JP2001351955A - Jig for measuring current or voltage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig for measuring a current or a voltage, without having to break an electronic component or the like on a substrate to be measured, requiring no working man-hours, when measuring the voltage or the current of an object (e.g. a semiconductor wafer) via a measuring substrate. SOLUTION: At a current measuring time, an input side insertion pin 31a is inserted and connected to an input side pin receiver 13, and an output side insertion pin 32a is inserted and connected to the output side pin receiver 14. In this state, a vertical plate 18 is pressed down by the output side insertion pin, and a receiving contact 15 and a pressure contact 16a become turned off. Accordingly, since the current passes an ammeter 121 as shown by a path K2, a current measurement can be conducted. A voltage measurement can be conducted, by inserting and connecting only the input side insertion pin and connecting the output side insertion pin to a ground line 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for measuring current and voltage, and particularly when measuring output current and output voltage via a measuring substrate used for inspection of a semiconductor wafer without requiring any man-hour. The present invention relates to a current / voltage measuring jig capable of measuring without destroying electronic components and the like on a measurement substrate.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a semiconductor wafer, a measurement test for determining whether the semiconductor wafer satisfies required specifications is performed through a measurement substrate 100 shown in FIG. The measurement substrate 100 has a hole 102 formed in the center of a substrate body 101 made of glass epoxy resin or the like.
Along the periphery of 02, a large number (for example, 120) of pin probes 103 that perform signal detection by contacting a semiconductor wafer (not shown) are provided upright. A large number of copper foil patterns 105 are formed from the pin probe 103 toward the male connectors 104 (104a, 104b). Code 10
Reference numerals 6a to 106d denote component areas, which indicate areas where electronic components such as ICs, resistors, capacitors, and variable resistors necessary for realizing the specifications of the measurement test are arranged.

When a measurement test is performed, as shown in FIG. 6, a semiconductor wafer 110 disposed below a measurement substrate 100 is moved in an upward direction of an arrow, and a predetermined portion of the semiconductor wafer 110 is moved to a pin probe 103. , And contact the equipment or measuring equipment (hereinafter referred to as measuring equipment) 12
A predetermined measurement test is performed according to 0. After the measurement test, the semiconductor wafer 110 is moved in the downward direction of the arrow, the next semiconductor wafer is set, and the next measurement test is performed.

The measurement tests include “voltage measurement” and “current measurement”. In the case of voltage measurement, a ground line (not shown) and the copper foil pattern 105 of the measurement substrate 100 are used.
Alternatively, the voltage between the terminals of the male connector 104 may be measured, so that the measurement can be easily performed.

[0005]

In the case of the above "current measurement", as shown in FIG. 7A, the copper foil pattern 105 of the measurement substrate 100 is cut, and the ammeter 1 is placed at the cut position.
21 was set to measure the current of the measurement target path.
Actually, instead of cutting (cutting) the copper foil pattern 105, as shown in FIG. 7B, soldering can be performed between opposing ends (lands) 105a and 105b of the copper foil pattern. The current is measured without soldering, and after the current measurement is completed, the lands 105a, 105
b was soldered 106 to return the measurement substrate 100 to its original state.

However, in such a measuring method,
Soldering and removing the solder require a lot of man-hours, and in the case of soldering or the like, there is a possibility that the electronic components or the like of the measurement board 100 may be erroneously destroyed.

Therefore, an object of the present invention is to measure the voltage and current of an object to be measured via a measurement substrate without requiring a man-hour and a current / current without destroying electronic components and the like on the measurement substrate. It is to provide a voltage measuring jig.

[0008]

According to the present invention, there is provided a current / voltage measuring jig which can be connected to a first connection receiving portion and connected to one terminal of a current / voltage measuring meter. A possible first pin terminal, a second pin terminal which can be inserted and connected to the second connection receiving part and which can be connected to the other terminal of the current / voltage measuring instrument, and one end of which is to be measured And one end side is connected to the first connection receiving portion, and the other end is ON / O.
A first electric path having a first contact that can be flipped, and a vertical moving plate that is moved up and down by inserting the second pin terminal;
A second contact path provided on one end side for turning on / off with respect to the first contact point and having a sliding contact on the other end side; A third electric circuit having a contact, being connected to the second connection receiving portion, and being further connectable to the outside, is provided.

