JP2001352158A - Method for mounting electronic component and mounted body using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve mounting strength by easily forming a part shaped like a fillet in a method for mounting an electronic component using conductive adhesive. SOLUTION: Conductive adhesive 3 is simultaneously applied to an electrode part 2a of an opposite face 1a opposite to a circuit board 9 and an electrode 2b of an edge face 1b of an electronic component 1 by a screen printing method using a screen printing plate 6 whose open part is large, and this electronic component 1 is loaded on the circuit board 9. The conductive adhesive 3 is hardened so that the conductive adhesive 3 shaped like a fillet can be formed at the electrode part 2b of the edge face 1b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for mounting an electronic component, and more particularly, to a method for mounting an electronic component on a circuit board by using a conductive adhesive instead of solder, and a mounting body using the same. It is about.

[0002]

2. Description of the Related Art Recently, awareness of environmental issues has increased,
In the field of electronics mounting, regulations on lead contained in solder are about to be regulated, and there is an urgent need to establish a joining technology that does not use lead for mounting electronic components. Lead-free mounting technology mainly includes lead-free solder and conductive adhesives. However, conductive adhesives, which are expected to have advantages such as flexibility of joints and lower mounting temperatures, are receiving more attention. .

A conventional conductive adhesive is generally one in which a conductive filler is dispersed in a resin-based adhesive component. A connection terminal of an electronic component and a connection terminal of a circuit board are interposed with the adhesive. After the connection, the resin is cured, and the electrical connection of the connection portion is secured by the contact between the conductive fillers in the adhesive. Therefore, since the connection portion is bonded with a resin, it has a merit that it flexibly responds to deformation due to heat or external force, and that the connection portion is less likely to crack as compared with solder in which the connection portion is an alloy. Therefore, it is expected as a substitute material for solder.

[0004]

However, the conventional mounting method of a component using a conductive adhesive has a problem that the mounting strength is lower than that of a conventional mounting method using a solder. The cause will be described below.

FIG. 11 shows a conventional mounting method using solder. First, as shown in FIG. 1A, a solder paste 14 is applied onto the conductor electrodes 8 of the circuit board 9 using a screen printing plate 6 and a squeegee 7, and as shown in FIG. Electronic components 1 on it
Are arranged through a mounting process, and are mounted as shown in FIG. In this reflow process, the solder is melted, and the electronic component 1 and the circuit board 9 are fixed. At this time, the portion of the electrode 2 of the solder-plated electronic component is wet with the solder, and the fillet 15 is formed. Thereby, high mounting strength is obtained.

On the other hand, in the conventional component mounting method using a conductive adhesive as shown in FIG. 12, as shown in FIG. 1A, a screen printing plate 6 and a squeegee 7 are used to mount the circuit board 9. The conductive adhesive 3 is applied on the conductor electrode 8 and, as shown in FIG.
Are arranged through a mounting process, and the conductive adhesive 3 is cured to be mounted as shown in FIG.

In the mounting method using the conductive adhesive,
Since the conductive adhesive 3 is cured in place without melting, a fillet shape cannot be formed as shown in FIG. Since the fillet shape cannot be formed in this way,
The mounting strength is lower than that of solder.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and in a technology for mounting an electronic component using a conductive adhesive, a shape portion similar to a fillet can be easily formed, and mounting strength can be improved. An object of the present invention is to provide a mounting method of an electronic component which can be improved and a mounting body using the same.

