JP2001308135A - Method of manufacturing semiconductor device and manufacturing apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a manufacturing apparatus therefor which can reliably perform wire-bonding works. SOLUTION: The apparatus comprises a clamper 30 having a plurality of pressing parts 32 for pressing a plurality of leads 10 of a lead frame at a plurality of positions at once, each pressing part 32 has a contact surface for contacting the lead 10, and the contact surface is movable independently in the direction perpendicular to the bonding face of the lead 10 when pressing the lead 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a semiconductor device and an apparatus for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor chip electrode is wire-bonded to a plurality of leads, a single pressing portion formed on a clamper simultaneously presses all of the plurality of leads.

However, in this case, in order to uniformly press the plurality of leads evenly, it is necessary to accurately flatten the clamper. However, all of the plurality of leads cannot be uniformly pressed flat. In some cases, wire bonding was sometimes difficult.

An object of the present invention is to solve this problem, and an object of the present invention is to provide a method and an apparatus for manufacturing a semiconductor device, which can perform wire bonding reliably.

[0005]

(1) A semiconductor device manufacturing apparatus according to the present invention includes a clamper having a plurality of pressing portions for pressing a plurality of leads of a lead frame at a plurality of positions at the same time. The contact surface of the lead with
When the lead is pressed, it is independently movable in a direction perpendicular to the bonding surface of the lead.

According to the present invention, even if the clamper itself is not precisely adjusted to be flat, the leads can be uniformly and flatly pressed only by pressing the leads with the plurality of pressing portions of the clamper. Therefore, for example, a plurality of leads can be securely wire-bonded.

(2) In this semiconductor device manufacturing apparatus, a contact surface of each of the pressing portions with the lead may be movable in the perpendicular direction by elastic means.

According to this, the elastic means is provided for each pressing portion. Thus, each pressing portion can be made movable.

(3) In this semiconductor device manufacturing apparatus, the pressing portion may be formed by the elastic means and a contact portion with the lead which is less likely to be deformed than the elastic means.

Thus, for example, even after the lead is pressed by the pressing portion, the contact portion of the pressing portion with the lead can be maintained in a constant shape. Therefore, a plurality of leads can be reliably held down.

(4) In the semiconductor device manufacturing apparatus, the elastic means may be a means for cushioning pressure by a fluid.

Thus, a clamper having elastic means can be easily formed.

(5) In the semiconductor device manufacturing apparatus, the elastic means may be a spring.

Thus, a clamper having elastic means can be easily formed.

(6) In this method of manufacturing a semiconductor device, the pressing portion may be the elastic means itself.

According to this, the clamper having the elastic means can be formed more easily.

(7) In this method of manufacturing a semiconductor device, the elastic means may be rubber.

According to this, by providing the rubber mechanically on the main body of the clamper, for example, a clamper having elastic means can be easily formed.

(8) In this semiconductor device manufacturing apparatus, the clamper is formed with a substantially rectangular hole, and each of the pressing portions is large enough to press a group of the leads, and each side of the hole is formed. May be formed along.

According to this, for example, the pressing portion is formed so as to press a plurality of leads for each group of leads facing each side of the die pad. This, relatively,
A plurality of leads can be reliably pressed flat with a simple form.

(9) In this semiconductor device manufacturing apparatus, each of the pressing portions may press any one of the leads.

According to this, the leads are pressed one by one. Thereby, the plurality of leads can be more securely pressed flat.

(10) A method of manufacturing a semiconductor device according to the present invention includes the steps of: pressing a portion of a lead frame near a tip of a plurality of leads; and bonding a wire to the tip. In the step of pressing the lead, the plurality of pressing portions movable in the direction perpendicular to the bonding surface presses the lead independently at each of the positions at a plurality of positions.

According to the present invention, even if the clamper itself is not precisely adjusted to be flat, the plurality of leads can be uniformly and flatly pressed only by pressing the leads with the pressing portion provided on the clamper. Therefore, a plurality of leads can be securely wire-bonded.

(11) In the method of manufacturing a semiconductor device, in the step of pressing the plurality of leads, the plurality of leads may be pressed for each group of the leads.

Thus, a plurality of leads can be reliably pressed flat in a relatively simple manner.

(12) In this method of manufacturing a semiconductor device, in the step of pressing the plurality of leads, each of the leads may be pressed.