In this current / voltage measuring jig, it is preferable that a plurality of the first, second, and third electric paths are formed in accordance with the number of connection terminals of the object to be measured. In addition, this current
As a preferred specific example of the voltage measuring jig, a jig for measuring a semiconductor wafer inspection substrate as the measurement object is used.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. FIG. 1A is a conceptual plan view when the current / voltage measurement jig DJ of this embodiment is used for current / voltage measurement, and FIG. 1B is a current / voltage measurement jig DJ.
FIG. FIG. 2 is a diagram illustrating a state where two insertion pins are not inserted in the jig. FIG. 3 is a diagram illustrating a state in which two insertion pins are inserted in the jig. FIG. 4 is a view illustrating one insertion pin inserted in the jig and the other insertion pin is connected to GND. FIG. 7 is a diagram for explaining a state in which the operation is performed.

The current / voltage measuring jig DJ has the following components (1) to (5). That is, (1) the input side pin receiver 1 as the first connection receiver
3 and an input side insertion pin 31a as a first pin terminal connectable to one terminal of each of the ammeter 121 and the voltmeter 42, and (2) an output side as a second connection receiving portion. An output-side insertion pin 32a as a second pin terminal that can be inserted and connected to the pin receiver 14 and can be connected to the other terminals of the ammeter 121 and the voltmeter 42, respectively.
And (3) one end portion of the measurement substrate 1 as a measurement object
00 is connected to the male connector 104 (connection terminal), the one end is connected to the input pin receiver 13, and the other end is a receiving contact 15a as a first contact that can be turned on and off. A first electric circuit 15 having: (4)
A pressing contact 16a as a second contact which is provided on an upper and lower plate 18 (a vertical moving plate) which is moved up and down by the insertion of the output side insertion pin 32a and which is turned ON / OFF with respect to the receiving contact 15a at one end. And a second electrical path 16 having a sliding contact 16b on the other end, and (5) a sliding receiving contact 17a slidable by the sliding contact 16b and connected to the output pin receiver 14. And a third electric circuit 17 that can be connected to the outside (measurement equipment).

According to the current / voltage measuring jig DJ,
At the time of current measurement, as shown in FIG.
1a is inserted and connected to the input side pin receiver 13, and the output side insertion pin 32a is inserted and connected to the output side pin receiver 14. In this state, the upper and lower plates 18 are pressed down by the output side insertion pins 32a, and the receiving contact 15a and the pressing contact 16a are turned off. Therefore, the current path is as shown by the symbol K2,
The current passes through an ammeter 121 to a measurement facility (not shown). Therefore, current measurement can be performed without cutting the copper foil pattern of the measurement substrate 100.

At the time of voltage measurement, for example, as shown in FIG. 4, only the input side insertion pin 31a is inserted and connected, and the output side insertion pin 32a is connected to the ground line 21. Therefore, the current path is as shown by the symbol K3, and the voltage can be measured.

In the jig DJ, as shown in FIG. 1, a plurality (eight) of male connectors 10
4, the first portion is attached to the main body 10 of the measurement substrate 100.
A plurality (eight) of the third to third electric paths 15, 16 and 17 are respectively formed. In this way, once the jig DJ is inserted and connected to the measurement board 100, eight paths of current and voltage can be measured, and the number of the paths that do not need to be cut is eight, so that the number of work steps can be greatly reduced.

In the measurement of a semiconductor wafer, an extremely large number of pin probes are arranged (see the section of the prior art). Therefore, when the object to be measured is a measurement substrate for semiconductor wafer inspection, the wafer inspection is performed. Can significantly reduce the number of work steps.

Hereinafter, the configuration and operation of the jig DJ will be described in more detail. As shown in FIGS. 1A and 1B, the male connector 104 of the measuring board 100 (see FIG. 5) is inserted into the female connector 11 of the current / voltage measuring jig DJ. Is relayed to the measurement equipment (equipment or measurement equipment) 120 (see FIG. 6).

The current / voltage measuring jig DJ includes a main body 10.
And an insertion pin portion 30. The main body 10 has a substantially rectangular parallelepiped shape, and the measurement substrate 1 is provided on one side (input side) of the main body 10.
A female connector 11 into which the male connector 104 is inserted is provided, and a male connector 12 to be inserted into the measuring equipment 120 is provided on the other side (output side).

The main body 10 is made of an insulator such as a synthetic resin, and has eight cylindrical input-side pin receivers 13 arranged in a line on the input side.
The output side has eight cylindrical output side pin receivers 14 in a line. Input side, output side pin receivers 13, 14
Are inserted into the inserted pins 31a,
The leaf springs 1a and 1a are securely contacted with each other.
3a and 14a are arranged.

