JP2001321714A - Apparatus for rotary coating - Google Patents
Apparatus for rotary coatingInfo
- Publication number
- JP2001321714A JP2001321714A JP2000141234A JP2000141234A JP2001321714A JP 2001321714 A JP2001321714 A JP 2001321714A JP 2000141234 A JP2000141234 A JP 2000141234A JP 2000141234 A JP2000141234 A JP 2000141234A JP 2001321714 A JP2001321714 A JP 2001321714A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spin coating
- container
- coating liquid
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、遠心力を利用して
基板上に塗布液を塗布し、均一な膜厚の塗膜を形成する
回転塗布装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin coating apparatus which applies a coating liquid on a substrate by using a centrifugal force to form a coating film having a uniform thickness.
【0002】[0002]
【従来の技術】従来より、半導体素子の製造工程におい
て、フォトレジストの塗膜形成に回転塗布装置が広く利
用されている。図2に該回転塗布装置の構成を模式的に
示す。図中、1は塗膜を形成する基板、2は回転チャッ
ク、3はモータ、4は供給ノズル、5はカップ、6は廃
液管である。図2の回転塗布装置においては、回転チャ
ック2に固定された基板1の中央部に供給ノズル4より
塗布液7が滴下され、モータ3の回転と共に遠心力によ
って滴下された塗布液7が基板半径方向に広がり、基板
1上に薄膜を形成すると共に半径方向に飛散した余分な
塗布液はカップ5に捕えられて廃液管6を通って廃棄さ
れる。2. Description of the Related Art Conventionally, in a process of manufacturing a semiconductor device, a spin coating apparatus has been widely used for forming a coating film of a photoresist. FIG. 2 schematically shows the configuration of the spin coating apparatus. In the figure, 1 is a substrate on which a coating film is formed, 2 is a rotary chuck, 3 is a motor, 4 is a supply nozzle, 5 is a cup, and 6 is a waste liquid pipe. In the spin coating apparatus shown in FIG. 2, the coating liquid 7 is dropped from the supply nozzle 4 to the center of the substrate 1 fixed to the rotary chuck 2, and the coating liquid 7 dropped by centrifugal force with the rotation of the motor 3 has a substrate radius. The excess coating liquid that spreads in the direction and forms a thin film on the substrate 1 and scatters in the radial direction is caught by the cup 5 and discarded through the waste liquid pipe 6.
【0003】[0003]
【発明が解決しようとする課題】上記回転塗布装置は、
塗布液としてニュートン流体を用いて円形の基板上に塗
膜を形成する場合には、均一な膜厚の塗膜を形成するこ
とができるが、塗布液としてせんだん応力がひずみ速度
に比例しない非ニュートン流体を用いた場合、ひずみ速
度の上昇に粘性が低下する場合には、回転中心部におい
て膜厚が厚くなり、均一な膜厚の塗膜が得られない。The above spin coating apparatus is
When a coating film is formed on a circular substrate using a Newtonian fluid as a coating liquid, a coating film having a uniform film thickness can be formed. In the case where the Newtonian fluid is used, when the viscosity decreases as the strain rate increases, the film thickness becomes large at the center of rotation, and a coating film having a uniform film thickness cannot be obtained.
【0004】また、矩形等の非円形基板を用いた場合、
基板と基板周辺の空気が同期回転せず、基板より半径方
向に飛散した塗布液が基板の回転により起こされる基板
周辺の気流の乱れによって、特に矩形エッジ部の裏面に
回り込む現象が生じ、後工程の搬送系を汚染したり、ゴ
ミの発生源となっていた。When a non-circular substrate such as a rectangle is used,
The substrate and the air around the substrate do not rotate synchronously, and the coating liquid scattered in the radial direction from the substrate causes turbulence in the air flow around the substrate caused by the rotation of the substrate, causing a phenomenon in which the coating liquid wraps around the back surface of the rectangular edge portion in particular, and the subsequent process And contaminated the transport system, and became a source of garbage.
【0005】本発明の課題は、上記問題点を解決し、均
一な膜厚の塗膜を容易に形成しうる回転塗布装置を提供
することにある。[0005] An object of the present invention is to solve the above problems and to provide a spin coating apparatus capable of easily forming a coating film having a uniform thickness.
