JP2001308565A - Electronic circuit unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a simple and inexpensive configuration by improving the adhesion property between a heat sink and an enclosure at a plurality of mounting parts and securing an improved heat radiation property when mounting the heat sink where large-power parts are mounted to the enclosure. SOLUTION: A printed circuit board 13 and a plurality of hybrid integrated circuits 14 are accommodated in an enclosure 12 made of aluminum die cast while they are mounted to a heat sink 24 to compose an electronic circuit unit(ECU) 11. The heat sink 24 is mounted to a mounting part 12b that is formed at three locations of the lower surface of the upper wall of the enclosure 12 while being thermally connected to the enclosure 12 by clamping a screw 26 from a lower portion. A plurality of grooves 33 for facilitating the deflection deformation of the enclosure 12 are formed at the outer surface side of the upper wall of the enclosure 12. These grooves 33 are formed while being extended nearly entirely on the upper surface of the enclosure 12 in forward and backward directions that orthogonally cross the left/right directions where the mounting part 12b forms a line by each two of them between mounting parts 12b at a position for avoiding the mounting part 12b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink having a high power component mounted in a housing made of a material having good thermal conductivity, and a heat sink connected to the housing at a plurality of longitudinal positions. The present invention relates to an electronic circuit unit to be mounted.

[0002]

For example, an electronic circuit unit such as an engine ECU mounted on an automobile is configured such that a circuit board on which electronic components are mounted is housed in a protective housing. In this case, the electronic components mounted on the circuit board include large power components such as power transistors that consume large amounts of power (heat is large), and other electronic devices such as microcomputers that generate heat by themselves or are relatively weak to heat. A heat dissipation structure that does not adversely affect components is required. By the way,
As an example, the heat-resistant temperature of a high-power semiconductor device is 150
The operating temperature of a semiconductor device such as a microcomputer used for a control circuit is 110 ° C.

[0003] With the recent demand for improved functions such as environmental measures for automobiles and advanced information technology, the above-mentioned ECU has been developed.
The scale of the circuit mounted on the ECU has been increasing, and on the other hand, there has been a demand for a smaller and lighter ECU. In view of this, in the applicant, as shown in FIG.
The structure of the electronic circuit unit 1 referred to as “electronic circuit unit 1” has been developed.

In this electronic circuit unit 1, a hybrid integrated circuit (HIC) 4 incorporating a large power component 3 such as a power transistor, a chip capacitor (not shown), a thick film resistor, and the like on a ceramic substrate 2 has a function. A plurality (two in this case) is provided for each of the plurality of hybrid integrated circuits 4.
Is mounted on one large (horizontal) heat sink 5 made of, for example, aluminum, and the heat sink 5 is thermally connected to the housing 6. In this case, the housing 6
Is formed in a substantially rectangular box shape having an open lower surface by, for example, aluminum die-casting.
A screw boss 6a is formed at a location.

The heat sink 5 is adapted to be attached to each of the screw bosses 6a by screws 7, and at this time, the housing 6 is heated by being in close contact with the lower surface of the screw boss 6a. Connection state. Thus, the heat of the large power component 3 is transmitted to the heat sink 5 via the ceramic substrate 2, further transmitted to the housing 6, and radiated from the outer surface of the housing 6 to the outside. The hybrid integrated circuit 4 is electrically connected to a printed circuit board 8 on which a not-shown microcomputer or the like (not shown) is mounted, and the printed circuit board 8 is so-called fastened together with the heat sink 5 by the screws 7. It is attached to the housing 6. In addition, a lid 9 is detachably attached to the lower opening of the housing 6.

However, the above configuration leaves room for improvement in the following points. That is, the processing accuracy of the upper surface of the heat sink 5 and the lower surface of the screw boss 6a of the housing 6 is as follows.
It is not very strict and the whole is not necessarily strictly on the same plane. For this reason, it is conceivable that the heat sink 5 may be in close contact with the lower surface of the screw boss portion 6a in some of the attachment portions, but a gap may be formed between the remaining attachment portions.