According to this, the leads are pressed one by one. Thereby, the plurality of leads can be more securely pressed flat.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

(First Embodiment) FIGS. 1 and 2 are views showing an apparatus and a method for manufacturing a semiconductor device according to the present embodiment. FIG. 1 is a view showing a plane of the clamper 30 in a state where a plurality of leads 10 of a lead frame are pressed. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 1 and is a view showing a cross-section of the clamper 30 when the lead 10 is pressed.

In this embodiment, a known lead frame is used. The lead frame shown in FIG. 1 includes a plurality of leads 10, a die pad 14, and suspension leads 16. The plurality of leads 10 are composed of an inner lead part and an outer lead part, and the tip part 1 of the lead 10 shown in FIG.
2 may be referred to as an inner lead portion. Die pad 14
The semiconductor chip 20 is mounted on the semiconductor chip 20. A plurality of electrodes (not shown) of the semiconductor chip 20 are electrically connected to the tips 12 of the leads 10 by wires or the like. In addition, the die pad 14 is generally rectangular in many cases. The suspension lead 16 is formed to be connected to a corner of the die pad 14,
This is for hanging the die pad 14 from the outer frame of the lead frame. However, the lead frame used in the present embodiment is not limited to this.

The clamper 30 includes a pressing portion 32 for holding the lead 10. Further, the clamper 30 may include a main body 34 having a hole 36.

The pressing portion 32 is connected to the lead 1 at a plurality of positions simultaneously.
A plurality is formed so as to hold 0. In this case,
The pressing portion 32 is formed so as to independently press the lead 10 without using another pressing portion 32. As shown in FIG. 1, the pressing portion 32 may be formed so as to intersect the direction in which the leads 10 extend when pressing the plurality of leads 10. When the pressing portion 32 presses the lead 10,
Except for the tip 12 of the lead 10, the lead 10 may be formed so as to press a portion close to the tip 12. The lead 10
The size and form of the contact area of the pressing portion 32 with the lead 10 when pressing is not particularly limited.

The pressing portion 32 is connected to the clamper 30 (the main body 3).
It may be formed along each side of the substantially rectangular hole 36 formed in 4). For example, a plurality of pressing portions 32 may be formed so as to press each group of leads 10 facing each side of the die pad 14 which is a rectangular shape of the lead frame. In other words, as shown in FIG.
The pressing portion 32 may be formed so as to press each of the group of leads 10 disposed therebetween. Further, the pressing portion 32 may be formed such that at least two or more leads 10 are used as a group of leads 10 and pressed by each group of leads 10. Thus, the plurality of leads 10 can be reliably held in a relatively simple form.

As shown in FIG. 1, the plurality of pressing portions 32
The ends of the pressing portions 32 may come into contact with each other to form an actual frame as a whole. Alternatively, the plurality of pressing portions 32 may be formed without actually forming a frame, with their ends separated from each other. In any case,
It is sufficient that the contact surfaces of the respective pressing portions 32 with the leads 10 can press the leads 10 independently, and the form is not limited.

The form of the pressing portions 32 provided at a plurality of positions is not limited to this. For example, the pressing portions 32 may be formed so as to press the plurality of leads 10 one by one.

As shown in FIG. 1, the plurality of pressing portions 32 may be formed on the main body 34. Main unit 34 shown here
May be in the same form as that corresponding to the body part of the well-known clamper. As shown in FIG.
May be configured to swing around one end (not shown) as a fulcrum, and to contact a plurality of pressing portions 32 provided on the other side with the lead 10. Also, the main body 3
A substantially rectangular hole 36 (see FIG. 1) is formed in 4, and the hole 36 enables the bonding of the lead 10. The shape of the hole 36 is not particularly limited, but is generally a rectangle or a shape similar thereto.

The contact surface of the pressing portion 32 with the lead 10 is formed so as to be movable in the direction perpendicular to the bonding surface of the lead 10 when the lead 10 is pressed.
Specifically, the contact surface of the pressing portion 32 with the lead 10 is formed so as to be independently movable so that the magnitude of the stress applied to the lead 10 is uniform in each pressing portion 32.

Each pressing portion 32 may be movable by elastic means. In the present embodiment, the pressing portion 32 includes an elastic means. For example, as shown in FIG. 2, the elastic means may be a means for cushioning pressure by a liquid such as oil 38. Alternatively, means for cushioning the pressure of gas such as air may be used. Thus, the clamper 30 having the elastic means can be easily formed.

