JP2001347525A - Mold for molding resin - Google Patents

Mold for molding resin

Info

Publication number
JP2001347525A
JP2001347525A JP2000171325A JP2000171325A JP2001347525A JP 2001347525 A JP2001347525 A JP 2001347525A JP 2000171325 A JP2000171325 A JP 2000171325A JP 2000171325 A JP2000171325 A JP 2000171325A JP 2001347525 A JP2001347525 A JP 2001347525A
Authority
JP
Japan
Prior art keywords
mold
medium
recess
heat medium
concave portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000171325A
Other languages
Japanese (ja)
Other versions
JP4266272B2 (en
Inventor
Mikihiko Kimura
実基彦 木村
Fumito Ueha
文人 上羽
Masateru Tsuji
正照 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP2000171325A priority Critical patent/JP4266272B2/en
Publication of JP2001347525A publication Critical patent/JP2001347525A/en
Application granted granted Critical
Publication of JP4266272B2 publication Critical patent/JP4266272B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To shorten a heating and cooling cycle of a mold and to reduce a molding cost by distributing a heating medium to a part near a cavity of the mold and positively distributing the medium to a bottom of a recess. SOLUTION: Narrow grooves 51 for distributing the heating medium are formed on a bottom 33h of the recess 33, and metal particles 53 having a particle size larger than the width of the groove 51 are disposed on a part contacted with the grooves 51. Thus, the medium is distributed to a part near the cavity 50 and a gap for distributing the medium is assured to positively distribute the medium to the bottom 33h of the recess 33.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は樹脂成形金型の改良
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a resin molding die.

【0002】[0002]

【従来の技術】樹脂成形金型として、例えば特開平7
−285169号公報「樹脂成形用金型」や実開平6
−9744号公報「金型」が知られている。上記は、
同公報の図1によれば、金型本体14(符号は公報に記
載の符号を流用)を加熱又は冷却のために多孔質焼結金
属で形成し、金型本体14のキャビティに金属、合成樹
脂又はセラッミクなどの表面被膜12を形成し、金型本
体14をバックプレート16Rで覆い、このバックプレ
ート16Rに温調流体供給管22R及び温調流体排出管
24Rを接続したものである。上記は、同公報の図1
によれば、金型1のキャビティ2表面近傍に冷却のため
に多孔質材の部分域3を形成し、この部分域3にメッキ
等の表層7を形成し、この表層7の反対から部分域3に
給水路4及び排水路5を接続したものである。
2. Description of the Related Art As resin molding dies, for example,
-285169, "Mold for resin molding"
Japanese Patent Application Laid-Open No. -9744 discloses a "mold". The above is
According to FIG. 1 of the publication, a mold body 14 (the reference numerals used in the publication are diverted) is formed of a porous sintered metal for heating or cooling, and a metal or composite is formed in a cavity of the mold body 14. A surface coating 12 such as resin or ceramic is formed, a mold body 14 is covered with a back plate 16R, and a temperature control fluid supply pipe 22R and a temperature control fluid discharge pipe 24R are connected to the back plate 16R. The above is shown in FIG.
According to the method, a partial region 3 of a porous material is formed near the surface of the cavity 2 of the mold 1 for cooling, and a surface layer 7 such as plating is formed in the partial region 3. 3, a water supply channel 4 and a drain channel 5 are connected.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記の樹脂
成形用金型では、温調流体供給管22Rから多孔質焼結
金属で形成した金型本体14に加熱媒体又は冷却媒体を
流すときに、金型本体14には特に加熱媒体又は冷却媒
体を温調流体供給管22Rから温調流体排出管24Rに
流すだけのものなので、加熱媒体又は冷却媒体を金型本
体14の表層に流すことが困難である。この結果、金型
本体14に温度むらが発生することがある。上記の金
型では、多孔質材の部分域3に表層7をメッキで形成し
たので、部分域3に流す冷却水が直接、表層7に触れる
ことができず、冷却効率の悪化を招くことがある。
However, in the above-described resin molding die, when a heating medium or a cooling medium flows from the temperature control fluid supply pipe 22R to the die body 14 formed of porous sintered metal. Since only the heating medium or the cooling medium flows from the temperature control fluid supply pipe 22R to the temperature control fluid discharge pipe 24R in the mold body 14, it is difficult to flow the heating medium or the cooling medium to the surface layer of the mold body 14. It is. As a result, uneven temperature may occur in the mold body 14. In the above-mentioned mold, since the surface layer 7 is formed by plating on the partial area 3 of the porous material, the cooling water flowing through the partial area 3 cannot directly touch the surface layer 7, and the cooling efficiency may be deteriorated. is there.