As described above, the heat sink 5 and the screw boss 6
If a gap is formed between the lower surface a and the lower surface, heat transferability is deteriorated and heat radiation is reduced. In this case, since the heat sink 5 and the housing 6 are both rigid, it is not easy to correct the gap at the time of screwing. On the other hand, if the thickness of the upper wall portion of the housing 6 is reduced to facilitate the correction, the heat capacity of the housing 6 becomes small, and the desired heat radiation performance cannot be secured.

[0008] In order to eliminate such disadvantages,
For example, as disclosed in JP-A-6-169188, it is conceivable to employ a structure in which a heat radiating member fixed to an electronic component is brought into contact with a case by the elastic force of a coil spring. However, in this case, the structure becomes complicated and cost increases, and it is not expected to obtain a contact force or a contact area as large as screwing. Even if a large spring force is provided, there are many problems in adopting it, such as the need for a robust structure to support it.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to mount a heat sink on which a high-power component is mounted to a housing at a plurality of locations. It is an object of the present invention to provide an electronic circuit unit that can have a simple and inexpensive configuration while improving adhesion to a body and ensuring good heat radiation.

[0010]

According to a first aspect of the present invention, there is provided an electronic circuit unit in which a heat sink on which a high power component is mounted is attached to a housing at a plurality of locations.
The feature is that a groove is provided to facilitate bending deformation. According to this, the housing is easily bent and deformed so that the groove forming portion becomes a bending point, and even if a gap is formed between the mounting portion of the housing and the heat sink, the bending deformation causes the contact of the mounting portion. The angle of the surface and the position in the direction of contact and separation with respect to the heat sink can be adjusted so as to eliminate the gap, and the adhesion between the mounting portion and the heat sink can be improved.

In the case, the portion other than the groove can be made thick, so that the desired heat radiation performance can be ensured. It only needs to be composed. As a result, according to the invention of claim 1,
It is possible to obtain an excellent effect that the adhesion between the heat sink and the housing in the plurality of mounting portions can be improved and good heat radiation can be secured, but a simple and inexpensive configuration can be achieved. it can.

In this case, the groove may be formed on either the inner surface side or the outer surface side of the housing from the viewpoint of making the housing easily deformable, but the groove may be formed on the outer surface side of the housing. With the provision, additional advantages such as an improvement in heat dissipation due to an increase in the heat dissipation area on the outer surface of the housing and an improvement in heat dissipation efficiency due to the generation of turbulence when air is blown can be obtained. Invention).

As means for attaching the heat sink to the attachment portion of the housing, screwing, riveting, caulking, welding, or the like can be employed. In particular, when screwing is employed, the tightening force of the screw is reduced. As a result, the housing can be automatically bent as it were, so that the correction can be easily performed (the invention of claim 3).

Here, it is more preferable that the groove is formed in the following form. That is, it is desirable that the groove is formed at a position avoiding the mounting portion (the invention of claim 4), whereby the thickness of the mounting portion of the housing is increased to improve the heat transfer property and the heat radiation property. can do. It is desirable that the groove is formed so as to extend in a direction orthogonal to the direction in which the mounting portions are arranged (the invention of claim 5), so that the housing can be easily bent and deformed in the target correction direction, and the mounting can be performed. It becomes difficult to bend and deform in the direction in which the parts are arranged.

Preferably, the groove is formed so as to extend over substantially the entire surface of the housing having the mounting portion (the invention of claim 6).
Compared to the case where the groove is formed short, the case can be easily bent and deformed. It is desirable to provide two or more grooves between adjacent mounting portions (the invention of claim 7),
According to this, the housing can be bent and deformed so as to be bent at two or more places between adjacent mounting portions.
Compared to the case where the bending deformation is performed at one place, the bending deformation can be freely performed, and the correction can be favorably performed. If the distance from the mounting portion to the groove is made uniform for each mounting portion (the invention of claim 8), the area of the thick portion of the housing that contacts each mounting portion can be made uniform, Heat conduction from each mounting part to the housing is performed uniformly,
Even heat radiation can be performed.