Further, of the plurality of pressing portions 32, the contact portion with the lead 10 except for the above-mentioned elastic means may be formed of a member which is less likely to be deformed than the elastic means. For example,
The contact portion of the pressing portion 32 with the lead 10 may be formed of a metal such as stainless steel. Thus, even after the lead 10 is pressed by the pressing portion 32, the lead 1 of the pressing portion 32
A constant shape can be maintained without deforming the contact portion with zero. Therefore, the plurality of leads 10 can be reliably pressed.

According to the semiconductor device manufacturing apparatus of the present embodiment, a plurality of leads can be obtained simply by pressing the leads 10 with the pressing portions 32 provided on the clamper 30 without accurately adjusting the clamper 30 itself to be flat. 10 can be pressed evenly and flatly. Further, the plurality of leads 10 can be uniformly and flatly pressed using the existing clamper mechanism. Therefore, for example, the plurality of leads 10 can be securely wire-bonded.

The apparatus for manufacturing a semiconductor device according to the present embodiment is configured as described above, and a method for manufacturing a semiconductor device will be described below.

The lead frame is placed on the table 60. For example, in a long lead frame in which a plurality of die pads 14 are formed in one direction, one die pad 1 is formed.
4 is placed on the platform 60.

The plurality of leads 10 of the lead frame placed on the table 60 are pressed by the clamper 30. The clamper 30 may be swung about one end (not shown) of the clamper 30 as a fulcrum, and the plurality of pressing portions 32 provided on the other side may contact the lead 10. In this case, the pressing portions 32 provided at a plurality of positions
Among them, the form of pressing the lead 10 in the pressing portion 32 differs depending on the difference in the distance from the fulcrum. The invention has particular utility in this case. That is, the pressing portion 32 that is movable in the direction perpendicular to the bonding surface of the lead 10 can make the stress when pressing the lead 10 uniform among the plurality of leads 10.

Further, by forming the pressing portion 32 so as to press each group of leads 10 facing each side of the die pad 14 which is, for example, a rectangular shape of a lead frame, it is possible to press the plurality of leads 10 more uniformly. it can. In addition,
In this case, a plurality of leads 10 may be pressed one by one.

When the leads 10 are pressed, portions of the plurality of leads 10 which are close to the tip 12 may be pressed. That is, the distal end portion 12 may be removed so as not to hinder the wire bonding performed later, and a portion close to the distal end portion 12 may be pressed so as to press the lead 10 reliably.

With the plurality of leads 10 held down by the clamper 30, wires are bonded to the tips 12 of the leads 10 through the holes 36. Note that the wire bonding in the present embodiment may be a known technique.

According to the method of manufacturing a semiconductor device in the present embodiment, a plurality of leads can be obtained by merely pressing the leads 10 with the pressing portions 32 provided on the clamper 30 without accurately adjusting the clamper 30 itself to be flat. 10 can be pressed evenly and flatly. Therefore, a plurality of leads 10 can be securely wire-bonded.

In addition, even if the clamper 30 is slightly warped due to multiple uses, a plurality of leads 1
0 can be uniformly and flatly pressed. Therefore, the durability of the clamper 30 can be improved.

(Second Embodiment) FIG. 3 is a view showing an apparatus for manufacturing a semiconductor device according to the present embodiment, and is a view showing a cross section of a clamper 40 in a state where a plurality of leads 10 are pressed. is there. The clamper 40 includes a pressing portion 42 for pressing the lead 10, and may further include a main body 44. In addition,
The manufacturing apparatus and the manufacturing method of the semiconductor device according to the present embodiment may be the same as the above-described embodiment except for the following description.

The elastic means in the present embodiment is a spring 48 as shown in FIG. One or more springs 48 are provided in each pressing portion 42. As long as the contact surface of each pressing portion 42 with the lead 10 is independently movable, a spring 48
Is not limited. Note that, of the pressing portion 42, the contact portion with the lead 10 except for the above-described elastic means may be formed of a metal such as stainless steel which is less likely to deform than the elastic means. In addition, according to the present embodiment, the same effect as in the above-described embodiment can be obtained.

(Third Embodiment) FIG. 4 is a view showing an apparatus for manufacturing a semiconductor device according to the present embodiment, and is a view showing a cross section of a clamper 50 in a state where a plurality of leads 10 are pressed. is there. The clamper 50 includes a pressing portion 52 that presses the lead 10, and may further include a main body 54. In addition,
The manufacturing apparatus and the manufacturing method of the semiconductor device according to the present embodiment may be the same as the above-described embodiment except for the following description.