【0004】そこで、本発明の目的は、キャビティに近
い部分に熱媒体を積極的に流通させることができ、金型
の加熱・冷却サイクルの短縮を図ることができる樹脂成
形金型を提供することにある。
Accordingly, an object of the present invention is to provide a resin molding die capable of positively flowing a heat medium to a portion near a cavity and shortening a heating / cooling cycle of the die. It is in.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に請求項1は、凹部の底がキャビティに近づくように凹
部を金型本体に開け、この金型本体の凹部に焼結金属層
を形成し、凹部を蓋部材で塞ぎ、焼結金属層に冷却用媒
体又は加熱用媒体としての熱媒体を流通させることで、
金型本体を強制冷却又は強制加熱することのできる樹脂
成形金型であって、凹部の底に、熱媒体を流通させる細
幅溝を形成し、少なくともこの細幅溝に接する部分に細
幅溝の溝幅よりも大径の金属粒を配置することを特徴と
する。
In order to achieve the above object, a first aspect of the present invention is to open a recess in a mold body such that the bottom of the recess approaches the cavity, and to form a sintered metal layer in the recess of the mold body. By forming and closing the recess with a lid member, by flowing a heating medium as a cooling medium or a heating medium through the sintered metal layer,
A resin molding die capable of forcibly cooling or forcibly heating a mold body, wherein a narrow groove for forming a heat medium is formed at the bottom of the concave portion, and a narrow groove is formed at least in a portion in contact with the narrow groove. A metal grain having a diameter larger than the groove width is arranged.

【0006】凹部の底がキャビティに近づくように凹部
を金型本体に開け、この金型本体の凹部に焼結金属層を
形成し、凹部を蓋部材で塞ぎ、焼結金属層に冷却用媒体
又は加熱用媒体としての熱媒体を流通させることで、金
型本体を強制冷却又は強制加熱する。このときに、凹部
の底に、熱媒体を流通させる細幅溝を形成し、少なくと
も細幅溝に接する部分に細幅溝の溝幅よりも大径の金属
粒を配置する。すなわち、凹部の底に、熱媒体を流通さ
せる細幅溝を形成し、この細幅溝に接する部分に細幅溝
の溝幅よりも大径の金属粒を配置することで、キャビテ
ィに近い部分に熱媒体を流通させる共に、熱媒体を流す
隙間を確保して凹部の底に熱媒体を積極的に流すように
する。
The concave portion is opened in the mold body so that the bottom of the concave portion approaches the cavity, a sintered metal layer is formed in the concave portion of the mold body, the concave portion is closed with a lid member, and the cooling medium is added to the sintered metal layer. Alternatively, the mold body is forcibly cooled or heated by flowing a heating medium as a heating medium. At this time, a narrow groove through which the heat medium flows is formed at the bottom of the concave portion, and a metal particle having a diameter larger than the groove width of the narrow groove is arranged at least in a portion in contact with the narrow groove. That is, by forming a narrow groove through which the heat medium flows at the bottom of the concave portion and disposing a metal particle having a diameter larger than the groove width of the narrow groove in a portion in contact with the narrow groove, a portion close to the cavity is formed. In addition, the heat medium is allowed to circulate, and at the same time, a gap for flowing the heat medium is ensured so that the heat medium flows positively to the bottom of the concave portion.

【0007】請求項2は、細幅溝の断面を円弧断面とし
たことを特徴とする。細幅溝の断面を円弧断面として、
キャビティから焼結金属層に加わる成形圧の分散化を図
る。
According to a second aspect of the present invention, the cross section of the narrow groove is an arc cross section. The cross section of the narrow groove is an arc section,
The molding pressure applied to the sintered metal layer from the cavity is dispersed.