[0009]

In order to solve the above-mentioned problems, a method for mounting an electronic component according to the present invention is a mounting method for mounting an electronic component on a circuit board using a conductive adhesive.
A step of applying a conductive adhesive to one of the electrode portion of the electronic component facing the circuit board and the electrode portion of the end face intersecting the facing surface, and applying an adhesive to the other electrode portion. And a step of applying

[0010] According to the present invention, a conductive adhesive is applied to one of the electrode portion on the opposing surface facing the circuit board of the electronic component and the electrode portion on the end surface intersecting the opposing surface. And electrical connection to the other electrode portion, an adhesive is applied to the other electrode portion to form a shape similar to that of the fillet, so that mounting strength can be increased.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION
A mounting method for mounting an electronic component on a circuit board using a conductive adhesive, comprising: one of an electrode portion on an opposing surface of the electronic component facing the circuit board and an electrode portion on an end surface intersecting the opposing surface. A step of applying a conductive adhesive to the electrode part of the electronic component, and a step of applying an adhesive to the other electrode part. A conductive adhesive is applied to one of the electrode parts on the intersecting end surface to achieve electrical connection with the circuit board, and an adhesive is applied to the other electrode part to form a shape similar to a fillet Therefore, mounting strength can be increased.

According to a second aspect of the present invention, in the first aspect of the present invention, the adhesive applied to the other electrode portion is the conductive adhesive applied to one of the electrode portions. In this case, the two steps are performed at the same time, and the same shape as the fillet can be formed at the same time as the electrical connection is made by the conductive adhesive, so that efficient mounting can be performed.

[0013] The invention according to claim 3 is the invention according to claim 1 or 2.
The invention described above includes a step of applying the conductive adhesive to an electrode portion on a back surface of the electronic component opposite to the facing surface, so that higher mounting strength can be obtained.

According to a fourth aspect of the present invention, there is provided a mounting method for mounting an electronic component on a circuit board using a conductive adhesive,
An application step of applying a conductive adhesive by screen printing using a screen printing plate to an electrode portion on an opposing surface of the electronic component facing the circuit board and an electrode portion on an end surface intersecting the opposing surface, wherein the screen The opening portion of the printing plate faces the electrode portion on the printing surface of the electronic component and has a size facing other than the printing surface, and the coating step includes the electrode portion of the printing surface via the screen printing plate. At the same time as applying the conductive adhesive, the conductive adhesive is applied to the electrode portion of the surface that intersects the printing surface through the opening facing the other than the printing surface, and the opposite surface or the end surface One of the surfaces is the printing surface, and the other surface is a surface intersecting the printing surface. A conductive adhesive is simultaneously applied to the electrode portions on the end surfaces to achieve electrical connection, and a shape similar to a fillet can be formed, so that efficient mounting can be performed and mounting strength can be increased. .

According to a fifth aspect of the present invention, there is provided a mounting method for mounting an electronic component on a circuit board using a conductive adhesive,
An application step of applying a conductive adhesive by a dispensing method to an electrode portion of the electronic component on an opposing surface facing the circuit board and an electrode portion of an end surface intersecting the opposing surface, wherein the application step includes a dispenser nozzle. The conductive adhesive is supplied to the dispensing surface of the electronic component, and the conductive adhesive is applied to the electrode portion of the dispensing surface, and at the same time, the conductive adhesive is protruded from the dispensing surface. And applying a conductive adhesive to the electrode portion of the surface that intersects the dispensing surface, and any one of the facing surface or the end surface is the dispensing surface, and the other surface is The surface intersects the dispensing surface, and the electrode portion on the opposing surface and the electrode portion on the end surface of the electronic component are electrically conductive by the dispensing method. With establishing electrical connection by applying the adhesive at the same time, it is possible to perform the formation of the fillet shape similar, with enabling a more efficient implementation, it is possible to increase the mounting strength.

The invention according to claim 6 is a mounting method for mounting an electronic component on a circuit board using a conductive adhesive,
An application step of applying a conductive adhesive to the electrode portion of the electronic component on an opposing surface facing the circuit board and an electrode portion of an end surface intersecting the opposing surface by a pin transfer method, wherein the applying step includes: Using a transfer pin having a shape corresponding to the outer shape of the electrode portion over the surface and the end surface, transferring the conductive adhesive to the electrode portion on the facing surface and the electrode portion on the end surface in the shape described above. Yes, it is possible to simultaneously apply a conductive adhesive to the electrode portion on the opposite surface and the electrode portion on the end surface of the electronic component by the pin transfer method to achieve electrical connection, and to form the same shape as the fillet, In addition to efficient implementation,
The mounting strength can be increased.

