (2) by using an electron microscope for the thickness of the side wall of the phosphor layer, the thickness of the bottom of the partition, and the presence / absence of the phosphor adhering to the top of the partition are shown in Table 1. It is one. As shown in Table 1, according to the manufacturing method of the present invention, each color phosphor is formed at the same thickness of 20 ± 5 μm on the bottom and side walls of the partition wall, and a plasma display substrate having no phosphor attached to the top of the partition wall is obtained. Was done.

[0045]

[Table 1]

Examples 7 to 12 and Comparative Examples 7 to 1
2 (1) Preparation of phosphor paste 110 g of inorganic phosphor powder was added to a 10% solution of ethyl cellulose in 14% terpineol / benzyl alcohol (3/5).
0 g was dispersed and mixed to prepare a phosphor paste.
Phosphor powders similar to those used in Examples 1 to 6 and Comparative Examples 1 to 6 were used. (2) Formation of Phosphor Layer In Examples 1 to 6 and Comparative Examples 1 to 6, when the phosphor layer was formed, the state in which the phosphor paste was filled under each filling condition was photographed using a CCD camera. , It was stored in the image. Subsequently, each color phosphor paste prepared in the above (1) was filled between the partition walls formed on the glass substrate in the same manner as in Examples 1 to 5 and Comparative Examples 1 to 3.

Filling was performed using the same base and dispenser as in Examples 1 to 6 and Comparative Examples 1 to 6, and the filled state was photographed with a CCD camera, and matched with an image stored in advance by image processing. The filling conditions were selected to perform filling. Thereafter, the resultant was dried by heating at 150 ° C. to form a phosphor layer. (3) Evaluation The results of observing the substrate on which the phosphor layer was formed in (2) by using an electron microscope for the thickness of the side wall of the phosphor layer, the thickness of the bottom of the partition, and the presence / absence of the phosphor adhering to the top of the partition are shown in Table 1. 2. As shown in Table 2, the manufacturing method of the present invention makes it possible to easily control the filling amount by performing image processing, and each color phosphor is formed on the bottom and side surfaces of the partition wall with an equivalent thickness of 20 ± 5 μm. Thus, a plasma display substrate having no phosphor adhered to the top of the partition wall was obtained.

[0048]

[Table 2]

[0049]

According to the method for manufacturing a substrate for a plasma display of the present invention, a substrate for a plasma display having high definition and uniform high luminance can be easily manufactured with a high yield. In addition, in the process of filling the phosphor paste, image processing is performed when setting a filling condition to control a desired filling amount during setup change or when checking an actual filling amount under the set filling condition. As a result, they can be automatically or simply performed, and efficient filling of the phosphor paste can be performed.

Continued on the front page F-term (reference) 5C028 FF12 FF16 5C040 FA01 FA04 GB03 GB14 GG03 GG09 JA13 JA31 MA23

Claims (3)

[Claims] 1. A method for manufacturing a plasma display substrate in which a phosphor layer is formed between partition walls, wherein when a phosphor paste is filled between the partition walls, a filling amount of the phosphor paste is determined by a groove formed by the partition walls. A method for manufacturing a substrate for a plasma display, wherein the volume is in the range of 50 to 120% of the volume of the substrate. 2. A method of manufacturing a plasma display substrate having a phosphor layer formed between partition walls, the method comprising: when filling a phosphor paste between partition walls, detecting a filling amount of the phosphor paste by image processing. And a method for manufacturing a substrate for a plasma display, which comprises controlling a filling amount. 3. The plasma display substrate according to claim 1, wherein the filling of the phosphor paste is performed between the partition walls formed in a stripe shape by using a base having discharge holes. Method.