【0008】[0008]

【発明の実施の形態】本発明の実施の形態を添付図に基
づいて以下に説明する。なお、図面は符号の向きに見る
ものとする。図1は本発明に係る樹脂成形金型の斜視図
である。樹脂金型装置20は、樹脂成形金型としての可
動側金型30と樹脂成形金型としての固定側金型40と
から構成するものであって、可動側金型30に成形凸部
32を形成し、固定側金型40に成形凹部42を形成
し、これらの成形凹部42及び成形凸部32を合せるこ
とで樹脂成形品Wを成形するためのキャビティ50を形
成するものである。
Embodiments of the present invention will be described below with reference to the accompanying drawings. The drawings should be viewed in the direction of reference numerals. FIG. 1 is a perspective view of a resin molding die according to the present invention. The resin mold apparatus 20 includes a movable mold 30 as a resin mold and a fixed mold 40 as a resin mold. The movable mold 30 includes a molding protrusion 32. The molding concave portion 42 is formed in the fixed mold 40, and the molding concave portion 42 and the molding convex portion 32 are combined to form the cavity 50 for molding the resin molded product W.

【0009】図2は図1の2−2線断面図であり、可動
側金型30の縦断面を示す。可動側金型30は、金型本
体31に形成した成形凸部32と、金型本体31に形成
した凹部33と、この凹部33に形成する多孔質の焼結
金属層34と、これらの焼結金属層34及び凹部33を
一括して覆う蓋部材35と、金型本体31に形成した複
数の入口としての入水口36・・・(・・・は複数個を示す。
以下同じ)及び出口としての排水口37・・・とからな
る。なお、本図では、入水口36・・・及び排水口37・・・
は一個のみを示す。固定側金型40は、金型本体41に
成形凹部42を備え、金型本体41に可動側金型30と
略同一の凹部、焼結金属層、蓋部材、入水口及び排水口
を備えるものであり、詳細な説明は省略する。
FIG. 2 is a sectional view taken along line 2-2 of FIG. 1 and shows a vertical section of the movable mold 30. As shown in FIG. The movable mold 30 includes a molding protrusion 32 formed in the mold body 31, a recess 33 formed in the mold body 31, a porous sintered metal layer 34 formed in the recess 33, The cover member 35 that covers the binding metal layer 34 and the recess 33 collectively, and the water inlets 36 as a plurality of inlets formed in the mold body 31 (a plurality of inlets are shown).
And the drains 37 as outlets. In addition, in this figure, the inlet 36 ... and the drain 37 ...
Indicates only one. The fixed mold 40 includes a mold recess 41 in the mold body 41, and the mold body 41 includes substantially the same recess as the movable mold 30, a sintered metal layer, a lid member, a water inlet and a drain. And the detailed description is omitted.

【0010】図3は図1の3−3線断面図であり、可動
側金型30の横断面を示す。凹部33は、底33hがキ
ャビティ50に近づくように金型本体31に開けたもの
であり、キャビティ50の強度を補間するための第1の
リブ38・・・を備えたものである。底33hは、熱媒体
(不図示)を流通させる細幅溝51・・・を形成しTもの
である。焼結金属層34は、熱媒体(不図示)としての
冷却用媒体又は加熱用媒体を流通させるための部材であ
って、底33hに形成した細幅溝51・・・に接する部分
に細幅溝51・・・の溝幅よりも大径の金属粒53を配置
した金属層である。熱媒体(不図示)は、焼結金属層3
4を流通させることで可動側金型30を強制冷却又は強
制加熱を図るための媒体であって、
FIG. 3 is a sectional view taken along line 3-3 of FIG. The concave portion 33 is opened in the mold body 31 so that the bottom 33 h approaches the cavity 50, and has the first ribs 38 for interpolating the strength of the cavity 50. The bottom 33h is formed with narrow grooves 51... Through which a heat medium (not shown) flows. The sintered metal layer 34 is a member for flowing a cooling medium or a heating medium as a heat medium (not shown), and has a narrow width at a portion in contact with the narrow grooves 51 formed on the bottom 33h. This is a metal layer in which metal grains 53 having a diameter larger than the groove width of the grooves 51 are arranged. The heating medium (not shown) includes the sintered metal layer 3
4 is a medium for forcibly cooling or forcibly heating the movable mold 30 by flowing the

【0011】蓋部材35は、焼結金属層34及び凹部3
3を一括して覆うベース部35aと、このベース部35
aに形成する第2のリブ39・・・とからなる部材であ
り、第1のリブ38・・・の先端にベース部35aを当て
ることで第1のリブ38・・・と共にキャビティ50の強
度を補間する部材である。第2のリブ39・・・は、第1
のリブ38・・・の軸線C・・・上に配置することで、可動側
金型30の放熱効果の促進を図ることを狙ったものであ
る。
The cover member 35 includes the sintered metal layer 34 and the recess 3.
And a base portion 35a that collectively covers
a formed on the first rib 38... and the strength of the cavity 50 together with the first ribs 38. Is a member for interpolating. The second ribs 39.
Are arranged on the axis C of the ribs 38 to promote the heat radiation effect of the movable mold 30.