According to a seventh aspect of the present invention, there is provided a package comprising an electrode of an electronic component connected to an electrode of a circuit board via a conductive adhesive, wherein the conductive adhesive is formed of the electronic component. Since the component is formed over the electrode portion on the opposing surface facing the circuit board and the electrode portion on the end surface intersecting the opposing surface, a mounted body having high mounting strength can be obtained.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a view showing a mounted body obtained by a mounting method according to Embodiment 1 of the present invention.

The mounting body 10 is provided with the electrodes 2 of the electronic component 1.
Is connected to the electrode 8 of the circuit board 9 via the conductive adhesive 3, and the conductive adhesive 3
Electrode portion 2a of opposing surface 1a opposing circuit board 9 and electrode portions 2b of left and right end surfaces 1b intersecting opposing surface 1a
Are formed over the entire surface. In this embodiment, the electrodes 2b are formed on the entire left and right end surfaces 1b.

In the conventional example shown in FIG. 12C, the conductive adhesive 3 is formed only on the electrode portion on the opposing surface of the electronic component 1 opposing the circuit board 9. In the mounting body 10 of the embodiment, the conductive adhesive 3 is formed over the electrode portions 2b of the left and right end faces 1b.
The conductive adhesive 3 of the electrode portion 2b has the same shape as that of the fillet, thereby improving the mounting strength.

Next, a method for mounting an electronic component according to the first embodiment will be described with reference to FIG.

In the first embodiment, as shown in FIG. 2A, the conductive adhesive 3 is applied by a screen printing method using a screen printing plate 6 to the opposing surface 1a of the electronic component 1.
2b and the electrode portion 2b of the end face 1b at the same time, and after being mounted on the circuit board 9 as shown in FIG. 2 (b), the conductive adhesive is applied as shown in FIG. 2 (c). 3 is mounted by heating and curing.

The screen printing plate 6 is configured as follows so that the conductive adhesive 3 can be simultaneously applied to the electrode portion 2a on the opposing surface 1a of the electronic component 1 and the electrode portion 2b on the end surface 1b. That is, as shown in FIG. 3 showing the positional relationship between the opening of the screen printing plate 6 and the electronic component 1, the rectangular opening 16 is formed by the electrode portion 2 a of the facing surface 1 a which is the printing surface of the electronic component 1. In this example, the area of the opening portion 16 is larger than the area of the electrode portion 2a on the opposing surface 1a.

The screen printing plate 6 and the squeegee 7
As shown in FIG. 2A, the conductive adhesive 3 is applied to the electrode portion 2a of the opposing surface 1a to be the printing surface of the electronic component 1 by a screen printing method (printing pressure 1 kg). The conductive adhesive 3 is simultaneously applied to the electrode portion 2b on the end face 1b of the electronic component 1 from the opening facing the portion 16 other than the printing surface. In this example, the thickness of the metal of the screen printing plate 6 is 0.1 mm, and the opening length L facing other than the printing surface shown in FIG.
μm.

The electronic component 1 on which the conductive adhesive 3 has been applied in this manner is mounted on a circuit board 9 by a mounting machine as shown in FIG. Thereafter, the circuit board 9 on which the electronic components 1 are arranged is placed in a hot-air circulating furnace adjusted to 150 ° C., and is cured by heating for 30 minutes, whereby the electronic component package 10 of FIG. 2C is completed. did.