In the present embodiment, the elastic means is rubber, and the pressing portion 52 is formed from the rubber. That is, in the present embodiment, the elastic means itself is the pressing portion 52. When the clamper 50 includes the main body 54, the main body 5
4 may be provided with rubber directly, and the rubber may be used as the pressing portion 52. Thereby, the clamper 50 having the elastic means can be easily formed. The elastic means according to the present embodiment may be a member having another elastic means other than rubber.

The rubber may be mechanically connected to the main body 54 by screws 57. This prevents the rubber from peeling off from the main body 54 due to heat during manufacturing, and the rubber can be securely connected to the main body 54. In addition, according to the present embodiment, the same effect as in the above-described embodiment can be obtained.

FIG. 5 shows a circuit board 100 on which the semiconductor device 1 manufactured by applying the present invention is mounted.
Generally, an organic substrate such as a glass epoxy substrate is used for the circuit board. Wiring patterns made of, for example, copper are formed on a circuit board so as to form a desired circuit, and these wiring patterns are electrically connected to external terminals (outer leads) of the semiconductor device by mechanically connecting them. Electrical conduction.

FIG. 6 shows a notebook personal computer 200 and FIG. 7 shows a mobile phone 300 as an electronic apparatus having the semiconductor device 1 to which the present invention is applied.

[Brief description of the drawings]

FIG. 1 is a view showing a semiconductor device manufacturing apparatus and a manufacturing method according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating a semiconductor device manufacturing apparatus and a manufacturing method according to a first embodiment to which the present invention is applied;

FIG. 3 is a view showing a semiconductor device manufacturing apparatus and a manufacturing method according to a second embodiment to which the present invention is applied;

FIG. 4 is a diagram showing a semiconductor device manufacturing apparatus and a manufacturing method according to a third embodiment to which the present invention is applied.

FIG. 5 is a diagram showing a circuit board on which a semiconductor device manufactured by a method of manufacturing a semiconductor device according to one of the embodiments to which the present invention is applied is mounted.

FIG. 6 is a diagram illustrating an electronic apparatus having a semiconductor device manufactured by a method of manufacturing a semiconductor device according to any one of the embodiments to which the present invention is applied;

FIG. 7 is a diagram illustrating an electronic apparatus having a semiconductor device manufactured by a method of manufacturing a semiconductor device according to any one of the embodiments to which the present invention is applied;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lead 12 Tip part 14 Die pad 16 Suspended lead 20 Semiconductor chip 30 Clamper 32 Pressing part 34 Body part 36 Hole 38 Oil 48 Spring 57 Screw 60 Unit

Claims (12)

[Claims] 1. A clamper having a plurality of pressing portions for simultaneously pressing a plurality of leads of a lead frame at a plurality of positions, wherein contact surfaces of the respective pressing portions with the leads are independent when the leads are pressed. A semiconductor device manufacturing apparatus movable in a direction perpendicular to a bonding surface of the lead. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein a contact surface of each of said pressing portions with said lead is movable in said perpendicular direction by elastic means. 3. The semiconductor device manufacturing apparatus according to claim 2, wherein said pressing portion is formed by said elastic means and a contact portion with said lead which is less deformable than said elastic means. Manufacturing equipment. 4. The apparatus for manufacturing a semiconductor device according to claim 2, wherein said elastic means is means for cushioning pressure by a fluid. 5. The apparatus for manufacturing a semiconductor device according to claim 2, wherein said elastic means is a spring. 6. The apparatus for manufacturing a semiconductor device according to claim 2, wherein the pressing portion is the elastic means itself. 7. The apparatus for manufacturing a semiconductor device according to claim 2, wherein said elastic means is rubber. 8. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the clamper has a substantially rectangular hole, and each of the pressing portions includes a group of the leads. It is big enough to hold
An apparatus for manufacturing a semiconductor device formed along each side of the hole. 9. The semiconductor device manufacturing apparatus according to claim 1, wherein each of said pressing portions presses any one of said leads. 10. A step of pressing a portion of the lead frame close to the tip of the plurality of leads, and a step of bonding a wire to the tip, wherein the step of pressing the plurality of leads is performed in a direction perpendicular to a bonding surface. By a plurality of pressing portions movable in, independently at each of the positions at a plurality of positions,
A method for manufacturing a semiconductor device for holding the leads. 11. The method for manufacturing a semiconductor device according to claim 10, wherein in the step of pressing the plurality of leads, the plurality of leads are pressed for each group. 12. The method of manufacturing a semiconductor device according to claim 10, wherein in the step of pressing the plurality of leads, each of the leads is pressed.