【0012】図4は図3の4部拡大図であり、底33h
に形成した細幅溝51・・・に接する部分に細幅溝51・・・
の溝幅よりも大径の金属粒53を配置することで、これ
らの細幅溝51・・・にも熱媒体(不図示)を流通させ、
熱媒体を流す隙間を確保して底33hに熱媒体を積極的
に流す構造にしたことを示す。この結果、キャビティ5
0に近い部位の金型本体31に、直接、熱媒体を流すこ
とができるので、加熱又は冷却時間の短縮を図ることが
できる。また、細幅溝51・・・の断面を、一例として円
弧断面としたものである。従って、キャビティ50から
焼結金属層34に加わる成形圧の分散化を図ることがで
きる。
FIG. 4 is an enlarged view of part 4 of FIG.
The narrow groove 51 is formed at a portion in contact with the narrow groove 51.
By disposing the metal particles 53 having a diameter larger than the width of the groove, a heat medium (not shown) is allowed to flow through these narrow grooves 51.
This shows that a structure in which a gap for flowing the heat medium is secured and the heat medium is positively flowed to the bottom 33h. As a result, the cavity 5
Since the heat medium can flow directly into the mold main body 31 at a position close to 0, the heating or cooling time can be reduced. The cross sections of the narrow grooves 51 are arc cross sections as an example. Therefore, the molding pressure applied from the cavity 50 to the sintered metal layer 34 can be dispersed.

【0013】図5は図1の5−5線断面図であり、可動
側金型30は、凹部33の底33hがキャビティ50
(図3参照)に近づくように凹部33を金型本体31に
開け、この金型本体31の凹部33に焼結金属層34を
形成し、凹部33を蓋部材35で塞ぎ、焼結金属層34
に冷却用媒体又は加熱用媒体としての熱媒体を流通させ
ることで、金型本体31を強制冷却又は強制加熱するこ
とのできる樹脂成形金型であって、凹部33の底33h
に、熱媒体(不図示)を流通させる細幅溝51・・・を形
成し、少なくとも細幅溝51・・・に接する部分に細幅溝
51・・・の溝幅よりも大径の金属粒53を配置する構造
にしたことを示す。
FIG. 5 is a sectional view taken along line 5-5 of FIG.
The recess 33 is opened in the mold body 31 so as to approach (see FIG. 3), a sintered metal layer 34 is formed in the recess 33 of the mold body 31, and the recess 33 is closed with a lid member 35. 34
A resin molding die capable of forcibly cooling or forcibly heating the mold body 31 by flowing a cooling medium or a heating medium as a heating medium through the bottom 33 h of the recess 33.
, Through which a heat medium (not shown) flows, and a metal having a diameter larger than the width of the narrow grooves 51. This shows that the structure in which the grains 53 are arranged is adopted.

【0014】すなわち、可動側金型30は、凹部33の
底33hに、熱媒体を流通させる細幅溝51を形成し、
この細幅溝51に接する部分に細幅溝51の溝幅よりも
大径の金属粒53を配置することで、キャビティ50に
近い部分に熱媒体を流通させる共に、熱媒体を流す隙間
を確保して凹部33の底33hに熱媒体を積極的に流す
ことができる。この結果、可動側金型30の加熱・冷却
サイクルの短縮を図ることができ、成形コストの削減を
図ることができる。
That is, the movable mold 30 is formed with a narrow groove 51 through which the heat medium flows, at the bottom 33 h of the recess 33.
By arranging the metal particles 53 having a diameter larger than the width of the narrow groove 51 in a portion in contact with the narrow groove 51, a heat medium is allowed to circulate in a portion close to the cavity 50 and a gap for flowing the heat medium is secured. Thus, the heat medium can be positively flown to the bottom 33h of the concave portion 33. As a result, the heating / cooling cycle of the movable mold 30 can be shortened, and the molding cost can be reduced.