The groove may be provided in a circular shape centering on the mounting portion (the invention of claim 9). According to this, the housing can be easily bent in any direction. When the mounting portions are arranged vertically and horizontally, the grooves can be provided so as to extend in a lattice shape vertically and horizontally (the invention of claim 10), whereby the housing is flexibly deformed in both the vertical direction and the horizontal direction. This facilitates the correction of the angle of the contact surface in each mounting portion.

The casing can be manufactured by aluminum die casting. At this time, if the grooves are formed at the same time (the invention of claim 11), the grooved casing can be made extremely simple. And it can be manufactured at low cost. Further, the high power component may be mounted on a ceramic substrate to form a hybrid integrated circuit, and in this case, a plurality of hybrid integrated circuits may be mounted on a heat sink. Invention). As a result, the heat radiation effect is excellent, and the overall size can be reduced. In this case, if the heat sink is provided near the connector for external connection,
Invention 3), the wiring from the hybrid integrated circuit to the connector can be shortened, and the size reduction is more effective.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Several embodiments in which the present invention is applied to an engine ECU of an automobile will be described below with reference to FIGS. <First Embodiment> First, a first embodiment of the present invention (corresponding to claims 1, 2, 3, 4, 5, 6, 7, 8, 11, 12, 13) will be described with reference to FIGS. 5 will be described.

FIG. 5 schematically shows the entire configuration of an engine ECU 11 as an electronic circuit unit according to the present embodiment. The ECU 11 includes a printed board 13 as a main board and a plurality of hybrid boards to be described later in a thin rectangular box-shaped housing (case) 12 made of a material having good heat conductivity such as aluminum. Integrated circuit (HIC) 14
And so on. Note that the bottom of the housing 12 is closed by a removable lid 32 (see FIG. 1).

Although not described in detail, a wiring pattern (not shown) is formed on the printed circuit board 13 and a large number of electronic components such as a microcomputer 15 and a logic IC 16 are mounted on the surface thereof. In addition to the hybrid integrated circuit 14, a control circuit for realizing various functions related to engine control is configured. Also,
An opening 12 a is formed in the back wall of the housing 12, and a connector for connection to the outside is located on the rear side of the printed circuit board 13 inside the opening 12 a. 17 are provided.

Here, the hybrid integrated circuit 14 is composed of a circuit including a large power component, such as a power transistor, having a large power consumption (large heat generation) such as a power transistor in the control circuit. For example, four (only two are shown in FIG. 1 and the like for convenience) are provided. As shown in FIG. 1 and the like, the hybrid integrated circuit 14 includes a ceramic substrate 18 on which a wiring pattern (not shown) is formed, a power transistor 19 as a large power component, another semiconductor element, and a thick film resistor. A plurality of components such as a body and a chip capacitor (both not shown) are mounted. As shown only in FIG. 5, a number of clips 23 for electrical connection to the printed circuit board 13 are provided on the lower side of the ceramic substrate 18.

The plurality of hybrid integrated circuits 14 are mounted on the surface (front surface) of one elongated heat sink 24 made of a material having good thermal conductivity such as aluminum, for example, by bonding (for example, by bonding). Mounted) and configured as an HIC assembly 25. As an adhesive for mounting the hybrid integrated circuit 14 on the heat sink 24, for example, a thermosetting adhesive having good thermal conductivity such as a silicon-based adhesive is used.