In the embodiment, as the conductive adhesive 3, for example, silver (80% by weight, 1: 1 spherical and flake) is used as the conductive filler, and epoxy resin is used as the resin and amine is used as the hardening material. The one using a system curing agent was used. As the circuit board 9, for example, a glass epoxy board shown in FIG. 4 having a circuit pattern formed of copper foil was used. In FIG. 4, reference numeral 19 denotes a measuring pad.
Also, the electrodes are formed by solder plating (63Sn) as the electronic component 1.
37Pb) chip resistor (short chip of 3216 size) was used.

The shear strength of the electronic component mounted body 10 obtained by the mounting method of the first embodiment was measured. The average value is shown in Table 1 together with a conventional comparative example in which the number of samples is set to 100 and a conductive adhesive is applied to a circuit board by a screen printing method, together with each embodiment described later. In the conventional example, the same conductive adhesive and circuit board as in Embodiment 1 are used, and the mounting is performed by the method shown in FIG.
A circuit board on which electronic components are arranged is placed in a hot-air circulating furnace adjusted as described above, and cured by heating for 30 minutes to produce a mounted body.

[0028]

[Table 1]

As shown in Table 1, the end face 1b of the electronic component 1
The mounting body 10 of the first embodiment, in which the conductive adhesive 3 having the same shape as the fillet is formed on the electrode portion 2b, has improved mounting strength as compared with the conventional example.

In this embodiment, screen printing is performed using the opposing surface 1a as a printing surface. However, as another embodiment of the present invention, screen printing may be performed using the end surface 1b as a printing surface.

(Embodiment 2) FIG. 5 is a diagram showing a positional relationship between a screen printing plate 6 and an electronic component 1 used in a mounting method according to Embodiment 2 of the present invention. 3 are assigned the same reference numerals.

The mounting method of the second embodiment also uses the same screen printing method as that of the first embodiment, and the electronic component is mounted on the circuit board by the same procedure as that of the first embodiment. It is.

In the first embodiment, as shown in FIG. 3, the screen printing plate 6 has an opening 16
The size of the screen printing plate 6 according to the second embodiment differs from that of the screen printing plate 6 according to the second embodiment, as shown in FIG. Has a U-shaped opening that faces other than the printing surface over the left and right end faces 1b and the front and rear end faces of the electronic component 1. The screen printing plate 6 is used to implement the above-described embodiment. By performing screen printing in the same manner as in the first embodiment, the conductive adhesive 3 is applied to the electrode portion 2a on the opposing surface 1a of the electronic component 1, and the conductive adhesive 3 is transferred from the opening portion facing other than the printed surface. The coating is applied not only to the left and right sides of the component 1 but also to the electrode portions 2b of the front and rear end surfaces 1b.

Thus, the front and rear end surfaces 1 of the electronic component 1
The conductive adhesive 3 similar to the fillet shape is also formed on the electrode portion 2b of b, and the mounting strength is further improved.

In this example, the opening length L facing the area other than the printing surface in FIG. 5B is 50 μm, and the opening width W is 30 μm.
And

The shear strength of the package obtained by the mounting method of the second embodiment was measured. The number of samples was set to 100, and the results are shown in Table 1.

As shown in Table 1, the mounting strength is improved as compared with the conventional example.

(Embodiment 3) FIG. 6 is a view showing a method of mounting an electronic component according to Embodiment 3 of the present invention, and portions corresponding to those of Embodiment 1 described above have the same reference numerals. Is attached.

In the third embodiment, as shown in FIG. 6A, a conductive adhesive 3 is dispensed by a dispensing method using a dispenser 11 so that an electrode portion 2a and an end surface 1b of the opposing surface 1a of the electronic component 1 are formed. 6 (b), and mounted on the circuit board 9 as shown in FIG. 6 (b), and then the conductive adhesive 3 as shown in FIG. 6 (c).
Is cured by heating.