【0015】言い換えれば、可動側金型30は、第1の
リブ38・・・を残すようなかたちで、金型本体31に凹
部33を形成したものであり、結果として、凹部33は
複数の流路33A〜33F(ここでは、凹部33を流路
33A〜33Fと呼ぶことにする)を形成したかたちに
なり、それぞれの流路33A〜33Fに焼結金属層34
を設け、それぞれの流路33A〜33Fに入水口36・・
・及び排水口37・・・を設けたものとも言える。従って、
凹部33をそれぞれの流路33A〜33Fに仕切ること
で、熱媒体(不図示)を均一に流すことができるので、
金型温度のばらつきの低減を図ることができる。
In other words, the movable mold 30 has a concave portion 33 formed in the mold body 31 in such a manner as to leave the first ribs 38... The channels 33A to 33F (here, the recesses 33 are referred to as channels 33A to 33F) are formed, and the sintered metal layers 34 are formed in the respective channels 33A to 33F.
Are provided, and the water inlets 36 are provided in the respective flow paths 33A to 33F.
.. And a drain 37. Therefore,
By partitioning the recess 33 into the respective flow paths 33A to 33F, a heat medium (not shown) can be uniformly flowed.
Variations in mold temperature can be reduced.

【0016】以上に述べた可動側金型30(樹脂成形金
型)の作用を次に説明する。図6(a)〜(d)は本発
明に係る樹脂成形金型の第1作用説明図であり、可動側
金型30(図3参照)の製作手順の一例を示す。(a)
において、金属ブロック52に成形凸部32及び凹部3
3を形成し、金型本体31を製作する。(b)におい
て、鉄系金属、アルミニウム系金属若しくはステンレス
鋼の金属粒53・・・を凹部33に充填する。(c)にお
いて、凹部33に金属粒53・・・を充填済みの金型本体
31を焼結炉54に入れ、金属粒53・・・同士を焼結さ
せ、焼結金属層34を形成する。
The operation of the movable mold 30 (resin molding mold) described above will be described below. 6 (a) to 6 (d) are first operation explanatory views of the resin molding die according to the present invention, and show an example of a manufacturing procedure of the movable die 30 (see FIG. 3). (A)
, The metal block 52 is provided with the molded convex portion 32 and the concave portion 3.
3 and the mold body 31 is manufactured. In (b), the recesses 33 are filled with metal particles 53... Of iron-based metal, aluminum-based metal, or stainless steel. In (c), the mold body 31 in which the recesses 33 are filled with the metal particles 53 is placed in a sintering furnace 54, and the metal particles 53 are sintered together to form a sintered metal layer 34. .

【0017】(d)において、蓋部材35で焼結金属層
34及び凹部33を一括して覆い、ボルト締め又は熱溶
着を行ない、凹部33を密封する。その後、成形凸部3
2面の仕上を行ない、成形凸部32面と凹部33の底3
3h面との厚さをtとするときに、厚さtを2mmから
5mmの範囲に設定する。ここで、厚さtが2mm以下
では成形凸部32の強度が不足する。また、5mm以上
では冷却効率又は熱効率の悪化を招く。
In (d), the sintered metal layer 34 and the recess 33 are collectively covered with a cover member 35, and the recess 33 is sealed by bolting or heat welding. After that, the forming protrusion 3
After finishing the two surfaces, the surface of the formed convex portion 32 and the bottom 3 of the concave portion 33 are formed.
When the thickness with respect to the 3h surface is t, the thickness t is set in a range from 2 mm to 5 mm. Here, if the thickness t is 2 mm or less, the strength of the molded projection 32 is insufficient. On the other hand, if it is 5 mm or more, the cooling efficiency or the heat efficiency is deteriorated.

【0018】図7(a),(b)は本発明に係る樹脂成
形金型の第2作用説明図であり、(a)は比較例を示
し、(b)は実施例を示す。(a)において、樹脂成形
金型としての可動側金型100は、金型本体101に成
形凸部102を形成し、金型本体101に凹部103を
形成し、この凹部33に焼結金属層104を形成し、金
型本体101に複数の入水口106・・・及び排水口10
7・・・を形成したものであって、入水口106から熱媒
体(不図示)を凹部103に矢印,の如く供給する
と、凹部103の表面に熱媒体を集中させて流すことは
できないと考えられる。
FIGS. 7 (a) and 7 (b) are views for explaining a second operation of the resin molding die according to the present invention, wherein (a) shows a comparative example and (b) shows an example. 1A, a movable mold 100 as a resin molding mold has a mold body 101 formed with a molding protrusion 102, a mold body 101 with a recess 103, and a sintered metal layer formed in the recess 33. 104 and a plurality of water inlets 106.
Are formed, and when a heat medium (not shown) is supplied from the water inlet 106 to the concave portion 103 as shown by an arrow, it is considered that the heat medium cannot be concentrated and flown on the surface of the concave portion 103. Can be