The HIC assembly 25 is mounted on the printed circuit board 13 at a position near the rear portion (near the front portion of the connector 17) so as to extend in the left-right direction. It is attached to the housing 12 at a plurality of attachment portions 12a in a thermally connected state. That is, FIGS. 1 to 3 do not show the mounting structure of the heat sink 24 (HIC assembly 25) to the housing 12, and here, for convenience, two hybrid integrated circuits 14 are mounted on the heat sink 24. It is assumed that.

On the inner surface (lower surface) of the upper wall of the housing 12,
The mounting portions 12b are integrally provided so as to protrude downward at three positions, that is, at left and right end portions and at an intermediate portion therebetween. Each of the mounting portions 12b is formed of a so-called screw boss portion, and has a screw hole at the center of a rectangular block-shaped protrusion. On the other hand, as shown in FIGS. 1 and 2, the heat sink 24 is formed with a plurality of screw insertion holes 24a penetrating in the vertical direction corresponding to the mounting portion 12b. The printed circuit board 13 has a mounting hole 13a corresponding thereto.

The heat sink 24 (HI
The C assembly 25) is attached at three places in the drawing by inserting the screw 26 from below into the mounting hole 13a and the screw insertion hole 24.
a and tightened to the mounting portion 12b. As a result, the heat sink 24 is screwed to the housing 12, and at this time, the upper surface of the heat sink 24 is
b may be in close contact with the lower surface (surface contact state).

Although not shown in detail, the distal end (lower end) of each clip 23 of each hybrid integrated circuit 14 is
It is inserted into a through hole formed in the printed circuit board 13 and is jet-soldered on the lower surface side, so that each hybrid integrated circuit 14 is electrically connected to the printed circuit board 13. At this time, as shown in FIG. 5, an alignment plate 27 for aligning the pitch of each clip 23 is provided on the upper surface side of the printed circuit board 13.

As shown in FIGS. 1 and 3, in this embodiment, the outer surface (upper surface) of the upper wall of the housing 12 is
A plurality of (four in the figure) grooves 33 are formed to facilitate the bending deformation of the housing 12. These grooves 33
The cross section has a semicircular (U-shaped) shape, and each is two positions between adjacent mounting portions 12b (away from) the mounting portions 12b, and the two mounting portions 12b are arranged in the direction in which the mounting portions 12b are arranged (left and right). direction)
Are formed so as to extend substantially in the front-rear direction of the upper wall portion (upper surface) of the housing 12 in a direction orthogonal to the front-rear direction (front-rear direction). At this time, as shown in FIG.
b to the nearest groove 33 is the distance between the mounting portions 12b
And it is even.

Although a detailed description is omitted, the housing 12 is manufactured by aluminum die casting (casting molding). At this time, a molding die has a ridge corresponding to the groove 33. The groove 33 is formed simultaneously and integrally when the housing 12 is formed. In this case, the casing 12 is relatively thick (for example, the thickness dimension is 1.
5 mm), and the groove 33 has a width of 2 mm, for example.
And a depth dimension of about 1 mm.

Next, the operation of the above configuration will be described with reference to FIG. In the ECU 11 configured as described above, a large power component (power transistor 19) at the time of use is used.
Is transmitted from the mounting portion 12b to the housing 12 via the ceramic substrate 18 and the heat sink 24,
The heat is satisfactorily radiated to the outside from the outer surface portion of the substrate. Therefore, the heat radiation effect is excellent, and it is possible to prevent the adverse effects of heat on components such as the microcomputer 15 on the printed circuit board.

Further, in the above configuration, unlike the case where the package-type large power components (the power transistors 19) are individually mounted on the heat sink, the size can be reduced by using the hybrid integrated circuit 14. In addition, since each hybrid integrated circuit 14 can be disposed very close to the connector 17, the wiring through which a large current flows on the printed circuit board 13 is shortened, and the area required for the wiring is significantly reduced. Can be achieved.