【0006】[0006]
【課題を解決するための手段】本発明は、基板中央部に
塗布液を付与し、該中央部における基板の法線を軸とし
て該基板を回転させながら、遠心力により基板表面に上
記塗布液を展開させて基板全面に塗膜を形成する回転塗
布装置であって、上記基板が該基板と同期回転する容器
内に収納され、該容器が、中央部に向かって基板表面と
の距離が漸増する凸形状を有する蓋体と、側壁と、底部
とから構成され、回転中心となる蓋体中央部に気体導入
口を、側壁或いは底部周縁部に気体排出口をそれぞれ備
えたことを特徴とする回転塗布装置である。According to the present invention, a coating liquid is applied to the center of a substrate, and the coating liquid is applied to the surface of the substrate by centrifugal force while rotating the substrate around a normal line of the substrate at the center. A spin coating apparatus for forming a coating film on the entire surface of a substrate by spreading the substrate, wherein the substrate is accommodated in a container that rotates synchronously with the substrate, and the distance between the container and the substrate surface gradually increases toward the center. A lid having a convex shape, a side wall, and a bottom, wherein a gas inlet is provided at a central portion of the lid serving as a center of rotation, and a gas outlet is provided at a peripheral portion of the side wall or the bottom. It is a spin coating device.
【0007】上記本発明は、気体導入口が外気或いは圧
力流体発生源に連通していること、塗布液が非ニュート
ン流体であること、蓋体の凸形状が基板の内接円内に形
成され、基板が非円形であること、を好ましい態様とし
て含むものである。According to the present invention, the gas inlet communicates with the outside air or the pressure fluid generating source, the coating liquid is a non-Newtonian fluid, and the convex shape of the lid is formed within the inscribed circle of the substrate. And the substrate is non-circular as a preferred embodiment.
【0008】[0008]
【発明の実施の形態】本発明の回転塗布装置の特徴は、
基板を特定の容器に収納して回転させることにある。か
かる容器は、基板表面に対向する蓋体と、側壁と、底部
を有し、該蓋体が中央部に向かって基板との距離が漸増
する凸形状であり、その中央部に気体導入口を備えてい
る。また、容器の側壁或いは底部周縁部には気体排出口
が設けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The features of the spin coating apparatus of the present invention are as follows.
The object is to rotate a substrate stored in a specific container. Such a container has a lid facing the substrate surface, a side wall, and a bottom, and the lid has a convex shape in which the distance from the substrate gradually increases toward the center, and a gas inlet is provided in the center. Have. A gas outlet is provided on the side wall or the bottom peripheral edge of the container.
【0009】図1は、本発明の回転塗布装置の一実施形
態の構成を示す模式図である。図中、図2と同じ部材に
は同じ符号を付しており、1は塗膜を形成する基板、2
は基板1を固定し、モータ3の回転と共に回転する回転
チャック、3はモータ、5は廃液を回収するカップ、6
は廃液を導く廃液管、7は基板1上に滴下された塗布
液、8はゴミの侵入や飛散した塗布液が装置外に漏れる
のを防止するカバー、9は基板1と共に同期回転する容
器の蓋体、10は容器の底部、11は容器の側壁、12
は蓋体9の中央部に設けられた気体導入口、13は容器
の側壁部11に設けられた気体排出口であり、廃液口を
兼ねている。FIG. 1 is a schematic view showing the configuration of an embodiment of the spin coating apparatus according to the present invention. In the drawing, the same members as those in FIG. 2 are denoted by the same reference numerals, and 1 is a substrate on which a coating film is formed.
Is a rotating chuck that fixes the substrate 1 and rotates with the rotation of the motor 3, 3 is a motor, 5 is a cup for collecting waste liquid, 6 is
Is a waste liquid pipe for guiding waste liquid, 7 is a coating liquid dropped on the substrate 1, 8 is a cover for preventing intrusion of dust and leakage of the scattered coating liquid out of the apparatus, and 9 is a container which rotates synchronously with the substrate 1. Lid, 10 is the bottom of the container, 11 is the side wall of the container, 12
Is a gas inlet provided in the center of the lid 9, and 13 is a gas outlet provided in the side wall 11 of the container, which also serves as a waste liquid port.