【0019】(b)において、可動側金型30は、凹部
33の底33hに複数の細幅溝51・・・を形成したの
で、入水口36から熱媒体(不図示)を供給するとき
に、凹部33の底33hに矢印,の如く熱媒体を集
中させて流すことができるので、金型温度を迅速に制御
することができる。
In FIG. 2B, the movable mold 30 has a plurality of narrow grooves 51... Formed in the bottom 33 h of the recess 33, so that a heat medium (not shown) is supplied from the water inlet 36. Since the heat medium can be made to flow in a concentrated manner as indicated by an arrow in the bottom 33h of the concave portion 33, the mold temperature can be quickly controlled.

【0020】図8は本発明に係る樹脂成形金型の第3作
用説明図であり、可動側金型30は、凹部33の底33
hに、焼結金属層34を構成する金属粒53の外径より
も狭幅であって円弧断面の細幅溝51・・・を形成したも
のである。従って、キャビティ50から焼結金属層34
に加わる成形圧を矢印・・・の如く分散化を図ることが
できる。この結果、実質的に金型本体31の剛性の向上
を図ることができる。
FIG. 8 is an explanatory view of a third operation of the resin molding die according to the present invention.
h, narrow grooves 51 having a smaller width than the outer diameter of the metal grains 53 constituting the sintered metal layer 34 and having an arc-shaped cross section are formed. Therefore, the sintered metal layer 34 is removed from the cavity 50.
Can be dispersed as indicated by arrows. As a result, the rigidity of the mold body 31 can be substantially improved.

【0021】図9は本発明に係る樹脂成形金型の別実施
例の細幅溝の拡大図であり、細幅溝56・・・の断面を、
矩形断面としたものであって、底33hに形成した細幅
溝56・・・に接する部分に細幅溝56・・・の溝幅よりも大
径の金属粒53を配置することで、これらの細幅溝56
・・・にも熱媒体(不図示)を流通させ、底33hに熱媒
体を積極的に流す構造にしたことを示す。
FIG. 9 is an enlarged view of a narrow groove of another embodiment of the resin molding die according to the present invention.
By forming the metal grains 53 having a rectangular cross section and having a diameter larger than the width of the narrow grooves 56... At a portion in contact with the narrow grooves 56. Narrow groove 56
.. Also indicate that a heat medium (not shown) is circulated and the heat medium is positively flowed to the bottom 33h.

【0022】図10は本発明に係る第2実施の形態の樹
脂成形金型の部分断面図であり、樹脂成形金型としての
可動側金型60の部分断面を示す。なお、可動側金型3
0と同一部品は同一符号を用い詳細な説明を省略する。
31は金型本体、32は成形凸部、33は凹部、33h
は凹部33の底、51・・・は細幅溝、64は凹部に形成
する焼結金属層であり、可動側金型60は、焼結金属層
64を多層構造とし、細幅溝51・・・に臨む第1層64
Aを構成する金属粒63の外径を細幅溝51・・・を超え
るようにし、その他の層64B,64Cを構成する金属
粒63B,63Cの外径を任意の外径にしたものであ
る。
FIG. 10 is a partial sectional view of a resin molding die according to a second embodiment of the present invention, and shows a partial cross section of a movable mold 60 as a resin molding die. The movable mold 3
The same parts as in FIG.
31 is a mold main body, 32 is a molding convex part, 33 is a concave part, 33h
Are the bottom of the recess 33, 51 is a narrow groove, 64 is a sintered metal layer formed in the recess, the movable mold 60 has a sintered metal layer 64 having a multilayer structure, ..First layer 64 facing the
The outer diameter of the metal particles 63 constituting A is made to exceed the narrow grooves 51..., And the outer diameter of the metal particles 63B, 63C constituting the other layers 64B, 64C is set to an arbitrary outer diameter. .