In this embodiment, the dispenser 11
Dispenser to which the conductive adhesive 3 is supplied with the nozzle of the dispenser 11 facing so that the conductive adhesive 3 can be simultaneously applied to the electrode portion 2a on the opposing surface 1a and the electrode portion 2b on the end surface 1b of the electronic component 1. Opposing surface 1 which is a surface
a, the conductive adhesive 3 is applied to the electrode portion 2a, and the conductive adhesive 3 is protruded from the facing surface 1a.
To apply the conductive adhesive 3 to the electrode portion 2b on the end face 1b. In this example, the dispenser 11
Is larger than the area of the electrode portion 2a on the facing surface 1a.

The electronic component 1 coated with the conductive adhesive 3 was mounted on a circuit board 9 by a mounting machine as shown in FIG. 6B. Thereafter, the circuit board 9 on which the electronic components 1 are arranged is placed in a hot-air circulating furnace adjusted to 150 ° C., and is cured by heating for 30 minutes to complete the electronic component package 10 shown in FIG. completed.

In the mounting body 10, the conductive adhesive 3 is formed from the electrode portion 2a on the facing surface 1a to the electrode portion 2b on the end surface 1b, and the conductive adhesive 3 on the electrode portion 2b on the end surface 1b is It has the same shape as the fillet, which can improve the mounting strength. Other configurations are the same as those in the first embodiment.

The shear strength of the electronic component package 10 obtained by the mounting method of the third embodiment was measured. The number of samples was set to 100, and the results are shown in Table 1.

As shown in Table 1, the mounting strength is improved as compared with the conventional example.

(Embodiment 4) FIG. 7 is a diagram showing a mounting method of an electronic component according to Embodiment 4 of the present invention, and portions corresponding to the above-described Embodiment 3 have the same reference numerals. Is attached.

As in the third embodiment, the conductive adhesive is applied to the electrode portion 2a on the facing surface 1a and the electrode portion 2b on the end surface 1b by the dispenser 11, as shown in FIG. The electrode part 2c of the back surface 1c and the electrode part 2 of the end surface 1b, which are surfaces opposite to the opposing surface 1a, are displaced by the dispenser 11 with the electronic component 1 reversed.
7B, a conductive adhesive was applied as shown in FIG. 7B, and then, as shown in FIG. 7C, the electronic component 1 was mounted on the circuit board 9 by a mounting machine. After this, 150 ° C
The circuit board 9 on which the electronic components 1 are arranged is placed in a hot air circulating furnace adjusted as described above, and cured by heating for 30 minutes to obtain the electronic component package 10 shown in FIG. 7D.

As described above, the conductive adhesive 3 is applied to the electronic component 1.
Is applied to the electrode portion 2c on the back surface of the substrate, so that the mounting strength is further enhanced. Other configurations are the same as those in the third embodiment.

As described above, the shear strength of the electronic component mounted body 10 obtained by the mounting method of the fourth embodiment was measured. The number of samples was set to 100, and the results are shown in Table 1.

As shown in Table 1, the mounting strength is improved as compared with the conventional example.

In the above embodiment, the facing surface 1a
Although the conductive adhesive 3 is applied to the electrode portion 2a side of the back surface 1c after the conductive adhesive 3 is applied to the electrode portion 2a side, it is needless to say that the order may be reversed.

(Embodiment 5) FIG. 8 is a diagram showing a method of mounting an electronic component according to Embodiment 5 of the present invention, wherein parts corresponding to those in Embodiment 1 described above have the same reference characters. Is attached.

In the fifth embodiment, FIGS. 8 (a) to 8 (c)
As shown in FIG. 8, the conductive adhesive 3 is simultaneously applied to the electrode portion 2a of the opposing surface 1a and the electrode portion 2b of the end surface 1b of the electronic component 1 by a pin transfer method using the transfer pins 12, and FIG. After being mounted on the circuit board 9 as shown in FIG. 8D, the conductive adhesive 3 as shown in FIG.
Is cured by heating.