Eight sets of laterally opposed input side pin receivers 13 and output side pin receivers 14 (for example, one indicated by reference numeral 13b and one indicated by reference numeral 14b) are each made up of a first crank-shaped copper wire or the like. A current path (first electric path) 15, a short straight second electric path 16, and an L-shaped third electric path 17 are arranged to be conductive (ON / OFF).

That is, the left end of the first electric circuit 15 is
1 and a receiving contact 15 receiving a pressing contact at the right end.
a, and a second electrical path 16 corresponding to the receiving contact 15a.
A pressing contact 16a is formed at the left end of the. A sliding contact 16b is formed at the right end of the second electric path 16, and a sliding receiving contact 17a that is in sliding contact with the lower end of the third electric path 17 corresponding to the sliding contact 16b is formed. The right end of the third circuit 17 is the male connector 1
2 corresponding terminal (for example, the one indicated by reference numeral 12a). The first circuit 15 and the input pin receiver 13 are connected, and the third circuit 17 and the output pin receiver 14 are connected.

With this configuration, each electric circuit 1
When the contact portions 5, 16, and 17 are in contact with each other, the corresponding input-side pin receiver 13 and output-side pin receiver 14
(For example, indicated by reference numerals 13b and 14b).

The second electric path 16 is fixedly arranged on the upper surface of an upper and lower plate 18 made of an insulator supported by a coil spring 19 so as to be vertically movable. Reference numeral 21 denotes a GND (ground line) serving as a reference when measuring a voltage,
(Not shown).

The insertion pin portion 30 is provided with the input side pin receiver 1.
An input-side insertion pin 31 and an output-side insertion pin 32 for insertion into the output pin 3 and the output-side pin receiver 14, respectively. Since the input side insertion pin section 31 and the output side insertion pin section 32 have the same configuration, the input side insertion pin section 31 will be described below.
Only the configuration of the output side insertion pin 32 will be omitted.

The input side insertion pin portion 31 includes a thin columnar insertion pin 31a made of brass or the like to be inserted into the input side pin receiver 13, and a coil spring 31b externally fitted to the insertion pin.
And a conducting wire 3 for connecting to the ammeter 121 (see FIG. 3).
1c. The input side insertion pin portion 31 and the output side insertion pin portion 32 are movably supported by vertical movement means (not shown).

Next, the operation (operation) of this embodiment will be described. 2 when the insertion pin is not inserted The state shown in FIG. 2 is a state in which both the input-side insertion pin portion 31 and the output-side insertion pin portion 32 are not inserted into the pin receivers 13 and 14. That is, the current of the measurement substrate 100 is
This is the case where it is supplied to 0 as it is. In this state, FIG.
As shown in (1), both of the two insertion pins 31a and 32a are not inserted into the input side pin receiver 13 and the output side pin receiver 14. Therefore, the receiving contact 15a of the first electric circuit 15 and the pressing contact 16a of the second electric circuit 16 are ON, and the sliding contact 16b of the second electric circuit 16 and the sliding receiving contact 17a of the third electric circuit 17 are ON. (See FIG. 1B). Therefore, a current flows through the path K1, so that the measurement substrate 10
The current of 0 is supplied directly to the measurement equipment 120 (not shown).

At the time of current measurement FIG. 3 shows a case where the current flowing through the measurement substrate 100 is measured by the ammeter 121. That is, the input-side insertion pin 31a is inserted into the input-side pin receiver 13, and the output-side insertion pin 32a is inserted into the output-side pin receiver 14. In this state, the input side insertion pin 31a and the input side pin receiver 13
The contact state with the leaf spring 13a is secured, and the distal end of the output side insertion pin 32a pushes down the second electric circuit 16, so that the receiving contact 15a of the first line 15 and the second electric circuit 16
Is turned off. For this reason, the current from the measurement board 100 follows the path K2 and flows through the ammeter 121 to the measurement equipment 120 (not shown).

At the time of voltage measurement The state of FIG. 4 is a case where the voltage of the measurement substrate 100 is measured by the voltmeter 42. That is, the input side insertion pin 31a
Is inserted into the input side pin receiver 13, and the output side insertion pin 32 a is connected to the GND 21. In this state, a contact state is secured by the input side insertion pin 31a and the leaf spring 13a, and the receiving contact 15a of the first line 15 and the second electric circuit 1
No. 6 pressing contact 16a is ON. Therefore, the current from the measurement substrate 100 passes through the path K3 and
0 (not shown). In this state, the input side conductor 31
When c and the output-side conductor 32c are connected to a predetermined terminal of the voltmeter 42, the voltage of the path K3 can be measured.