【0023】例えば、第2層64Bの金属粒63Bの外
径をより大きなものを使用することで、焼結金属層64
全体に流せる熱媒体(不図示)の量を増やすことがで
き、迅速に金型温度を調整することができる。また、第
2層64Bの金属粒63Bの外径をより小さなものを使
用することで、凹部33の底33hに熱媒体(不図示)
を集中させて、迅速に金型温度を調整することができ
る。さらに、その他の層64B,64Cを構成する金属
粒63B,63Cの大きさを任意なものを使用できるの
で、焼結金属層64を安価に製作できる。この結果、可
動側金型60のコストの低減を図ることができる。
For example, by using a metal particle 63B having a larger outer diameter for the second layer 64B, the sintered metal layer 64B can be used.
The amount of the heat medium (not shown) that can flow in the whole can be increased, and the mold temperature can be quickly adjusted. Further, by using a metal particle 63B having a smaller outer diameter for the second layer 64B, a heat medium (not shown) is formed on the bottom 33h of the concave portion 33.
And quickly adjust the mold temperature. Further, since the size of the metal grains 63B and 63C constituting the other layers 64B and 64C can be arbitrarily set, the sintered metal layer 64 can be manufactured at low cost. As a result, the cost of the movable mold 60 can be reduced.

【0024】尚、第2の実施の形態では図9に示すよう
に、焼結金属層64を第1層64A及びその他の層64
B,64Cの3層構造としたが、これに限るものではな
く、2層以上であればよい。また、その他の層の金属粒
の粒径を大小混ぜたものを使用したものであってもよ
い。この場合、任意の大きさの金属粒を混ぜることで、
金型強度の向上を図ることができる。
In the second embodiment, as shown in FIG. 9, the sintered metal layer 64 is made up of a first layer 64A and other layers 64A.
Although a three-layer structure of B and 64C is used, the present invention is not limited to this. Further, a material in which the particle size of the metal particles of the other layers is mixed large and small may be used. In this case, by mixing metal particles of any size,
The mold strength can be improved.

【0025】[0025]

【発明の効果】本発明は上記構成により次の効果を発揮
する。請求項1は、凹部の底に、熱媒体を流通させる細
幅溝を形成し、少なくともこの細幅溝に接する部分に細
幅溝の溝幅よりも大径の金属粒を配置したので、キャビ
ティに近い部分に熱媒体を流通させることができる共
に、熱媒体を流す隙間を確保して熱媒体を凹部の底に積
極的に流すことができる。この結果、金型の加熱・冷却
サイクルの短縮を図ることができ、成形コストの削減を
図ることができる。
According to the present invention, the following effects are exhibited by the above configuration. According to the first aspect of the present invention, a narrow groove is formed at the bottom of the concave portion for flowing the heat medium, and metal particles having a diameter larger than the groove width of the narrow groove are arranged at least at a portion in contact with the narrow groove. The heat medium can be allowed to circulate in a portion near the heat medium, and the heat medium can be positively flown to the bottom of the concave portion by securing a gap through which the heat medium flows. As a result, the heating / cooling cycle of the mold can be shortened, and the molding cost can be reduced.

【0026】請求項2は、細幅溝の断面を円弧断面とし
たので、キャビティから焼結金属層に加わる成形圧の分
散化を図ることができる。この結果、実質的に金型本体
の剛性の向上を図ることができる。
In the second aspect, since the cross section of the narrow groove is an arc-shaped cross section, the molding pressure applied to the sintered metal layer from the cavity can be dispersed. As a result, the rigidity of the mold body can be substantially improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る樹脂成形金型の斜視図FIG. 1 is a perspective view of a resin molding die according to the present invention.

【図2】図1の2−2線断面図FIG. 2 is a sectional view taken along line 2-2 of FIG.

【図3】図1の3−3線断面図FIG. 3 is a sectional view taken along line 3-3 in FIG. 1;

【図4】図3の4部拡大図FIG. 4 is an enlarged view of a part of FIG. 3;

【図5】図1の5−5線断面図FIG. 5 is a sectional view taken along line 5-5 of FIG. 1;

【図6】本発明に係る樹脂成形金型の第1作用説明図FIG. 6 is an explanatory view of a first operation of the resin molding die according to the present invention.

【図7】本発明に係る樹脂成形金型の第2作用説明図FIG. 7 is an explanatory view of a second operation of the resin molding die according to the present invention.