The transfer pins 12 are, for example, as shown in FIGS.
As shown in (c), the electronic component 1 has a substantially right-angled corner corresponding to the outer shape of the electrode portions 2a and 2b of the facing surface 1a and the end surface 1b. 8 (a) and 8 (b), the conductive adhesive 3 is disposed to form the electrode portions 2a, 2 on the facing surface 1a and the end surface 1b.
The transfer is performed in a shape corresponding to b. In FIG. 8, the transfer pins 12 shown in FIG. 9B are used.

The electronic component 1 coated with the conductive adhesive 3 was mounted on a circuit board 9 by a mounting machine as shown in FIG. 8D. Thereafter, the circuit board 9 on which the electronic components 1 are arranged is installed in a hot-air circulating furnace adjusted to 150 ° C.
When cured by heating for 30 minutes, the electronic component package shown in FIG. 8E was completed.

The shear strength of the electronic component mounted body 10 obtained by the mounting method of the fifth embodiment was measured.
The number of samples was set to 100, and the results are shown in Table 1.

As shown in Table 1, the mounting strength is improved as compared with the conventional example.

(Other Embodiments) There are various shapes for applying the conductive adhesive, for example, the same improvement in the mounting strength can be obtained by the application shape as shown in FIG. . In FIG. 10, FIG.
Fig. 2 shows the electrode portion 2b on the side end surface 1b of the electronic component 1, where 2a indicates an electrode portion on the facing surface 1a and 2c indicates an electrode portion on the back surface 1c. The conductive adhesive 3 may be formed so as to extend over the electrode portion 2a of the facing surface 1a and the electrode portion 2b of the lateral end surface 1b, as shown in FIGS. As shown in FIG. 5D, the electrode may be formed so as to extend over the electrode portions on the front and rear end faces.
As shown in FIG. 7E, the electrode may be formed so as to extend over the electrode portion 2c of the back surface 1c opposite to the facing surface 1a, and as shown in FIG. It may be formed so as to extend over the portion and the electrode portion 2c on the back surface, or may be formed so as to extend around the periphery except for the electrode portions 2b on the left and right end surfaces as shown in FIG.

In each of the above-described embodiments, the electrode portion 2a on the facing surface 1a of the electronic component 1 and the electrode portion 2b on the end surface 1b are provided.
Although the conductive adhesive 3 was simultaneously applied to the electrode portions 2a, as another embodiment of the present invention, one of the surfaces, for example, the electrode portion 2a of the opposing surface 1a was electrically connected by applying the conductive adhesive 3 On the other hand, the electrode portion on the other surface may be coated with an adhesive having no conductivity to form a shape similar to that of the fillet to increase the mounting strength. In this case, for example, What is necessary is just to perform application twice using a dispenser.

Further, in the above embodiment, the present invention is applied to a chip resistor as an electronic component, but it is needless to say that the present invention can be applied to a lead component, a bare IC chip and other electronic components.

[0060]

As described above, according to the present invention, a shape similar to a fillet can be easily formed by using a conductive adhesive, and a mounted body having high mounting strength can be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing a mounted body of an electronic component obtained by a mounting method according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for mounting an electronic component according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a positional relationship between an opening portion of the screen printing plate and an electronic component according to the first embodiment.

FIG. 4 is a view showing a pattern of the circuit board according to the first embodiment;

FIG. 5 is a diagram illustrating a positional relationship between an opening portion of a screen printing plate and an electronic component according to a second embodiment of the present invention.

FIG. 6 is a diagram illustrating a method for mounting an electronic component according to a third embodiment of the present invention.

FIG. 7 is a diagram illustrating a method for mounting an electronic component according to a fourth embodiment of the present invention.

FIG. 8 is a diagram illustrating a method for mounting an electronic component according to a fifth embodiment of the present invention.

FIG. 9 is a diagram illustrating a shape of a transfer pin according to a fifth embodiment.