【0010】図1の装置において、気体導入口12に外
気が連通するように構成して、基板1の中央部に塗布液
7を滴下して基板1を回転させると、容器内の空気は気
体排出口13へと排出され、容器内圧力が低下するた
め、気体導入口12より気体が流入する。流入した気体
は基板1上に滴下された塗布液7に衝突し、回転中心部
において塗膜の膜厚が厚くなるのを抑える。この気体の
流れによる塗膜の膜厚平坦化効果は、基板の回転が高速
の場合に強くなるが、蓋体9の凸形状を調整して基板と
の距離の漸増加減を調整することにより、調節すること
が可能である。また、基板の回転数が低い場合には、容
器内の圧力が十分に下がらず、気体導入口12から気体
排出口13への気体の流れが十分に形成できない場合が
あるが、このような場合には、気体導入口12を圧力流
体発生源(不図示)に連通させて気体導入口12より流
れ込む気体の流量や圧力を調整することによって、上記
膜厚平坦化効果を調整することができる。In the apparatus shown in FIG. 1, the outside air communicates with the gas inlet 12, and when the coating liquid 7 is dropped on the center of the substrate 1 and the substrate 1 is rotated, the air in the container becomes gaseous. The gas is discharged to the outlet 13 and the pressure in the container is reduced, so that gas flows in from the gas inlet 12. The inflowing gas collides with the coating liquid 7 dropped on the substrate 1 and suppresses the film thickness of the coating film from increasing at the center of rotation. The flattening effect of the coating film thickness due to the gas flow becomes stronger when the substrate is rotated at a high speed, but by adjusting the convex shape of the lid 9 to adjust the gradual increase and decrease of the distance from the substrate, It is possible to adjust. Further, when the rotation speed of the substrate is low, the pressure in the container may not be sufficiently reduced, and the gas flow from the gas inlet 12 to the gas outlet 13 may not be sufficiently formed. By adjusting the flow rate and pressure of the gas flowing from the gas introduction port 12 by connecting the gas introduction port 12 to a pressure fluid generation source (not shown), the film thickness flattening effect can be adjusted.
【0011】また、基板1として矩形等非円形の基板を
用いた場合には、該基板1の内接円内に蓋体9の凸形状
を形成することにより、容器内の気体は基板1とともに
回転周方向に動くため、基板1のエッジ部に発生する気
流の乱れが従来に比べて極めて小さくなり、これにより
塗布液7の基板1裏面への回り込みを防止し、後工程の
搬送系の汚染やゴミの発生を抑制することができる。When a non-circular substrate such as a rectangle is used as the substrate 1, by forming the convex shape of the lid 9 in an inscribed circle of the substrate 1, the gas in the container is removed together with the substrate 1. Since it moves in the circumferential direction of rotation, the turbulence of the air flow generated at the edge of the substrate 1 is extremely small as compared with the conventional case, thereby preventing the coating liquid 7 from flowing to the back surface of the substrate 1 and contaminating the transport system in a later process. And generation of dust can be suppressed.
【0012】基板1より半径方向に飛散する余分な塗布
液7は側壁11に衝突し、底部10に設けられた気体排
出口より容器外に排出され、カップ5を経て廃液管6を
通って装置外に排出される。Excess coating liquid 7 scattered from the substrate 1 in the radial direction collides with the side wall 11, is discharged out of the container from a gas discharge port provided in the bottom 10, passes through the cup 5, passes through the waste liquid pipe 6, and then passes through the apparatus. It is discharged outside.
【0013】[0013]
【発明の効果】以上説明したように、本発明の回転塗布
装置は、塗布液が非ニュートン流体であったり、基板の
形状が非円形である場合にも、均一な膜厚の塗膜を容易
に形成することができ、後工程の搬送系の汚染やゴミの
発生も防止される。よって、薄膜の形成材料としての選
択肢が広がり、特に半導体素子製造分野において、より
優れた素子の製造、製造工程の簡略化に非常に有用であ
る。As described above, the spin coating apparatus of the present invention can easily form a coating film having a uniform thickness even when the coating liquid is a non-Newtonian fluid or the substrate has a non-circular shape. Thus, contamination of the transfer system in the subsequent process and generation of dust can be prevented. Therefore, the choice of a material for forming a thin film is widened, and it is very useful for manufacturing a more excellent element and simplifying a manufacturing process, particularly in a semiconductor element manufacturing field.