【図8】本発明に係る樹脂成形金型の第3作用説明図FIG. 8 is an explanatory view of a third operation of the resin molding die according to the present invention.

【図9】本発明に係る樹脂成形金型の別実施例の細幅溝
の拡大図
FIG. 9 is an enlarged view of a narrow groove of another embodiment of the resin molding die according to the present invention.

【図10】本発明に係る第2実施の形態の樹脂成形金型
の部分断面図
FIG. 10 is a partial sectional view of a resin molding die according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

30,60…樹脂成形金型(可動側金型)、31…金型
本体、33…凹部、33h…底、34,64…焼結金属
層、50…キャビティ、51,56…細幅溝、53…金
属粒、64A…第1層、64B,64C…その他の層。
30, 60: resin molding die (movable mold), 31: die body, 33: recess, 33h: bottom, 34, 64: sintered metal layer, 50: cavity, 51, 56: narrow groove, 53: metal particles, 64A: first layer, 64B, 64C: other layers.

フロントページの続き (72)発明者 辻 正照 埼玉県狭山市新狭山1丁目10番地1 ホン ダエンジニアリング株式会社内 Fターム(参考) 4F202 AJ08 AJ10 AK13 CA30 CB01 CD27 CN01 CN05 CN12 CN15 CN22 Continued on the front page (72) Inventor Masateru Tsuji 1-10-1 Shinsayama, Sayama-shi, Saitama Honda Engineering Co., Ltd. F-term (reference) 4F202 AJ08 AJ10 AK13 CA30 CB01 CD27 CN01 CN05 CN12 CN15 CN22

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 凹部の底がキャビティに近づくように凹
部を金型本体に開け、この金型本体の凹部に焼結金属層
を形成し、前記凹部を蓋部材で塞ぎ、前記焼結金属層に
冷却用媒体又は加熱用媒体としての熱媒体を流通させる
ことで、金型本体を強制冷却又は強制加熱することので
きる樹脂成形金型であって、 前記凹部の底に、前記熱媒体を流通させる細幅溝を形成
し、少なくともこの細幅溝に接する部分に細幅溝の溝幅
よりも大径の金属粒を配置することを特徴とする樹脂成
形金型。
1. A concave portion is opened in a mold body such that a bottom of the concave portion approaches the cavity, a sintered metal layer is formed in the concave portion of the mold body, and the concave portion is closed with a lid member. A resin molding die capable of forcibly cooling or forcibly heating the mold body by flowing a heat medium as a cooling medium or a heating medium through the heat medium. A resin molding die, wherein a narrow groove to be formed is formed, and a metal particle having a diameter larger than the groove width of the narrow groove is arranged at least in a portion in contact with the narrow groove.
【請求項2】 前記細幅溝の断面を、円弧断面としたこ
とを特徴とする請求項1記載の樹脂成形金型。
2. The resin molding die according to claim 1, wherein a cross section of the narrow groove is an arc cross section.
JP2000171325A 2000-06-07 2000-06-07 Resin mold Expired - Fee Related JP4266272B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000171325A JP4266272B2 (en) 2000-06-07 2000-06-07 Resin mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000171325A JP4266272B2 (en) 2000-06-07 2000-06-07 Resin mold

Publications (2)

Publication Number Publication Date
JP2001347525A true JP2001347525A (en) 2001-12-18
JP4266272B2 JP4266272B2 (en) 2009-05-20

Family

ID=18673894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000171325A Expired - Fee Related JP4266272B2 (en) 2000-06-07 2000-06-07 Resin mold

Country Status (1)

Country Link
JP (1) JP4266272B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005329555A (en) * 2004-05-18 2005-12-02 Mitsubishi Heavy Ind Ltd Mold
JP2006015751A (en) * 2004-06-30 2006-01-19 Soc D Technologie Michelin Tire mold with helically extending heating conduit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005329555A (en) * 2004-05-18 2005-12-02 Mitsubishi Heavy Ind Ltd Mold
JP4503351B2 (en) * 2004-05-18 2010-07-14 三菱重工プラスチックテクノロジー株式会社 Mold for molding
JP2006015751A (en) * 2004-06-30 2006-01-19 Soc D Technologie Michelin Tire mold with helically extending heating conduit

Also Published As

Publication number Publication date
JP4266272B2 (en) 2009-05-20

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