In this embodiment, the measurement of the current and the voltage has been described for a single path. However, for example, as shown in FIG. 1, the current and the voltage of a plurality of circuits (eight circuits in FIG. 1) are measured.
It is possible to measure the voltage.

[0029]

As described above, according to the present invention, unlike the prior art, the current can be easily measured without cutting the circuit pattern of the measuring board, soldering or removing. Can be. Also, the risk of destruction of electronic components and the like on the measurement substrate is reduced.

Further, by forming a plurality of the first, second, and third electric paths in accordance with the number of connection terminals of the object to be measured, the number of operation steps for current / voltage measurement can be greatly reduced. Furthermore, in the measurement of the output current and the output voltage of the semiconductor wafer, since an extremely large number of pin probes are arranged, by using a measurement substrate for semiconductor wafer inspection as the object to be measured, the number of man-hours for the wafer inspection is significantly reduced. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention,
(A) is a conceptual plan view showing a connection relationship between a measurement substrate and a current / voltage measurement jig, and (B) is a side sectional view of a current / voltage measurement jig.

FIG. 2 is a diagram illustrating a state in which two insertion pins are not inserted in the current / voltage measurement jig.

FIG. 3 is a diagram illustrating a state in which two insertion pins are inserted (at the time of current measurement) in the current / voltage measurement jig.

FIG. 4 is a diagram illustrating a state in which one insertion pin is inserted and the other insertion pin is connected to GND (during voltage measurement) in the current / voltage measurement jig.

FIG. 5 is a plan view of a measurement substrate.

FIG. 6 is a side view showing a positional relationship between a measurement substrate and a semiconductor wafer during current / voltage measurement.

FIG. 7 is a diagram for explaining inconvenience of the related art,
(A) is a diagram for measuring the current by cutting the pattern of the measurement substrate, and (B) is a diagram for explaining the presence or absence of soldering as a cutting means by providing a land on the pattern.

[Explanation of symbols]

DJ: current / voltage measuring jig, 10: main body, 11: female connector, 12: male connector, 12a: corresponding terminal, 13:
Input side pin receiver, 13a: leaf spring, 13b: input side pin receiver, 14: output side pin receiver, 14a: leaf spring, 14b
... Output pin receiver, 15 ... First electric path, 15a ... Receiving contact of the first electric path, 16 ... Second electric path, 16a ... Pressing contact of the second electric path, 16b ... Sliding contact of the second electric path, 17 ... Third Electric circuit,
17a: slide receiving contact of the third electric circuit, 18: upper and lower plates, 19
... Coil spring, 21 ... GND, 30 ... Insertion pin part, 31
... input side insertion pin part, 31a ... insertion pin, 31b ... coil spring, 31c ... lead wire, 32 ... output side insertion pin part, 32
a ... insertion pin, 32b ... coil spring, 32c ... lead wire, 4
2: voltmeter, 51a: corresponding terminal, 100: measuring board, 1
01: substrate body, 102: hole, 103: pin probe,
104, 104a, 104b: male connector, 105: pattern, 105a, 105b: land, 106: soldering, 106a to 106d: component area, 110: semiconductor wafer, 120: measuring equipment, 121: ammeter.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01R 29/00 H01R 29/00 C

Claims (3)

[Claims] 1. A first pin terminal connectable to a first connection receiving portion and connectable to one terminal of a current / voltage measuring instrument; and a first pin terminal capable of being inserted and connected to a second connection receiving portion. A second pin terminal connectable to another terminal of the current / voltage measurement meter; one end connected to the connection terminal of the object to be measured and the one end connected to the first connection receiving portion; And
The other end is provided on a first electric path having a first contact that can be turned on and off, and on a vertically moving plate that is moved up and down by insertion of the second pin terminal. ON for contacts
A second electric circuit having a second contact to be turned off and having a sliding contact on the other end side, a sliding contact sliding on the sliding contact, and being connected to the second connection receiving part; A current / voltage measurement jig further comprising a third electric circuit that can be connected to the outside. 2. The current / voltage measuring jig according to claim 1, wherein a plurality of said first, second, and third electric paths are formed in accordance with the number of connection terminals of said object to be measured. 3. The current / voltage measuring jig according to claim 1, wherein the measuring object is a measuring substrate for inspecting a semiconductor wafer.