FIG. 10 is a view showing an application shape of a conductive adhesive of the present invention.

FIG. 11 is a view showing a conventional method for mounting an electronic component using solder.

FIG. 12 is a diagram illustrating a conventional method for mounting an electronic component using a conductive adhesive.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Opposite surface 1b End surface 1c Back surface 2 Electrode of electronic component 3 Conductive adhesive 6 Screen printing plate 7 Squeegee 8 Circuit board electrode 9 Circuit board 10 Mounting body 11 Dispenser 12 Transfer pin 16 Screen printing opening

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takashi Kitae 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Hiroki Takezawa 1006 Kadoma Kadoma, Kadoma City, Osaka Pref. Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E319 AA03 AA07 AB06 BB11 CD27 CD29

Claims (7)

[Claims] 1. A mounting method for mounting an electronic component on a circuit board using a conductive adhesive, comprising: an electrode portion of the electronic component on a facing surface facing the circuit board or an electrode on an end surface intersecting the facing surface. A method for mounting an electronic component, comprising: a step of applying a conductive adhesive to one of the electrode portions; and a step of applying an adhesive to the other electrode portion. 2. The method according to claim 1, wherein the adhesive applied to the other electrode portion is the conductive adhesive applied to one of the electrode portions, and both of the steps are performed simultaneously. Electronic component mounting method. 3. The electronic component mounting method according to claim 1, further comprising a step of applying the conductive adhesive to an electrode portion on a back surface of the electronic component opposite to the opposing surface. 4. A mounting method for mounting an electronic component on a circuit board using a conductive adhesive, comprising: an electrode portion on the opposite surface of the electronic component facing the circuit board; and an electrode on an end surface intersecting the opposite surface. Part, including an application step of applying a conductive adhesive by screen printing using a screen printing plate, the opening portion of the screen printing plate faces the electrode portion on the printing surface of the electronic component, and other than the printing surface The application step is to apply a conductive adhesive to the electrode portion of the printing surface through the screen printing plate, and at the same time, the printing surface through the opening portion facing other than the printing surface To apply a conductive adhesive to the electrode portion of the surface that intersects,
A method of mounting an electronic component, wherein one of the facing surface and the end surface is the printing surface, and the other surface is a surface intersecting the printing surface. 5. A mounting method for mounting an electronic component on a circuit board using a conductive adhesive, comprising: an electrode portion on the opposite surface of the electronic component facing the circuit board; and an electrode on an end surface intersecting the opposite surface. The part includes an application step of applying a conductive adhesive by a dispensing method, the applying step supplies a conductive adhesive to a dispensing surface of the electronic component facing a nozzle of a dispenser, and supplies the conductive adhesive to an electrode portion of the dispensing surface. At the same time as applying the conductive adhesive, the conductive adhesive is supplied so that the conductive adhesive protrudes from the dispense surface, and the conductive adhesive is applied to the electrode portion on the surface intersecting the dispense surface. And setting one of the facing surface and the end surface as the dispense surface and the other surface as a surface intersecting the dispense surface. Mounting method of electronic components and butterflies. 6. A mounting method for mounting an electronic component on a circuit board using a conductive adhesive, comprising: an electrode portion on the opposite surface of the electronic component facing the circuit board; and an electrode on an end surface intersecting the opposite surface. The portion includes a coating step of applying a conductive adhesive by a pin transfer method, the coating step, using a transfer pin having a shape corresponding to the outer shape of the electrode portion over the facing surface and the end surface, The method of mounting an electronic component, wherein the conductive adhesive is transferred in the shape to the electrode portion on the facing surface and the electrode portion on the end surface. 7. A mounting body formed by connecting electrodes of an electronic component to electrodes of a circuit board via a conductive adhesive, wherein the conductive adhesive faces the electronic component to the circuit board. A mounting body formed over an electrode portion on a surface and an electrode portion on an end surface intersecting the opposing surface.