However, since the processing accuracy of the upper surface of the heat sink 24 and the lower surface of the mounting portion 12b of the housing 12 is not so strict, all the mounting portions 12b may be affected by factors such as undulation of each surface. The heat sink 24 does not always adhere exactly,
In the case of b, there is a possibility that a gap may occur due to the gap between the two or the oblique contact. If such a gap is formed, the heat transfer from the heat sink 24 to the housing 12 is inferior, and the heat radiation is reduced.

However, in this embodiment, the groove 3 is formed in the housing 12.
The provision of 3 makes it easier for the casing 12 to bend and deform so that the groove 33 is formed at the bent point. For this reason, even when a displacement occurs between the mounting portion 12b of the housing 12 and the heat sink 24, the angle of the contact surface of the mounting portion 12b and the position in the direction of contact and separation with respect to the heat sink 24 are adjusted by the bending deformation to make the gap. Correction can be performed so that all of the mounting portions 12b and the heat sink 24 can be in close contact with each other.

In this case, when the heat sink 24 is screwed in each of the mounting portions 12b, the housing 12 can be automatically bent, so to speak, by the tightening force of the screw 26.
Correction is easily performed. At this time, the groove 33 is formed so as to extend over substantially the entire upper surface of the housing 12 in the front-rear direction orthogonal to the direction (the left-right direction) in which the mounting portions 12b are arranged.
The housing 12 can be easily bent and deformed in a target correction direction (left-right direction).

Further, since two grooves 33 are provided between the adjacent mounting portions 12b, the housing 12 is bent and deformed so as to be bent at two or more positions between the adjacent mounting portions 12b. Thus, the bending deformation can be performed freely as compared with the case where the bending deformation is performed at one place, and the correction can be performed more favorably. FIG. 4 schematically shows how the upper wall portion of the housing 12 is corrected by bending deformation. In the case where two grooves 33 are provided between the mounting portions 12b, (a) one groove This makes it easier to freely adjust the angle of the lower surface of each mounting portion 12b than in the case of providing (22).

Since the portion of the housing 12 other than the groove 33 is formed to be thick, unlike the case where the thickness of the housing is reduced, the desired heat radiation performance can be secured. At this time, since the groove 33 is formed at a position distant from the mounting portion 12b, the thickness of the mounting portion 12b can be increased to improve the heat transfer property and the heat radiation property.
The distance from the mounting portion 12b to the groove 33 is determined by each mounting portion 12b.
, The area of the thick portion of the housing 12 that comes into contact with each mounting portion 12b can be made uniform, and heat conduction from each mounting portion 12b to the housing 12 is performed uniformly, Even heat radiation is performed.

Moreover, since the groove 33 is provided on the outer surface side of the housing 12, the housing 1 has a smaller size than the case where it is provided on the inner surface side.
Additional advantages such as an improvement in heat dissipation due to an increase in the heat dissipation area on the outer surface of 2, and an increase in heat dissipation efficiency due to the generation of turbulence when air is blown can be obtained.

Further, unlike the structure described in the conventional example in which the heat radiating member is brought into contact with the case by the elastic force of the coil spring, the heat sink 24 and the heat sink 24 have a simple and inexpensive structure in which only the groove 33 is provided in a part of the housing 12. Good heat radiation can be ensured by increasing the adhesion to the housing 12. Further, in this embodiment, since the aluminum die casting is used for manufacturing the housing 12, the housing 12 having the groove 33 can be manufactured extremely easily and at low cost.

As described above, according to the present embodiment, the heat sink 24 on which the heat-generating component such as the power transistor 19 is mounted is mounted on the housing 12 at the plurality of mounting portions 12b. Since the groove 33 for facilitating the mounting is provided, the adhesion between the heat sink 24 and the housing 12 in the plurality of mounting portions 12b can be improved, and good heat radiation can be ensured, but it is simple and inexpensive. It is possible to obtain an excellent effect such that a simple configuration can be achieved.