【図1】本発明の回転塗布装置の一実施形態の構成を示
す模式図である。FIG. 1 is a schematic diagram showing a configuration of an embodiment of a spin coating device of the present invention.
【図2】従来の回転塗布装置の構成を示す模式図であ
る。FIG. 2 is a schematic diagram showing a configuration of a conventional spin coating device.
1 基板 2 回転チャック 3 モータ 4 塗布液供給ノズル 5 廃液回収カップ 6 廃液管 7 塗布液 8 カバー 9 蓋体 10 底部 11 側壁 12 気体導入口 13 気体排出口 DESCRIPTION OF SYMBOLS 1 Substrate 2 Rotary chuck 3 Motor 4 Coating liquid supply nozzle 5 Waste liquid collection cup 6 Waste liquid pipe 7 Coating liquid 8 Cover 9 Lid 10 Bottom 11 Side wall 12 Gas inlet 13 Gas outlet
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2H025 AA00 AB16 EA05 4D075 AC64 AC79 DA08 DC22 EA31 4F042 EB06 EB24 EB29 5F046 JA07 JA08 JA10 JA11 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2H025 AA00 AB16 EA05 4D075 AC64 AC79 DA08 DC22 EA31 4F042 EB06 EB24 EB29 5F046 JA07 JA08 JA10 JA11
Claims (5)
における基板の法線を軸として該基板を回転させなが
ら、遠心力により基板表面に上記塗布液を展開させて基
板全面に塗膜を形成する回転塗布装置であって、上記基
板が該基板と同期回転する容器内に収納され、該容器
が、中央部に向かって基板表面との距離が漸増する凸形
状を有する蓋体と、側壁と、底部とから構成され、回転
中心となる蓋体中央部に気体導入口を、側壁或いは底部
周縁部に気体排出口をそれぞれ備えたことを特徴とする
回転塗布装置。1. A coating liquid is applied to a central portion of a substrate, and the coating liquid is spread on the surface of the substrate by centrifugal force while rotating the substrate around a normal line of the substrate at the central portion to coat the entire surface of the substrate. A spin coating apparatus for forming a film, wherein the substrate is housed in a container that rotates synchronously with the substrate, and the container has a lid having a convex shape in which a distance from the substrate surface gradually increases toward a central portion. , A side wall and a bottom portion, wherein a gas inlet is provided at a central portion of a lid serving as a center of rotation, and a gas outlet is provided at a peripheral portion of the side wall or the bottom portion.
1に記載の回転塗布装置。2. The spin coating apparatus according to claim 1, wherein the gas introduction port communicates with outside air.
いる請求項1に記載の回転塗布装置。3. The spin coating device according to claim 1, wherein the gas inlet communicates with a pressure fluid generation source.
1〜3のいずれかに記載の回転塗布装置。4. The spin coating apparatus according to claim 1, wherein the coating liquid is a non-Newtonian fluid.
れ、基板が非円形である請求項1〜4のいずれかに記載
の回転塗布装置。5. The spin coating apparatus according to claim 1, wherein the convex shape of the lid is formed in an inscribed circle of the substrate, and the substrate is non-circular.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000141234A JP2001321714A (en) | 2000-05-15 | 2000-05-15 | Apparatus for rotary coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000141234A JP2001321714A (en) | 2000-05-15 | 2000-05-15 | Apparatus for rotary coating |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001321714A true JP2001321714A (en) | 2001-11-20 |
Family
ID=18648378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000141234A Withdrawn JP2001321714A (en) | 2000-05-15 | 2000-05-15 | Apparatus for rotary coating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001321714A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018126507A1 (en) * | 2017-01-04 | 2018-07-12 | 中国科学院光电技术研究所 | Photoresist coating method and device |
-
2000
- 2000-05-15 JP JP2000141234A patent/JP2001321714A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018126507A1 (en) * | 2017-01-04 | 2018-07-12 | 中国科学院光电技术研究所 | Photoresist coating method and device |
US11061330B2 (en) | 2017-01-04 | 2021-07-13 | The Institute Of Optics And Electronics, The Chinese Academy Of Sciences | Methods and apparatuses for coating photoresist |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20070807 |