<Second to Fifth Embodiments> FIGS. 6 to 9
Shows the second to fifth embodiments of the present invention, respectively. In these embodiments, since the internal structure and the like of the electronic circuit unit (ECU 11) are almost the same as those in the first embodiment, the same reference numerals are given to the same parts and new illustrations and detailed explanations are given. Are omitted, and only the points different from the first embodiment will be described below.

FIG. 6 shows a second embodiment of the present invention.
This embodiment is different from the first embodiment in that grooves 34 for easily bending and deforming are formed on the upper surface of the housing 12 in a circular shape centered on each mounting portion 12b. (In three places). According to this, the groove 3
By providing 4, the housing 12 can be easily bent in any direction. Therefore, according to the present embodiment, similarly to the first embodiment, a plurality of mounting portions 12b are provided.
In this case, it is possible to obtain an excellent effect that the adhesion between the heat sink 24 and the housing 12 can be enhanced and good heat radiation can be secured, but a simple and inexpensive configuration can be achieved.

FIG. 7 shows a third embodiment of the present invention.
). In this embodiment, the housing 1
A groove 35 is also provided on the upper surface of 2 in a circular shape centering on each mounting portion 12b, and a plurality of grooves 35 are formed concentrically, in this case three each.
According to this, the housing 12 can be further easily bent.

FIG. 8 shows a fourth embodiment of the present invention.
). In this fourth embodiment,
The heat sink 36 has a large size that is thick in the front-back direction,
Accordingly, on the lower surface of the upper wall portion of the housing 37, a total of six mounting portions 3 in two rows in the vertical (front-back) direction and three rows in the horizontal (left-right) direction are provided.
7a is provided. A groove 38 is formed on the upper surface of the housing 37 so as to easily bend and deform.
(6 places) in a circular shape centered at the center. With such a configuration, the adhesion between the heat sink 36 and the housing 37 in each mounting portion 37a can be improved, and good heat radiation can be secured.
An excellent effect that a simple and inexpensive configuration can be achieved can be obtained.

FIG. 9 shows a fifth embodiment of the present invention.
0 (corresponding to 0). In this embodiment as well, as in the ninth embodiment, mounting portions 37a are arranged vertically and horizontally on the casing 37 with respect to the large heat sink 36. On the upper surface of the housing 37, two grooves 39, each extending in the vertical (front-back) direction and two grooves 40 extending in the horizontal (left-right) direction, are provided between the mounting portions 37a in a lattice shape. It is formed as follows.

With such a configuration, the grooves 39, 40
Are provided so as to extend vertically and horizontally in a lattice shape,
Is easily deformed in both the vertical and horizontal directions,
It is possible to satisfactorily correct the angle of the contact surface in each mounting portion 37a. It is possible to obtain an excellent effect that it is possible to improve the adhesion between the heat sink 36 and the housing 37 in each of the mounting portions 37a and to secure good heat dissipation, but to use a simple and inexpensive configuration. be able to.

In each of the above embodiments, the groove 33 and the like are
2, but grooves may be formed on the inner surface of the housing for the intended purpose of making the housing easier to bend and deform, and the inner and outer surfaces may be formed on the inner surface of the housing. They may be formed on both sides. Further, the grooves may be formed so as to extend in a diagonal direction or in a curved line, instead of extending linearly perpendicular to the direction in which the mounting portions are arranged. The cross-sectional shape of the groove may be a U-shape, an upward U-shape, a V-shape, or the like.
The width dimension and the depth dimension can also be set freely so as to obtain the desired flexibility.

In each of the above embodiments, screwing is used as a means for attaching the heat sink 24 and the like to the attaching portion 12b of the housing 12. However, riveting, caulking, welding, or the like may be employed. Can also. Even in the case of screwing, it is also possible to adopt a configuration in which screwing is performed from the upper surface side of the housing 12, and the present invention is applied even when the number of screwing points (mounting parts) is two or four or more. be able to.

In the above-described embodiment, the hybrid integrated circuit 14 in which the high power components (the power transistors 19) and the like are mounted on the ceramic substrate 18 is used. However, the package type single high power components are individually mounted on the heat sink. The present invention can also be applied to an object. In addition, the internal structure such as the connection structure of the hybrid integrated circuit 14 to the printed circuit board 13 and the like can be variously modified, and can be widely applied to not only ECUs for automobiles but also electronic circuit units in general. The present invention can be implemented with appropriate modifications without departing from the gist.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention, and is a longitudinal sectional front view showing a mounting structure of a heat sink to a housing.

FIG. 2 is a right side view of a longitudinal section along the line II of FIG. 1;

FIG. 3 is a plan view of an ECU.

FIG. 4 is a schematic diagram showing the ease of correction in the case where two grooves are provided between the mounting portions (a) in comparison with the case where one groove is provided (b).

FIG. 5 is a perspective view schematically showing a configuration of an ECU in a state where a part of a housing is broken.

FIG. 6 is a view corresponding to FIG. 3, showing a second embodiment of the present invention.

FIG. 7 is a view corresponding to FIG. 3, showing a third embodiment of the present invention;

FIG. 8 is a view corresponding to FIG. 3, showing a fourth embodiment of the present invention;

FIG. 9 is a view corresponding to FIG. 3, showing a fifth embodiment of the present invention.

FIG. 10 is a diagram corresponding to FIG. 1 showing a conventional example.

[Explanation of symbols]

In the drawings, reference numeral 11 denotes an ECU (electronic circuit unit);
7 is a housing, 12b and 37a are mounting portions, 13 is a printed circuit board, 14 is a hybrid integrated circuit, 15 is a microcomputer, 17 is a connector, 18 is a ceramic substrate, 19 is a power transistor (high power component), and 24 and 36 are A heat sink, 25 indicates an HIC assembly, and 33, 34, 35, 38, 39, 40 indicate grooves.

Claims (13)

[Claims] 1. A housing made of a material having good thermal conductivity,
An electronic circuit unit in which a heat sink on which a high-power component is mounted is mounted in a thermally connected state at a plurality of mounting portions of the housing, wherein a groove is formed in the housing to facilitate bending deformation. An electronic circuit unit comprising: 2. The electronic circuit unit according to claim 1, wherein the groove is provided on an outer surface of the housing. 3. The heat sink according to claim 1, wherein the heat sink is attached to the housing by screwing.
An electronic circuit unit as described. 4. The electronic circuit unit according to claim 1, wherein the groove is formed at a position avoiding the mounting portion. 5. The electronic circuit unit according to claim 1, wherein the groove extends in a direction perpendicular to a direction in which the mounting portions are arranged. 6. The electronic circuit unit according to claim 5, wherein the groove is formed so as to extend over substantially the entire surface of the housing having the mounting portion. 7. The groove according to claim 1, wherein two or more grooves are provided between adjacent mounting portions.
An electronic circuit unit according to any one of the above. 8. The electronic circuit unit according to claim 1, wherein the distance from the mounting portion to the groove is equal for each mounting portion. 9. The device according to claim 1, wherein the groove is provided in a circular shape with the mounting portion as a center.
An electronic circuit unit according to any one of the above. 10. The electronic circuit unit according to claim 1, wherein said mounting portions are arranged vertically and horizontally, and said grooves are provided so as to extend vertically and horizontally in a lattice shape. . 11. The electronic circuit according to claim 1, wherein the housing is manufactured by aluminum die casting, and the groove is formed at the same time. unit. 12. The high power component is mounted on a ceramic substrate to form a hybrid integrated circuit, and a plurality of hybrid integrated circuits are mounted on the heat sink. Claims 1 to 11
Electronic circuit unit described in any of the above. 13. The electronic circuit unit according to claim 12, wherein the heat sink is provided near a connector for external connection.